US20070069219A1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
US20070069219A1
US20070069219A1 US11/429,235 US42923506A US2007069219A1 US 20070069219 A1 US20070069219 A1 US 20070069219A1 US 42923506 A US42923506 A US 42923506A US 2007069219 A1 US2007069219 A1 US 2007069219A1
Authority
US
United States
Prior art keywords
light emitting
emitting device
light
emitting element
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/429,235
Other languages
English (en)
Inventor
Ming-Te Lin
Ming-Yao Lin
Chia-Chang Kuo
Sheng-Pan Huang
Wen-Yung Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Technology Research Institute ITRI
Original Assignee
Industrial Technology Research Institute ITRI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrial Technology Research Institute ITRI filed Critical Industrial Technology Research Institute ITRI
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, SHENG-PAN, KUO, CHIA-CHANG, LIN, MING-TE, LIN, MING-YAO, YEH, WEN-YUNG
Publication of US20070069219A1 publication Critical patent/US20070069219A1/en
Priority to US12/487,651 priority Critical patent/US8017964B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
US11/429,235 2005-09-28 2006-05-08 Light emitting device Abandoned US20070069219A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/487,651 US8017964B2 (en) 2005-09-28 2009-06-19 Light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW094133671A TWI274430B (en) 2005-09-28 2005-09-28 Light emitting device
TW094133671 2005-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/487,651 Division US8017964B2 (en) 2005-09-28 2009-06-19 Light emitting device

Publications (1)

Publication Number Publication Date
US20070069219A1 true US20070069219A1 (en) 2007-03-29

Family

ID=37832775

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/429,235 Abandoned US20070069219A1 (en) 2005-09-28 2006-05-08 Light emitting device
US12/487,651 Active US8017964B2 (en) 2005-09-28 2009-06-19 Light emitting device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/487,651 Active US8017964B2 (en) 2005-09-28 2009-06-19 Light emitting device

Country Status (5)

Country Link
US (2) US20070069219A1 (de)
JP (1) JP4825095B2 (de)
KR (1) KR100863612B1 (de)
DE (1) DE102006038099A1 (de)
TW (1) TWI274430B (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321778A1 (en) * 2008-06-30 2009-12-31 Advanced Optoelectronic Technology, Inc. Flip-chip light emitting diode and method for fabricating the same
WO2010074371A1 (ko) * 2008-12-26 2010-07-01 루미마이크로 주식회사 칩온보드형 발광 다이오드 패키지 및 그것의 제조 방법
US20100314655A1 (en) * 2009-03-02 2010-12-16 Thompson Joseph B Light Emitting Assemblies and Portions Thereof
US20110175119A1 (en) * 2010-01-15 2011-07-21 Kim Deung Kwan Light emitting apparatus and lighting system
US20120133268A1 (en) * 2010-11-30 2012-05-31 Jon-Fwu Hwu Airtight multi-layer array type led
US8816375B2 (en) 2010-06-10 2014-08-26 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component
CN111584471A (zh) * 2020-05-12 2020-08-25 深圳雷曼光电科技股份有限公司 显示屏及其制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008154952A1 (de) * 2007-06-18 2008-12-24 Osram Gesellschaft mit beschränkter Haftung Elektronisches bauteil und verfahren zum herstellen eines elektronischen bauteils
KR100937136B1 (ko) * 2007-12-24 2010-01-18 (주)루미브라이트 복수의 패키지를 모듈화한 리드프레임을 이용한 발광다이오드 모듈
TWI483418B (zh) 2009-04-09 2015-05-01 Lextar Electronics Corp 發光二極體封裝方法
KR101028243B1 (ko) * 2010-04-01 2011-04-11 엘지이노텍 주식회사 발광 모듈
KR101037508B1 (ko) * 2010-03-25 2011-05-26 안복만 엘이디 실장용 회로기판 및 이의 제조방법
CN102588762A (zh) * 2011-01-06 2012-07-18 隆达电子股份有限公司 发光二极管杯灯
TWI414714B (zh) 2011-04-15 2013-11-11 Lextar Electronics Corp 發光二極體杯燈
CN102509761A (zh) * 2012-01-04 2012-06-20 日月光半导体制造股份有限公司 芯片构装
JP7231809B2 (ja) * 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060097276A1 (en) * 2004-11-05 2006-05-11 Jeffrey Chen Flip chip type LED lighting device manufacturing method
US7075225B2 (en) * 2003-06-27 2006-07-11 Tajul Arosh Baroky White light emitting device
US7276739B2 (en) * 2004-03-11 2007-10-02 Chen-Lun Hsin Chen Low thermal resistance light emitting diode

