US20080087573A1 - Carrier tape and method of wrapping semiconductor devices using the same - Google Patents

Carrier tape and method of wrapping semiconductor devices using the same Download PDF

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Publication number
US20080087573A1
US20080087573A1 US11/907,720 US90772007A US2008087573A1 US 20080087573 A1 US20080087573 A1 US 20080087573A1 US 90772007 A US90772007 A US 90772007A US 2008087573 A1 US2008087573 A1 US 2008087573A1
Authority
US
United States
Prior art keywords
pocket
tape
carrier tape
frame
perforation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/907,720
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English (en)
Inventor
Moon-Soo Han
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, MOON-SOO
Publication of US20080087573A1 publication Critical patent/US20080087573A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D83/00—Containers or packages with special means for dispensing contents
    • B65D83/04—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills
    • B65D83/0445—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments
    • B65D83/0463—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments formed in a band or a blisterweb, inserted in a dispensing device or container
    • B65D83/0472—Containers or packages with special means for dispensing contents for dispensing annular, disc-shaped, or spherical or like small articles, e.g. tablets or pills all the articles being stored in individual compartments formed in a band or a blisterweb, inserted in a dispensing device or container the band being wound in flat spiral, folded in accordion or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Definitions

  • carrier tapes or trays may be used as the wrapping materials.
  • the carrier tape protects the semiconductor packages included therein from external shocks, and allows the semiconductor packages to be handled more easily.
  • FIG. 1 is a perspective view showing a carrier tape according to the conventional art.
  • semiconductor devices may be loaded in pockets 14 that are recessed on a carrier tape 10 . Upper portions of the pockets 14 may then be sealed by a cover tape 20 .
  • the carrier tape 10 may be wound on a reel 30 and transferred to the user.
  • the user may withdraw the semiconductor devices from the carrier tape 10 to use the semiconductor packages.
  • the cover tape 20 may be removed first, and the semiconductor devices included in the pockets 14 withdrawn.
  • sprocket holes 12 may be used when the carrier tape 10 is wound/unwound, or when the cover tape 20 is attached/detached.
  • the conventional carrier tape 10 once the cover tape 20 is removed to withdraw the semiconductor devices, it may be impossible to use the cover tape 20 and carrier tape 10 again. As such, the conventional carrier tape may be discarded to become a cause of environmental contamination. Further, even if a defect occurs on only one portion of the plurality of pockets 14 and/or the cover tape 20 , the entire carrier tape 10 and/or the cover tape 20 must be discarded.
  • Example embodiments may provide a carrier tape that may be recyclable so as not to become a cause of environmental contamination. Even when a defect occurs on recesses of a carrier tape, a corresponding part may be easily replaced. Thus, the carrier tape may be more economically and environmentally advantageous over the conventional art.
  • Example embodiments also may provide a method of wrapping semiconductor devices using the tape carrier.
  • a carrier tape for receiving semiconductor devices may include a frame tape having perforation portions, and a pocket.
  • the pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket.
  • the pocket may be capable of being attached/detached into/from the perforation portion.
  • a pair of stoppers facing each other may be disposed on an opening portion of the pocket.
  • the semiconductor device may be separated by moving the stoppers so that the pocket and the carrier tape may be recycled.
  • the pocket may be inserted into the perforation portion to be attached into the frame tape.
  • the carrier tape may further include a reel, on which the frame tape may be wound.
  • a lip portion in parallel with the recessed bottom may be formed on at least a portion of the opening portion of the pocket with constant width. The lip portion may prevent the pocket from penetrating the perforation portion even if the pocket is forcefully inserted into the perforation portion of the frame tape.
  • the pocket may be removably inserted into the perforation portion of the frame tape, and the lip portion may be mounted on a peripheral surface of the perforation portion of the frame tape.
  • the stoppers may be disposed in parallel to the recessed bottom to prevent the semiconductor device from escaping from the pocket.
  • the stoppers may be capable of rotating toward the recessed bottom and may be incapable of moving toward the opposite direction of the recessed bottom.
  • the pocket may be inserted into the perforation portion of the frame tape, and the pocket may include a protrusion at least on a side surface of the pocket for preventing the pocket from escaping from the frame tape.
  • a method of wrapping semiconductor devices using a carrier tape which may include a frame tape having perforation portions, and a pocket.
  • the pocket may have a recessed bottom, on which the semiconductor device may be received, and a stopper that may prevent the semiconductor device received in the recessed bottom from escaping from the pocket.
  • the pocket may be capable of being attached/detached into/from the perforation portion.
  • the method may include attaching the pocket onto the frame tape, and inserting the semiconductor device into the pocket.
  • FIG. 1 is a perspective view of a carrier tape according to the conventional art
  • FIGS. 2A and 2B are perspective views of a frame tape and a pocket according to an example embodiment
  • FIG. 3 is a perspective view of a carrier tape, in which the pocket of FIG. 2B is attached on the frame tape of FIG. 2A , according to an example embodiment
  • FIG. 4 is a cross-sectional view of the carrier tape taken along line IV-IV of FIG. 3 ;
  • FIG. 5 is a cross-sectional view of a pocket according to an example embodiment
  • FIG. 6 is a cross-sectional view of a pocket according to an example embodiment
  • FIG. 7 is a cross-sectional view of a pocket illustrating how a protrusion formed thereon prevent the pocket from escaping from the frame tape according to an example embodiment
  • FIGS. 8A and 8B are cross-sectional views of protrusions according to an example embodiment.
  • FIG. 9 is a perspective view illustrating a method of wrapping semiconductor devices according to an example embodiment.
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to example embodiments set forth herein. Rather, example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the thicknesses of layers and regions are exaggerated for clarity.
  • Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
  • a carrier tape for receiving semiconductor devices.
  • the carrier tape may include a frame tape having perforation portions, and pockets.
  • Each pocket may include a recessed bottom on which the semiconductor device may be received, and a stopper for preventing the received semiconductor device from escaping from the pocket.
  • the pocket may be capable of being attached/detached into/from the perforation portions.
  • FIG. 2A is a perspective view of a frame tape according example embodiments
  • FIG. 2B is a perspective view of a pocket according to example embodiments
  • FIG. 3 is a perspective view of a carrier tape according to example embodiments.
  • the frame tape 100 may include perforation portions 110 .
  • the frame tape 100 may optionally include sprocket holes 120 that may be used when the frame tape 100 is wound/unwound.
  • the frame tape 100 may be formed of the same material as that of a conventional carrier tape. However, the frame tape 100 is not limited thereto because there may be no need for the frame tape 100 to be attached to a cover tape. Therefore, a wide variety of materials may be used to form the frame tape 100 .
  • a conventional carrier tape may have various widths according to the sizes of the semiconductor devices that are to be received, and a certain semiconductor device may only be received in a carrier tape having a corresponding width.
  • the carrier tape 100 semiconductor devices of different sizes may be received by changing pockets 200 ( FIG. 2B ).
  • the pocket and the frame tape are recyclable and therefore are more environmentally friendly.
  • the size of perforation portion 110 may be adjusted to correspond to a size of the pocket (not shown) that is attached to the frame tape 100 .
  • the perforation portions 110 may be arranged with a predetermined interval therebetween to facilitate automation.
  • the sprocket holes 120 may be fabricated to have various shapes/intervals.
  • the pocket 200 may include a recessed bottom 210 where the semiconductor device (not shown) may be received, and a stopper 220 that may prevent the semiconductor device from escaping from the pocket 200 .
  • a pair of stoppers 220 facing each other may be disposed on an opening portion of the pocket.
  • the stopper 220 may use a structure familiar to those of skill in the art. However, the structure of the stopper 220 is not limited thereto.
  • the inner space in the pocket 200 may be adjusted according to the size of the semiconductor device that is to be received in the pocket 200 . If the semiconductor device is small, a pocket having smaller inner space may be used to receive the semiconductor device, but still have the same outer appearance of the pocket 200 . Therefore, the frame tape 100 may be used to receive semiconductor devices having various sizes to provide a more economical and easily automated alternative to the conventional carrier tape.
  • the pocket 200 may be inserted into the perforation portion 110 of the frame tape 100 .
  • the pocket 200 may include a lip portion 230 that may be formed with constant width on at least a part of the opening in parallel with the recessed bottom 210 .
  • lip portions 230 may be disposed on facing two sides of the opening of the pocket 200 .
  • the lip portions 230 may also be formed on all sides of the opening. The lip portions 230 may prevent the pocket 200 from passing through the perforation portion 110 when the pocket 200 is inserted into the perforation portion 110 of the frame tape 100 .
  • FIG. 3 is a perspective view showing the pocket 200 mounted on the frame tape 100 .
  • FIG. 4 is a cross-sectional view showing the pocket taken along line IV-IV of FIG. 3 .
  • the lip portions 230 of the pocket 200 may be mounted on the peripheral surfaces of the perforation portion 110 of the frame tape 100 .
  • FIG. 5 is a cross-sectional view of a pocket 300 according to example embodiments.
  • a stopper 320 of the pocket 300 may be parallel with recessed bottom 310 to prevent the semiconductor device from escaping from the pocket 300 .
  • the stopper 320 may rotate toward the recessed bottom (direction A in FIG. 5 ). However, the stopper 320 may not rotate toward the opposite portion (opposite direction to the direction A in FIG. 5 ) to prevent the semiconductor device (not shown) received in the pocket 300 from escaping out of the pocket 300 .
  • the stopper 320 may be sufficiently rotated in the direction A of FIG. 5 to ensure a sufficient space so the semiconductor device may be withdrawn.
  • FIG. 6 is a cross-sectional view of a pocket 400 according to example embodiments.
  • the pocket 400 may be inserted into the perforation portion 110 of the frame tape 100 .
  • a protrusion 440 may be disposed on at least one side surface 450 of the pocket 400 to prevent the pocket 400 from escaping from the frame tape 100 .
  • FIG. 7 is a cross-sectional view of a pocket showing how the protrusion 440 may prevent the pocket 400 from escaping from the frame tape 100 .
  • the pocket 400 may be inserted into the frame tape 100 .
  • lip portions 430 may be mounted on the frame tape 100 , and edges of the perforation portion of the frame tape 100 may be inserted between the protrusions 440 and the lip portions 430 . Therefore, the escape of the pocket 400 from the frame tape 100 may be prevented by the protrusion 440 .
  • the edges of the frame tape 100 may be removed from the gap between the protrusion 440 and the lip portion 430 .
  • side portions of the frame tape 100 may be extended to both side directions to separate the pocket 400 , or both side surfaces 450 of the pocket 400 may be pressed to separate the pocket 400 from the frame tape 100 .
  • FIGS. 8A and 8B are cross-sectional views of a part of a pocket 400 showing examples of the protrusion 440 .
  • an upper edge of a protrusion 440 a may be rounded.
  • it may be easier to separate the pocket 400 from the frame tape 100 .
  • an end portion of a protrusion 440 b may be attached to the side surface 450 of the pocket 400 , and the other end of the protrusion 440 b may be separated from the side surface 450 .
  • the end portion of the protrusion 440 b may be attached onto the side surface 450 of the pocket 400 so as to be inclined. If an external force is not applied, the other end of the protrusion 440 b may be separated from the side surface 450 of the pocket 400 as denoted by the solid line in FIG. 8B . If an external force is applied toward the center portion of the pocket 400 , the protrusion portion 440 b may be bent and may be adhered onto the side surface 450 of the pocket 400 .
  • the pocket 400 may be easily inserted into the frame tape 100 .
  • the other end portion of the protrusion 440 b may be separated from the side surface 450 of the pocket 400 to prevent the pocket 400 from escaping from the frame tape 100 .
  • the pocket 400 is to be separated, the other end may be pressed to contact the side surface 450 of the pocket 400 and the pocket 400 may be easily separated from the frame tape 100 .
  • the carrier tape may further include a reel.
  • the reel may be the reel 30 of FIG. 1 , but is not limited thereto.
  • the carrier tape may be easily handled.
  • a method of wrapping semiconductor devices using a carrier tape receiving semiconductor devices which may include a frame tape having perforation portions, and a pocket including a recessed bottom, on which the semiconductor device may be received, and a stopper preventing the semiconductor device from escaping from the pocket, and capable of being attached/detached into/from the perforation portion, the method may include attaching the pocket into the frame tape, and inserting the semiconductor device into the pocket.
  • FIG. 9 is an exploded perspective view illustrating an example method of wrapping the semiconductor device.
  • the pocket 200 may be removably attached into the perforation portion 110 of the frame tape 110 and a semiconductor device 500 may be inserted into the pocket 200 . Attaching of the pocket 200 may be performed by inserting the pocket 200 into the perforation portion 110 . As described above, the pocket 200 may be inserted until the lip portions of the pocket 200 are mounted on the surface of the frame tape 100 .
  • the stoppers 230 may be folded toward the inside of the pocket 200 , and then, unfolded. After inserting the semiconductor device 500 into the pocket 200 , the stoppers 230 may be arranged in parallel with the recessed bottom of the pocket 200 to prevent the semiconductor device 500 from escaping from the pocket 200 .
  • the carrier tape may be recyclable to be more environmentally friendly. Even if a defective portion is generated on the pocket, the corresponding portion may be easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape of example embodiments.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
US11/907,720 2006-10-17 2007-10-17 Carrier tape and method of wrapping semiconductor devices using the same Abandoned US20080087573A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060101026A KR100771888B1 (ko) 2006-10-17 2006-10-17 캐리어 테이프 및 그를 이용한 반도체 소자의 포장 방법
KR10-2006-0101026 2006-10-17

Publications (1)

Publication Number Publication Date
US20080087573A1 true US20080087573A1 (en) 2008-04-17

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Application Number Title Priority Date Filing Date
US11/907,720 Abandoned US20080087573A1 (en) 2006-10-17 2007-10-17 Carrier tape and method of wrapping semiconductor devices using the same

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US (1) US20080087573A1 (ko)
KR (1) KR100771888B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103625774A (zh) * 2013-12-11 2014-03-12 苏州康铂塑料科技有限公司 一种回收可利用的电子包装载带
CN103662402A (zh) * 2013-12-16 2014-03-26 苏州康铂塑料科技有限公司 芯片载带定位结构

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444993A (en) * 1968-04-23 1969-05-20 Thomas J Lunsford Component package with dust cover
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
US5119934A (en) * 1989-07-14 1992-06-09 Seiko Epson Corporation Transport carrier tape with integral component engaging means
US5360110A (en) * 1992-09-14 1994-11-01 Matsushita Electric Industrial Co., Ltd. Component container
US5472085A (en) * 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
US5690233A (en) * 1995-03-30 1997-11-25 Kaneko Denki Kabushiki Kaisha Carrier tape with recesses for electronic parts
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5967328A (en) * 1998-01-22 1999-10-19 Dial Tool Industries, Inc. Part carrier strip
US6016918A (en) * 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US6270614B1 (en) * 1997-04-02 2001-08-07 Fujitsu Limited Method for fabricating carrier tape
US6681937B2 (en) * 2001-06-08 2004-01-27 Smk Corporation Packing tape composition and packing method using the packing tape composition
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US20040206665A1 (en) * 2003-04-16 2004-10-21 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Transport tape

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444993A (en) * 1968-04-23 1969-05-20 Thomas J Lunsford Component package with dust cover
US5119934A (en) * 1989-07-14 1992-06-09 Seiko Epson Corporation Transport carrier tape with integral component engaging means
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
US5360110A (en) * 1992-09-14 1994-11-01 Matsushita Electric Industrial Co., Ltd. Component container
US5472085A (en) * 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
US5690233A (en) * 1995-03-30 1997-11-25 Kaneko Denki Kabushiki Kaisha Carrier tape with recesses for electronic parts
US6270614B1 (en) * 1997-04-02 2001-08-07 Fujitsu Limited Method for fabricating carrier tape
US5967328A (en) * 1998-01-22 1999-10-19 Dial Tool Industries, Inc. Part carrier strip
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US6016918A (en) * 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US6681937B2 (en) * 2001-06-08 2004-01-27 Smk Corporation Packing tape composition and packing method using the packing tape composition
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US20040206665A1 (en) * 2003-04-16 2004-10-21 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Transport tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103625774A (zh) * 2013-12-11 2014-03-12 苏州康铂塑料科技有限公司 一种回收可利用的电子包装载带
CN103662402A (zh) * 2013-12-16 2014-03-26 苏州康铂塑料科技有限公司 芯片载带定位结构

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Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HAN, MOON-SOO;REEL/FRAME:020019/0033

Effective date: 20071016

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION