US20050158527A1 - Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit - Google Patents

Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit Download PDF

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Publication number
US20050158527A1
US20050158527A1 US11/017,778 US1777804A US2005158527A1 US 20050158527 A1 US20050158527 A1 US 20050158527A1 US 1777804 A US1777804 A US 1777804A US 2005158527 A1 US2005158527 A1 US 2005158527A1
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Prior art keywords
resin
metal
electronic circuit
moisture absorption
rate
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Abandoned
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US11/017,778
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English (en)
Inventor
Naoko Yamaguchi
Hideo Aoki
Chiaki Takubo
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Toshiba Corp
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Individual
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AOKI, HIDEO, TAKUBO, CHIAKI, YAMAGUCHI, NAOKO
Publication of US20050158527A1 publication Critical patent/US20050158527A1/en
Priority to US12/541,568 priority Critical patent/US8220147B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12097—Nonparticulate component encloses particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the present invention relates to a metal-containing resin particle, a resin particle, an electronic circuit substrate, and a method of producing the electronic circuit.
  • an underlying layer for electroless plating having an arbitrary pattern is first prepared by using electrophotography with a metal-containing resin particle.
  • a plating layer is formed on the underlying layer by electroless plating, and an insulating layer is formed by electrophotography using resin particles made of resin only, so that an electronic circuit substrate is formed.
  • thermosetting resin mainly composed of an epoxy resin is used for both the resin of the metal-containing resin particles and the resin particles containing resin only.
  • epoxy radicals are easy to absorb moisture due to its high hydrophilic nature, there is a problem in that the electrical resistance of the surfaces of the metal-containing resin particles and the resin particles is lowered, and the desired amount of electrostatic charge is difficult to obtain.
  • metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.
  • resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption of 500 to 14500 ppm, is provided.
  • an electronic circuit substrate comprising a substrate, a metal-containing resin layer formed on said substrate and formed by using the metal-containing resin particles according to claim 1 , and a plating layer formed on said metal-containing resin layer by using metal particles of said metal-containing resin layer as kernels is provided.
  • an electronic circuit substrate comprising a substrate, a plating layer formed on said substrate, and a resin layer formed on said plating layer, and formed by using the resin particles according to claim 5 is provided.
  • a method of producing an electronic circuit comprising forming a metal-containing resin layer in an environment at 70% or less of relative humidity, wherein said forming of the metal-containing resin layer comprises forming a visible image on a surface of a photoconductor on which an electrostatic latent image is formed, by electrostatically attaching metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, and transferring the visible image composed of the metal-containing resin particles and formed on the surface of the photoconductor on a substrate, is provided.
  • a method of producing an electronic circuit comprising forming a metal-containing resin layer in an environment of 70% or less in relative humidity, wherein said forming of the resin layer comprises forming a visible image on a surface of a photoconductor on which an electrostatic latent image is formed, by electrostatically attaching resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having 500 to 14500 ppm in rate of moisture absorption, and transferring the visible image composed of the resin particles and formed on the surface of the photoconductor on the substrate, is provided.
  • FIG. 1 is a flow chart showing a flow of production process of an electronic circuit substrate relating to an embodiment of the present invention.
  • FIG. 2A to FIG. 2D are schematic diagrams of production process of the electronic circuit substrate relating to an embodiment of the present invention.
  • FIG. 3 is a view showing the operation of an underlying layer forming apparatus relating to an embodiment of the present invention.
  • FIG. 4 is a view showing the operation of an insulating layer forming apparatus relating to an embodiment of the present invention.
  • FIG. 5 is a graph showing relations between a rate of moisture absorption of metal-containing resin particles and the amount of electrostatic charge of the metal-containing resin particles relating to example 1.
  • FIG. 6 is a graph showing relations between a rate of moisture absorption of resin particles and the amount of electrostatic charge of the resin particles relating to example 2.
  • FIG. 7 is a graph showing relations between time for standing still and a rate of moisture absorption of the resin particles relating to example 3.
  • FIG. 1 is a flow chart showing a flow of production process of an electronic circuit substrate relating to an embodiment of the present invention
  • FIG. 2A to FIG. 2D are schematic process drawings of the electronic circuit substrate relating to an embodiment of the present invention.
  • FIG. 3 is a view showing operations of an underlying layer forming apparatus relating to an embodiment of the present invention
  • FIG. 4 is a view showing operations of an insulating layer forming apparatus relating to an embodiment of the present invention.
  • an underlying layer 2 for electroless plating is formed by printing using electrophotography (step 1 ).
  • the underlying layer 2 can be formed by using an underlying layer forming apparatus 10 as shown in FIG. 3 .
  • the underlying layer forming apparatus 10 mainly comprises a photoconductor drum 11 , an electrostatic charger 12 , a laser generator and scanner 13 , a developing machine 14 , a transfer printing machine 15 , and a fixing apparatus 16 .
  • the underlying layer forming apparatus 10 is placed in a room R where the relative humidity is 70% or lower.
  • a surface potential of the photoconductive drum 11 is uniformly charged at a fixed potential (for instance, a minus charge) by the electrostatic charger 12 .
  • a Scorotron method of charging a roller method of charging, and a brush method of charging can be cited.
  • a laser beam 13 A is irradiated to the photoconductive drum 11 in response to an image signal by a laser generator and scanner 13 removing the minus charge in the irradiated portion to form a charged image (electrostatic latent image) of a prescribed pattern on the surface of the photoconductive drum 11 .
  • charged metal-containing resin particles 2 A stored in a developing machine 14 are electrostatically attached on the electrostatic latent image on the photoconductive drum 11 by means of a feeder to obtain a visible image.
  • a dry or wet toner transfer technology in a well known electrophotography type copy system can be applied to the developing machine 14 .
  • the metal-containing resin particles having a particle size from 3 to 50 ⁇ m are stored in the developing machine 14 . More desirable particle size of the metal-containing resin particles 2 A is from 5 to 10 ⁇ m.
  • the metal-containing resin particles 2 A having a particle size of 3 ⁇ m or less are stored in the developing machine 14 together with a liquid which serves as a solvent.
  • the metal-containing resin particles 2 A stored in the developing machine 14 are supplied to the photoconductive drum 11 by means of the feeder to develop. At this time, a charged area development or a discharged area development can be used.
  • the metal-containing resin particles 2 A are composed of a resin containing 50 wt % or more of a thermosetting resin having a rate of moisture absorption from 500 to 14500 ppm and fine metal particles contained in this resin.
  • a rate of moisture absorption of the resin is desirably from 4000 to 8000 ppm.
  • the reason for determining the rate of moisture absorption of the resin to be from 500 to 14500 ppm is as follows. If the rate of moisture absorption of the resin is less than 500 ppm or more than 14500 ppm, the amount of electrostatic charge is below 5 ⁇ C/g being a lower limit of the electrostatic charge with which an ordinary dry type copier is able to develop.
  • thermosetting resin in a B-stage solid at room temperatures is used as a thermosetting resin to be contained in the resin.
  • the B-stage refers to a state in which at least one portion of the thermosetting resin is not hardened but melted when prescribed heat is applied.
  • epoxy resin, polyimide resin, phenol resin, bismaleimide resin, cyanate ester resin, bismaleimide-triazine resin, benzicyclobutene resin, polyimide resin, polybenzoxazol resin, butadiene resin, silicone resin, polycarbo-di-imide resin, polyurethane resin and so on can be used.
  • fine metal particles at least one kind of fine metal particles selected from the group consisting of platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag) is desirably used.
  • Pt platinum
  • Pd palladium
  • Cu copper
  • Au gold
  • Ni nickel
  • Ag silver
  • These fine metal particles serve as kernels for electroless plating and have a catalytic function for progress of a plating reaction.
  • lead or copper is desirably used.
  • the visible image (pattern) formed with the metal-containing resin particles 2 A on the surface of the photoconductive drum 11 is electrostatically transferred onto a desired substrate 1 from the photoconductive drum 11 by the copier 15 .
  • the photoconductive drum 11 is recovered after the transfer by removing the metal-containing resin particles 2 A left on the surface of the photoconductive drum 11 with a cleaning apparatus (not shown).
  • the metal-containing resin particles 2 A in B-stage which are transferred onto the substrate 1 , are passed through the fixing apparatus 16 which emits heat or light, so that a thermosetting resin composing the metal-containing resin particles 2 A is melted to form a metal-containing resin layer 2 B. Thereafter, the metal-containing resin layer 2 B is heated or irradiated with light by the fixing apparatus 16 to be hardened so that the metal-containing resin layer 2 B is fixed on the substrate 1 . Through these processes, an underlying layer 2 is formed.
  • a plating layer 3 is formed on the underlying layer 2 by electroless plating using the fine metal particles contained in the underlying layer 2 as kernels as shown in FIG. 2B (step 2 ). It should be noted that though the plating layer 3 is formed by electroless plating in the present embodiment, the plating layer 3 can be formed by both of electroless plating and electroplating.
  • etching with a solvent such as aceton, isopropanol acid or alkali or the like, or shot blasting, airblasting and so on can be cited.
  • an electrically insulative insulating layer 4 is formed on the substrate 1 as shown in FIG. 2C by printing using the electrophotography (step 3 ).
  • the insulating layer 3 can be formed using an insulating layer forming apparatus 20 nearly similar in structure to the underlying layer forming apparatus 10 .
  • the insulating layer forming apparatus 20 is placed in the room R having relative humidity of 70% or lower.
  • a resin particle 4 A is stored in the developing machine 14 in place of the metal-containing resin particle 2 A as shown in FIG. 4 .
  • a surface potential of the photoconductive drum 11 is uniformly charged at a fixed potential (for instance, minus charge) by an electrostatic charger 12 .
  • a laser beam 13 A is irradiated to the photoconductive drum 11 in response to an image signal by a laser generator 13 removing the minus charge in the irradiated portion to form a charged image (electrostatic latent image) of a prescribed pattern on the surface of the photoconductive drum 11 .
  • the resin particles 4 A which are charged by the developing machine 14 are electrostatically attached on the surface of the photoconductive drum 11 to form a visible image on the surface of the photoconductive drum 11 (step 33 ).
  • a dry or wet toner transfer technology in a well-known electrophotography copying system can be applied to the developing machine 14 .
  • the resin particles 4 A having an average particle size from 3 to 50 ⁇ m are stored in the developing machine 14 .
  • the more desirable particle size of the resin particle 4 A is from 8 to 15 ⁇ m.
  • the resin particles having a particle size of 3 ⁇ m or less are stored together with a liquid being the solvent in the developing machine 14 .
  • the particle size of the resin particle 4 A is desirably larger than that of the metal-containing resin particle 2 A.
  • the resin particles 4 A stored in the developing machine 14 are supplied to the photoconductive drum 11 by a feeder to be developed. At this time, a charged area development or a discharged area development can be used.
  • the resin particles 4 A are composed of resin containing 50 wt % or more of a thermosetting resin, having the rate of moisture absorption from 500 to 14500 ppm.
  • the rate of moisture absorption of the resin is desirably from 4000 to 8000 ppm.
  • the reason for determining the rate of moisture absorption of the resin to be from 500 to 14500 ppm is as follows. If the rate of moisture absorption of the resin is less than 500 ppm or more than 14500 ppm, the amount of electrostatic charge comes to be below 5 ⁇ C/g being a lower limit of the electrostatic charge with which an ordinary dry type copier is able to develop.
  • thermosetting resin in a B-stage solid state at room temperatures can be used as a thermosetting resin to be contained in the resin.
  • thermosetting resin in B-stage epoxy resin, polyimide resin, phenol resin, bismaleimide resin, cyanate ester resin, bismaleimide-triazine resin, benzicyclobutene resin, polyimide resin, polybenzoxazol resin, butadiene resin, silicone resin, polycarbo-di-imide resin, polyurethane resin and so on can be used.
  • the visible image (pattern) is formed on the surface of the photoconductive drum 11 , it is electrostatically transferred onto the desired substrate 1 from the photoconductive drum 11 by the copier 15 .
  • the photoconductive drum 11 after the transfer is recovered by removing the resin particles 4 A left on the surface of the photoconductive drum 11 with a cleaning apparatus (not shown).
  • the visible image is transferred onto the substrate 1 , the visible image is heated by the fixing apparatus 16 to soften the resin particles 4 A composing the visible image so that a resin layer 4 B is formed. Then, the resin layer 4 B is hardened by heat or light irradiation with the fixing apparatus 16 to fix the resin layer 4 B on the substrate 1 (step 35 ). Through the above process, the insulating layer 4 composed of the resin layer 4 B is formed.
  • step 1 After forming the insulating layer 4 on the substrate 1 , the electronic circuit forming process from step 1 to step 3 is repeated to form a multilayered electronic circuit substrate 5 such as shown in FIG. 2D .
  • the metal-containing resin particles 2 A composed of a resin containing 50 wt % or more of a thermosetting resin and having the rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in this resin, are used in the present embodiment, the amount of charge of the metal-containing resin particles 2 A can be controlled in an optimum range, so that the underlying layer 2 (metal-containing resin layer 2 B) can be accurately formed.
  • the amount of charge of the resin particles 4 A can be controlled in an optimum range, so that the insulating layer 4 (resin layer 4 B) can be accurately formed.
  • the rate of moisture absorption of the resin in the metal-containing resin particle 2 A can be kept at 14500 ppm or less, so that the underlying layer 2 (metal-containing resin layer 2 B) can be accurately formed.
  • the rate of moisture absorption of the resin particle 4 A can be kept at 14500 ppm or less, so that the insulating layer 4 (resin layer 4 B) can be accurately formed.
  • metal-containing resin particles composed of 50 wt % resin and 50 wt % fine metal particles, having an average particle size of 7.9 ⁇ m are used.
  • the resin is composed of epoxy resin only and the fine metal particles are composed of copper (Cu).
  • a plurality of metal-containing resin particles different in rate of moisture absorption are prepared and the amount of electrostatic charge at the time when these metal-containing resin particles are charged is measured.
  • the rate of moisture absorption of the resin in the metal-containing resin particles is a value obtained by a calculation in such a manner that the metal-containing resin particle is kept standing still for two days in a vacuum environment while weighing the resin particle.
  • a state at which nearly no change of weight is recognized is taken as a dry state of the resin particle, and the rate of moisture absorption is calculated by dividing a change in weight of the resin since then with the weight of the resin in the dry state.
  • FIG. 5 is a graph showing relations between the rate of moisture absorption of the resin in the metal-containing resin particle and the amount of electrostatic charge of the metal-containing resin particle relating to the present example.
  • the rate of moisture absorption is 458 ppm
  • the amount of the electrostatic charge is 4.76 ⁇ C/g. This is due to existence of a metal-containing resin particle which causes reverse charging.
  • the rate of moisture absorption is 15424 ppm
  • the amount of charge is 3.52 ⁇ C/g. This is because the electrical resistance on the surface of the metal-containing resin particle is lowered, which makes the charging thereon difficult.
  • the amounts of electrostatic charge in either cases are below 5 ⁇ C/g, the value being a lower limit of the electrostatic charge with which an ordinary dry type copier is able to develop.
  • the range of rate of moisture absorption to be 5 ⁇ C/g or more from this graph, it is found that when the rate of moisture absorption is from 500 ppm to 14500 ppm, the amount of electrostatic charge becomes 5 ⁇ /g or more. From this result, the optimum range in rate of moisture absorption of the resin in the metal-containing resin particle is confirmed to be from 500 ppm to 14500 ppm.
  • example 2 In the present example, an optimum range of the rate of moisture absorption in the resin particle is studied.
  • resin particles composed of epoxy resin only having an average particle size of 7.9 ⁇ m are used.
  • a plurality of resin particle samples different in rate of moisture absorption are prepared, and the amount of electrostatic charge at the time when these resin particles are charged is measured.
  • the rate of moisture absorption of the resin is a value obtained by a calculation in such a manner that the resin particle is kept standing still for two days in a vacuum environment while weighing the resin particle.
  • a state at which nearly no change of weight is recognized is taken as a dry state of the resin particle, and the rate of moisture absorption is calculated by dividing a change in weight of the resin since then with the weight of resin particle in the dry state.
  • FIG. 6 is a graph showing relations between the rate of moisture absorption of the resin particle and the amount of electrostatic charge of the resin particle relating to the present example.
  • the rate of moisture absorption is 443 ppm
  • the amount of the electrostatic charge is 4.82 ⁇ C/g. This is due to existence of a resin particle which causes reverse charging.
  • the rate of moisture absorption is 15320 ppm
  • the amount of charge is 4.10 ⁇ C/g. This is because the electrical resistance on the surface of the resin particle is lowered, which makes the charging thereon difficult.
  • the amounts of electrostatic charge in either cases are below 5 ⁇ C/g, the value being a lower limit of the electrostatic charge with which an ordinary dry type copier is able to develop.
  • the range of rate of moisture absorption to be 5 ⁇ C/g or more from this graph, it is found that when the rate of moisture absorption is from 500 ppm to 14500 ppm, the amount of electrostatic charge becomes 5 ⁇ /g or more. From this result, the optimum range in rate of moisture absorption of the resin particle is confirmed to be from 500 ppm to 14500 ppm.
  • the reason for that the optimum range in the rate of moisture absorption of the resin of the metal-containing resin particle is the same as that of the resin particle is as follows. Since 89% in volume of the metal-containing resin particle containing 50 wt % of copper (Cu) is resin, the surfaces of both resin are nearly equal, as long as the average particle size of the metal-containing resin particles is the same as that of the resin particles.
  • example 3 the relative humidity of an environment, at which the rate of moisture absorption of the resin particle is 14500 ppm or less is studied.
  • FIG. 7 is a graph showing relations between the time for standing still and the rate of moisture absorption of the resin particle relating to the present example. As shown in FIG. 7 , it is confirmed that the rate of moisture absorption of the resin particle is nearly saturated for about six hours without depending on the average particle size, and becomes constant thereafter. Also confirmed is that the rate of moisture absorption of the resin particle differs depending on the relative humidity of the environment where the resin particle is kept standing still. More concretely, when the resin particle is kept standing still in an environment at 70% R.H., the rate of moisture absorption becomes constant at around 14400 ppm, and when the resin particle is kept standing still in an environment at 80% R.H., the rate of moisture absorption becomes constant at around 17300 ppm.

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  • Developing Agents For Electrophotography (AREA)
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KR101050214B1 (ko) * 2009-04-09 2011-07-19 대덕지디에스 주식회사 다층 인쇄회로기판 및 그 제조방법
CN105573076A (zh) * 2016-03-11 2016-05-11 中物院成都科学技术发展中心 一种用于打印导电图案的粉末的制备方法
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CN1638602A (zh) 2005-07-13
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US8220147B2 (en) 2012-07-17
US20100000083A1 (en) 2010-01-07

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