US20070154291A1 - Displaced wafer detection systems - Google Patents

Displaced wafer detection systems Download PDF

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Publication number
US20070154291A1
US20070154291A1 US11/444,500 US44450006A US2007154291A1 US 20070154291 A1 US20070154291 A1 US 20070154291A1 US 44450006 A US44450006 A US 44450006A US 2007154291 A1 US2007154291 A1 US 2007154291A1
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US
United States
Prior art keywords
wafers
transmission robot
unified pod
pod
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/444,500
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English (en)
Inventor
Yuan-Hsing Lin
Chang-Liang Huang
Chiung-Chun Lee
Lin-Her Ko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Powerchip Semiconductor Corp
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Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Assigned to POWERCHIP SEMICONDUCTOR CORP. reassignment POWERCHIP SEMICONDUCTOR CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, CHANG-LIANG, KO, LIN-HER, LEE, CHIUNG-CHUN, LIN, YUAN-HSING
Publication of US20070154291A1 publication Critical patent/US20070154291A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40562—Position and orientation of end effector, teach probe, track them
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Definitions

  • the present invention relates to semiconductor manufacturing techniques, and more particularly to displaced wafer detection systems.
  • a unified pod such as a front opening unified pod (FOUP) packing 13 or 25 pieces of 12′′ wafers, is utilized to transport wafers between fabrication steps and prevents contamination of wafers.
  • FOUP front opening unified pod
  • the pod opener automatically opens the door of the unified pod, and the wafers therein are acquired by other mechanisms and sent to various fabrication equipment.
  • FIG. 1 is a fab floor plan.
  • pod opener 20 automatically opens the door of unified pod 10 .
  • Horizontal transmission robot 30 comprises robot arms R 1 and R 2 .
  • Horizontal transmission robot 30 utilizes robot arm R 1 to carry a wafer lot in a horizontal direction from unified pod 10 to another position.
  • the wafers remain substantially parallel.
  • all the acquired wafers are intended to substantially reach the same position of wafer 12 in the floor plan of FIG. 2 , i.e. the centers of the wafers are intended to lie on substantially the same line.
  • Some wafers, such as wafer 11 may fall occasionally, e.g. the center of wafer 11 does not lie on the same line as other wafers.
  • An exemplary embodiment of a displaced wafer detection system comprises a unified pod, a pod opener, a horizontal transmission robot, and a sensor.
  • the unified pod encloses a plurality of wafers in a first position.
  • the pod opener opens the unified pod.
  • the horizontal transmission robot carries the wafers from the unified pod to a second position. When one of the wafers has reached the second position, the sensor detects if any wafer slips during wafer transmission from the unified pod.
  • An exemplary embodiment of a displaced wafer detection system comprises a unified pod, a pod opener, a horizontal transmission robot, a vertical transmission robot, a transporter, and a sensor.
  • the unified pod encloses a first lot of wafers in a first position.
  • the pod opener opens the unified pod.
  • the horizontal transmission robot carries the wafers from the unified pod.
  • the vertical transmission robot when in a first orientation, acquires the wafers and then vertically rotates to a second orientation.
  • the transporter moves upward to support the wafers in a vertical orientation when the vertical transmission robot is in the second orientation.
  • the sensor detects if any wafers have dropped from the vertical transmission robot before the wafers are supported by the transporter.
  • FIG. 1 is a schematic diagram of a fab
  • FIG. 2 is a schematic view of a horizontal transmission robot acquiring a wafer lot
  • FIG. 3 is a schematic view of a vertical transmission robot acquiring a wafer lot
  • FIG. 4 is a schematic diagram of a wafer dropping from the vertical transmission robot
  • FIG. 5 is a schematic diagram of a displaced wafer detection system
  • FIG. 6 is a schematic diagram of the arrangement of transmitters and receivers of a sensor
  • FIG. 7 is a schematic diagram of the arrangement of transmitters and receivers of another sensor
  • FIG. 8 is a side view of a sensor in a first direction
  • FIG. 9 is a side view of a sensor in a second direction.
  • FIG. 10 is a side view of an exemplary sensor.
  • sensor 60 is disposed between horizontal transmission robot 30 and pod opener 20
  • sensor 70 is disposed between vertical transmission robot 40 and transporter 50
  • Control unit 1 which may be integrated in or coupled to a manufacturing execution system (MES) dominates sensors 60 and 70 and receives detection data therefrom.
  • Unified pod 10 encloses a plurality of wafers 13 .
  • pod opener 20 automatically opens the door of unified pod 10 , wherein wafers 13 are substantially parallel and in a first position.
  • the centers of wafers 13 in the opened unified pod 10 lie substantially on a first line.
  • Horizontal transmission robot 30 comprises robot arms R 1 and R 2 .
  • Horizontal transmission robot 30 utilizes robot arm R 1 to horizontally carry wafers 13 from unified pod 10 to a second position, wherein wafers 13 remain substantially parallel.
  • the centers of wafers 13 reach and lie on a second line.
  • sensor 60 detects if any wafers slipped during transport of wafers 13 from unified pod 10 to the second position by horizontal transmission robot 30 .
  • Sensor 60 is disposed between horizontal transmission robot and the pod opener while wafers 13 are carried by horizontal transmission robot 30 from unified pod 10 to the second position.
  • Sensor 60 may be fixed to pod opener 20 or horizontal transmission robot 30 , or even to another movable or stationary equipment or object.
  • sensor 60 is fixed to a first surface of pod opener 20 , facing horizontal transmission robot 30 while horizontal transmission robot 30 is carrying wafers 13 from unified pod 10 .
  • Sensor 60 comprises at least one transmitter dispatching a signal and one receiver accepting the signal.
  • the transmitter and the receiver may be disposed on a third line parallel to the second line, whereby detection signals are transmitted from the transmitter to the receiver along the third line.
  • the path of the detection signals lies substantially on the same plane as the first and the second lines.
  • Control unit 1 may direct the transmitter to deliver detection signals when horizontal transmission robot 30 has delivered wafers 13 from unified pod 10 to the second position.
  • Control unit 1 determines that at least one of wafers 13 slips when one of wafers 13 has reached the second position when the receiver does not receive the delivered detection signals.
  • Control unit 1 stops horizontal transmission robot 30 .
  • the detection signals are preferably implemented by infrared or other means that does not affect the wafers.
  • Sensor 60 may also be implemented by coupling of transmitters and receivers. As shown in FIG. 6 , transmitters 61 transmit detection signals 63 to receivers 62 . If transmitters 61 and receivers 62 are arranged horizontally to align all wafers, sensor 60 can further identify and report a sliding wafer to control unit 1 . As shown in FIG. 10 , a side view of an example of sensor 60 is provided. The closer the path of detection signals 63 to wafers 13 , the finer is the wafer sliding detection ability of sensor 60 .
  • wafers 13 are transferred from horizontal transmission robot 30 to vertical transmission robot 40 .
  • Vertical transmission robot 40 acquires wafers 13 when in a first orientation, and then vertically rotates to a second orientation to make wafers 13 stand in a vertical orientation.
  • transporter 50 moves upward from its original position below vertical transmission robot 40 to support wafers 13 in a vertical orientation, and moves wafers 13 along a specific track.
  • Transporter 50 can carry two lots of wafers, wherein wafers of a second lot are inserted between wafers of a first lot.
  • Sensor 70 detects if any wafers dropped from vertical transmission robot 40 during the period from the beginning of rotation of vertical transmission robot 40 to support of wafers 13 by transporter 50 .
  • Sensor 70 is disposed between vertical transmission robot 40 and transporter 50 when vertical transmission robot 40 is in the second orientation, and wafers 13 have not been supported by transporter 50 .
  • Sensor 70 may be fixed to transporter 50 or vertical transmission robot 40 , or even to another movable or stationary equipment or object.
  • Wafers 13 acquired by vertical transmission robot 40 are substantially parallel.
  • the centers of wafers 13 substantially move along a vertical plane while vertical transmission robot 40 rotates from the first orientation to the second orientation.
  • Sensor 70 comprises at least one transmitter dispatching a signal and one receiver accepting the signal.
  • the transmitter and the receiver may be disposed on a fourth line substantially parallel to or lying on the vertical plane.
  • Control unit 1 determines that at least one of the wafers 13 drops if the signal from the transmitter to the receiver is interrupted during a period since wafers 13 are acquired by vertical transmission robot 40 until wafers 13 are supported by transporter 50 . Control unit 1 may accordingly stop transporter 50 when at least a wafer drops.
  • Sensor 70 may also be implemented by coupling of transmitter and receiver.
  • transmitters 71 transmit detection signals 73 to receivers 72 . If transmitters 71 and receivers 72 align every wafer, sensor 70 can further identify and report a dropping wafer to control unit 1 .
  • FIG. 8 a side view of an exemplary sensor 70 is provided. Wafers 14 are wafers previously acquired by transporter 50 . Wafers 13 and 14 are interleaved on transporter 50 .
  • FIG. 9 A side view of another exemplary sensor 70 is provided in FIG. 9 .
  • FIGS. 8 and 9 are side views of examples of sensor 70 in different directions.
  • control unit 1 determines that at least one of the wafers 13 has dropped if the detection signals from transmitter 71 to receiver 72 are interrupted during a period since vertical transmission robot 40 acquires wafers 13 until wafers 13 and wafers 14 are interleaved. Control unit 1 may accordingly stop transporter 50 .
  • Control unit 1 detects wafer sliding or dropping events utilizing sensors 60 and 70 . When a wafer slide or a wafer drop event is detected, control unit 1 stops equipment carrying wafers and equipment acquiring the wafers and restarts the stopped equipment when problems caused by wafer sliding or wafer dropping are addressed, thus wafer damage caused by a small number of sliding and dropping wafers is prevented.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US11/444,500 2005-12-30 2006-06-01 Displaced wafer detection systems Abandoned US20070154291A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW094147624A TW200725785A (en) 2005-12-30 2005-12-30 Displaced wafer detection systems
TW94147624 2005-12-30

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KR (1) KR100780085B1 (ko)
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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5206627A (en) * 1990-11-21 1993-04-27 Tokyo Electron Sagami Limited Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD
US5604443A (en) * 1994-05-23 1997-02-18 Tokyo Electron Limited Probe test apparatus
US5706201A (en) * 1996-05-07 1998-01-06 Fortrend Engineering Corporation Software to determine the position of the center of a wafer
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
US5971696A (en) * 1996-10-01 1999-10-26 Tokyo Electron Limited System for carrying-in of cassette for substrates to be processed
US6224312B1 (en) * 1996-11-18 2001-05-01 Applied Materials, Inc. Optimal trajectory robot motion
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US20040213648A1 (en) * 2003-04-14 2004-10-28 Hofmeister Christopher A Substrate cassette mapper
US20070071581A1 (en) * 2005-07-11 2007-03-29 Ulysses Gilchrist Process apparatus with on-the-fly workpiece centering
US7219676B2 (en) * 2002-09-03 2007-05-22 Samsung Electronics Co., Ltd. Substrate detecting apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100252041B1 (ko) * 1997-10-30 2000-04-15 윤종용 캐리어 내에서의 웨이퍼 로딩 상태 검출장치 및 방법
JP3590517B2 (ja) 1998-01-21 2004-11-17 株式会社 日立インダストリイズ カセット内ウエフア検出装置
JP2001060615A (ja) 1999-08-20 2001-03-06 Rorze Corp ウエハ搬送装置に於けるウエハ認識装置
JP4246420B2 (ja) * 2000-09-14 2009-04-02 平田機工株式会社 Ｆｏｕｐオープナ及びｆｏｕｐオープナのマッピング方法
KR20020032702A (ko) * 2000-10-26 2002-05-04 윤종용 반도체 제조설비에 적용되는 웨이퍼 드롭 방지장치
KR20050049988A (ko) * 2003-11-24 2005-05-27 삼성전자주식회사 반도체 제조용 이송 챔버의 웨이퍼 감지 장치

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5206627A (en) * 1990-11-21 1993-04-27 Tokyo Electron Sagami Limited Substrate detecting system with edge detection, such as wafer or base material of semiconductor device or LCD
US5604443A (en) * 1994-05-23 1997-02-18 Tokyo Electron Limited Probe test apparatus
US5706201A (en) * 1996-05-07 1998-01-06 Fortrend Engineering Corporation Software to determine the position of the center of a wafer
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
US5971696A (en) * 1996-10-01 1999-10-26 Tokyo Electron Limited System for carrying-in of cassette for substrates to be processed
US6224312B1 (en) * 1996-11-18 2001-05-01 Applied Materials, Inc. Optimal trajectory robot motion
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US7219676B2 (en) * 2002-09-03 2007-05-22 Samsung Electronics Co., Ltd. Substrate detecting apparatus
US20040213648A1 (en) * 2003-04-14 2004-10-28 Hofmeister Christopher A Substrate cassette mapper
US20070071581A1 (en) * 2005-07-11 2007-03-29 Ulysses Gilchrist Process apparatus with on-the-fly workpiece centering

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KR20070072329A (ko) 2007-07-04
KR100780085B1 (ko) 2007-11-29
TW200725785A (en) 2007-07-01

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AS Assignment

Owner name: POWERCHIP SEMICONDUCTOR CORP., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YUAN-HSING;HUANG, CHANG-LIANG;LEE, CHIUNG-CHUN;AND OTHERS;REEL/FRAME:017949/0756

Effective date: 20060417

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION