FR2793943B1 - Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components - Google Patents

Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components

Info

Publication number
FR2793943B1
FR2793943B1 FR9906433A FR9906433A FR2793943B1 FR 2793943 B1 FR2793943 B1 FR 2793943B1 FR 9906433 A FR9906433 A FR 9906433A FR 9906433 A FR9906433 A FR 9906433A FR 2793943 B1 FR2793943 B1 FR 2793943B1
Authority
FR
France
Prior art keywords
micro
components
manufacture
method
chip inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9906433A
Other languages
French (fr)
Other versions
FR2793943A1 (en
Inventor
Laurent Basteres
Ahmed Mhani
Jean Michel Karam
Catherine Charrier
Eric Bouchon
Guy Imbert
Francois Valentin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Memscap
Original Assignee
Memscap
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memscap filed Critical Memscap
Priority to FR9906433A priority Critical patent/FR2793943B1/en
Publication of FR2793943A1 publication Critical patent/FR2793943A1/en
Application granted granted Critical
Publication of FR2793943B1 publication Critical patent/FR2793943B1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/046Printed circuit coils structurally combined with ferromagnetic material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/042Printed circuit coils by thin film techniques
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
FR9906433A 1999-05-18 1999-05-18 Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components Expired - Lifetime FR2793943B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9906433A FR2793943B1 (en) 1999-05-18 1999-05-18 Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR9906433A FR2793943B1 (en) 1999-05-18 1999-05-18 Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components
US09/558,641 US6429764B1 (en) 1999-05-18 2000-04-26 Microcomponents of the microinductor or microtransformer type and process for fabricating such microcomponents
JP2000133972A JP2000353617A (en) 1999-05-18 2000-05-02 Microelement, such as microinductor, micro-transformer, or the like, and manufacture of such microelements
EP20000420093 EP1054417A1 (en) 1999-05-18 2000-05-10 Microcomponents of microinductance or microtransformer type and manufacturing process
CA 2308871 CA2308871A1 (en) 1999-05-18 2000-05-11 Micro-inductance or micro-transformer micro-components, and manufacturing process for such micro-components

Publications (2)

Publication Number Publication Date
FR2793943A1 FR2793943A1 (en) 2000-11-24
FR2793943B1 true FR2793943B1 (en) 2001-07-13

Family

ID=9545823

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9906433A Expired - Lifetime FR2793943B1 (en) 1999-05-18 1999-05-18 Microwave components of the chip inductor or micro transformer type, and method of manufacture of such micro-components

Country Status (5)

Country Link
US (1) US6429764B1 (en)
EP (1) EP1054417A1 (en)
JP (1) JP2000353617A (en)
CA (1) CA2308871A1 (en)
FR (1) FR2793943B1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906849B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7960269B2 (en) 2005-07-22 2011-06-14 Megica Corporation Method for forming a double embossing structure
US8021976B2 (en) 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US8089155B2 (en) 1998-12-21 2012-01-03 Megica Corporation High performance system-on-chip discrete components using post passivation process
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US8487400B2 (en) 1998-12-21 2013-07-16 Megica Corporation High performance system-on-chip using post passivation process

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KR100530871B1 (en) * 1998-08-14 2006-06-16 이해영 Bonding wire inductor, and chip-inductor, coupler and transformer including the bonding wire inductor
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6965165B2 (en) * 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
DE10002377A1 (en) * 2000-01-20 2001-08-02 Infineon Technologies Ag Coil and coil system for integration into a microelectronic circuit and microelectronic circuit
DE10104648B4 (en) * 2000-07-14 2004-06-03 Forschungszentrum Karlsruhe Gmbh RF microinductance
SG119136A1 (en) * 2000-08-14 2006-02-28 Megic Corp High performance system-on-chip using post passivation process
FR2828186A1 (en) * 2001-08-06 2003-02-07 Memscap Micro-electro-mechanical component functioning as filter, for use in the range of radio-frequencies
US6759275B1 (en) 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
FR2830670A1 (en) * 2001-10-10 2003-04-11 St Microelectronics Sa Integrated circuit with inductance comprises spiral channel in which metal deposit forms inductance winding
FR2830683A1 (en) 2001-10-10 2003-04-11 St Microelectronics Sa Integrated circuit with inductance comprises spiral channel in which metal deposit forms inductance winding
TW577094B (en) * 2002-05-10 2004-02-21 Ind Tech Res Inst High-density multi-turn micro coil and its manufacturing method
FR2842018B3 (en) * 2002-07-02 2004-06-04 Memscap Microcomponent including an inductive element of the type inductance or transformer
US20050093667A1 (en) * 2003-11-03 2005-05-05 Arnd Kilian Three-dimensional inductive micro components
KR100568416B1 (en) * 2003-12-15 2006-04-05 매그나칩 반도체 유한회사 Method of forming a inductor in semiconductor devices
US7355282B2 (en) 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US7283029B2 (en) * 2004-12-08 2007-10-16 Purdue Research Foundation 3-D transformer for high-frequency applications
JP4764668B2 (en) * 2005-07-05 2011-09-07 セイコーエプソン株式会社 Electronic substrate manufacturing method and electronic substrate
US20070188920A1 (en) * 2006-02-16 2007-08-16 Samsung Electronics Co., Ltd. Microinductor and fabrication method thereof
CN100405543C (en) 2006-07-21 2008-07-23 中国科学院上海微系统与信息技术研究所 Method for producing CMOS process compatible embedded suspension solenoid structure inductance or mutual inductance
US8749021B2 (en) 2006-12-26 2014-06-10 Megit Acquisition Corp. Voltage regulator integrated with semiconductor chip
US7868431B2 (en) * 2007-11-23 2011-01-11 Alpha And Omega Semiconductor Incorporated Compact power semiconductor package and method with stacked inductor and integrated circuit die
US8217748B2 (en) * 2007-11-23 2012-07-10 Alpha & Omega Semiconductor Inc. Compact inductive power electronics package
US7884696B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Lead frame-based discrete power inductor
US7884452B2 (en) 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
US20090309687A1 (en) * 2008-06-11 2009-12-17 Aleksandar Aleksov Method of manufacturing an inductor for a microelectronic device, method of manufacturing a substrate containing such an inductor, and substrate manufactured thereby,
JP5335931B2 (en) 2008-12-26 2013-11-06 メギカ・コーポレイションMegica Corporation Chip package with power management integrated circuit and related technology
US9721715B2 (en) * 2009-01-22 2017-08-01 2Sentient Inc. Solid state components having an air core
US20100259349A1 (en) * 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor
CN102376693B (en) * 2010-08-23 2016-05-11 香港科技大学 Monolithic magnetic induction device
CN102738128B (en) 2011-03-30 2015-08-26 香港科技大学 High inductance integrated magnetic induction device and the manufacturing method
KR101541570B1 (en) * 2011-09-30 2015-08-04 삼성전기주식회사 Coil Parts And Method of Manufacturing The Same
FR3025943A1 (en) * 2014-09-11 2016-03-18 Saint Gobain Performance Plast Electroconductive support for oled, oled incorporating and manufacturing the same.
US10014250B2 (en) * 2016-02-09 2018-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor devices
JP2019110237A (en) 2017-12-19 2019-07-04 三菱電機株式会社 Transformer, manufacturing method of the transformer, and semiconductor device

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US3305814A (en) * 1967-02-21 Hybrid solid state device
US4933209A (en) * 1989-06-28 1990-06-12 Hewlett-Packard Company Method of making a thin film recording head apparatus utilizing polyimide films
US5336921A (en) * 1992-01-27 1994-08-09 Motorola, Inc. Vertical trench inductor
JPH08203760A (en) * 1995-01-25 1996-08-09 Toshiba Corp Air-core current transformer
US5621594A (en) * 1995-02-17 1997-04-15 Aiwa Research And Development, Inc. Electroplated thin film conductor coil assembly
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
US5898991A (en) * 1997-01-16 1999-05-04 International Business Machines Corporation Methods of fabrication of coaxial vias and magnetic devices

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US7906422B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US7915157B2 (en) 1998-12-21 2011-03-29 Megica Corporation Chip structure and process for forming the same
US8089155B2 (en) 1998-12-21 2012-01-03 Megica Corporation High performance system-on-chip discrete components using post passivation process
US8138079B2 (en) 1998-12-21 2012-03-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US8487400B2 (en) 1998-12-21 2013-07-16 Megica Corporation High performance system-on-chip using post passivation process
US7906849B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US8008776B2 (en) 2001-12-13 2011-08-30 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7919867B2 (en) 2001-12-13 2011-04-05 Megica Corporation Chip structure and process for forming the same
US7932603B2 (en) 2001-12-13 2011-04-26 Megica Corporation Chip structure and process for forming the same
US8026588B2 (en) 2002-10-15 2011-09-27 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US8742580B2 (en) 2002-10-15 2014-06-03 Megit Acquisition Corp. Method of wire bonding over active area of a semiconductor circuit
US8021976B2 (en) 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US9142527B2 (en) 2002-10-15 2015-09-22 Qualcomm Incorporated Method of wire bonding over active area of a semiconductor circuit
US9153555B2 (en) 2002-10-15 2015-10-06 Qualcomm Incorporated Method of wire bonding over active area of a semiconductor circuit
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US7960269B2 (en) 2005-07-22 2011-06-14 Megica Corporation Method for forming a double embossing structure

Also Published As

Publication number Publication date
US6429764B1 (en) 2002-08-06
EP1054417A1 (en) 2000-11-22
CA2308871A1 (en) 2000-11-18
JP2000353617A (en) 2000-12-19
FR2793943A1 (en) 2000-11-24

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