US20080083988A1 - Top layers of metal for high performance IC's - Google Patents
Top layers of metal for high performance IC's Download PDFInfo
- Publication number
- US20080083988A1 US20080083988A1 US11/930,189 US93018907A US2008083988A1 US 20080083988 A1 US20080083988 A1 US 20080083988A1 US 93018907 A US93018907 A US 93018907A US 2008083988 A1 US2008083988 A1 US 2008083988A1
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- United States
- Prior art keywords
- layer
- over
- metallization structure
- pad
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 73
- 239000002184 metal Substances 0.000 title claims abstract description 73
- 229920001721 polyimide Polymers 0.000 claims abstract description 36
- 239000004642 Polyimide Substances 0.000 claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims abstract description 28
- 238000001465 metallisation Methods 0.000 claims description 61
- 238000002161 passivation Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 35
- 229910000679 solder Inorganic materials 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 8
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 25
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 21
- 238000009826 distribution Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 229910001111 Fine metal Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Definitions
- the invention relates to the manufacturing of high performance Integrated Circuit (IC's), and more specifically to methods of achieving high performance of the Integrated Circuits by reducing the parasitic capacitance and resistance of inter-connecting wiring on a chip.
- IC Integrated Circuit
- the flip-chip technique using an area array, has the advantage of achieving the highest density of interconnection to the device and a very low inductance interconnection to the package.
- pre-testability, post-bonding visual inspection, and TCE (Temperature Coefficient of Expansion) matching to avoid solder bump fatigue are still challenges.
- TCE mismatch can cause a large thermal stress on the solder-lead joints that can lead to joint breakage caused by solder fatigue from temperature cycling operations.
- U.S. Pat. No. 5,212,403 shows a method of forming wiring connections both inside and outside (in a wiring substrate over the chip) for a logic circuit depending on the length of the wire connections.
- U.S. Pat. No. 5,501,006 shows a structure with an insulating layer between the integrated circuit (IC) and the wiring substrate.
- a distribution lead connects the bonding pads of the IC to the bonding pads of the substrate.
- U.S. Pat. No. 5,055,907 discloses an extended integration semiconductor structure that allows manufacturers to integrate circuitry beyond the chip boundaries by forming a thin film multi-layer wiring decal on the support substrate and over the chip.
- this reference differs from the invention.
- U.S. Pat. No. 5,106,461 (Volfson et al.) teaches a multi layer interconnect structure of alternating polyimide (dielectric) and metal layers over an IC in a TAB structure.
- U.S. Pat. No. 5,635,767 (Wenzel et al.) teaches a method for reducing RC delay by a PBGA that separates multiple metal layers.
- U.S. Pat. No. 5,686,764 shows a flip chip substrate that reduces RC delay by separating the power and I/O traces.
- Another objective of the present invention is to reduce resistive voltage drop of the power supply lines that connect the IC to surrounding circuitry or circuit components.
- Another objective of the present invention is to reduce the RC delay constant of the signal paths of high performance IC's.
- Yet another objective of the present invention is to facilitate the application of IC's of reduced size and increased circuit density.
- Yet another objective of the present invention is to further facilitate and enhance the application of low resistor conductor metals.
- Yet another objective of the present invention is to allow for increased I/O pin count for the use of high performance IC's.
- Yet another objective of the present invention is to simplify chip assembly by reducing the need for re-distribution of I/O chip connections.
- Yet another objective of the present invention is to facilitate the connection of high-performance IC's to power buses.
- Yet another objective of the present invention is to facilitate the connection of high-performance IC's to clock distribution networks.
- Yet another objective of the present invention is to reduce IC manufacturing costs by allowing or facilitating the use of less expensive process equipment and by accommodating less strict application of clean room requirements, this as compared to sub-micron manufacturing requirements.
- Yet another objective of the present invention is to be a driving force and stimulus for future system-on-chip designs since the present invention allows ready and cost effective interconnection between functional circuits that are positioned at relatively large distances from each other on the chip.
- Yet another objective of the present design is to form the basis for a computer based routing tool that automatically routes interconnections that exceed a pre-determined length in accordance with the type of interconnection that needs to be established.
- the present invention adds one or more thick layers of dielectric and one or more layers of wide metal lines on top of the finished device wafer.
- the thick layer of dielectric can, for example, be of polyimide or benzocyclobutene (BCB) with a thickness of over, for example, 3 um.
- the wide metal lines can, for instance, be of aluminum or electroplated copper. These layers of dielectric and metal lines can be used for power buses or power planes, clock distribution networks, critical signal, re-distribution of I/O pads for flip chip applications, and for long signal paths.
- FIG. 1 shows a cross section of the interconnection scheme of the present invention.
- FIG. 2 shows a cross section of the present invention in a more complex circuit configuration.
- FIG. 3 a shows the top view of a combination power and X-signal plane using the present invention.
- FIG. 3 b shows the top view of a combination power and Y-signal plane using the present invention.
- FIG. 4 shows the top view of solder bump arrangement using the present invention and is an expanded view of a portion of FIG. 5 .
- FIG. 5 shows the top view of an example of power/ground pads combined with signal pad using the present invention.
- FIG. 6 shows a basic integrated circuit (IC) interconnect scheme of the invention.
- FIG. 7 shows an extension of the basic IC interconnect scheme by adding power, ground and signal distribution capabilities.
- FIG. 8 shows an approach of how to transition from sub-micron metal to wide metal interconnects.
- FIG. 9 shows detail regarding BGA device fan out using the invention.
- FIG. 10 shows detail regarding BGA device pad relocation using the invention.
- FIG. 11 shows detail regarding the usage of common power, ground and signal pads for BGA devices using the invention.
- the present invention teaches an Integrated Circuit structure where key re-distribution and interconnection metal layers and dielectric layers are added over a conventional IC. These re-distribution and interconnection layers allow for wider buses and reduce conventional RC delay.
- a silicon substrate 1 has transistors and other devices, typically formed of poly silicon, covered by a dielectric layer 2 deposited over the devices and the substrate.
- Layer 3 indicates the totality of metal layers and dielectric layers that are typically created on top of the device layer 2 .
- Points of contact 6 such as bonding pads known in the semiconductor art, are in the top surface of layers 3 and are part of layer 3 . These points of contact 6 are points within the IC arrangement that need to be further connected to surrounding circuitry, that is to power lines or to signal lines.
- a passivation layer 4 formed of for example silicon nitride, is deposited on top of layer 3 , as is known in the art for protecting underlying layers from moisture, contamination, etc.
- the key steps of the invention begin with the deposition of a thick layer 5 of polyimide is deposited.
- a pattern 7 is exposed and etched through the polyimide layer 5 and the passivation layer 4 where the pattern 7 is the same as the pattern of the contact points 6 . This opens the contact points 6 up to the surface 8 of the polyimide layer 5 .
- Electrical contact with the contact points 6 can now be established by filling the openings 7 with a conductor.
- the tops 9 of this metal conductor can now be used for connection of the IC to its environment, and for further integration into the surrounding electrical circuitry.
- Pads 10 , 11 and 12 are formed on top of the top 9 of the metal conductors 7 ; these pads can be of any design in width and thickness to accommodate specific circuit design requirements.
- a larger size pad can, for instance, be used as a flip chip pad.
- a somewhat smaller in size pad can be used for power distribution or as a ground or signal bus.
- the following connections can, for instance, be made to the pads shown in FIG.
- pad 10 can serve as a flip chip pad
- pad 11 can serve as a flip chip pad or can be connected to electrical power or to electrical ground or to an electrical signal bus
- pad 12 can also serve as a flip chip pad.
- Pad size and the standard rules and restrictions of electrical circuit design determine the electrical connections to which a given pad lends itself.
- the contact points 6 relate to the size and the number of the contact points 6 , FIG. 1 . Because these contact points 6 are located on top of a thin dielectric (layer 3 , FIG. 1 ) the pad size cannot be too large since a large pad size brings with it a large capacitance. In addition, a large pad size will interfere with the routing capability of that layer of metal. It is therefore preferred to keep the size of the pad 6 small.
- the size of pad 6 is however also directly related with the aspect ratio of via 7 . An aspect ratio of about 5 is acceptable for the consideration of via etching and via filling. Based on these considerations, the size of the contact pad 6 can be in the order of 0.3 ⁇ m to 5.0 ⁇ m, the exact size being dependent on the thickness of layers 4 and 5 .
- the contact points 6 can comprise any appropriate contact material, such as but not limited to tungsten, copper (electroplated or electroless), aluminum, polysilicon, or the like.
- Layer 4 in FIG. 1 can be a typical IC passivation layer.
- the most frequently used passivation layer in the present state of the art is plasma enhanced CVD (PECVD) oxide and nitride.
- PECVD plasma enhanced CVD
- a layer of between about 0.15 and 2.0 ⁇ m PECVD oxide is deposited first followed by a layer of between about 0.5 and 2.0 ⁇ m, and preferably approximately 0.7 ⁇ m nitride.
- Passivation layer 4 is very important because it protects the device wafer from moisture and foreign ion contamination.
- the positioning of this layer between the sub-micron process (of the integrated circuit) and the tens-micron process (of the interconnecting metallization structure) is of critical importance since it allows for a cheaper process that possibly has less stringent clean room requirements for the process of creating the interconnecting metallization structure.
- Layer 5 is a thick polymer dielectric layer (for example polyimide) that has a thickness in excess of 2 ⁇ m (after curing)
- the range of polyimide thickness can vary from 2 ⁇ m to 30 ⁇ m dependent on electrical design requirements.
- the Hitachi-Dupont polyimide HD 2732 or 2734 can, for example, be used.
- the polyimide can be spin-on coated and cured. After spin-on coating, the polyimide will be cured at between approximately 250 and 450 degrees C., preferably at 400 degrees C., for between approximately 0.5 and 1.5 hours, preferably for 1 hour, in a vacuum or nitrogen ambient.
- the polyimide film can be multiple coated and cured.
- BCB polymer benzocyclobutene
- opening 7 has previously been discussed.
- the dimension of the opening together with the dielectric thickness determines the aspect ratio of the opening.
- the aspect ratio challenges the via etch process and the metal filling capability. This leads to a diameter for opening 7 in the range of approximately 0.5 ⁇ m to 3.0 ⁇ m while the height for opening 7 can be in the range of approximately 3 ⁇ m to 20 ⁇ m.
- the aspect ratio of opening 7 is designed such that filling of the via with metal can be accomplished.
- the via can be filled with CVD metal such as CVD tungsten or CVD copper, with electroless nickel, with a damascene metal filling process, with electroplating copper, with sputtering aluminum, etc.
- step heights of underlying features are reduced, and step slopes are gentle and smooth.
- the cured polyimide films can tolerate temperatures of up to 500 degrees C. without degradation of their dielectric film characteristics.
- polyimide films have dielectric breakdowns, which are only slightly lower than that of SiO 2 .
- the dielectric constant of polyimides is smaller than that of silicon nitride and of SiO 2 .
- FIG. 2 shows how the present invention as indicated in FIG. 1 can be further extended to include multiple layers of polyimide and, in so doing, can be adapted to a larger variety of applications.
- the lower level build up of this cross section is identical to the build up shown in FIG. 1 with a silicon wafer 1 , the poly silicon layer 2 , the metal and dielectric combined layer 3 , the passivation layer 4 , the polyimide layer 5 and the pads 10 deposited on top of layer 5 .
- the function of the structure that has been described in FIG. 1 can be further extended by depositing another layer of polyimide 14 on top of the previously deposited layer 5 and overlaying the pads 10 . Selective etching and metal deposition can further create contact points 12 .
- These contact points 12 can be connected with pads 10 as shown by connector 13 . Depositing pads 12 on top of layer 14 can thus further extend this process. These pads 12 can be further customized to a particular application, the indicated extension of multiple layers of polyimides greatly enhances the flexibility and usefulness of the present invention. Additional alternating layers of polyimide and metal lines and/or power or ground planes may be added above layers 12 and 16 , as needed. Dielectric layers 14 and 16 can be formed as described above with reference to FIG. 1 for the dielectric layer 5 .
- FIGS. 3 a and 3 b show a top view of one possible use of the present invention.
- Interconnecting a number of pads 32 that have been created as described creates signal lines 30 .
- Additional contact points such as point 34 can allow signal lines to pass vertically between layers.
- the various contact points can, for instance, be created within the surface of a power plane or ground plane 36 .
- the layers within the interconnecting metallization structure of the present invention can contain signal interconnections in the X-direction, signal interconnections in the Y-direction, signal interconnections between X and or Y directions, interconnections to and/or within power and/or ground buses.
- the present invention further teaches the interconnection of signal lines, power and ground buses between the connected IC's and the top of the metallization system of the present invention.
- FIG. 3 a shows signal lines formed in the X-direction.
- FIG. 3 b shows signal lines formed in the Y-direction.
- FIG. 4 presents yet another application of the present invention. Shown in FIG. 4 is an exploded view of a part of FIG. 5 that presents an area array I/O distribution.
- FIG. 4 shows pads 41 (on which solder bumps can be created) and an example of a layout of the redistribution of the peripheral pads 41 ′.
- the exploded view of FIG. 4 is taken along the line 2 - 2 ′ shown in FIG. 5 ; the redistribution of the peripheral pads 41 ′ (see FIG. 4 ) is, for clarity of overview, not shown in FIG. 5 .
- the power or ground connections can be made to any point that is required on the bottom device.
- the power and ground planes can be connected to the power and ground planes of the package substrates.
- FIG. 4 shows an example of how to use the topmost metal layer to redistribute the peripheral pads 41 ′ to become area array pads 41 .
- the solder bumps can then be created on pads 41 .
- FIG. 5 shows the top surface of a plane that contains a design pattern of a combination of power or ground pads 52 and signal pads 54 .
- FIG. 5 shows the pad openings in the top dielectric layer.
- the number of power or ground pads 52 shown in FIG. 5 can be reduced if there are power and/or ground planes within the chip 53 . From this it is clear that the package number of I/O's can be reduced within the scope of the present invention which leads to a reduction of the package cost by eliminating common signal/power/ground connections within the package. For instance, a 470 I/O count on a BGA chip can, within the scope of the present invention, be reduced to a 256 I/O count using the present invention. This results in considerable savings for the overall package.
- FIG. 6 shows a basic design advantage of the invention. This advantage allows for the sub-micron or fine-lines, that run in the immediate vicinity of the metal layers 3 and the contact points 6 , to be extended in an upward direction 20 through metal interconnect 7 ′. This extension continues in the direction 22 in the horizontal plane of the metal interconnect 26 and comes back down in the downward direction 24 through metal interconnect 7 ′′.
- the functions and constructs of the passivation layer 4 and the insulating layer 5 remain as previously highlighted under FIG. 1 .
- This basic design advantage of the invention is to “elevate” or “fan-out” the fine-line interconnects and to remove these interconnects from the micron and sub-micron level to a metal interconnect level that has considerably larger dimensions and is therefore characterized by smaller resistance and capacitance and is easier and more cost effective to manufacture.
- This aspect of the invention does not include any aspect of conducting line re-distribution and therefore has an inherent quality of simplicity. It therefore further adds to the importance of the invention in that it makes micron and sub-micron wiring accessible at a wide-metal level.
- the interconnections 7 ′ and 7 ′′ interconnect the fine-level metal by going up through the passivation and polymer or polyimide dielectric layers, traverses over a distance on the wide-metal level and continues by descending from the wide-metal level back down to the fine-metal level by again traversing down through the passivation and polymer or polyimide dielectric layers.
- the extensions that are in this manner accomplished need not to be limited to extending fine-metal interconnect points 6 of any particular type, such as signal or power or ground, with wide metal line 26 .
- the laws of physics and electronics will impose limitations, if any, as to what type of interconnect can by established in this manner where limiting factors will be the conventional limiting factors of resistance, propagation delay, RC constants and others.
- the upper metallization structure over the passivation layer 4 may comprise any appropriate contact material, such as but not limited to tungsten, chromium, copper (electroplated or electroless), aluminum, polysilicon, or the like.
- the upper metallization structure over the passivation layer 4 and over the contact points 6 can be formed using a process comprising an electroplating process, a sputtering process, an electroless-plating process, or a damascene process. Where the invention is of importance is that the invention provides much broader latitude in being able to apply these laws and, in so doing, provides a considerably extended scope of the application and use of Integrated Circuits and the adaptation of these circuits to a wide-metal environment.
- the upper metallization structure may have multiple metal layers and multiple dielectric layers as depicted in FIG. 2 .
- the upper metallization structure may comprise multiple metal traces and a metal plane, such as a power plane or ground plane, enclosing the metal traces as shown in FIGS. 3 a and 3 b.
- FIG. 7 shows how the basic interconnect aspect of the invention can further be extended to now not only elevate the fine-metal to the plane of the wide-metal but to also add power, ground and signal distribution interconnects of power, ground and signal planes at the wide-metal level.
- the wide-metal interconnect 26 of FIG. 6 is now extended to further include an interconnection with the via 21 .
- some pads may not be positioned in a location from which easy fan-out can be accomplished to a location that is required for the next step of circuit assembly.
- the BGA substrate requires additional layers in the package construction in order to accomplish the required fan-out.
- the invention teaches an approach that makes additional layers in the assembling of an IC feasible while not unduly increasing the cost of creating such a multi-layer interface.
- Ball formation 28 on the surface of interconnect 23 indicates how the invention replaces part of the conventional BGA interconnect function, the solder bump provides for flip chip assembly.
- This interconnect 28 now connects the BGA device with surrounding circuitry at the wide-metal level as opposed to previous interconnects of the BGA device at the fine-metal level.
- the wide-metal interconnect of the BGA has obvious advantages of cost of manufacturing and improved BGA device performance.
- FIG. 8 further shows a cross section wherein the previous linear construction of the metal interconnection running through the passivation layer and the insulation layer is now conical in form.
- the sub-micron metal layer 60 is covered with a passivation layer 62 , a layer 64 of polyimide or polymer is deposited over the passivation layer 62 .
- the wide metal level 66 is formed on the surface of layer 64 .
- the via 70 is shown as having sloping sides, these sloping sides can be achieved by controlling the photolithography process that is used to created the via 70 .
- the etching of the polyimide or polymer can for instance be done under an angle of about 75 degrees with the following curing being done under an angle of 45 degrees.
- a photosensitive polyimide or polymer can be used, the cone shape of the via 70 can in that case be achieved by variation of exposure combined with time of exposure combined with angle of exposure.
- a wet etch can be applied that has a gradated faster and longer time etch as the top of the via 70 is being approached.
- the layer of wide-metal pad 68 is deposited on the surface of the polymer or polyimide layer 64 , the wide-metal pad deposition 68 mates with the top surface of the via 70 and is centered on top of this surface.
- FIGS. 9 through 11 show further detail to demonstrate the concepts of BGA chip ball fan-out, pad relocation and the creation of common ground, power and signal pads.
- the concept of pad relocation, fan-out, pad addition or pad reduction can be realized by forming the wide and thick metal interconnection scheme over the passivation layer described in this invention, to replace the function of BGA substrate 130 .
- FIG. 9 shows a cross section 100 of a BGA chip, five balls 101 through 105 are also shown.
- ball 101 can be repositioned to location 111 , ball 102 to location 112 , etc. for the remaining solder bumps 103 through 105 .
- the separation of contact points 111 through 115 is considerably larger than the separation of the original solder bumps 101 through 105 .
- the BGA substrate 106 is the subject of the invention, this substrate allows for spreading the distance between the contact points or balls of the BGA device to a considerable degree.
- FIG. 10 shows the concept of pad relocation.
- BGA pad 120 connects to any of the contact balls 101 through 105 .
- the BGA pads can be arranged in a different and arbitrary sequence that is required for further circuit design or packaging. For instance contact point 101 , which is on the far left side of the BGA device 100 , is re-routed to location 122 which is on the second far right of the BGA substrate 130 .
- the re-arrangements of the other BGA solder bumps can readily be learned from following the wiring 131 within the substrate 131 and by tracing from solder bump to one of the contact points 122 through 125 of the BGA substrate.
- FIG. 11 shows the interconnecting of BGA device solder bumps into common power, ground or signal pads.
- the BGA chip 100 is again shown with five solder bumps 101 through 105 .
- the BGA substrate 130 contains a wiring scheme that contains in this example three wiring units, one for each for the power, ground and signal bumps of the BGA device. It is clear from FIG. 11 that wire arrangement 132 connects BGA device solder bumps 101 , 103 and 105 to interconnect point 138 of the BGA substrate 130 .
- BGA device solder bump 104 is connected to interconnect point 140 of the BGA substrate by means of the wire arrangement 136
- BGA device solder bump 102 is connected to interconnect point 142 of the BGA substrate by means of the wire arrangement 134 .
- the number of pins required to interconnect the BGA device 100 is in this manner reduced from five to three. It is clear that for more BGA device solder bumps, as is the case for an actual BGA device, the numeric effect of the indicated wiring arrangement is considerably more beneficial.
- Fan-out capability can be provided by the invention, using the metal conductors within the openings through the insulating layer and through the passivation layer that connect electrical contact pads of the top metallization structure with contact points of the interconnecting metallization structure.
- Each of the electrical contact points of the interconnecting metallization structure is connected directly and sequentially with at least one electrical contact point of the top metallization structure.
- the distance between electrical contact points of the top metallization structure is larger than the distance between electrical contact points of the interconnecting metallization structure by a measurable amount.
- the number of electrical contact pads of the upper metallization structure can exceed the number of contact points of the interconnecting metallization structure by a considerable amount. This provides an addition effect.
- Pad relocation may also be accomplished by the method of the invention. Electrical contact points of the top metallization structure are connected with the contact points of the interconnecting metallization structure, directly but not necessarily sequentially, thereby creating a pad relocation effect. In this method, the distance between electrical contact points of the top metallization structure is larger than the distance between the electrical contact points of the interconnecting metallization structure by a measurable amount. The positions of the electrical contact points of the top metallization structure over the passivation layer from a top view are different from that of the contact points of the interconnecting metallization structure exposed by the openings in the passivation layer.
- a reduction effect may also be accomplished by the method of the invention, wherein common nodes are connected together. Electrical contact points on a top surface of the top metallization structure are connected with contact points of the interconnecting metallization structure exposed by the openings in the passivation layer, where fewer contact points are used in the top metallization structure, since functionally equivalent contact points in the interconnecting metallization structure are connected together. That is, the number of contact points for a particular electrical function among the electrical contact points of the top metallization structure is smaller than the number of electrical contact points of the interconnecting metallization structure exposed by the passivation layer by a measurable amount.
- IC's of reduced size can be packaged and inter-connected with other circuit or system components without limiting the performance of the IC's.
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Abstract
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
Description
- This application is a continuation of application Ser. No. 11/230,102, filed on Sep. 19, 2005, now pending, which is a continuation of application Ser. No. 11/121,477, filed on May 4, 2005, now pending, which is a continuation of application Ser. No. 10/389,543, filed on Mar. 14, 2003, now U.S. Pat. No. 6,965,165, which is a division of application Ser. No. 09/972,639, filed on Oct. 9, 2001, now U.S. Pat. No. 6,657,310, which is a division of application Ser. No. 09/251,183, filed on Feb. 17, 1999, now U.S. Pat. No. 6,383,916, which is a continuation-in-part of application Ser. No. 09/216,791, filed on Dec. 21, 1998, now abandoned.
- (1) Field of the Invention
- The invention relates to the manufacturing of high performance Integrated Circuit (IC's), and more specifically to methods of achieving high performance of the Integrated Circuits by reducing the parasitic capacitance and resistance of inter-connecting wiring on a chip.
- (2) Description of the Prior Art
- When the geometric dimensions of the Integrated Circuits are scaled down, the cost per die is decreased while some aspects of performance are improved. The metal connections which connect the Integrated Circuit to other circuit or system components become of relative more importance and have, with the further miniaturization of the IC, an increasingly negative impact on the circuit performance. The parasitic capacitance and resistance of the metal interconnections increase, which degrades the chip performance significantly. Of most concern in this respect is the voltage drop along the power and ground buses and the RC delay of the critical signal paths. Attempts to reduce the resistance by using wider metal lines result in higher capacitance of these wires.
- To solve this problem, the approach has been taken to develop low resistance metal (such as copper) for the wires while low dielectric materials are used in between signal lines. Increased Input-Output (IO) combined with increased demands for high performance IC's has led to the development of Flip Chip Packages. Flip-chip technology fabricates bumps (typically Pb/Sn solders) on Al pads on chip and interconnect the bumps directly to the package media, which are usually ceramic or plastic based. The flip-chip is bonded face down to the package medium through the shortest path. These technologies can be applied not only to single-chip packaging, but also to higher or integrated levels of packaging in which the packages are larger and to more sophisticated substrates that accommodate several chips to form larger functional units.
- The flip-chip technique, using an area array, has the advantage of achieving the highest density of interconnection to the device and a very low inductance interconnection to the package. However, pre-testability, post-bonding visual inspection, and TCE (Temperature Coefficient of Expansion) matching to avoid solder bump fatigue are still challenges. In mounting several packages together, such as surface mounting a ceramic package to a plastic board, the TCE mismatch can cause a large thermal stress on the solder-lead joints that can lead to joint breakage caused by solder fatigue from temperature cycling operations.
- U.S. Pat. No. 5,212,403 (Nakanishi) shows a method of forming wiring connections both inside and outside (in a wiring substrate over the chip) for a logic circuit depending on the length of the wire connections.
- U.S. Pat. No. 5,501,006 (Gehman, Jr. et al.) shows a structure with an insulating layer between the integrated circuit (IC) and the wiring substrate. A distribution lead connects the bonding pads of the IC to the bonding pads of the substrate.
- U.S. Pat. No. 5,055,907 (Jacobs) discloses an extended integration semiconductor structure that allows manufacturers to integrate circuitry beyond the chip boundaries by forming a thin film multi-layer wiring decal on the support substrate and over the chip. However, this reference differs from the invention.
- U.S. Pat. No. 5,106,461 (Volfson et al.) teaches a multi layer interconnect structure of alternating polyimide (dielectric) and metal layers over an IC in a TAB structure.
- U.S. Pat. No. 5,635,767 (Wenzel et al.) teaches a method for reducing RC delay by a PBGA that separates multiple metal layers.
- U.S. Pat. No. 5,686,764 (Fulcher) shows a flip chip substrate that reduces RC delay by separating the power and I/O traces.
- It is the primary objective of the present invention to improve the performance of High Performance Integrated Circuits.
- Another objective of the present invention is to reduce resistive voltage drop of the power supply lines that connect the IC to surrounding circuitry or circuit components.
- Another objective of the present invention is to reduce the RC delay constant of the signal paths of high performance IC's.
- Yet another objective of the present invention is to facilitate the application of IC's of reduced size and increased circuit density.
- Yet another objective of the present invention is to further facilitate and enhance the application of low resistor conductor metals.
- Yet another objective of the present invention is to allow for increased I/O pin count for the use of high performance IC's.
- Yet another objective of the present invention is to simplify chip assembly by reducing the need for re-distribution of I/O chip connections.
- Yet another objective of the present invention is to facilitate the connection of high-performance IC's to power buses.
- Yet another objective of the present invention is to facilitate the connection of high-performance IC's to clock distribution networks.
- Yet another objective of the present invention is to reduce IC manufacturing costs by allowing or facilitating the use of less expensive process equipment and by accommodating less strict application of clean room requirements, this as compared to sub-micron manufacturing requirements.
- Yet another objective of the present invention is to be a driving force and stimulus for future system-on-chip designs since the present invention allows ready and cost effective interconnection between functional circuits that are positioned at relatively large distances from each other on the chip.
- Yet another objective of the present design is to form the basis for a computer based routing tool that automatically routes interconnections that exceed a pre-determined length in accordance with the type of interconnection that needs to be established.
- The present invention adds one or more thick layers of dielectric and one or more layers of wide metal lines on top of the finished device wafer. The thick layer of dielectric can, for example, be of polyimide or benzocyclobutene (BCB) with a thickness of over, for example, 3 um. The wide metal lines can, for instance, be of aluminum or electroplated copper. These layers of dielectric and metal lines can be used for power buses or power planes, clock distribution networks, critical signal, re-distribution of I/O pads for flip chip applications, and for long signal paths.
-
FIG. 1 shows a cross section of the interconnection scheme of the present invention. -
FIG. 2 shows a cross section of the present invention in a more complex circuit configuration. -
FIG. 3 a shows the top view of a combination power and X-signal plane using the present invention. -
FIG. 3 b shows the top view of a combination power and Y-signal plane using the present invention. -
FIG. 4 shows the top view of solder bump arrangement using the present invention and is an expanded view of a portion ofFIG. 5 . -
FIG. 5 shows the top view of an example of power/ground pads combined with signal pad using the present invention. -
FIG. 6 shows a basic integrated circuit (IC) interconnect scheme of the invention. -
FIG. 7 shows an extension of the basic IC interconnect scheme by adding power, ground and signal distribution capabilities. -
FIG. 8 shows an approach of how to transition from sub-micron metal to wide metal interconnects. -
FIG. 9 shows detail regarding BGA device fan out using the invention. -
FIG. 10 shows detail regarding BGA device pad relocation using the invention. -
FIG. 11 shows detail regarding the usage of common power, ground and signal pads for BGA devices using the invention. - The present invention teaches an Integrated Circuit structure where key re-distribution and interconnection metal layers and dielectric layers are added over a conventional IC. These re-distribution and interconnection layers allow for wider buses and reduce conventional RC delay.
- Referring now more specifically to
FIG. 1 , there is shown a cross section of one implementation of the present invention. Asilicon substrate 1 has transistors and other devices, typically formed of poly silicon, covered by adielectric layer 2 deposited over the devices and the substrate.Layer 3 indicates the totality of metal layers and dielectric layers that are typically created on top of thedevice layer 2. Points ofcontact 6, such as bonding pads known in the semiconductor art, are in the top surface oflayers 3 and are part oflayer 3. These points ofcontact 6 are points within the IC arrangement that need to be further connected to surrounding circuitry, that is to power lines or to signal lines. Apassivation layer 4, formed of for example silicon nitride, is deposited on top oflayer 3, as is known in the art for protecting underlying layers from moisture, contamination, etc. - The key steps of the invention begin with the deposition of a
thick layer 5 of polyimide is deposited. Apattern 7 is exposed and etched through thepolyimide layer 5 and thepassivation layer 4 where thepattern 7 is the same as the pattern of the contact points 6. This opens the contact points 6 up to thesurface 8 of thepolyimide layer 5. - Electrical contact with the contact points 6 can now be established by filling the
openings 7 with a conductor. Thetops 9 of this metal conductor can now be used for connection of the IC to its environment, and for further integration into the surrounding electrical circuitry.Pads top 9 of themetal conductors 7; these pads can be of any design in width and thickness to accommodate specific circuit design requirements. A larger size pad can, for instance, be used as a flip chip pad. A somewhat smaller in size pad can be used for power distribution or as a ground or signal bus. The following connections can, for instance, be made to the pads shown inFIG. 1 : pad 10 can serve as a flip chip pad, pad 11 can serve as a flip chip pad or can be connected to electrical power or to electrical ground or to an electrical signal bus, pad 12 can also serve as a flip chip pad. There is no connection between the size of the pads shown inFIG. 1 and the suggested possible electrical connections for which this pad can be used. Pad size and the standard rules and restrictions of electrical circuit design determine the electrical connections to which a given pad lends itself. - The following comments relate to the size and the number of the contact points 6,
FIG. 1 . Because thesecontact points 6 are located on top of a thin dielectric (layer 3,FIG. 1 ) the pad size cannot be too large since a large pad size brings with it a large capacitance. In addition, a large pad size will interfere with the routing capability of that layer of metal. It is therefore preferred to keep the size of thepad 6 small. The size ofpad 6 is however also directly related with the aspect ratio of via 7. An aspect ratio of about 5 is acceptable for the consideration of via etching and via filling. Based on these considerations, the size of thecontact pad 6 can be in the order of 0.3 μm to 5.0 μm, the exact size being dependent on the thickness oflayers - The present invention does not impose a limitation on the number of contact pads that can be included in the design; this number is dependent on package design requirements.
Layer 4 inFIG. 1 can be a typical IC passivation layer. - The most frequently used passivation layer in the present state of the art is plasma enhanced CVD (PECVD) oxide and nitride. In creating
layer 4, a layer of between about 0.15 and 2.0 μm PECVD oxide is deposited first followed by a layer of between about 0.5 and 2.0 μm, and preferably approximately 0.7 μm nitride.Passivation layer 4 is very important because it protects the device wafer from moisture and foreign ion contamination. The positioning of this layer between the sub-micron process (of the integrated circuit) and the tens-micron process (of the interconnecting metallization structure) is of critical importance since it allows for a cheaper process that possibly has less stringent clean room requirements for the process of creating the interconnecting metallization structure. -
Layer 5 is a thick polymer dielectric layer (for example polyimide) that has a thickness in excess of 2 μm (after curing) The range of polyimide thickness can vary from 2 μm to 30 μm dependent on electrical design requirements. - For the deposition of
layer 5 the Hitachi-Dupont polyimide HD 2732 or 2734 can, for example, be used. The polyimide can be spin-on coated and cured. After spin-on coating, the polyimide will be cured at between approximately 250 and 450 degrees C., preferably at 400 degrees C., for between approximately 0.5 and 1.5 hours, preferably for 1 hour, in a vacuum or nitrogen ambient. For thicker polyimide, the polyimide film can be multiple coated and cured. - Another material that can be used to create
layer 5 is the polymer benzocyclobutene (BCB). This polymer is at this time commercially produced by for instance Dow Chemical and has recently gained acceptance to be used instead of typical polyimide application. - The dimensions of
opening 7 have previously been discussed. The dimension of the opening together with the dielectric thickness determines the aspect ratio of the opening. The aspect ratio challenges the via etch process and the metal filling capability. This leads to a diameter for opening 7 in the range of approximately 0.5 μm to 3.0 μm while the height for opening 7 can be in the range of approximately 3 μm to 20 μm. The aspect ratio ofopening 7 is designed such that filling of the via with metal can be accomplished. The via can be filled with CVD metal such as CVD tungsten or CVD copper, with electroless nickel, with a damascene metal filling process, with electroplating copper, with sputtering aluminum, etc. - It must be noted that the use of polyimide films as inter-level dielectrics has been pursued as a technique for providing partial planarization of a dielectric surface. Polyimides offer the following characteristics for such applications:
- they produce surfaces in which the step heights of underlying features are reduced, and step slopes are gentle and smooth.
- they are available to fill small openings without producing the voids that occur when low-temperature CVD oxide films are deposited.
- the cured polyimide films can tolerate temperatures of up to 500 degrees C. without degradation of their dielectric film characteristics.
- polyimide films have dielectric breakdowns, which are only slightly lower than that of SiO2.
- the dielectric constant of polyimides is smaller than that of silicon nitride and of SiO2.
- the process used to deposit and pattern polyimide films is relatively simple.
- For all of the above characteristics, polyimides are used and recommended within the scope of the present invention.
-
FIG. 2 shows how the present invention as indicated inFIG. 1 can be further extended to include multiple layers of polyimide and, in so doing, can be adapted to a larger variety of applications. The lower level build up of this cross section is identical to the build up shown inFIG. 1 with asilicon wafer 1, thepoly silicon layer 2, the metal and dielectric combinedlayer 3, thepassivation layer 4, thepolyimide layer 5 and thepads 10 deposited on top oflayer 5. The function of the structure that has been described inFIG. 1 can be further extended by depositing another layer ofpolyimide 14 on top of the previously depositedlayer 5 and overlaying thepads 10. Selective etching and metal deposition can further create contact points 12. These contact points 12 can be connected withpads 10 as shown byconnector 13. Depositingpads 12 on top oflayer 14 can thus further extend this process. Thesepads 12 can be further customized to a particular application, the indicated extension of multiple layers of polyimides greatly enhances the flexibility and usefulness of the present invention. Additional alternating layers of polyimide and metal lines and/or power or ground planes may be added abovelayers Dielectric layers FIG. 1 for thedielectric layer 5. -
FIGS. 3 a and 3 b show a top view of one possible use of the present invention. Interconnecting a number ofpads 32 that have been created as described creates signal lines 30. Additional contact points such aspoint 34 can allow signal lines to pass vertically between layers. The various contact points can, for instance, be created within the surface of a power plane orground plane 36. The layers within the interconnecting metallization structure of the present invention can contain signal interconnections in the X-direction, signal interconnections in the Y-direction, signal interconnections between X and or Y directions, interconnections to and/or within power and/or ground buses. The present invention further teaches the interconnection of signal lines, power and ground buses between the connected IC's and the top of the metallization system of the present invention. -
FIG. 3 a shows signal lines formed in the X-direction.FIG. 3 b shows signal lines formed in the Y-direction. -
FIG. 4 presents yet another application of the present invention. Shown inFIG. 4 is an exploded view of a part ofFIG. 5 that presents an area array I/O distribution.FIG. 4 shows pads 41 (on which solder bumps can be created) and an example of a layout of the redistribution of theperipheral pads 41′. The exploded view ofFIG. 4 is taken along the line 2-2′ shown inFIG. 5 ; the redistribution of theperipheral pads 41′ (seeFIG. 4 ) is, for clarity of overview, not shown inFIG. 5 . The power or ground connections can be made to any point that is required on the bottom device. Furthermore, the power and ground planes can be connected to the power and ground planes of the package substrates.FIG. 4 shows an example of how to use the topmost metal layer to redistribute theperipheral pads 41′ to becomearea array pads 41. The solder bumps can then be created onpads 41. -
FIG. 5 shows the top surface of a plane that contains a design pattern of a combination of power orground pads 52 andsignal pads 54.FIG. 5 shows the pad openings in the top dielectric layer. It is to be noted that the ground/power pads 52 are heavier and larger in design relative to thesignal pads 54. The present invention ideally lends itself to meeting these differences in design, as they are required within the art of chip and high performance circuit design. The number of power orground pads 52 shown inFIG. 5 can be reduced if there are power and/or ground planes within thechip 53. From this it is clear that the package number of I/O's can be reduced within the scope of the present invention which leads to a reduction of the package cost by eliminating common signal/power/ground connections within the package. For instance, a 470 I/O count on a BGA chip can, within the scope of the present invention, be reduced to a 256 I/O count using the present invention. This results in considerable savings for the overall package. -
FIG. 6 shows a basic design advantage of the invention. This advantage allows for the sub-micron or fine-lines, that run in the immediate vicinity of themetal layers 3 and the contact points 6, to be extended in anupward direction 20 throughmetal interconnect 7′. This extension continues in the direction 22 in the horizontal plane of themetal interconnect 26 and comes back down in the downward direction 24 throughmetal interconnect 7″. The functions and constructs of thepassivation layer 4 and the insulatinglayer 5 remain as previously highlighted underFIG. 1 . This basic design advantage of the invention is to “elevate” or “fan-out” the fine-line interconnects and to remove these interconnects from the micron and sub-micron level to a metal interconnect level that has considerably larger dimensions and is therefore characterized by smaller resistance and capacitance and is easier and more cost effective to manufacture. This aspect of the invention does not include any aspect of conducting line re-distribution and therefore has an inherent quality of simplicity. It therefore further adds to the importance of the invention in that it makes micron and sub-micron wiring accessible at a wide-metal level. Theinterconnections 7′ and 7″ interconnect the fine-level metal by going up through the passivation and polymer or polyimide dielectric layers, traverses over a distance on the wide-metal level and continues by descending from the wide-metal level back down to the fine-metal level by again traversing down through the passivation and polymer or polyimide dielectric layers. The extensions that are in this manner accomplished need not to be limited to extending fine-metal interconnect points 6 of any particular type, such as signal or power or ground, withwide metal line 26. The laws of physics and electronics will impose limitations, if any, as to what type of interconnect can by established in this manner where limiting factors will be the conventional limiting factors of resistance, propagation delay, RC constants and others. The upper metallization structure over thepassivation layer 4 may comprise any appropriate contact material, such as but not limited to tungsten, chromium, copper (electroplated or electroless), aluminum, polysilicon, or the like. The upper metallization structure over thepassivation layer 4 and over the contact points 6 can be formed using a process comprising an electroplating process, a sputtering process, an electroless-plating process, or a damascene process. Where the invention is of importance is that the invention provides much broader latitude in being able to apply these laws and, in so doing, provides a considerably extended scope of the application and use of Integrated Circuits and the adaptation of these circuits to a wide-metal environment. The upper metallization structure may have multiple metal layers and multiple dielectric layers as depicted inFIG. 2 . The upper metallization structure may comprise multiple metal traces and a metal plane, such as a power plane or ground plane, enclosing the metal traces as shown inFIGS. 3 a and 3 b. -
FIG. 7 shows how the basic interconnect aspect of the invention can further be extended to now not only elevate the fine-metal to the plane of the wide-metal but to also add power, ground and signal distribution interconnects of power, ground and signal planes at the wide-metal level. The wide-metal interconnect 26 ofFIG. 6 is now extended to further include an interconnection with the via 21. In typical IC design, some pads may not be positioned in a location from which easy fan-out can be accomplished to a location that is required for the next step of circuit assembly. In those cases, the BGA substrate requires additional layers in the package construction in order to accomplish the required fan-out. The invention teaches an approach that makes additional layers in the assembling of an IC feasible while not unduly increasing the cost of creating such a multi-layer interface.Ball formation 28 on the surface ofinterconnect 23 indicates how the invention replaces part of the conventional BGA interconnect function, the solder bump provides for flip chip assembly. Thisinterconnect 28 now connects the BGA device with surrounding circuitry at the wide-metal level as opposed to previous interconnects of the BGA device at the fine-metal level. The wide-metal interconnect of the BGA has obvious advantages of cost of manufacturing and improved BGA device performance. By being able to readily extend the wide-metal dimensions it also becomes possible to interconnect power, ground and signal lines at a wide-metal level thereby reducing the cost and complexity of performing this function at the fine-metal level. The indication of 28 as a ball does not imply that the invention is limited to solder bumps for making interconnects. The invention is equally applicable to wirebonding for making circuit interconnects. -
FIG. 8 further shows a cross section wherein the previous linear construction of the metal interconnection running through the passivation layer and the insulation layer is now conical in form. Thesub-micron metal layer 60 is covered with apassivation layer 62, alayer 64 of polyimide or polymer is deposited over thepassivation layer 62. Thewide metal level 66 is formed on the surface oflayer 64. The via 70 is shown as having sloping sides, these sloping sides can be achieved by controlling the photolithography process that is used to created the via 70. The etching of the polyimide or polymer can for instance be done under an angle of about 75 degrees with the following curing being done under an angle of 45 degrees. Also, a photosensitive polyimide or polymer can be used, the cone shape of the via 70 can in that case be achieved by variation of exposure combined with time of exposure combined with angle of exposure. Where non-photosensitive polymer or polyimide is used, a wet etch can be applied that has a gradated faster and longer time etch as the top of the via 70 is being approached. The layer of wide-metal pad 68 is deposited on the surface of the polymer orpolyimide layer 64, the wide-metal pad deposition 68 mates with the top surface of the via 70 and is centered on top of this surface. -
FIGS. 9 through 11 show further detail to demonstrate the concepts of BGA chip ball fan-out, pad relocation and the creation of common ground, power and signal pads. The concept of pad relocation, fan-out, pad addition or pad reduction can be realized by forming the wide and thick metal interconnection scheme over the passivation layer described in this invention, to replace the function ofBGA substrate 130. -
FIG. 9 shows across section 100 of a BGA chip, fiveballs 101 through 105 are also shown. By using theBGA substrate 106 and thewiring 107 within thesubstrate 106, it is clear thatball 101 can be repositioned tolocation 111,ball 102 tolocation 112, etc. for the remaining solder bumps 103 through 105. It is clear that the separation of contact points 111 through 115 is considerably larger than the separation of the original solder bumps 101 through 105. TheBGA substrate 106 is the subject of the invention, this substrate allows for spreading the distance between the contact points or balls of the BGA device to a considerable degree. -
FIG. 10 shows the concept of pad relocation. BGA pad 120 connects to any of thecontact balls 101 through 105. By using theBGA substrate 130 and thewiring 131 that is provided within the substrate, it is clear that the BGA pads can be arranged in a different and arbitrary sequence that is required for further circuit design or packaging. Forinstance contact point 101, which is on the far left side of theBGA device 100, is re-routed tolocation 122 which is on the second far right of theBGA substrate 130. The re-arrangements of the other BGA solder bumps can readily be learned from following thewiring 131 within thesubstrate 131 and by tracing from solder bump to one of the contact points 122 through 125 of the BGA substrate. -
FIG. 11 shows the interconnecting of BGA device solder bumps into common power, ground or signal pads. TheBGA chip 100 is again shown with fivesolder bumps 101 through 105. TheBGA substrate 130 contains a wiring scheme that contains in this example three wiring units, one for each for the power, ground and signal bumps of the BGA device. It is clear fromFIG. 11 thatwire arrangement 132 connects BGA device solder bumps 101, 103 and 105 to interconnectpoint 138 of theBGA substrate 130. It can further be seen that BGAdevice solder bump 104 is connected to interconnectpoint 140 of the BGA substrate by means of thewire arrangement 136, while BGAdevice solder bump 102 is connected to interconnectpoint 142 of the BGA substrate by means of thewire arrangement 134. The number of pins required to interconnect theBGA device 100 is in this manner reduced from five to three. It is clear that for more BGA device solder bumps, as is the case for an actual BGA device, the numeric effect of the indicated wiring arrangement is considerably more beneficial. - The concept of fan-out, pad relocation can be realized by forming the wide and thick metal interconnection scheme over the passivation layer described in this invention, to replace the function of
BGA substrate 130. FromFIGS. 9, 10 and 11 it can be seen that the extended functionality and extended wiring ability that are provided by the interconnect wiring schemes that are typically created in theBGA substrate 130 can be substituted by forming the wide and thick metal interconnection scheme over the passivation layer, ondevice 100. Some of the methods and possibilities of interconnect line routing that can be implemented using the method of the invention are highlighted in the following paragraphs. - Fan-out capability can be provided by the invention, using the metal conductors within the openings through the insulating layer and through the passivation layer that connect electrical contact pads of the top metallization structure with contact points of the interconnecting metallization structure. Each of the electrical contact points of the interconnecting metallization structure is connected directly and sequentially with at least one electrical contact point of the top metallization structure. In a fan-out scheme, the distance between electrical contact points of the top metallization structure is larger than the distance between electrical contact points of the interconnecting metallization structure by a measurable amount.
- Alternatively, in a pad-addition scheme, the number of electrical contact pads of the upper metallization structure can exceed the number of contact points of the interconnecting metallization structure by a considerable amount. This provides an addition effect.
- Pad relocation may also be accomplished by the method of the invention. Electrical contact points of the top metallization structure are connected with the contact points of the interconnecting metallization structure, directly but not necessarily sequentially, thereby creating a pad relocation effect. In this method, the distance between electrical contact points of the top metallization structure is larger than the distance between the electrical contact points of the interconnecting metallization structure by a measurable amount. The positions of the electrical contact points of the top metallization structure over the passivation layer from a top view are different from that of the contact points of the interconnecting metallization structure exposed by the openings in the passivation layer.
- A reduction effect may also be accomplished by the method of the invention, wherein common nodes are connected together. Electrical contact points on a top surface of the top metallization structure are connected with contact points of the interconnecting metallization structure exposed by the openings in the passivation layer, where fewer contact points are used in the top metallization structure, since functionally equivalent contact points in the interconnecting metallization structure are connected together. That is, the number of contact points for a particular electrical function among the electrical contact points of the top metallization structure is smaller than the number of electrical contact points of the interconnecting metallization structure exposed by the passivation layer by a measurable amount.
- Some of the advantages of the present invention are:
- 1) improved speed of the IC interconnections due to the use of wider metal lines (which results in lower resistance) and thicker dielectrics between the interconnecting lines (which results in lower capacitance and reduced RC delay). The improved speed of the IC interconnections results in improved performance of High Performance IC's.
- 2) an inexpensive manufacturing process since there is no need for expensive equipment that is typically used in sub-micron IC fabrication; there is also no need for the extreme clean room facilities that are typically required for sub-micron manufacturing.
- 3) reduced packaging costs due to the elimination of the need for redundant I/O and multiple power and ground connection points that are needed in a typical IC packaging.
- 4) IC's of reduced size can be packaged and inter-connected with other circuit or system components without limiting the performance of the IC's.
- 5) since dependence on ultra-fine wiring is reduced, the use of low resistance conductor wires is facilitated.
- 6) structures containing more complicated IC's can be created because the invention allows for increased I/O pin count.
- 7) more complicated IC's can be created without the need for a significant increase in re-distribution of package I/O connections.
- 8) power buses and clock distribution networks are easier to integrate within the design of IC's.
- 9) future system-on-chip designs will benefit from the present invention since it allows ready and cost effective interconnection between functional circuits that are positioned at relatively large distances from each other on the chip.
- 10) form the basis for a computer based routing tool that automatically routes interconnections that exceed a pre-determined length in accordance with the type of interconnection that needs to be established.
- 11) provide a means to standardize BGA packaging.
- 12) be applicable to both solder bumps and wirebonding for making further circuit interconnects.
- 13) provide a means for BGA device solder bump fan-out thereby facilitating the packing and design of BGA devices.
- 14) provide a means for BGA device pad relocation thereby providing increased flexibility for the packing and design of BGA devices.
- 15) provide a means for common BGA device power, ground and signal lines thereby reducing the number of pins required to interconnect the BGA device with the surrounding circuits.
- 16) provide a means for more relaxed design rules in designing circuit vias by the application of sloped vias.
- 17) provide the means for extending a fine-wire interconnect scheme to a wide-wire interconnect scheme without the need to apply a passivation layer over the surface of the fine-wire structure.
- Although the preferred embodiment of the present invention has been illustrated, and that form has been described in detail, it will be readily understood by those skilled in the art that various modifications may be made therein without departing from the spirit of the invention or from the scope of the appended claims.
Claims (20)
1. An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer, and wherein said first metallization structure comprises a first pad having a top surface with a first region and a second region surrounding said first region;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first and second metal layers, over said first and second dielectric layers and on said second region, wherein a first opening in said passivation layer is over said first region and exposes said first region, wherein said first opening has a transverse dimension between 0.5 and 3 micrometers, and wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip;
a second metallization structure in said first opening and over said passivation layer, wherein said second metallization structure comprises electroplated copper in said first opening and over said passivation layer; and
a solder bump directly on said electroplated copper.
2. The integrated circuit chip of claim 1 , wherein said topmost nitride layer is over said topmost oxide layer.
3. The integrated circuit chip of claim 1 , wherein said first metallization structure further comprises a second pad, wherein a second opening in said passivation layer is over said second pad and exposes said second pad, wherein said second metallization structure is further in said second opening, and wherein said second pad is connected to said first pad through said second metallization structure.
4. The integrated circuit chip of claim 1 further comprising a polymer layer on said passivation layer, wherein a second opening in said polymer layer is over said first pad and exposes said first pad, and wherein said second metallization structure is further over said polymer layer and in said second opening.
5. The integrated circuit chip of claim 4 , wherein said polymer layer has a thickness between 2 and 30 micrometers.
6. The integrated circuit chip of claim 4 , wherein said polymer layer comprises polyimide.
7. The integrated circuit chip of claim 4 , wherein said polymer layer comprises benzocyclobutene (BCB).
8. An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer, wherein said first metallization structure comprises a first pad having a top surface with a first region and a second region surrounding said first region, and wherein said first metallization structure comprises electroplated copper;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first and second metal layers, over said first and second dielectric layers and on said second region, wherein a first opening in said passivation layer is over said first region and exposes said first region, wherein said first opening has a transverse dimension between 0.5 and 3 micrometers, and wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip;
a second metallization structure in said first opening and over said passivation layer, wherein said second metallization structure comprises electroplated copper in said first opening and over said passivation layer; and
a solder bump directly on said electroplated copper.
9. The integrated circuit chip of claim 8 , wherein said topmost nitride layer is over said topmost oxide layer.
10. The integrated circuit chip of claim 8 , wherein said first metallization structure further comprises a second pad, wherein a second opening in said passivation layer is over said second pad and exposes said second pad, wherein said second metallization structure is further in said second opening, and wherein said second pad is connected to said first pad through said second metallization structure.
11. The integrated circuit chip of claim 8 further comprising a polymer layer on said passivation layer, wherein a second opening in said polymer layer is over said first pad and exposes said first pad, and wherein said second metallization structure is further over said polymer layer and in said second opening.
12. The integrated circuit chip of claim 11 , wherein said polymer layer has a thickness between 2 and 30 micrometers.
13. The integrated circuit chip of claim 11 , wherein said polymer layer comprises polyimide.
14. The integrated circuit chip of claim 11 , wherein said polymer layer comprises benzocyclobutene (BCB).
15. An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer, wherein said first metallization structure comprises a first pad having a top surface with a first region and a second region surrounding said first region, and wherein said first metallization structure comprises electroplated copper;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first and second metal layers, over said first and second dielectric layers and on said second region, wherein a first opening in said passivation layer is over said first region and exposes said first region, wherein said first opening has a transverse dimension between 0.5 and 3 micrometers, and wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip;
a second metallization structure in said first opening and over said passivation layer; and
a solder bump over said second metallization structure.
16. The integrated circuit chip of claim 15 , wherein said topmost nitride layer is over said topmost oxide layer.
17. The integrated circuit chip of claim 15 , wherein said first metallization structure further comprises a second pad, wherein a second opening in said passivation layer is over said second pad and exposes said second pad, wherein said second metallization structure is further in said second opening, and wherein said second pad is connected to said first pad through said second metallization structure.
18. The integrated circuit chip of claim 15 further comprising a polymer layer on said passivation layer, wherein a second opening in said polymer layer is over said first pad and exposes said first pad, and wherein said second metallization structure is further over said polymer layer and in said second opening.
19. The integrated circuit chip of claim 18 , wherein said polymer layer has a thickness between 2 and 30 micrometers.
20. The integrated circuit chip of claim 18 , wherein said polymer layer comprises polyimide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/930,189 US20080083988A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21679198A | 1998-12-21 | 1998-12-21 | |
US09/251,183 US6383916B1 (en) | 1998-12-21 | 1999-02-17 | Top layers of metal for high performance IC's |
US09/972,639 US6657310B2 (en) | 1998-12-21 | 2001-10-09 | Top layers of metal for high performance IC's |
US10/389,543 US6965165B2 (en) | 1998-12-21 | 2003-03-14 | Top layers of metal for high performance IC's |
US11/121,477 US7294870B2 (en) | 1998-12-21 | 2005-05-04 | Top layers of metal for high performance IC's |
US11/230,102 US7368376B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/930,189 US20080083988A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/230,102 Continuation US7368376B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080083988A1 true US20080083988A1 (en) | 2008-04-10 |
Family
ID=39197209
Family Applications (67)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/389,543 Expired - Lifetime US6965165B2 (en) | 1998-12-21 | 2003-03-14 | Top layers of metal for high performance IC's |
US11/121,477 Expired - Fee Related US7294870B2 (en) | 1998-12-21 | 2005-05-04 | Top layers of metal for high performance IC's |
US11/130,917 Expired - Fee Related US7329954B2 (en) | 1998-12-21 | 2005-05-17 | Top layers of metal for high performance IC's |
US11/131,481 Expired - Fee Related US7372155B2 (en) | 1998-12-21 | 2005-05-18 | Top layers of metal for high performance IC's |
US11/145,468 Expired - Fee Related US7384864B2 (en) | 1998-12-21 | 2005-06-03 | Top layers of metal for high performance IC's |
US11/149,092 Expired - Fee Related US7422976B2 (en) | 1998-12-21 | 2005-06-09 | Top layers of metal for high performance IC's |
US11/230,102 Expired - Fee Related US7368376B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/230,101 Expired - Fee Related US7372085B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/230,004 Expired - Fee Related US7294871B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/829,109 Expired - Fee Related US7999384B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,108 Expired - Fee Related US7358610B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,107 Abandoned US20070262460A1 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
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US11/829,110 Expired - Fee Related US8531038B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,105 Expired - Fee Related US7385291B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/833,225 Abandoned US20070267714A1 (en) | 1998-12-21 | 2007-08-02 | Top layers of metal for high performance IC's |
US11/839,552 Abandoned US20070273034A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,557 Abandoned US20070273037A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,551 Abandoned US20070273033A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,550 Abandoned US20070273032A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,558 Expired - Fee Related US7442969B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,554 Expired - Fee Related US7884479B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,559 Expired - Fee Related US7397135B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,556 Abandoned US20070273036A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,561 Abandoned US20070273041A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,560 Abandoned US20070273040A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/840,235 Abandoned US20070281467A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,239 Expired - Fee Related US7465975B2 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,242 Expired - Fee Related US7425764B2 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,238 Abandoned US20070278686A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,243 Abandoned US20070278691A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,230 Abandoned US20070278688A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,237 Abandoned US20070281463A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,241 Abandoned US20070281458A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,232 Abandoned US20070278685A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,236 Abandoned US20070281468A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,233 Abandoned US20070278689A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,234 Abandoned US20070278690A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/893,659 Abandoned US20070288880A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,231 Abandoned US20070278684A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/842,161 Abandoned US20070284752A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,158 Abandoned US20070284751A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,159 Abandoned US20070284753A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,153 Expired - Fee Related US8471384B2 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,160 Expired - Fee Related US7482693B2 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/845,115 Expired - Fee Related US7385292B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,109 Abandoned US20070290348A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,759 Abandoned US20070290355A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,771 Abandoned US20070290358A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,773 Abandoned US20070293036A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,766 Expired - Fee Related US7382058B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,111 Abandoned US20070290350A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,123 Expired - Fee Related US8415800B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,116 Expired - Fee Related US7388292B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,110 Abandoned US20070290349A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,113 Abandoned US20070290351A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,764 Abandoned US20070290356A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,122 Abandoned US20070290354A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,775 Expired - Fee Related US7396756B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/930,191 Expired - Fee Related US7456100B2 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US11/930,189 Abandoned US20080083988A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US11/930,185 Abandoned US20080083987A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US11/930,187 Abandoned US20080048329A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US12/036,309 Abandoned US20080146020A1 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/036,306 Abandoned US20080142980A1 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/036,308 Expired - Fee Related US8022545B2 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/203,154 Expired - Fee Related US7863654B2 (en) | 1998-12-21 | 2008-09-03 | Top layers of metal for high performance IC's |
Family Applications Before (60)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/389,543 Expired - Lifetime US6965165B2 (en) | 1998-12-21 | 2003-03-14 | Top layers of metal for high performance IC's |
US11/121,477 Expired - Fee Related US7294870B2 (en) | 1998-12-21 | 2005-05-04 | Top layers of metal for high performance IC's |
US11/130,917 Expired - Fee Related US7329954B2 (en) | 1998-12-21 | 2005-05-17 | Top layers of metal for high performance IC's |
US11/131,481 Expired - Fee Related US7372155B2 (en) | 1998-12-21 | 2005-05-18 | Top layers of metal for high performance IC's |
US11/145,468 Expired - Fee Related US7384864B2 (en) | 1998-12-21 | 2005-06-03 | Top layers of metal for high performance IC's |
US11/149,092 Expired - Fee Related US7422976B2 (en) | 1998-12-21 | 2005-06-09 | Top layers of metal for high performance IC's |
US11/230,102 Expired - Fee Related US7368376B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/230,101 Expired - Fee Related US7372085B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/230,004 Expired - Fee Related US7294871B2 (en) | 1998-12-21 | 2005-09-19 | Top layers of metal for high performance IC's |
US11/829,109 Expired - Fee Related US7999384B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,108 Expired - Fee Related US7358610B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,107 Abandoned US20070262460A1 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,106 Abandoned US20070262459A1 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,110 Expired - Fee Related US8531038B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/829,105 Expired - Fee Related US7385291B2 (en) | 1998-12-21 | 2007-07-27 | Top layers of metal for high performance IC's |
US11/833,225 Abandoned US20070267714A1 (en) | 1998-12-21 | 2007-08-02 | Top layers of metal for high performance IC's |
US11/839,552 Abandoned US20070273034A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,557 Abandoned US20070273037A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,551 Abandoned US20070273033A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,550 Abandoned US20070273032A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,558 Expired - Fee Related US7442969B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,554 Expired - Fee Related US7884479B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,559 Expired - Fee Related US7397135B2 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,556 Abandoned US20070273036A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,561 Abandoned US20070273041A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/839,560 Abandoned US20070273040A1 (en) | 1998-12-21 | 2007-08-16 | Top layers of metal for high performance IC's |
US11/840,235 Abandoned US20070281467A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,239 Expired - Fee Related US7465975B2 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,242 Expired - Fee Related US7425764B2 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,238 Abandoned US20070278686A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,243 Abandoned US20070278691A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
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US11/893,659 Abandoned US20070288880A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/840,231 Abandoned US20070278684A1 (en) | 1998-12-21 | 2007-08-17 | Top layers of metal for high performance IC's |
US11/842,161 Abandoned US20070284752A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,158 Abandoned US20070284751A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,159 Abandoned US20070284753A1 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,153 Expired - Fee Related US8471384B2 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/842,160 Expired - Fee Related US7482693B2 (en) | 1998-12-21 | 2007-08-21 | Top layers of metal for high performance IC's |
US11/845,115 Expired - Fee Related US7385292B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,109 Abandoned US20070290348A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,759 Abandoned US20070290355A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,771 Abandoned US20070290358A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,773 Abandoned US20070293036A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,766 Expired - Fee Related US7382058B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,111 Abandoned US20070290350A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,123 Expired - Fee Related US8415800B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,116 Expired - Fee Related US7388292B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,110 Abandoned US20070290349A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,113 Abandoned US20070290351A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,764 Abandoned US20070290356A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,122 Abandoned US20070290354A1 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/845,775 Expired - Fee Related US7396756B2 (en) | 1998-12-21 | 2007-08-27 | Top layers of metal for high performance IC's |
US11/930,191 Expired - Fee Related US7456100B2 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/930,185 Abandoned US20080083987A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US11/930,187 Abandoned US20080048329A1 (en) | 1998-12-21 | 2007-10-31 | Top layers of metal for high performance IC's |
US12/036,309 Abandoned US20080146020A1 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/036,306 Abandoned US20080142980A1 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/036,308 Expired - Fee Related US8022545B2 (en) | 1998-12-21 | 2008-02-25 | Top layers of metal for high performance IC's |
US12/203,154 Expired - Fee Related US7863654B2 (en) | 1998-12-21 | 2008-09-03 | Top layers of metal for high performance IC's |
Country Status (1)
Country | Link |
---|---|
US (67) | US6965165B2 (en) |
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