NO20081174L - Anordning for opptak og holding av flere substrater, samt galvaniseringsanordning - Google Patents

Anordning for opptak og holding av flere substrater, samt galvaniseringsanordning

Info

Publication number
NO20081174L
NO20081174L NO20081174A NO20081174A NO20081174L NO 20081174 L NO20081174 L NO 20081174L NO 20081174 A NO20081174 A NO 20081174A NO 20081174 A NO20081174 A NO 20081174A NO 20081174 L NO20081174 L NO 20081174L
Authority
NO
Norway
Prior art keywords
solar cells
recording
holding
well
electroplating device
Prior art date
Application number
NO20081174A
Other languages
English (en)
Inventor
Christian Schmid
Original Assignee
Schmid Gmbh & Co Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Gmbh & Co Geb filed Critical Schmid Gmbh & Co Geb
Publication of NO20081174L publication Critical patent/NO20081174L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Heads (AREA)

Abstract

For å behandle solceller (26) i en elektroplatteringsanordning (30) kan de bli innsatt i en gitteraktig eller brettaktig opptaksanordning (11). De blir således mekanisk holdt, og elektrisk kontakt blir gjort med dem via kontakter (24). I stedet for individuelle solceller (26) blir opptaksanordningene (11) beveget med et stort antall innsatte solceller gjennom elektroplatteringsanordningene (11) beveget med et stort antall innsatte solceller gjennom elektroplatteringsinnretningen (30) for behandling. Elektrisk kontakt blir i dette tilfellet gjort med solcellene (26) ved hjelp av kontaktene (24) og rammebena (12,14) på en ragende vinkelseksjon (16) sammen med kantstriper (17) hos opptaksanordningen. Kontaktruller (42) hviler på kantstripene og er koblet til en elektrisk strømkilde (44).
NO20081174A 2005-08-09 2008-03-05 Anordning for opptak og holding av flere substrater, samt galvaniseringsanordning NO20081174L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005039100A DE102005039100A1 (de) 2005-08-09 2005-08-09 Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
PCT/EP2006/007903 WO2007017279A1 (de) 2005-08-09 2006-08-09 Einrichtung zur aufnahme bzw. halterung mehrerer substrate und galvanisiereinrichtung

Publications (1)

Publication Number Publication Date
NO20081174L true NO20081174L (no) 2008-03-05

Family

ID=37075698

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20081174A NO20081174L (no) 2005-08-09 2008-03-05 Anordning for opptak og holding av flere substrater, samt galvaniseringsanordning

Country Status (13)

Country Link
US (1) US20080142358A1 (no)
EP (1) EP1913179B1 (no)
JP (1) JP4908509B2 (no)
KR (1) KR101389402B1 (no)
CN (1) CN101316952B (no)
AT (1) ATE472000T1 (no)
AU (1) AU2006278145B2 (no)
CA (1) CA2617502A1 (no)
DE (2) DE102005039100A1 (no)
ES (1) ES2348148T3 (no)
IL (1) IL189256A0 (no)
NO (1) NO20081174L (no)
WO (1) WO2007017279A1 (no)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007054093B3 (de) 2007-11-13 2009-07-23 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Transport von flachem Gut in Durchlaufanlagen
DE102008022282A1 (de) * 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen
DE102008026199B3 (de) 2008-05-30 2009-10-08 Rena Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von ebenem Gut in Durchlaufanlagen
DE102009018360A1 (de) 2009-04-23 2010-11-04 Rena Gmbh Verfahren und Vorrichtung zur elektrolytischen Behandlung von Solarzellen
TWI487442B (zh) 2009-05-13 2015-06-01 Atotech Deutschland Gmbh 用於處理待處理平面材料的方法、處理台與組件
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
WO2011120714A2 (de) 2010-04-01 2011-10-06 Somont Gmbh Solarzellen und herstellverfahren dafür
DE102010014555A1 (de) 2010-04-01 2011-10-06 Somont Gmbh Verfahren und Vorrichtung zur elektrochemischen Metallisierung von flachem Gut
CN203795007U (zh) * 2010-09-23 2014-08-27 太阳能公司 用于电镀的不可渗透基板载体
DE102010042481A1 (de) 2010-10-15 2012-04-19 Roth & Rau Ag Verfahren zur galvanischen Erzeugung von Kontaktstrukturen auf Wafern für die Produktion von Solarzellen und Modulen
WO2013050805A1 (de) * 2011-10-06 2013-04-11 Roth & Rau Ag Substratwendeeinrichtung
KR101392779B1 (ko) * 2012-04-05 2014-05-08 주식회사 호진플라텍 태양전지용 양면 전기 도금을 위한 기판 캐리어 장치
DE102014225270A1 (de) 2014-12-09 2016-06-09 Gebr. Schmid Gmbh Kontaktrahmen für elektrochemische Substratbeschichtung
US20170145577A1 (en) * 2015-11-19 2017-05-25 Rohm And Haas Electronic Materials Llc Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US11078025B2 (en) * 2017-11-21 2021-08-03 Chemcut Holdings LLC Lightweight roller
DE102018111868A1 (de) * 2018-05-17 2019-11-21 Meyer Burger (Germany) Gmbh Substratträger

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347771A (en) * 1965-01-25 1967-10-17 Bendix Corp Lead-tin alloy plating fixture for silicon
US3824176A (en) * 1972-08-28 1974-07-16 Buckbee Mears Co Matrix holder
US4192729A (en) * 1978-04-03 1980-03-11 Burroughs Corporation Apparatus for forming an aluminum interconnect structure on an integrated circuit chip
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
CA1190514A (en) * 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
ES2024439B3 (es) * 1986-02-28 1992-03-01 Schering Ag Berlin Und Bergkamen Armazones alargados y piezas correspondientes para la fijacion soltable de placas de circuito impreso que han de galvanizarse, y placas de circuito impreso correspondientes.
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
JPH04263097A (ja) * 1991-02-16 1992-09-18 Murata Mfg Co Ltd 電子部品の外部電極形成方法
US6395163B1 (en) * 1992-08-01 2002-05-28 Atotech Deutschland Gmbh Process for the electrolytic processing especially of flat items and arrangement for implementing the process
DE4330346C1 (de) * 1993-09-08 1994-11-03 Stohrer Doduco Gmbh & Co Vorrichtung zum anodischen Oxidieren von Werkstücken
DE4340346A1 (de) * 1993-11-26 1995-06-01 Audi Ag Verwendung und Herstellverfahren für ein Deformationselement im Fahrzeugbau sowie Deformationselement
JPH08302497A (ja) * 1995-05-10 1996-11-19 Hitachi Cable Ltd めっき装置用給電ロールおよびロール支持機構
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
JPH10226897A (ja) * 1997-02-19 1998-08-25 Dainippon Printing Co Ltd メッキ方法および装置
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
DE19842974A1 (de) * 1998-09-19 2000-03-23 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
US6080289A (en) * 1998-10-28 2000-06-27 International Business Machines Corporation Electroplating apparatus with self-cleaning contacts
KR20010104651A (ko) * 2000-05-08 2001-11-26 히가시 데쓰로 액 처리 장치 및 액 처리 방법
US6524463B2 (en) * 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
GB0218259D0 (en) * 2002-08-06 2002-09-11 Money Controls Ltd Fraud prevention
JP2005023398A (ja) * 2003-07-04 2005-01-27 Kaneko Denki Kk メッキ方法およびメッキ装置
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells

Also Published As

Publication number Publication date
US20080142358A1 (en) 2008-06-19
JP4908509B2 (ja) 2012-04-04
CA2617502A1 (en) 2007-02-15
ES2348148T3 (es) 2010-11-30
CN101316952A (zh) 2008-12-03
AU2006278145A1 (en) 2007-02-15
KR101389402B1 (ko) 2014-05-27
AU2006278145B2 (en) 2010-11-18
EP1913179B1 (de) 2010-06-23
IL189256A0 (en) 2008-08-07
KR20080034992A (ko) 2008-04-22
JP2009504906A (ja) 2009-02-05
WO2007017279A1 (de) 2007-02-15
CN101316952B (zh) 2011-09-07
DE502006007271D1 (de) 2010-08-05
DE102005039100A1 (de) 2007-02-15
EP1913179A1 (de) 2008-04-23
ATE472000T1 (de) 2010-07-15

Similar Documents

Publication Publication Date Title
NO20081174L (no) Anordning for opptak og holding av flere substrater, samt galvaniseringsanordning
SE0201321D0 (sv) An implantable medical device and a manufacturing method thereof
EP1817808A4 (en) ELECTRODE CONNECTOR WITH ASSEMBLED PLATE AND BATTERY MODULE
ATE484077T1 (de) Elektrische anschluss- und verbindungsdose für ein solarzellenmodul
ATE494648T1 (de) Kontaktvorrichtung zum kontaktieren von leiterfolien
NZ584290A (en) Battery consisting of a plurality of cells positioned and connected together in a separating and positioning casing without the use of welding
WO2009111665A3 (en) Use of chained implants in solar cells
TW200623833A (en) Image reading apparatus
WO2007041533A3 (en) Photovoltaic module with improved backplane
DK2208234T5 (da) Fotovoltaisk indretning
ZA200805715B (en) Solar cell with physically separated distributed electrical contacts
GB2387232B (en) Measuring arrangement,energy storage module and electrical device
ATE509392T1 (de) Anschluss-system zur realisierung von abzweigungen an durchgehenden leitern
WO2008120162A3 (en) Electrochemical energy source and electronic device provided with such an electrochemical energy source
DK1786439T3 (da) Fremgangsmåder til aktivering af NKT-celler
ATE371969T1 (de) Anschlussystem zum anschluss elektrischer leiter an ein elektrisches gerät
WO2009065088A3 (en) Solar-powered headset
TW200721493A (en) Power semiconductor device with integrated passive component
WO2009090172A3 (en) Apparatus and method for manufacturing fast and low cost electrical contacts to solar modules
ATE438203T1 (de) Vorrichtung für die energieversorgung
WO2009086803A3 (de) Photovoltaikelement, trägerstruktur, verfahren zur montage einer trägerstruktur und kraftwerk dazu
DK1403981T3 (da) Konnektor, hvori der i en lang periode kan opretholdes kontaktkraft
FR2839979B1 (fr) Dispositif de culture de cellules
SG143166A1 (en) Ground structure, and heater and chemical vapor deposition apparatus including the same
WO2007021994A3 (en) Electrode shielding for electroporation

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application