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592169A (ja) * 1982-06-29 1984-01-07 Fujitsu Ltd ３次元画像メモリ設定装置
JP2000006467A (ja) * 1998-06-24 2000-01-11 Matsushita Electron Corp 画像書込みデバイス
JP2002134793A (ja) * 2000-10-26 2002-05-10 Omron Corp 光素子用光学デバイス
JP2004055168A (ja) * 2002-07-16 2004-02-19 Ichikoh Ind Ltd Ｌｅｄランプモジュール
KR20040020240A (ko) * 2002-08-30 2004-03-09 엘지이노텍 주식회사 발광다이오드 램프 및 그 제조방법
US7091653B2 (en) * 2003-01-27 2006-08-15 3M Innovative Properties Company Phosphor based light sources having a non-planar long pass reflector
JP2005071798A (ja) * 2003-08-25 2005-03-17 Seiko Epson Corp 照明装置、電気光学装置及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7075225B2 (en) * 2003-06-27 2006-07-11 Tajul Arosh Baroky White light emitting device
US7276739B2 (en) * 2004-03-11 2007-10-02 Chen-Lun Hsin Chen Low thermal resistance light emitting diode
US20060097276A1 (en) * 2004-11-05 2006-05-11 Jeffrey Chen Flip chip type LED lighting device manufacturing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321778A1 (en) * 2008-06-30 2009-12-31 Advanced Optoelectronic Technology, Inc. Flip-chip light emitting diode and method for fabricating the same
WO2010074371A1 (ko) * 2008-12-26 2010-07-01 루미마이크로 주식회사 칩온보드형 발광 다이오드 패키지 및 그것의 제조 방법
KR100989579B1 (ko) 2008-12-26 2010-10-25 루미마이크로 주식회사 칩온보드형 발광 다이오드 패키지 및 그것의 제조 방법
US20100314655A1 (en) * 2009-03-02 2010-12-16 Thompson Joseph B Light Emitting Assemblies and Portions Thereof
US8269248B2 (en) * 2009-03-02 2012-09-18 Thompson Joseph B Light emitting assemblies and portions thereof
US20110175119A1 (en) * 2010-01-15 2011-07-21 Kim Deung Kwan Light emitting apparatus and lighting system
US8816375B2 (en) 2010-06-10 2014-08-26 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component
US20120133268A1 (en) * 2010-11-30 2012-05-31 Jon-Fwu Hwu Airtight multi-layer array type led
US8253330B2 (en) * 2010-11-30 2012-08-28 GEM Weltronics TWN Corporation Airtight multi-layer array type LED
CN111584471A (zh) * 2020-05-12 2020-08-25 深圳雷曼光电科技股份有限公司 显示屏及其制造方法

Also Published As

Publication number Publication date
TW200713635A (en) 2007-04-01
JP2007096320A (ja) 2007-04-12
US8017964B2 (en) 2011-09-13
JP4825095B2 (ja) 2011-11-30
KR100863612B1 (ko) 2008-10-15
TWI274430B (en) 2007-02-21
KR20070035951A (ko) 2007-04-02
US20090250717A1 (en) 2009-10-08
DE102006038099A1 (de) 2007-03-29

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Legal Events

Date Code Title Description
AS Assignment

Owner name: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, MING-TE;LIN, MING-YAO;KUO, CHIA-CHANG;AND OTHERS;REEL/FRAME:017842/0820

Effective date: 20060323

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION