FR2791470B1 - Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit - Google Patents

Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit

Info

Publication number
FR2791470B1
FR2791470B1 FR9903762A FR9903762A FR2791470B1 FR 2791470 B1 FR2791470 B1 FR 2791470B1 FR 9903762 A FR9903762 A FR 9903762A FR 9903762 A FR9903762 A FR 9903762A FR 2791470 B1 FR2791470 B1 FR 2791470B1
Authority
FR
France
Prior art keywords
integrated circuit
manufacturing
method
inductive component
incorporating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9903762A
Other languages
French (fr)
Other versions
FR2791470A1 (en
Inventor
Laurent Basteres
Ahmed Mhani
Francois Valentin
Jean Michel Karam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Memscap
Original Assignee
Memscap
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memscap filed Critical Memscap
Priority to FR9903762A priority Critical patent/FR2791470B1/en
Publication of FR2791470A1 publication Critical patent/FR2791470A1/en
Application granted granted Critical
Publication of FR2791470B1 publication Critical patent/FR2791470B1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10Inductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227Inductive arrangements or effects of, or between, wiring layers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
FR9903762A 1999-03-23 1999-03-23 Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit Expired - Lifetime FR2791470B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9903762A FR2791470B1 (en) 1999-03-23 1999-03-23 Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
FR9903762A FR2791470B1 (en) 1999-03-23 1999-03-23 Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit
US09/525,840 US6459135B1 (en) 1999-03-23 2000-03-15 Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit
EP00420046A EP1039544A1 (en) 1999-03-23 2000-03-21 Monolithic integrated circuit comprising an inductor and a method of fabricating the same
CA002301988A CA2301988A1 (en) 1999-03-23 2000-03-22 Monolithic integrated circuit with a built-in inductive component and procedure for fabricating such an integrated circuit
JP2000080808A JP2000277693A (en) 1999-03-23 2000-03-22 Integrated circuit with incorporated inductive element and manufacture of the same
US10/177,435 US6548365B2 (en) 1999-03-23 2002-06-21 Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit

Publications (2)

Publication Number Publication Date
FR2791470A1 FR2791470A1 (en) 2000-09-29
FR2791470B1 true FR2791470B1 (en) 2001-06-01

Family

ID=9543651

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9903762A Expired - Lifetime FR2791470B1 (en) 1999-03-23 1999-03-23 Monolithic integrated circuit incorporating an inductive component and method for manufacturing such an integrated circuit

Country Status (5)

Country Link
US (2) US6459135B1 (en)
EP (1) EP1039544A1 (en)
JP (1) JP2000277693A (en)
CA (1) CA2301988A1 (en)
FR (1) FR2791470B1 (en)

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US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US7372161B2 (en) * 2000-10-18 2008-05-13 Megica Corporation Post passivation interconnection schemes on top of the IC chips
US7531417B2 (en) 1998-12-21 2009-05-12 Megica Corporation High performance system-on-chip passive device using post passivation process
US20080035974A1 (en) 1998-12-21 2008-02-14 Megica Corporation High performance system-on-chip using post passivation process
US7405149B1 (en) 1998-12-21 2008-07-29 Megica Corporation Post passivation method for semiconductor chip or wafer
US6965165B2 (en) * 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US6869870B2 (en) 1998-12-21 2005-03-22 Megic Corporation High performance system-on-chip discrete components using post passivation process
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US8178435B2 (en) * 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
US7521805B2 (en) * 2004-10-12 2009-04-21 Megica Corp. Post passivation interconnection schemes on top of the IC chips
US7271489B2 (en) 2003-10-15 2007-09-18 Megica Corporation Post passivation interconnection schemes on top of the IC chips
USRE43674E1 (en) 2000-10-18 2012-09-18 Megica Corporation Post passivation metal scheme for high-performance integrated circuit devices
US7459790B2 (en) * 2003-10-15 2008-12-02 Megica Corporation Post passivation interconnection schemes on top of the IC chips
US6495442B1 (en) 2000-10-18 2002-12-17 Magic Corporation Post passivation interconnection schemes on top of the IC chips
JP4956874B2 (en) * 2001-08-02 2012-06-20 ソニー株式会社 Semiconductor device and semiconductor manufacturing method
FR2828186A1 (en) * 2001-08-06 2003-02-07 Memscap Micro-electro-mechanical component functioning as filter, for use in the range of radio-frequencies
US6759275B1 (en) 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
FR2832852B1 (en) * 2001-11-29 2004-02-27 Memscap Method for manufacturing an electronic component incorporating an inductive micro-component
FR2832853B1 (en) * 2001-11-29 2004-02-27 Memscap Method for manufacturing an electronic component incorporating an inductive micro-component
FR2833411B1 (en) * 2001-12-11 2004-02-27 Memscap Method for manufacturing an electronic component incorporating an inductive micro-component
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW544882B (en) 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW503496B (en) 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
DE10212630A1 (en) * 2002-03-21 2003-10-16 Infineon Technologies Ag Coil on a semiconductor substrate and method for its production
FR2841042B1 (en) * 2002-06-13 2004-07-09 Memscap Micro-component including planar inductance and method for manufacturing such a micro-component
JP4229642B2 (en) * 2002-06-18 2009-02-25 Necエレクトロニクス株式会社 Inductor for semiconductor integrated circuit and manufacturing method thereof
US7319277B2 (en) * 2003-05-08 2008-01-15 Megica Corporation Chip structure with redistribution traces
US6716693B1 (en) * 2003-03-27 2004-04-06 Chartered Semiconductor Manufacturing Ltd. Method of forming a surface coating layer within an opening within a body by atomic layer deposition
US7394161B2 (en) 2003-12-08 2008-07-01 Megica Corporation Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US7355282B2 (en) 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US7423346B2 (en) * 2004-09-09 2008-09-09 Megica Corporation Post passivation interconnection process and structures
US7473999B2 (en) * 2005-09-23 2009-01-06 Megica Corporation Semiconductor chip and process for forming the same
US7381642B2 (en) * 2004-09-23 2008-06-03 Megica Corporation Top layers of metal for integrated circuits
TWI330863B (en) 2005-05-18 2010-09-21 Megica Corp Semiconductor chip with coil element over passivation layer
TWI305951B (en) 2005-07-22 2009-02-01 Megica Corp Method for forming a double embossing structure
US7367113B2 (en) * 2006-04-06 2008-05-06 United Microelectronics Corp. Method for fabricating a transformer integrated with a semiconductor structure
US7524731B2 (en) * 2006-09-29 2009-04-28 Freescale Semiconductor, Inc. Process of forming an electronic device including an inductor
US20080185679A1 (en) * 2006-10-19 2008-08-07 United Microelectronics Corp. Inductor layout and manufacturing method thereof
US8749021B2 (en) * 2006-12-26 2014-06-10 Megit Acquisition Corp. Voltage regulator integrated with semiconductor chip
FR2911006A1 (en) * 2007-01-03 2008-07-04 St Microelectronics Sa Integrated electronic circuit chip for electronic circuit assembly e.g. filter, has inductor arranged above protective layer, where thickness of inductor is extended from and beyond upper surface of protective layer
US20100165585A1 (en) * 2008-12-26 2010-07-01 Megica Corporation Chip packages with power management integrated circuits and related techniques
US8872627B2 (en) 2010-02-12 2014-10-28 Biotillion, Llc Tracking biological and other samples using RFID tags
KR101793469B1 (en) * 2016-01-22 2017-11-03 (주)티에스이 Chip-type inductor

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Publication number Priority date Publication date Assignee Title
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
JPH0677407A (en) * 1992-04-06 1994-03-18 Nippon Precision Circuits Kk Semiconductor device
US5478773A (en) * 1994-04-28 1995-12-26 Motorola, Inc. Method of making an electronic device having an integrated inductor
US5446311A (en) * 1994-09-16 1995-08-29 International Business Machines Corporation High-Q inductors in silicon technology without expensive metalization
JPH08116031A (en) * 1994-10-17 1996-05-07 Hitachi Ltd Semiconductor device
JPH08172161A (en) * 1994-12-16 1996-07-02 Hitachi Ltd Inductor element and its manufacture and monolithic microwave integrated circuit using the same
JPH0936312A (en) * 1995-07-18 1997-02-07 Nec Corp Inductance element and its manufacture
JPH0963847A (en) * 1995-08-25 1997-03-07 Nec Corp Inductor element and fabrication thereof
JPH09186018A (en) * 1995-12-23 1997-07-15 Samsung Electron Co Ltd Inductor using polyimide and its manufacture
JP2904086B2 (en) * 1995-12-27 1999-06-14 日本電気株式会社 Semiconductor device and manufacturing method thereof
JP2765547B2 (en) * 1995-12-27 1998-06-18 日本電気株式会社 Semiconductor device and manufacturing method thereof
FR2780546B1 (en) * 1998-06-29 2003-05-16 Memscap Monolithic integrated circuit comprising a plane inductance or a planar transformer, and method for manufacturing such a circuit

Also Published As

Publication number Publication date
CA2301988A1 (en) 2000-09-23
EP1039544A1 (en) 2000-09-27
JP2000277693A (en) 2000-10-06
US6459135B1 (en) 2002-10-01
US20020160576A1 (en) 2002-10-31
FR2791470A1 (en) 2000-09-29
US6548365B2 (en) 2003-04-15

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