TW200619108A - Cushion for packing disks such as semiconductor wafers - Google Patents

Cushion for packing disks such as semiconductor wafers

Info

Publication number
TW200619108A
TW200619108A TW094128621A TW94128621A TW200619108A TW 200619108 A TW200619108 A TW 200619108A TW 094128621 A TW094128621 A TW 094128621A TW 94128621 A TW94128621 A TW 94128621A TW 200619108 A TW200619108 A TW 200619108A
Authority
TW
Taiwan
Prior art keywords
cushion
semiconductor wafers
cushion members
container
packing disks
Prior art date
Application number
TW094128621A
Other languages
English (en)
Inventor
Clifton C Haggard
James R Thomas
song-ping Chen
ru-zheng Liu
Mao-Shi Khoo
Original Assignee
E Pak International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E Pak International Inc filed Critical E Pak International Inc
Publication of TW200619108A publication Critical patent/TW200619108A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/54—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for
    • B65D85/544—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for for gramophone records

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging For Recording Disks (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094128621A 2004-08-24 2005-08-22 Cushion for packing disks such as semiconductor wafers TW200619108A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60387304P 2004-08-24 2004-08-24

Publications (1)

Publication Number Publication Date
TW200619108A true TW200619108A (en) 2006-06-16

Family

ID=36113050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128621A TW200619108A (en) 2004-08-24 2005-08-22 Cushion for packing disks such as semiconductor wafers

Country Status (5)

Country Link
US (1) US20060042998A1 (zh)
JP (1) JP2006066911A (zh)
KR (1) KR20060050561A (zh)
SG (1) SG120286A1 (zh)
TW (1) TW200619108A (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
KR101395467B1 (ko) 2006-06-13 2014-05-14 엔테그리스, 아이엔씨. 재사용이 가능한 웨이퍼 용기용 탄성 쿠션
KR101472145B1 (ko) * 2006-11-07 2014-12-12 신에츠 폴리머 가부시키가이샤 기판 수납 용기
WO2009060782A1 (ja) * 2007-11-09 2009-05-14 Shin-Etsu Polymer Co., Ltd. リテーナ及び基板収納容器
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
CN101673697B (zh) * 2008-09-12 2011-07-27 家登精密工业股份有限公司 门上凹陷区域两旁配有晶圆限制件模块的前开式晶圆盒
US8556079B2 (en) * 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
SG184004A1 (en) * 2010-03-11 2012-10-30 Entegris Inc Thin wafer shipper
WO2012054627A2 (en) * 2010-10-19 2012-04-26 Entegris, Inc. Front opening wafer container with wafer cushion
TWI568653B (zh) 2012-05-04 2017-02-01 恩特葛瑞斯股份有限公司 具有安裝在門上的運輸緩衝墊的晶圓容器
JP5946539B2 (ja) * 2012-10-23 2016-07-06 ミライアル株式会社 基板収納容器
CN103346115B (zh) * 2013-05-09 2016-08-24 北京市塑料研究所 硅片承载器卡具
US9304690B2 (en) 2014-05-07 2016-04-05 HGST Netherlands B.V. System and method for peer-to-peer PCIe storage transfers
TWI579215B (zh) * 2016-10-07 2017-04-21 家登精密工業股份有限公司 垂直固定機構傳送盒及使用其之傳送方法
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11031046B2 (en) * 2019-01-05 2021-06-08 Western Digital Technologies, Inc. Disk-shaped article shipping container
CN114287055A (zh) * 2019-07-19 2022-04-05 恩特格里斯公司 晶片缓冲器
KR20230047471A (ko) * 2020-08-11 2023-04-07 엔테그리스, 아이엔씨. 카세트 유지부

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2639200A1 (de) * 1976-08-31 1978-03-09 Volkswagenwerk Ag Laufrad fuer axialturbinen, insbesondere fuer gasturbinen
US4171740A (en) * 1976-09-07 1979-10-23 Monsanto Company Wafer packaging system
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
DE3413837A1 (de) * 1984-04-12 1985-10-17 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verpackung fuer halbleiterscheiben
US4966284A (en) * 1987-07-07 1990-10-30 Empak, Inc. Substrate package
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5255797A (en) * 1992-02-26 1993-10-26 Fluoroware, Inc. Wafer carrier with wafer retaining cushions
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5586658A (en) * 1995-06-06 1996-12-24 Fluoroware, Inc. Wafer cushions for wafer shipper
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
JP2796502B2 (ja) * 1994-10-06 1998-09-10 信越ポリマー株式会社 ウェーハ収納容器のウェーハ抑え
JP3343805B2 (ja) * 1995-08-15 2002-11-11 富士通株式会社 ディスク装置
JPH0966990A (ja) * 1995-09-04 1997-03-11 Yayoi Kk 電子部品搬送体
US5704493A (en) * 1995-12-27 1998-01-06 Dainippon Screen Mfg. Co., Ltd. Substrate holder
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US5775508A (en) * 1997-01-06 1998-07-07 Empak, Inc. Disk package for rotating memory disks
JPH1131740A (ja) * 1997-05-14 1999-02-02 Komatsu Ltd 半導体ウェハ容器
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
CN1128470C (zh) * 2000-09-01 2003-11-19 陈正明 晶片减薄后与载体分离的工艺方法及其装置
US6669253B2 (en) * 2000-12-18 2003-12-30 David W. Benzing Wafer boat and boat holder
JP3938293B2 (ja) * 2001-05-30 2007-06-27 信越ポリマー株式会社 精密基板収納容器及びその押さえ部材
KR100487541B1 (ko) * 2002-09-06 2005-05-03 삼성전자주식회사 반도체기판의 세정/건조 공정에 사용되는 웨이퍼 가이드들
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器

Also Published As

Publication number Publication date
JP2006066911A (ja) 2006-03-09
SG120286A1 (en) 2006-03-28
US20060042998A1 (en) 2006-03-02
KR20060050561A (ko) 2006-05-19

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