US20060042998A1 - Cushion for packing disks such as semiconductor wafers - Google Patents

Cushion for packing disks such as semiconductor wafers Download PDF

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Publication number
US20060042998A1
US20060042998A1 US11/205,414 US20541405A US2006042998A1 US 20060042998 A1 US20060042998 A1 US 20060042998A1 US 20541405 A US20541405 A US 20541405A US 2006042998 A1 US2006042998 A1 US 2006042998A1
Authority
US
United States
Prior art keywords
cushion
base
cushion member
disk
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/205,414
Other languages
English (en)
Inventor
Clifton Haggard
James Thomas
Song Chen
Ru Liu
Mao Khoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ePAK International Inc
Original Assignee
ePAK International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ePAK International Inc filed Critical ePAK International Inc
Priority to US11/205,414 priority Critical patent/US20060042998A1/en
Assigned to E.PAK INTERNATIONAL, INC. reassignment E.PAK INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, SONG PING, KHOO, MAO SHI, LIU, RU ZHENG, HAGGARD, CLIFTON C., THOMAS, JAMES R.
Publication of US20060042998A1 publication Critical patent/US20060042998A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/54—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for
    • B65D85/544—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for for gramophone records

Definitions

  • FIG. 6 shows selected features of one example container portion.
  • FIG. 7 schematically illustrates a feature of an example embodiment.
  • each cushion member 60 includes at least one contacting portion 90 near a vertex 92 between two adjacent generally linear segments of the cushion member.
  • the example in FIG. 1 has two contacting portions 90 for each cushion member 60 .
  • the example of FIG. 5 has one contacting portion 90 for each cushion member 60 ′.
  • the contacting portions 90 in the illustrated examples are located near a vertex 92 between generally perpendicularly aligned, adjacent linear portions of the cushion member.
  • the second portion 26 of the container 20 in the example of FIG. 6 includes a locking feature 100 on an inside surface 102 for securing a selected cushion 40 in place within the container 20 .
  • the locking feature comprises a plurality of tabs that are arranged to allow the base 42 to snap into place on the second portion 26 .
  • the same locking feature allows the cushion 40 to be selectively removed from the rest of the container.
  • One advantage to this example arrangement is that it allows the cushion 40 to be replaced or recycled without requiring the entire container 20 to be replaced or recycled. If one portion of the container 40 becomes damaged, for example, that portion can be replaced without the material costs of replacing the entire container or more than one portion of the container.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging For Recording Disks (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US11/205,414 2004-08-24 2005-08-17 Cushion for packing disks such as semiconductor wafers Abandoned US20060042998A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/205,414 US20060042998A1 (en) 2004-08-24 2005-08-17 Cushion for packing disks such as semiconductor wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60387304P 2004-08-24 2004-08-24
US11/205,414 US20060042998A1 (en) 2004-08-24 2005-08-17 Cushion for packing disks such as semiconductor wafers

Publications (1)

Publication Number Publication Date
US20060042998A1 true US20060042998A1 (en) 2006-03-02

Family

ID=36113050

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/205,414 Abandoned US20060042998A1 (en) 2004-08-24 2005-08-17 Cushion for packing disks such as semiconductor wafers

Country Status (5)

Country Link
US (1) US20060042998A1 (zh)
JP (1) JP2006066911A (zh)
KR (1) KR20060050561A (zh)
SG (1) SG120286A1 (zh)
TW (1) TW200619108A (zh)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060108258A1 (en) * 2004-11-23 2006-05-25 John Burns Wafer container with secondary wafer restraint system
US20090032433A1 (en) * 2008-08-08 2009-02-05 Chin-Ming Lin Wafer container with restrainer
US20100072107A1 (en) * 2006-11-07 2010-03-25 Shin-Etsu Polymer Co., Ltd. Substrate storage container
EP2207199A1 (en) * 2007-11-09 2010-07-14 Shin-Etsu Polymer Co. Ltd. Retainer and substrate storing container
US20100236977A1 (en) * 2009-08-26 2010-09-23 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with adjustable inside diameter
US20100307957A1 (en) * 2006-06-13 2010-12-09 Entegris, Inc. Reusable resilient cushion for wafer container
CN101673697B (zh) * 2008-09-12 2011-07-27 家登精密工业股份有限公司 门上凹陷区域两旁配有晶圆限制件模块的前开式晶圆盒
CN103346115A (zh) * 2013-05-09 2013-10-09 北京市塑料研究所 硅片承载器卡具
US20130299384A1 (en) * 2010-10-19 2013-11-14 Entegris, Inc. Front opening wafer container with wafer cushion
US9557922B2 (en) 2014-05-07 2017-01-31 HGST Netherlands B.V. System and method for peer-to-peer PCIe storage transfers
US20170062253A1 (en) * 2010-03-11 2017-03-02 Entegris, Inc. Thin wafer shipper
TWI579215B (zh) * 2016-10-07 2017-04-21 家登精密工業股份有限公司 垂直固定機構傳送盒及使用其之傳送方法
US9633877B2 (en) 2012-05-04 2017-04-25 Entegris, Inc. Wafer container with door mounted shipping cushions
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11031046B2 (en) * 2019-01-05 2021-06-08 Western Digital Technologies, Inc. Disk-shaped article shipping container
WO2022035893A1 (en) * 2020-08-11 2022-02-17 Entegris, Inc. Cassette hold down
US11587810B2 (en) * 2019-07-19 2023-02-21 Entegris, Inc. Wafer cushion

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014064774A1 (ja) * 2012-10-23 2014-05-01 ミライアル株式会社 基板収納容器

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
US4102602A (en) * 1976-08-31 1978-07-25 Volkswagenwerk Aktiengesellschaft Rotor for an axial turbine
US4171740A (en) * 1976-09-07 1979-10-23 Monsanto Company Wafer packaging system
US4555024A (en) * 1984-04-12 1985-11-26 Wacker-Chemie Gmbh Packaging unit for semiconductor wafers
US4966284A (en) * 1987-07-07 1990-10-30 Empak, Inc. Substrate package
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5255797A (en) * 1992-02-26 1993-10-26 Fluoroware, Inc. Wafer carrier with wafer retaining cushions
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5586658A (en) * 1995-06-06 1996-12-24 Fluoroware, Inc. Wafer cushions for wafer shipper
US5704493A (en) * 1995-12-27 1998-01-06 Dainippon Screen Mfg. Co., Ltd. Substrate holder
US5842575A (en) * 1997-01-06 1998-12-01 Empak, Inc. Disk package for rotating memory disks
US5864447A (en) * 1995-08-15 1999-01-26 Fujitsu Limited Disk drive with stopper mechanism including a cushion member seated on a circumferential groove
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
US6601592B1 (en) * 2000-09-01 2003-08-05 Zhengming Chen Method of semiconductor substrate batch demounting
US6669253B2 (en) * 2000-12-18 2003-12-30 David W. Benzing Wafer boat and boat holder
US20040045865A1 (en) * 2002-09-06 2004-03-11 Jun Pil-Kwon Wafer guides for processing semiconductor substrates
US7017749B2 (en) * 2001-05-30 2006-03-28 Shin-Etsu Polymer Co., Ltd. Precision substrate storage container and retaining member therefor
US7344031B2 (en) * 2004-06-11 2008-03-18 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796502B2 (ja) * 1994-10-06 1998-09-10 信越ポリマー株式会社 ウェーハ収納容器のウェーハ抑え
JPH0966990A (ja) * 1995-09-04 1997-03-11 Yayoi Kk 電子部品搬送体
JPH1131740A (ja) * 1997-05-14 1999-02-02 Komatsu Ltd 半導体ウェハ容器

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4102602A (en) * 1976-08-31 1978-07-25 Volkswagenwerk Aktiengesellschaft Rotor for an axial turbine
US4171740A (en) * 1976-09-07 1979-10-23 Monsanto Company Wafer packaging system
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
US4555024A (en) * 1984-04-12 1985-11-26 Wacker-Chemie Gmbh Packaging unit for semiconductor wafers
US4966284A (en) * 1987-07-07 1990-10-30 Empak, Inc. Substrate package
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5255797A (en) * 1992-02-26 1993-10-26 Fluoroware, Inc. Wafer carrier with wafer retaining cushions
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5749467A (en) * 1992-05-26 1998-05-12 Empak, Inc. Wafer suspension box
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5586658A (en) * 1995-06-06 1996-12-24 Fluoroware, Inc. Wafer cushions for wafer shipper
US5864447A (en) * 1995-08-15 1999-01-26 Fujitsu Limited Disk drive with stopper mechanism including a cushion member seated on a circumferential groove
US5704493A (en) * 1995-12-27 1998-01-06 Dainippon Screen Mfg. Co., Ltd. Substrate holder
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US5842575A (en) * 1997-01-06 1998-12-01 Empak, Inc. Disk package for rotating memory disks
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
US6601592B1 (en) * 2000-09-01 2003-08-05 Zhengming Chen Method of semiconductor substrate batch demounting
US6669253B2 (en) * 2000-12-18 2003-12-30 David W. Benzing Wafer boat and boat holder
US7017749B2 (en) * 2001-05-30 2006-03-28 Shin-Etsu Polymer Co., Ltd. Precision substrate storage container and retaining member therefor
US20040045865A1 (en) * 2002-09-06 2004-03-11 Jun Pil-Kwon Wafer guides for processing semiconductor substrates
US7344031B2 (en) * 2004-06-11 2008-03-18 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
US20060108258A1 (en) * 2004-11-23 2006-05-25 John Burns Wafer container with secondary wafer restraint system
US20100307957A1 (en) * 2006-06-13 2010-12-09 Entegris, Inc. Reusable resilient cushion for wafer container
US8528738B2 (en) * 2006-06-13 2013-09-10 Entegris, Inc. Reusable resilient cushion for wafer container
US20100072107A1 (en) * 2006-11-07 2010-03-25 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US7967147B2 (en) * 2006-11-07 2011-06-28 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US8356713B2 (en) 2007-11-09 2013-01-22 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
EP2207199A1 (en) * 2007-11-09 2010-07-14 Shin-Etsu Polymer Co. Ltd. Retainer and substrate storing container
US20100258475A1 (en) * 2007-11-09 2010-10-14 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
EP2207199A4 (en) * 2007-11-09 2012-11-07 Shinetsu Polymer Co RESTRAINT DEVICE AND RECEPTACLE FOR STORING SUBSTRATE
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
US20090032433A1 (en) * 2008-08-08 2009-02-05 Chin-Ming Lin Wafer container with restrainer
CN101673697B (zh) * 2008-09-12 2011-07-27 家登精密工业股份有限公司 门上凹陷区域两旁配有晶圆限制件模块的前开式晶圆盒
US8556079B2 (en) 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
US20100236977A1 (en) * 2009-08-26 2010-09-23 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with adjustable inside diameter
US20170062253A1 (en) * 2010-03-11 2017-03-02 Entegris, Inc. Thin wafer shipper
US10276414B2 (en) * 2010-03-11 2019-04-30 Entegris, Inc. Thin wafer shipper
US20130299384A1 (en) * 2010-10-19 2013-11-14 Entegris, Inc. Front opening wafer container with wafer cushion
US9633877B2 (en) 2012-05-04 2017-04-25 Entegris, Inc. Wafer container with door mounted shipping cushions
CN103346115A (zh) * 2013-05-09 2013-10-09 北京市塑料研究所 硅片承载器卡具
US9557922B2 (en) 2014-05-07 2017-01-31 HGST Netherlands B.V. System and method for peer-to-peer PCIe storage transfers
TWI579215B (zh) * 2016-10-07 2017-04-21 家登精密工業股份有限公司 垂直固定機構傳送盒及使用其之傳送方法
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11031046B2 (en) * 2019-01-05 2021-06-08 Western Digital Technologies, Inc. Disk-shaped article shipping container
US11587810B2 (en) * 2019-07-19 2023-02-21 Entegris, Inc. Wafer cushion
WO2022035893A1 (en) * 2020-08-11 2022-02-17 Entegris, Inc. Cassette hold down
TWI802957B (zh) * 2020-08-11 2023-05-21 美商恩特葛瑞斯股份有限公司 卡匣固持件

Also Published As

Publication number Publication date
JP2006066911A (ja) 2006-03-09
TW200619108A (en) 2006-06-16
KR20060050561A (ko) 2006-05-19
SG120286A1 (en) 2006-03-28

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Legal Events

Date Code Title Description
AS Assignment

Owner name: E.PAK INTERNATIONAL, INC., TEXAS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HAGGARD, CLIFTON C.;THOMAS, JAMES R.;CHEN, SONG PING;AND OTHERS;REEL/FRAME:016540/0052;SIGNING DATES FROM 20050812 TO 20050816

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE