US20090236016A1 - Method for manufacturing glass molding die - Google Patents

Method for manufacturing glass molding die Download PDF

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Publication number
US20090236016A1
US20090236016A1 US12/473,360 US47336009A US2009236016A1 US 20090236016 A1 US20090236016 A1 US 20090236016A1 US 47336009 A US47336009 A US 47336009A US 2009236016 A1 US2009236016 A1 US 2009236016A1
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United States
Prior art keywords
less
coating layer
surface coating
substrate
temperature
Prior art date
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Abandoned
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US12/473,360
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English (en)
Inventor
Jun Masuda
Takaharu Tashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
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Toshiba Machine Co Ltd
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Filing date
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Assigned to TOSHIBA KIKAI KABUSHIKI KAISHA reassignment TOSHIBA KIKAI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MASUDA, JUN, TASHIRO, TAKAHARU
Publication of US20090236016A1 publication Critical patent/US20090236016A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06—Construction of plunger or mould
    • C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
    • C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
    • C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00—Heat treatment of ferrous alloys
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00—Heat treatment of ferrous alloys
    • C21D6/04—Hardening by cooling below 0 degrees Celsius
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/12—Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/22—Ferrous alloys, e.g. steel alloys containing chromium with molybdenum or tungsten
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/24—Ferrous alloys, e.g. steel alloys containing chromium with vanadium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/10—Die base materials
    • C03B2215/11—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
    • C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals

Definitions

  • the present invention relates to a method for manufacturing a glass molding die requiring precision machining, and specifically to a manufacturing method under which a die maintains its shape with high precision.
  • the Ni—P layer formed by electroless plating may be cracked.
  • the phenomenon is ascribable to the molding temperature. More specifically, the N—P layer is in an amorphous state after plating, and is crystallized when heated to about 270° C. or higher. At this point, the plated layer causes volume shrinkage, and is cracked by tensile stress.
  • a substrate having a coefficient of thermal expansion of 10 ⁇ 10 ⁇ 6 to 16 ⁇ 10 ⁇ 6 K ⁇ 1 is subjected to plating, followed by heat treatment at 400 to 500° C.
  • the substrate has a coefficient of thermal expansion equal to that of the Ni—P plated layer, the volume shrinkage accompanied by the crystallization occurs only in the plated layer during heat treatment, which may result in cracking in the plated layer due to great tensile stress.
  • the die In addition, if the die is heated to a high temperature during use, the die causes plastic deformation, which results in the failure to maintain the shape of the die with high precision.
  • the present invention is intended to provide a method for manufacturing a glass molding die. According to the method, cracking in the surface coating layer at the molding temperature and plastic deformation of the die are prevented, whereby the die maintains its shape with high precision, and has a longer life.
  • the method for manufacturing a glass molding die according to the present invention has the following aspects.
  • a substrate by hardening a steel material containing 0.3 wt % or more and 2.7 wt % or less of carbon and 13 wt % or less of chromium, and further containing at least one additive selected from 0.5 wt % or more and 3 wt % or less of molybdenum, 0.1 wt % or more and 5 wt % or less of vanadium, and 1 wt % or more and 7 wt % or less of tungsten, and then subjecting the steel material to subzero treatment; forming a surface coating layer composed of an amorphous Ni—P alloy on the surface of the substrate; and heating the surface coating layer thereby rendering the surface coating layer an eutectic structure composed of Ni and Ni 3 P.
  • FIG. 1 is a block diagram schematically showing a method for manufacturing a glass molding die according to one embodiment of the present invention.
  • FIG. 1 is a block diagram schematically showing a method for manufacturing a glass molding die according to one embodiment of the present invention.
  • the glass molding die is manufactured by the following process.
  • the substrate used herein is a steel material containing 0.3 wt % or more and 2.7 wt % or less of carbon and 13 wt % or less of chromium, and further containing at least one additive selected from 0.5 wt % or more and 3 wt % or less of molybdenum, 0.1 wt % or more and 5 wt % or less of vanadium, and 1 wt % or more and 7 wt % or less of tungsten.
  • the substrate is subjected to rough machining (ST 1 ), and then to hardening and high temperature tempering (ST 2 ). Subsequently, the substrate is pretreated before plating (ST 3 ), and then subjected to electroless plating to form a surface coating layer (plated layer) composed of an Ni—P alloy (ST 4 ). Subsequently, the substrate and the surface coating layer are subjected to heat treatment (ST 5 ) thereby crystallizing the surface coating layer, and tempering the substrate. Thereafter, the substrate and the surface coating are finished (ST 6 and ST 7 , respectively), and then the surface coating layer is coated with a releasing film (ST 8 ).
  • the substrate used in the manufacturing method according to an embodiment of the present invention is a steel material containing Mo, V, or W for improving the high-temperature hardness. Therefore, the surface coating layer will not be cracked during high-temperature tempering. The reason for this is that the substrate contains a large amount of residual austenite immediately after hardening, but the residual austenite is transformed into low carbon martensite and martensite by high-temperature tempering.
  • the temperature of the high-temperature tempering is 400 to 650° C. or less. If the temperature is lower than 400° C., the residual austenite is not so effectively reduced, and if higher than 650° C., the substrate is markedly softened.
  • the high-temperature tempering may be replaced with subzero treatment. Subzero treatment is also effective for transforming residual austenite into martensite.
  • the surface coating layer is formed with an Ni—P alloy such as Ni—P, Ni—P—B, or Ni—P—W. These structures are amorphous or partially amorphous after plating, and is transformed into a completely crystallized mixed structure composed of Ni and Ni 3 P after heating at a temperature of about 270° C. or higher.
  • the temperature of the heat treatment is greater than or equal to the working temperature of the die (more specifically, the glass molding temperature). If the heat treatment temperature is lower than the working temperature of the die, the dimension of the die can vary during use, which results in the deterioration of the dimensional accuracy of the molded product. If the heat treatment temperature is too high, the plated surface is affected. Therefore, the upper limit of the heat treatment temperature is about 700° C.
  • the reason for the use of the steel material having the above-described composition as the substrate is as follows.
  • the C content is 0.3 wt % or more and 2.7 wt % or less. If the C content is less than 0.3 wt %, the volume shrinkage of the substrate during tempering is insufficient. On the other hand, if the C content is more than 2.7 wt %, the volume shrinkage of the substrate is sufficient, but the toughness of the substrate deteriorates.
  • the Cr content is 13 wt % or less. If the Cr content is more than 13 wt %, the residual austenite is poorly decomposed.
  • the lower limit of the Cr content is not particularly limited.
  • the contents of Mo, V, and W as additives are 0.5 wt % or more and 3 wt % or less, 0.1 wt % or more and 5 wt % or less, and 1 wt % or more and 7 wt % or less, respectively. If the amount of these additives is too small, the substrate has insufficient high-temperature hardness, and may cause plastic deformation under pressure. Excessive addition of the additives results in an increase in cost, so that the upper limits are defined.
  • Substrates with different compositions were subjected to electroless Ni—P plating to form dies coated with a 100- ⁇ m-thick coating. These dies were subjected to heat treatment and molding, and the incidence of cracking during molding, and whether the substrates caused plastic deformation during glass molding were recorded. Table 1 lists the composition of the substrates, tempering temperature, the incidence of cracking, and the assessment of whether the substrates caused plastic deformation.
  • the specimen 7 as a comparative example is a plastic molding die subjected to conventional heat treatment. The molding temperature was 550° C. for all the specimens.
  • the substrate and surface coating layer may be subjected to heat treatment after finishing the substrate and surface coating layer.
  • various modifications may be made without departing from the scope of the present invention.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Chemically Coating (AREA)
  • Heat Treatment Of Articles (AREA)
US12/473,360 2006-12-14 2009-05-28 Method for manufacturing glass molding die Abandoned US20090236016A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006337367 2006-12-14
JP2006-337367 2006-12-14
PCT/JP2007/073955 WO2008072664A1 (ja) 2006-12-14 2007-12-12 ガラス成形用金型の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073955 Continuation WO2008072664A1 (ja) 2006-12-14 2007-12-12 ガラス成形用金型の製造方法

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US (1) US20090236016A1 (https=)
JP (1) JP5073469B2 (https=)
KR (1) KR101053701B1 (https=)
DE (1) DE112007003026B4 (https=)
TW (1) TW200844056A (https=)
WO (1) WO2008072664A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090178737A1 (en) * 2005-06-24 2009-07-16 Jun Masuda Die for press forming of glass and manufacturing method thereof
US20090252866A1 (en) * 2006-12-14 2009-10-08 Toshiba Kikai Kabushiki Kaisha Method of producing glass forming mold
US20100011815A1 (en) * 2007-04-10 2010-01-21 Toshiba Kikai Kabushiki Kaisha Glass-shaping mold and method for manufacturing the same
US9145323B2 (en) 2013-01-21 2015-09-29 Corning Incorporated Molds for shaping glass and methods for making the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101053701B1 (ko) * 2006-12-14 2011-08-02 도시바 기카이 가부시키가이샤 글래스 성형용 금형의 제조 방법

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TWI351387B (https=) 2011-11-01
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KR101053701B1 (ko) 2011-08-02
TW200844056A (en) 2008-11-16

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