US20080047634A1 - Copper alloy - Google Patents

Copper alloy Download PDF

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Publication number
US20080047634A1
US20080047634A1 US11/846,074 US84607407A US2008047634A1 US 20080047634 A1 US20080047634 A1 US 20080047634A1 US 84607407 A US84607407 A US 84607407A US 2008047634 A1 US2008047634 A1 US 2008047634A1
Authority
US
United States
Prior art keywords
precipitate
copper alloy
mass
precipitates
alloy according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/846,074
Other languages
English (en)
Inventor
Kuniteru Mihara
Nobuyuki Tanaka
Tatsuhiko Eguchi
Kiyoshige Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Assigned to THE FURUKAWA ELECTRIC CO., LTD. reassignment THE FURUKAWA ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EGUCHI, TATSUHIKO, HIROSE, KIYOSHIGE, MIHARA, KUNITERU, TANAKA, NOBUYUKI
Publication of US20080047634A1 publication Critical patent/US20080047634A1/en
Priority to US13/083,874 priority Critical patent/US20110186187A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
US11/846,074 2005-02-28 2007-08-28 Copper alloy Abandoned US20080047634A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/083,874 US20110186187A1 (en) 2005-02-28 2011-04-11 Copper alloy

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005055144 2005-02-28
JP2005-055147 2005-02-28
JP2005055147 2005-02-28
JP2005-055144 2005-02-28
PCT/JP2006/303738 WO2006093140A1 (fr) 2005-02-28 2006-02-28 Alliage de cuivre

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/303738 Continuation WO2006093140A1 (fr) 2005-02-28 2006-02-28 Alliage de cuivre

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/083,874 Division US20110186187A1 (en) 2005-02-28 2011-04-11 Copper alloy

Publications (1)

Publication Number Publication Date
US20080047634A1 true US20080047634A1 (en) 2008-02-28

Family

ID=36941169

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/846,074 Abandoned US20080047634A1 (en) 2005-02-28 2007-08-28 Copper alloy
US13/083,874 Abandoned US20110186187A1 (en) 2005-02-28 2011-04-11 Copper alloy

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/083,874 Abandoned US20110186187A1 (en) 2005-02-28 2011-04-11 Copper alloy

Country Status (4)

Country Link
US (2) US20080047634A1 (fr)
EP (1) EP1873266B1 (fr)
CN (1) CN101166840B (fr)
WO (1) WO2006093140A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100047112A1 (en) * 2007-02-16 2010-02-25 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy sheet excellent in strength and formability for electrical and electronic components
US20110163447A1 (en) * 2008-09-30 2011-07-07 Jx Nippon Mining & Metals Corporation High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film
US20110240182A1 (en) * 2008-12-12 2011-10-06 Jx Nippon Mining & Metals Corporation Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
US20130224070A1 (en) * 2012-02-24 2013-08-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy
US20130333812A1 (en) * 2010-12-13 2013-12-19 Tohoku Techno Arch Co., Ltd. Copper alloy and process for producing copper alloy
US20140010704A1 (en) * 2010-12-13 2014-01-09 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
CN103805807A (zh) * 2012-11-09 2014-05-21 株式会社豊山 用于电气和电子部件的铜合金材料及其制造方法
US9460825B2 (en) 2010-05-31 2016-10-04 Jx Nippon Mining & Metals Corporation Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same
US9476134B2 (en) 2008-09-30 2016-10-25 Jx Nippon Mining & Metals Corporation High purity copper and method of producing high purity copper based on electrolysis
US10056166B2 (en) 2010-08-24 2018-08-21 Jx Nippon Mining & Metals Corporation Copper-cobalt-silicon alloy for electrode material
US20180245184A1 (en) * 2017-02-25 2018-08-30 Wieland-Werke Ag Sliding element composed of a copper alloy
CN115198135A (zh) * 2022-07-07 2022-10-18 浙江鸿越铜业有限公司 一种合金铜棒及其加工工艺
CN116732384A (zh) * 2023-08-08 2023-09-12 宁波兴业盛泰集团有限公司 铜镍硅合金铸锭及其制备方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100086435A1 (en) * 2007-03-30 2010-04-08 Nippon Mining & Metals Co., Ltd. Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
US20110038753A1 (en) * 2007-11-05 2011-02-17 Hiroshi Kaneko Copper alloy sheet material
EP2256219A4 (fr) * 2008-02-18 2012-06-27 Furukawa Electric Co Ltd Matériau d'alliage de cuivre
CN102140594B (zh) * 2011-03-11 2012-10-03 无锡日月合金材料有限公司 一种高强高导高韧铜合金及其制备方法
CN102560192B (zh) * 2011-12-31 2016-11-23 无锡日月合金材料有限公司 一种高强高塑性铜合金及其制备方法
CN104561645B (zh) * 2014-11-10 2017-01-18 华玉叶 一种锡铜合金棒材的制备方法
RU2566097C1 (ru) * 2014-12-22 2015-10-20 Юлия Алексеевна Щепочкина Сплав на основе меди
CN104911390A (zh) * 2015-06-13 2015-09-16 陈新棠 一种抗菌耐腐蚀的热交换器铜管
CN105568047B (zh) * 2015-12-29 2017-10-10 宁波博威合金材料股份有限公司 高强高弹高导铜合金
RU2677902C1 (ru) * 2017-12-27 2019-01-22 Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") Высокопрочный медный сплав
CN109355529A (zh) * 2018-12-08 2019-02-19 雷纳德流体智能科技江苏股份有限公司 一种铜合金

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846346A (en) * 1995-12-08 1998-12-08 Poongsan Corporation High strength high conductivity Cu-alloy of precipitate growth suppression type and production process
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
US20050028907A1 (en) * 2002-03-12 2005-02-10 The Furukawa Electric Co., Ltd. High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
US20050236074A1 (en) * 2004-02-27 2005-10-27 Kuniteru Mihara Copper alloy

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6376839A (ja) * 1986-09-18 1988-04-07 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造法
EP0271991B1 (fr) * 1986-11-13 1991-10-02 Ngk Insulators, Ltd. Fabrication d'alliages cuivre-béryllium
JPH0830234B2 (ja) * 1987-07-24 1996-03-27 古河電気工業株式会社 高力高導電性銅合金
JPH04180531A (ja) * 1990-11-14 1992-06-26 Nikko Kyodo Co Ltd 通電材料
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP3520046B2 (ja) * 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4646192B2 (ja) * 2004-06-02 2011-03-09 古河電気工業株式会社 電気電子機器用銅合金材料およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846346A (en) * 1995-12-08 1998-12-08 Poongsan Corporation High strength high conductivity Cu-alloy of precipitate growth suppression type and production process
US20050028907A1 (en) * 2002-03-12 2005-02-10 The Furukawa Electric Co., Ltd. High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
US20050236074A1 (en) * 2004-02-27 2005-10-27 Kuniteru Mihara Copper alloy

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100047112A1 (en) * 2007-02-16 2010-02-25 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy sheet excellent in strength and formability for electrical and electronic components
US8784580B2 (en) * 2007-02-16 2014-07-22 Kobe Steel, Ltd. Copper alloy sheet excellent in strength and formability for electrical and electronic components
US20110163447A1 (en) * 2008-09-30 2011-07-07 Jx Nippon Mining & Metals Corporation High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film
US9476134B2 (en) 2008-09-30 2016-10-25 Jx Nippon Mining & Metals Corporation High purity copper and method of producing high purity copper based on electrolysis
US9441289B2 (en) * 2008-09-30 2016-09-13 Jx Nippon Mining & Metals Corporation High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film
US9394589B2 (en) * 2008-12-12 2016-07-19 Jx Nippon Mining & Metals Corporation Ni-Si-Co copper alloy and manufacturing method therefor
US20110240182A1 (en) * 2008-12-12 2011-10-06 Jx Nippon Mining & Metals Corporation Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
US9460825B2 (en) 2010-05-31 2016-10-04 Jx Nippon Mining & Metals Corporation Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same
US10056166B2 (en) 2010-08-24 2018-08-21 Jx Nippon Mining & Metals Corporation Copper-cobalt-silicon alloy for electrode material
US20130333812A1 (en) * 2010-12-13 2013-12-19 Tohoku Techno Arch Co., Ltd. Copper alloy and process for producing copper alloy
US20140010704A1 (en) * 2010-12-13 2014-01-09 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
US9476474B2 (en) * 2010-12-13 2016-10-25 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
US9121084B2 (en) * 2012-02-24 2015-09-01 Kobe Steel, Ltd. Copper alloy
US20130224070A1 (en) * 2012-02-24 2013-08-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy
US20140305551A1 (en) * 2012-11-09 2014-10-16 Poongsan Corporation Copper alloy material for electrical and electronic components and method of preparing the same
CN103805807A (zh) * 2012-11-09 2014-05-21 株式会社豊山 用于电气和电子部件的铜合金材料及其制造方法
US20180245184A1 (en) * 2017-02-25 2018-08-30 Wieland-Werke Ag Sliding element composed of a copper alloy
CN115198135A (zh) * 2022-07-07 2022-10-18 浙江鸿越铜业有限公司 一种合金铜棒及其加工工艺
CN116732384A (zh) * 2023-08-08 2023-09-12 宁波兴业盛泰集团有限公司 铜镍硅合金铸锭及其制备方法

Also Published As

Publication number Publication date
US20110186187A1 (en) 2011-08-04
EP1873266A1 (fr) 2008-01-02
CN101166840B (zh) 2012-07-18
EP1873266A4 (fr) 2010-07-28
WO2006093140A1 (fr) 2006-09-08
CN101166840A (zh) 2008-04-23
EP1873266B1 (fr) 2012-04-25

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Legal Events

Date Code Title Description
AS Assignment

Owner name: THE FURUKAWA ELECTRIC CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MIHARA, KUNITERU;TANAKA, NOBUYUKI;EGUCHI, TATSUHIKO;AND OTHERS;REEL/FRAME:020085/0429

Effective date: 20071030

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION