US20090042486A1 - Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method - Google Patents

Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method Download PDF

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Publication number
US20090042486A1
US20090042486A1 US12/155,133 US15513308A US2009042486A1 US 20090042486 A1 US20090042486 A1 US 20090042486A1 US 15513308 A US15513308 A US 15513308A US 2009042486 A1 US2009042486 A1 US 2009042486A1
Authority
US
United States
Prior art keywords
carrier
work
polishing
substrate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/155,133
Other languages
English (en)
Inventor
Fumihiko Tokura
Mitsuo Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKEUCHI, MITSUO, TOKURA, FUMIHIKO
Publication of US20090042486A1 publication Critical patent/US20090042486A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • FIG. 25 is a flowchart that describes the details of the step 1200 shown in FIG. 21 .
  • FIG. 33 is a perspective view of MEMS chips shown in FIG. 28 .
  • FIG. 3 is a schematic perspective view of an embodiment where the fixing member is an adhesive 120 in the carrier 110 shown in FIG. 2 .
  • the adhesive 120 of this embodiment is alcowax®.
  • the adhesive 120 bonds the carrier 110 and the work W together in the hole 113 .
  • a clearance J with a constant width can be created around the work W when the work W is housed in the hole 113 .
  • the fixing member contacts and fixes the work W in the hole 113 .
  • the fixing member prevents vibrations of the work W in the hole 113 .
  • a height direction of the carrier 110 is a Z direction
  • a plane perpendicular to the Z direction is a XY plane
  • the work W in the hole 113 can vibrate on the XY plane. When the work W does not vibrate, it does not collide with the carrier 110 or generate dusts.
  • Dusts may be removed once they occur from both surfaces Wa and Wb of the work W.
  • the following embodiment utilizes a pattern of a convex and a concave (a convexo-concave pattern) formed on at least one of both surfaces 112 a and 112 b of the carrier 110 to remove dusts that occur during polishing, from between the carrier 110 and the polishing surface as quickly as possible.
  • a description will now be given of the embodiment that forms the convexo-concave pattern as grooves.
  • FIG. 11 is a plan view of a carrier 110 G.
  • the top surface 112 a of the carrier 110 G has a plurality of grooves 116 C and 116 D configured to remove dusts. Except for the grooves 116 C and 116 D, the carrier 110 G is identical to the carrier 110 shown in FIG. 2 .
  • a pair of the grooves 116 D diverge from the same position on the groove 116 C apart from the center 111 a of the carrier 110 .
  • the diverging direction is not limited, but the groove 116 D is parallel to the adjacent groove 116 C at the diverging side in FIG. 11 .
  • the number of diverging points is not limited to one, and the diverged groove may further be diverged.
  • FIG. 14 is a plan view of a carrier 110 J.
  • the top surface 112 a of the carrier 110 J has a plurality of grooves 116 G configured to remove dusts. Except for the grooves 116 G, the carrier 110 J is identical to the carrier 110 shown in FIG. 2 .
  • a plurality of the grooves 116 G vertically extends from the center 111 a of the carrier 110 J.
  • the vortex extends clockwise in this embodiment but may also extend counterclockwise. The interval of the vortex may be constant or may not be constant.
  • the curved groove may extend concentrically, spirally, or vertically.
  • the grooves may also extend in any curved line, such as a quadratic curve, elliptic curve, or any other curves.
  • Each of the grooves 116 to 116 G has a width and depth of several tens of ⁇ m, and forms an isosceles triangular section.
  • each of the grooves 116 to 116 G has a V-shaped section but its sectional shape is not limited. While this embodiment forms the grooves 116 to 116 G on the top surface 112 a of each of the carriers 110 D- 110 K in the gravity direction, the bottom surface 112 b of the carriers 110 D to 110 K may also have these grooves additionally or exclusively.
  • the driving force of the motor 130 is transferred to the upper stool 160 via the gearbox 150 , and the upper stool 160 rotates in opposite directions to that of the lower stool 140 .
  • the tachogenerator 168 is placed around the rotation axis of the upper stool 160 , and outputs an analog voltage corresponding to the rotation rate of the upper stool 160 to the control unit 180 .
  • the pad 142 has a convexo-concave pattern 143 on the pad surface 142 a to remove dusts generated during polishing from between the carrier 110 and the polishing surface as quickly as possible.
  • the convexo-concave pattern 143 may be the groove shown in FIG. 8 to FIG. 16 , through-holes, or any other patterns.
  • FIG. 19A is a schematic sectional view showing a sun gear 156 , the carrier 110 , an outer gear 158 , a first dustproof mechanism 200 , and a second dustproof mechanism 240 .
  • This embodiment provides the sun gear 156 around the shaft 141 on the lower stool 140 under the gearbox 150 , and allows the sun gear 156 to rotate with the shaft 141 .
  • An alternative embodiment provides the sun gear 156 around the shaft 161 on the upper stool 160 over the gearbox 150 , and allows the sun gear 156 to rotate with the shaft 161 .
  • the sun gear 156 has teeth (cogs) 156 a.
  • the gearbox 150 serves as the sun gear and rotates.
  • the carrier 110 serves as the planetary gear, and rotates and revolves around the gearbox 150 .
  • the outer gear 158 is fixed.
  • the wiper 220 serves to prevent dust, which has been generated due to the engagements between the teeth 118 of the carrier 110 and the teeth 156 a of the sun gear 156 , from moving to the inside of the contact location 112 a 1 on the top surface 112 a of the carrier 110 .
  • the second block 250 has an annular shape, and is placed around and maintained stationary relative to the shaft 161 . However, it is optional that the second block 250 may be maintained stationary relative to the shaft 161 or rotate with the upper stool 160 .
  • the second block 250 includes convexes 252 a and 252 b, a groove 252 c, a convex 255 , an inner circumferential surface 256 , and an outer circumferential surface 257 .
  • FIG. 21 is a flowchart for explaining an operation of the polishing System 300 .
  • the control unit 180 increases the supply amount of the slurry S in increasing the polishing amount as a whole.
  • the control unit 180 reduces the supply amount of the slurry S in reducing the polishing amount as a whole. In other words, according to this embodiment, when the polishing amounts of the lower and upper stools 140 and 160 are different, the supply amount control over the slurry supply unit 175 cannot cancel this difference.
  • the control unit 180 supplies the current to the motor 130 , and rotates the lower stool 140 (step 1204 ) as well as in the step 1202 .
  • FIG. 28 is a schematic sectional view of a MEMS sensor 400 .
  • the MEMS sensor 400 includes a circuit substrate 410 , a pair of glass substrates 420 a and 420 b, a MEMS chip (electrical component) 430 , and wiring parts 440 and 442 .
  • the MEMS sensor 400 joins a pair of the glass substrates 420 a and 420 b to both sides of the MEMS chip 430 , and need the degree of flatness Ra of about 5 nm on surfaces 421 a and 421 b of the glass substrates 420 a and 420 b opposite to the MEMS chip 430 . It is conceivable to planarize only surfaces 421 a and 421 b of the glass substrates 420 a and 420 b opposite to the MEMS chip 430 , but the manufacture becomes easier when the front and back surfaces of the glass substrates 420 a and 420 b are not distinguished.
  • a circuit board 410 is manufactured by using the known technology (step 2100 ).
  • the circuit board 410 has the wiring pattern 412 on its front surface.
  • the MEMS sensor 400 is manufactured (step 2400 ).
  • pair of the glass substrates 420 a and 420 b of the conductive material 426 are connected to the wiring part 438 of the MEMS chip 430 .
  • the MEMS chip 430 is sealed in vacuum by joining the anodes of a pair of the glass substrates 420 a and 420 b to both sides of the wall 432 of the MEMS chip 430 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US12/155,133 2007-08-09 2008-05-29 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method Abandoned US20090042486A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-208395 2007-08-09
JP2007208395A JP2009039825A (ja) 2007-08-09 2007-08-09 研磨方法、基板及び電子機器の製造方法

Publications (1)

Publication Number Publication Date
US20090042486A1 true US20090042486A1 (en) 2009-02-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/155,133 Abandoned US20090042486A1 (en) 2007-08-09 2008-05-29 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method

Country Status (5)

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US (1) US20090042486A1 (ja)
EP (1) EP2025468A3 (ja)
JP (1) JP2009039825A (ja)
KR (1) KR20090015790A (ja)
CN (1) CN101362311A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235898A (ja) * 2012-05-07 2013-11-21 Shirasaki Seisakusho:Kk 両面研磨装置用キャリアの製造方法及びこれを用いた両面研磨装置並びに両面研磨方法
CN106312713B (zh) * 2016-08-30 2018-07-13 重庆凯龙科技有限公司 隔热板平面度加工装置
WO2018190780A1 (en) * 2017-04-12 2018-10-18 Ozyegin Universitesi Chemical mechanical planarization of gallium nitride
JP7212242B2 (ja) * 2018-08-21 2023-01-25 富士紡ホールディングス株式会社 被研磨物の保持具
CN115106871A (zh) * 2022-08-29 2022-09-27 成都中科卓尔智能科技集团有限公司 一种半导体材料表面缺陷柔性高精度修复装置及工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4081928A (en) * 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
US6062949A (en) * 1998-01-26 2000-05-16 Speedfam Co., Ltd. Polishing amount control system and method for same
US20020102931A1 (en) * 2001-01-31 2002-08-01 International Business Machines Corporation Work holding member for mechanical abrasion, abrading method, and abrading machine
US20080233840A1 (en) * 2007-03-19 2008-09-25 Siltronic Ag Method For The Simultaneous Grinding Of A Plurality Of Semiconductor Wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552305B2 (ja) * 1987-09-30 1996-11-13 東芝機械株式会社 両面研磨装置
JP2000305069A (ja) 1999-04-21 2000-11-02 Sanyo Electric Co Ltd 液晶表示用パネルの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4081928A (en) * 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
US6062949A (en) * 1998-01-26 2000-05-16 Speedfam Co., Ltd. Polishing amount control system and method for same
US20020102931A1 (en) * 2001-01-31 2002-08-01 International Business Machines Corporation Work holding member for mechanical abrasion, abrading method, and abrading machine
US6554689B2 (en) * 2001-01-31 2003-04-29 International Business Machines Corporation Work holding member for mechanical abrasion, abrading method, and abrading machine
US20080233840A1 (en) * 2007-03-19 2008-09-25 Siltronic Ag Method For The Simultaneous Grinding Of A Plurality Of Semiconductor Wafers

Also Published As

Publication number Publication date
EP2025468A3 (en) 2009-04-01
JP2009039825A (ja) 2009-02-26
EP2025468A2 (en) 2009-02-18
KR20090015790A (ko) 2009-02-12
CN101362311A (zh) 2009-02-11

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AS Assignment

Owner name: FUJITSU LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOKURA, FUMIHIKO;TAKEUCHI, MITSUO;REEL/FRAME:021067/0164

Effective date: 20080509

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION