US20080142358A1 - Device for picking up and holding a plurality of substrates and an electroplating device - Google Patents

Device for picking up and holding a plurality of substrates and an electroplating device Download PDF

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Publication number
US20080142358A1
US20080142358A1 US12/025,471 US2547108A US2008142358A1 US 20080142358 A1 US20080142358 A1 US 20080142358A1 US 2547108 A US2547108 A US 2547108A US 2008142358 A1 US2008142358 A1 US 2008142358A1
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US
United States
Prior art keywords
substrates
reception device
frame pieces
reception
galvanizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/025,471
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English (en)
Inventor
Christian Schmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
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Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Assigned to GEBR. SCHMID GMBH & CO. reassignment GEBR. SCHMID GMBH & CO. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHMID, CHRISTIAN
Publication of US20080142358A1 publication Critical patent/US20080142358A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to a device for receiving or holding several flat substrates in one plane, as well as a galvanizing or electroplating device with a passage path for the substrates through a treatment chamber, the substrates being held in an aforementioned device.
  • Hitherto substrates have been conveyed on conveying rollers lying in the manner of a roller conveyor in galvanizing devices for substrates, such as for example printed circuit boards or more especially solar cells or wafers.
  • substrates such as for example printed circuit boards or more especially solar cells or wafers.
  • the substrates can be formed from very thin silicon, which is correspondingly sensitive or fragile.
  • sensitive substrates have to be handled with extreme care, for example on introduction into a galvanizing device. In many cases this means either increased mechanical expenditure for the gripping devices or a decelerated handling, which gives rise to undesired delays.
  • the problem of the invention is to provide an aforementioned device for receiving or holding several flat substrates, as well as a galvanizing device suitable for the working thereof, enabling the problems of the prior art to be avoided and permitting a more careful working and conveying of the substrates.
  • the device has a frame with frame pieces forming reception zones between them and as a result of the frame pieces recesses or cutouts are formed.
  • the frame pieces can run in grid-like manner, particularly with an outer frame and intermediate frame pieces as subdivisions.
  • the frame pieces have supports for the substrates on which the substrates rest.
  • the mechanical holding of the substrates and/or an electrical contacting takes place on the substrate side engaging on the supports.
  • a reception device or holder for several flat substrates can be created, in which the substrates are placed in the reception zones.
  • the latter can be made more robust than the substrates, so that it is readily possible to use conventional gripping devices or the like.
  • the supports there can be a precisely defined connection between the reception device and the substrate, which can be matched to specific substrate characteristics.
  • the reception device it is possible in the case of a plurality of substrates to not only move one substrate in connection with individual working steps, but instead all the substrates of a reception device can be moved. If electrical contacting with the substrates takes place via the reception device or the supports, in certain cases it is possible to economize additional contacting devices directly on the substrates.
  • This also has the advantage that the mechanical loading of the substrates by contact rollers or other contacting devices can be reduced or avoided.
  • the reception device brings about both a mechanical holding or reception of the substrates and also an electrical contacting thereon.
  • the supports can for example be constructed as projections, which project or emanate from the frame pieces.
  • the projections can either be relatively narrow, i.e. almost punctiform, in order to bring about a very limited surface coverage on the substrates. This permits a contact with a treatment medium in a galvanizing device in an advantageous, very large-area manner.
  • the projections can be wider in order to bring about a type of linear supporting of the substrates with their marginal area on the receptacles or frame pieces. This permits an adequately stable supporting or bearing action, especially with sensitive substrates, because there is a distribution thereof.
  • the projections can also run below the plane of the frame pieces, for example by a downward bend. This makes it possible to have the bearing substrates in roughly one plane with the holder or the frame pieces.
  • the projections may project downwards over the plane formed by the underside of the frame pieces.
  • the substrates rest in the reception device or on the projections in such a way that their top side is not below the plane of the top side of the frame pieces and instead preferably projects by a small amount. This makes it possible to ensure that rollers or the like engaging from above in all cases also engage on the top side of the substrates and not mainly on the frame pieces projecting over the substrates.
  • contacts which project upwards.
  • electrical contacting can be improved independently of the material or construction of the projections.
  • Contacts can be in the form of contact projections, contact points or contact studs with electrically conductive surfaces.
  • the contacts can be made from contact material advantageously used for switching contacts.
  • seals it is possible to provide them with seals in such a way that no electrical contact takes place when the substrates are applied.
  • undesired deposits on the contacts can be avoided, because the treatment medium cannot come into direct engagement with the contacts as a result of the seal. It is possible to have cup or pot-shaped rubber seals around the contacts.
  • the entire reception device is electrically conductive and can for example be made from metal.
  • all parts or frame pieces of the reception device are electrically conductively interconnected.
  • such a receptacle can be rough worked from a metal sheet in the manner of a grid-like tray.
  • the reception device with an electrically insulating coating, for example paint or a covering. This avoids any deposition of coating material on the receptacle during a galvanizing process. If such deposition of coating material takes place on the aforementioned contacts as exposed surfaces of the reception device, then at certain time intervals said contacts must be cleaned or stripped free, as is known to the expert.
  • an electrically insulating coating for example paint or a covering.
  • a part or section of the device can project on an outside, particularly an outer area or from an outside frame piece. This is advantageously bent upwards from the plane of the substantially flat device, particularly with a further sideways bending following onto the same.
  • said projecting section is for example electrically conductively connected to the frame pieces or electrical contacts for the engagement of the substrates, then via said section there can be an electrical contacting with the reception device.
  • the section can for example be made from the same material as the remainder of the device, for example it can be rough worked from the aforementioned metal sheet. It is advantageously possible to construct the entire reception device integrally or in one piece. Said section can also be used for the gripping of the reception device in an area which is remote from the inserted substrates, so as to provide protection for the same.
  • the reception device in such a way that a substrate is sealingly located in a reception zone between adjacent frame pieces.
  • all the reception zones of a reception device carry substrates and in this way form a substantially liquid-tight surface.
  • the sealing or tightness requirements must at least be such that in the case of movement through the treatment medium or a liquid bath liquid does not penetrate from below through the areas between the substrate and the frame pieces, this applying in the case where the pressure of the liquid from below is only limited.
  • the reception device is constructed for identical substrates and each substrate is then held in the same way.
  • several reception zones are provided successively in juxtaposed manner, for example with an overall rectangular zone.
  • onto the reception device can be fixed a covering device or cover, particularly in a movable or articulated manner.
  • Substrates placed in the reception device can be fixed by the cover or secured against dropping out or becoming detached.
  • the cover can cover roughly the same surface area as the reception device.
  • it has a similar structure with pieces and interposed zones.
  • Particularly advantageously it is constructed in a substantially similar or almost identical manner to the reception device. If the substrates are also held or secured from above in the reception device, easier movement thereof is possible and in particular can be held vertically or even rotated.
  • the cover is fixed at a number of points to the reception device, it can be made much thinner or weaker because it does not necessarily have to form an independently supporting structure. Its function is solely to hold the substrates in the reception zones of the reception device.
  • the substrates run through the treatment chamber.
  • the latter contains a treatment medium, for example an electrolyte, for the galvanic application of a coating to the substrates.
  • the substrates can advantageously be thin printed circuit boards or alternatively thin solar cells, as described hereinbefore.
  • the passage path has conveying means, for example conveying rollers, wheels, etc.
  • the above-described reception device is conveyed or runs on the passage path through the treatment chamber.
  • On the reception devices or on the substrates can engage pressure rollers, wheels or the like for various different functions. It is possible for there to be at least one such pressure roller in the passage direction for each successive row of substrates. If the substrates are very sensitive, as stated hereinbefore, the pressure rollers are advantageously particularly soft so as not to damage the substrates.
  • An aforementioned reception device projects laterally over or away from the substrate plane and is in particular bent upwards.
  • the angular section extends to an aforementioned electric contacting means and is advantageously not in contact with the treatment medium or is positioned outside the galvanizing device. It is particularly advantageous to bend the reception device upwards and then to the side, so that the end projects over the galvanizing device.
  • Electrical contacting can take place through engaging contacting rollers or jointly running contact clips or other contacts, such as also contact brushes.
  • the treatment medium extends to the underside of the substrates passing through or up to the latter.
  • the height level can extend relatively precisely to the underside of the substrates. This can lead to a type of wave formation in the treatment medium, in order that the underside of the substrates is reached by the weak waves or with their wave crests.
  • substrates can be placed in the reception device in sealing manner, as described hereinbefore.
  • Electrodes or the like for the galvanizing process can be provided below the substrates. If the substrates pass in fully immersed manner through the treatment medium, electrodes can also be provided above the same.
  • contacting means can be provided forming an electrical contact with the substrates. They can be constructed as circumferential contacting rollers. For this purpose they can engage on the frame pieces, advantageously running in the conveying direction. It is particularly advantageous to provide at least one contacting means on each frame piece running in the conveying direction.
  • These frame pieces, on which the contacting means engage, can be advantageously higher than the substrates in the reception device. Thus, they are generally above the liquid bath level. They are also electrically conductive.
  • contact bridges can be provided, which run from the frame pieces with the contacting means to the substrates located therein. They can have a bow or bridge-like construction and lead bilaterally from the frame pieces to the substrates and the substrates can rest on ends of the contact bridges. This permits electrical contacting of the substrates even without conductive frames.
  • a contacting roller preferably on the same shaft.
  • the contacting means preferably contacting rollers, can be constructed resiliently or elastically, particularly with contacting surfaces projecting resiliently from a solid central part. They can be segmented, but this generally only serves to provide a more resilient construction.
  • FIG. 1A sloping view of an inventive reception device.
  • FIGS. 2 & 3 Larger scale detail views of the reception device of FIG. 1 .
  • FIG. 4 A sectional representation through an inventive galvanizing device for solar cells.
  • FIG. 5 A side view of the galvanizing device of FIG. 4 .
  • FIG. 6 A sloping view of another inventive galvanizing device.
  • FIG. 7 A larger scale detail view of the contacting on the reception device of FIG. 6 .
  • FIG. 1 shows in a sloping or oblique view a reception device 11 which is constructed in the manner of a tray.
  • Outside external frame pieces 12 and intermediate inside frame pieces 14 form a type of grid or lattice with recesses between them, so as to constitute reception zones 20 . It can be seen that all the reception zones 20 between frame pieces 12 and 14 are of the same size, although this need not be the case.
  • the reception device 11 can be made from metal, particularly a sheet metal plate. It can be coated in insulating manner with a covering or a paint, which is resistant to the treatment media generally used during galvanizing.
  • the marginal strip 17 is free on at least one side or has an electrically conductive surface, advantageously this is on both sides.
  • FIGS. 2 and 3 reveals how at a number of points projections 22 project from the frame pieces 12 and 14 . They can either be fixed subsequently to the frame pieces, for example by welding, or alternatively they can be rough worked by a punching process or the like from a single metal sheet together with said frame pieces.
  • the sectional view of FIG. 3 shows that the thickness of the projections 22 is less than the thickness of the frame pieces and in particular they are only half as thick.
  • the top side of the solar cells is not too far above the top side of the reception device 11 or frame pieces 12 and 14 . This is explained in greater detail hereinafter relative to FIGS. 4 and 5 .
  • the contacts 24 can for example be contact points or tips and can be made from a contact material normally used for switching contacts or the like, i.e. from a different material to the projections 22 . This has the advantage of even better contacting with the solar cells 26 or other substrates to be placed in the reception zones 20 .
  • walls 31 form a treatment chamber 32 housing an electrolyte as a treatment medium in which is dissolved the metal which is to be deposited on the solar cells 26 .
  • the reception devices 11 according to FIG. 1 are conveyed lying on conveying rollers 33 through the galvanizing device 30 .
  • the conveying rollers 33 are driven by a drive 34 .
  • numerous conveying rollers 33 are successively arranged and form a passage path for the reception devices 11 or solar cells 26 .
  • the reception device 11 is covered by a solar cell 26 .
  • the pressure rollers 36 engage on the top side of solar cells 26 in galvanizing device 30 . They comprise a very flexible rubber covering 37 on a metal core 38 and are also driven by drive 34 .
  • the pressure rollers 36 are positioned in such a way that they in each case rest relatively precisely centrally along the rows of successive solar cells 26 .
  • the function of the pressure rollers 36 is to hold the solar cells 26 in the reception device 11 or reception zones 20 and to ensure the engagement of the contacts 24 on the underside.
  • the angular section 26 of reception device 11 projects upwards at least over the level of the treatment medium in the treatment chamber 32 .
  • the rightwards-projecting marginal strip 17 projects over the right-hand wall 31 and beyond.
  • a contact roller 42 contacts the underside.
  • a plurality of contact rollers 42 is provided along the passage path. By means thereof there is a constant electrical contact with the marginal strip 17 and consequently the reception device 11 .
  • the contact roller 42 is once again connected to a power source 44 or its negative pole.
  • the positive pole of the power source 44 is connected to elongated electrodes 40 , which are positioned between the rollers above and below solar cells 26 in treatment chamber 32 .
  • the solar cells 26 are placed in the reception device 11 for treatment purposes. Electrical contacting of the solar cells with the reception device 11 takes place via the contacts 25 engaging with the underside.
  • the solar cells 26 can be firmly held in the reception zones 20 , for example by a further, grid-like frame, clips, etc.
  • springs or the like can be provided which press the solar cells 26 into the reception zones 20 or against the contacts 24 and are automatically locked on inserting the substrates.
  • small suction cups, a vacuum holding means, etc. for example in the vicinity of projections 22 . They can also embrace the contacts 24 with the aforementioned sealing function.
  • the solar cells 26 are advantageously made from silicon or are silicon wafers. Hitherto they have been printed on in complicated manner in part with silver paste as the contact material.
  • the galvanizing device 30 is provided to galvanically deposit the contact layer, particularly on the front of the solar cells.
  • the treatment medium in the treatment chamber 32 contains a corresponding proportion of contact material, for example silver.
  • the reception device 11 containing the solar cells 26 is then introduced into the galvanizing device 30 .
  • the reception device 11 moves along the passage path on conveying rollers 33 through said treatment chamber 32 . If deposition of silver is only to take place on the underside of the solar cells 26 , the height of the treatment medium can be correspondingly chosen or the treatment medium should only extend to the underside of the solar cells 26 .
  • the solar cells 26 are electrically conductively connected by their underside via contacts 24 and projections 22 , as well as frame pieces 12 and 14 with the angular section 16 or marginal strip 17 .
  • contact rollers 42 extend up to the marginal strip 17 and are once again connected to the negative pole of power source 44 , the undersides of the solar cells 26 are at this potential.
  • electrodes 40 connected to the positive pole of power source 44 , voltage is applied or the potential gradient to the solar cells 26 is built up for the deposition of silver from the treatment medium on the underside of solar cells 26 .
  • Process parameters such as the passage speed and composition of the treatment medium and the operation of the power source 44 , are in each case to be chosen as a function of the given application and provide no problem to the expert.
  • the reception device 11 with solar cells 26 is removed or extended out of the galvanizing device 30 . This can be followed by a further treatment or an intermediate storage. For as long as the solar cells 26 are not individually required or worked, they can be left in the reception device 11 . In the latter they can be easily conveyed, stored and protected against damage.
  • the coating is to be removed therefrom at certain time intervals. This process is called “destripping” by the experts. It is advantageous if the reception device 11 only has an electrically conductive surface in the vicinity of contacts 24 and marginal strip 17 , because then no coating can take place in the remaining areas. Alternatively to the aforementioned removal of a coating, this can take place in a wet chemical manner.
  • FIG. 4 shows how the pressure rollers 36 in each case press the solar cells 26 into the reception zones 20 .
  • the pressure rollers 36 As the top of the solar cells 26 project slightly over the top of the frame pieces 12 , 14 , it is ensured that the pressure rollers 36 always engage on the substrates or solar cells 26 and consequently press the latter downwards against the contacts 24 .
  • the power source 44 there can also be light sources below the solar cells 26 . They can assist the coating process by irradiating the solar cells 26 from below with light of a suitable wavelength, preferably in a range 400 to 1100 nm. In certain circumstances it is even conceivable for the necessary galvanizing current to be produced solely by the light sources. However, advantageously such a light-induced current generation is combined with an aforementioned, controlled power source.
  • a frame-like reception device 111 with outside frame pieces 112 and inside frame pieces 114 is covered with substrates 126 . They are conveyed by conveying rollers 133 through a plant similar to that described hereinbefore. Substrates 126 are held by pressure rollers 136 in the reception device 111 .
  • the pressure rollers 136 are located on the same shafts 150 as the intermediately provided contacting rollers 152 .
  • the latter have resilient contact zones 154 projecting from a central part 153 .
  • the contacting rollers 152 or contact zones 154 engage on the top of the frame pieces 114 .
  • the latter are continuously electrically conductive or have a corresponding coating or support.
  • contact bridges 155 project bilaterally. They can alternatively be in the form of clips or have some similarly functioning shape.
  • the contact bridges 155 pass into ends 156 on which rest the substrates 126 and are in this way electrically contacted in the aforementioned manner with the contacts 24 .

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Magnetic Heads (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US12/025,471 2005-08-09 2008-02-04 Device for picking up and holding a plurality of substrates and an electroplating device Abandoned US20080142358A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005039100A DE102005039100A1 (de) 2005-08-09 2005-08-09 Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
DE102005039100.1 2005-08-09
PCT/EP2006/007903 WO2007017279A1 (de) 2005-08-09 2006-08-09 Einrichtung zur aufnahme bzw. halterung mehrerer substrate und galvanisiereinrichtung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/007903 Continuation WO2007017279A1 (de) 2005-08-09 2006-08-09 Einrichtung zur aufnahme bzw. halterung mehrerer substrate und galvanisiereinrichtung

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US20080142358A1 true US20080142358A1 (en) 2008-06-19

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US12/025,471 Abandoned US20080142358A1 (en) 2005-08-09 2008-02-04 Device for picking up and holding a plurality of substrates and an electroplating device

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US (1) US20080142358A1 (ja)
EP (1) EP1913179B1 (ja)
JP (1) JP4908509B2 (ja)
KR (1) KR101389402B1 (ja)
CN (1) CN101316952B (ja)
AT (1) ATE472000T1 (ja)
AU (1) AU2006278145B2 (ja)
CA (1) CA2617502A1 (ja)
DE (2) DE102005039100A1 (ja)
ES (1) ES2348148T3 (ja)
IL (1) IL189256A0 (ja)
NO (1) NO20081174L (ja)
WO (1) WO2007017279A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9016230B2 (en) 2009-05-13 2015-04-28 Atotech Deutschland Gmbh Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
EP3170923A1 (en) * 2015-11-19 2017-05-24 Rohm and Haas Electronic Materials LLC Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US20190152713A1 (en) * 2017-11-21 2019-05-23 Chemcut Holdings LLC Lightweight roller

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007054093B3 (de) 2007-11-13 2009-07-23 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Transport von flachem Gut in Durchlaufanlagen
DE102008022282A1 (de) * 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen
DE102008026199B3 (de) 2008-05-30 2009-10-08 Rena Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von ebenem Gut in Durchlaufanlagen
DE102009018360A1 (de) 2009-04-23 2010-11-04 Rena Gmbh Verfahren und Vorrichtung zur elektrolytischen Behandlung von Solarzellen
DE102010008233A1 (de) 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
EP2553733A2 (de) 2010-04-01 2013-02-06 Somont GmbH Solarzellen und herstellungsverfahren dafür
DE102010014555A1 (de) 2010-04-01 2011-10-06 Somont Gmbh Verfahren und Vorrichtung zur elektrochemischen Metallisierung von flachem Gut
JP5792820B2 (ja) * 2010-09-23 2015-10-14 サンパワー コーポレイション 電気メッキ用の非浸透性基板キャリア
DE102010042481A1 (de) 2010-10-15 2012-04-19 Roth & Rau Ag Verfahren zur galvanischen Erzeugung von Kontaktstrukturen auf Wafern für die Produktion von Solarzellen und Modulen
WO2013050805A1 (de) * 2011-10-06 2013-04-11 Roth & Rau Ag Substratwendeeinrichtung
KR101392779B1 (ko) 2012-04-05 2014-05-08 주식회사 호진플라텍 태양전지용 양면 전기 도금을 위한 기판 캐리어 장치
DE102014225270A1 (de) 2014-12-09 2016-06-09 Gebr. Schmid Gmbh Kontaktrahmen für elektrochemische Substratbeschichtung
DE102018111868A1 (de) * 2018-05-17 2019-11-21 Meyer Burger (Germany) Gmbh Substratträger

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347771A (en) * 1965-01-25 1967-10-17 Bendix Corp Lead-tin alloy plating fixture for silicon
US3824176A (en) * 1972-08-28 1974-07-16 Buckbee Mears Co Matrix holder
US4192729A (en) * 1978-04-03 1980-03-11 Burroughs Corporation Apparatus for forming an aluminum interconnect structure on an integrated circuit chip
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4752371A (en) * 1986-02-28 1988-06-21 Schering Aktiengesellschaft Elongated frame for releasably-holding printed circuit boards
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US5914016A (en) * 1996-07-17 1999-06-22 Gebr. Schmid Gmbh & Co. Apparatus for the treatment of articles
US6080289A (en) * 1998-10-28 2000-06-27 International Business Machines Corporation Electroplating apparatus with self-cleaning contacts
US20010037945A1 (en) * 2000-05-08 2001-11-08 Wataru Okase Liquid treatment equipment and liquid treatment method
US6319383B1 (en) * 1997-08-21 2001-11-20 Atotech Deutschland Gmbh Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
US6395163B1 (en) * 1992-08-01 2002-05-28 Atotech Deutschland Gmbh Process for the electrolytic processing especially of flat items and arrangement for implementing the process
US20030010643A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing wafers and other planar articles within a processing cell
US20050061605A1 (en) * 2002-08-06 2005-03-24 Bell Malcolm Reginald Hallis Fraud prevention
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1190514A (en) * 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
JPH04263097A (ja) * 1991-02-16 1992-09-18 Murata Mfg Co Ltd 電子部品の外部電極形成方法
DE4330346C1 (de) * 1993-09-08 1994-11-03 Stohrer Doduco Gmbh & Co Vorrichtung zum anodischen Oxidieren von Werkstücken
DE4340346A1 (de) * 1993-11-26 1995-06-01 Audi Ag Verwendung und Herstellverfahren für ein Deformationselement im Fahrzeugbau sowie Deformationselement
JPH08302497A (ja) * 1995-05-10 1996-11-19 Hitachi Cable Ltd めっき装置用給電ロールおよびロール支持機構
JPH10226897A (ja) * 1997-02-19 1998-08-25 Dainippon Printing Co Ltd メッキ方法および装置
DE19842974A1 (de) * 1998-09-19 2000-03-23 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
JP2005023398A (ja) * 2003-07-04 2005-01-27 Kaneko Denki Kk メッキ方法およびメッキ装置

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347771A (en) * 1965-01-25 1967-10-17 Bendix Corp Lead-tin alloy plating fixture for silicon
US3824176A (en) * 1972-08-28 1974-07-16 Buckbee Mears Co Matrix holder
US4192729A (en) * 1978-04-03 1980-03-11 Burroughs Corporation Apparatus for forming an aluminum interconnect structure on an integrated circuit chip
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4752371A (en) * 1986-02-28 1988-06-21 Schering Aktiengesellschaft Elongated frame for releasably-holding printed circuit boards
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
US6395163B1 (en) * 1992-08-01 2002-05-28 Atotech Deutschland Gmbh Process for the electrolytic processing especially of flat items and arrangement for implementing the process
US5914016A (en) * 1996-07-17 1999-06-22 Gebr. Schmid Gmbh & Co. Apparatus for the treatment of articles
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US6319383B1 (en) * 1997-08-21 2001-11-20 Atotech Deutschland Gmbh Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
US6080289A (en) * 1998-10-28 2000-06-27 International Business Machines Corporation Electroplating apparatus with self-cleaning contacts
US20010037945A1 (en) * 2000-05-08 2001-11-08 Wataru Okase Liquid treatment equipment and liquid treatment method
US20030010643A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing wafers and other planar articles within a processing cell
US20050061605A1 (en) * 2002-08-06 2005-03-24 Bell Malcolm Reginald Hallis Fraud prevention
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9016230B2 (en) 2009-05-13 2015-04-28 Atotech Deutschland Gmbh Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
US9713265B2 (en) 2009-05-13 2017-07-18 Atotech Deutschland Gmbh Method, treatment station and assembly for treating a planar material to be treated
EP3170923A1 (en) * 2015-11-19 2017-05-24 Rohm and Haas Electronic Materials LLC Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US20190152713A1 (en) * 2017-11-21 2019-05-23 Chemcut Holdings LLC Lightweight roller
US11078025B2 (en) * 2017-11-21 2021-08-03 Chemcut Holdings LLC Lightweight roller

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AU2006278145B2 (en) 2010-11-18
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EP1913179B1 (de) 2010-06-23
WO2007017279A1 (de) 2007-02-15
DE502006007271D1 (de) 2010-08-05
AU2006278145A1 (en) 2007-02-15
ES2348148T3 (es) 2010-11-30
CN101316952A (zh) 2008-12-03
JP2009504906A (ja) 2009-02-05
NO20081174L (no) 2008-03-05
CA2617502A1 (en) 2007-02-15
EP1913179A1 (de) 2008-04-23
ATE472000T1 (de) 2010-07-15
KR101389402B1 (ko) 2014-05-27
DE102005039100A1 (de) 2007-02-15

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