US20010022395A1 - Cooling structure for multichip module - Google Patents

Cooling structure for multichip module Download PDF

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Publication number
US20010022395A1
US20010022395A1 US09/747,517 US74751700A US2001022395A1 US 20010022395 A1 US20010022395 A1 US 20010022395A1 US 74751700 A US74751700 A US 74751700A US 2001022395 A1 US2001022395 A1 US 2001022395A1
Authority
US
United States
Prior art keywords
cooling structure
electronic devices
structure according
heat
multichip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/747,517
Other languages
English (en)
Inventor
Makoto Tmai
Naoki Ogawa
Yuji Yagi
Takashi Kojima
Yasushi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMAI, MAKOTO, KOJIMA, TAKASHI, OGAWA, NAOKI, YAGI, YUJI, YAMADA, YASUSHI
Publication of US20010022395A1 publication Critical patent/US20010022395A1/en
Priority to US10/262,865 priority Critical patent/US6969907B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling

Definitions

  • the invention relates to a cooling structure for a multichip module and, more particularly, to a cooling structure for a multichip module having a plurality of electronic devices that generate different amounts of heat relative to each other.
  • a structure for cooling a multichip module by radiating heat from one face thereof (e.g. Japanese Patent Application Laid-Open No. HEI 11-121666).
  • a heat radiation body for covering a plurality of electronic devices is attached to a substrate to which the electronic devices that are different in height are mounted, with a silicon seat of high thermal conductivity being interposed among the electronic devices. Heat generated from the respective electronic devices is radiated through the heat radiation body.
  • the electronic devices which are used to control electric power or the like, need to be kept below a permissible operating temperature and therefore heat generated in connection with switching operation or the like needs to be removed. Thus, it is considered important to achieve improvement of performance and size reduction in the cooling structure.
  • a cooling structure for a multichip module having a plurality of electronic devices in which the devices generate different amount of heat relative to each other, comprising a first member which is provided on a first face of the multichip module and which transmits heat generated by the electronic devices to the outside of the module and a second member which is provided on a second face that is different from the first face, which is in contact with the electronic devices, and which has thermal conductivity.
  • electric power may be supplied to the electronic devices through the second member. This makes it possible to economize space for the member for supplying electric power and thus to achieve further size reduction.
  • FIG. 1 is a front view of the construction of a multichip module having a cooling structure according to one embodiment of the invention
  • FIG. 2 is a plan view of the multichip module shown in FIG. 1 as viewed in a direction indicated by an arrow A;
  • FIG. 3 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow B.
  • FIG. 1 is a front view of the overall construction of a multichip module 20 having a cooling structure of the invention.
  • FIG. 2 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow A.
  • FIG. 3 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow B.
  • the multichip module 20 has electronic devices 24 , 26 .
  • the electronic devices 24 , 26 generate different amounts of heat.
  • the electronic devices 24 , 26 are mounted to an insulated substrate 22 by means of solder. It is assumed herein that the generation of heat by the electronic device 24 is greater than that by the electronic device 26 .
  • the module 20 has an electrode 32 for supplying electric power to the electronic devices 24 , 26 , a heat leveling plate 30 that makes the electronic devices 24 , 26 substantially uniform in temperature, and a heat radiation plate 40 disposed below the insulated substrate 22 . Also, an insulator 34 with high thermal conductivity is provided between the electrode 32 and the heat radiation plate 40 .
  • heat generated by electronic devices is varied depending on drive conditions. While the electronic device 24 includes an IGBT, a power MOS and a power transistor, the electronic device 26 includes a diode, for example.
  • the heat leveling plate 30 makes the temperatures of electronic devices 24 , 26 substantially uniform and also supplies them with electric power from the electrode 32 .
  • an electrically conductive material of high thermal conductivity is used as a base material of the heat leveling plate 30 .
  • the heat radiation plate 40 radiates heat to a cooling medium such as air and water and is thus made from a material of high thermal conductivity (e.g. a metal such as aluminum and stainless steel).
  • a material of high thermal conductivity e.g. a metal such as aluminum and stainless steel.
  • the heat radiation plate 40 may include a flow passage for the cooling medium or form a flow passage for the cooling medium in combination with another member. Fins may be provided in a portion facing the flow passage for the cooling medium to enhance cooling effect.
  • the heat radiation paths of the multichip module 20 of the embodiment include a first path wherein heat generated from the electronic devices 24 , 26 flows from the heat radiation plate 40 to the cooling medium through the insulated substrate 22 , a second path wherein heat generated from the electronic device 24 flows to the cooling medium through the heat leveling plate 30 , the electronic device 26 , the insulated substrate 22 and the heat radiation plate 40 , and a third path wherein heat generated from the electronic device 24 flows to the cooling medium through the heat leveling plate 30 , the electrode 32 , the insulator 34 and the heat radiation plate 40 .
  • the second and third paths both include the heat leveling plate 30 .
  • the heat leveling plate 30 distributes heat generated from the electronic device 24 to the electronic device 26 and the electrode 32 . Accordingly, the electronic devices 24 , 26 and the electrode 32 become substantially uniform in temperature. As a result, in comparison with a cooling structure provided only with the first path wherein heat generated from the electronic device 24 flows from the heat radiation plate 40 to the cooling medium through the insulated substrate 22 , cooling effect of the electronic device 24 can be enhanced.
  • the electronic device 26 which generates less heat than the electronic device 24 is supplied with heat from the electronic device 24 by the heat leveling plate 30 .
  • the temperature of electronic device 26 becomes higher than a temperature attained by heat generation of the electronic device 26 itself.
  • the permissible operating temperature of a general semiconductor device is substantially constant (e.g. approximately 150° C.) regardless of its generation of heat.
  • the temperature of the electronic device 26 does not exceed the permissible operating temperature even if it has received heat generated by the electronic device 24 through the heat leveling plate 30 .
  • the heat leveling plate 30 is used to make the electronic devices 24 , 26 and the electrode 32 substantially uniform in temperature. Thereby it becomes possible to enhance cooling effect of the electronic device 24 in comparison with a cooling structure which does not have the heat leveling plate 30 , and to reduce the size of the entire module.
  • the heat leveling plate 30 also serves as a member for supplying electric power to the electronic devices 24 , 26 from the electrode 32 , additional wire bonding does not need for supplying electric power to the electronic devices 24 , 26 from the electrode. Consequently, the multichip module 20 can also be applied to small-size electronic devices which do not permit wire bonding. Also, it is possible to prevent complication of the multichip module.
  • heat generated by the electronic devices 24 , 26 passes through the mutichip module 20 along respective paths as indicated by arrows, and the heat is radiated from the heat radiation plate 40 to the outside. Accordingly, it may be difficult to level the temperature of the heat leveling plate 30 and the temperature of the heat radiation plate 40 to be substantially equal to each other.
  • the heat radiation plate 40 having substantially the same coefficient of thermal expansion as that of the heat leveling plate 30 can prevent warp of the mutichip module 20 , even if there is a temperature gap between the heat leveling plate 30 and the heat radiation plate 40 .
  • the insulated substrate 22 instead of the heat radiation plate 40 , of a material having substantially the same coefficient of thermal expansion as that of the heat leveling plate 30 . It is also possible to add another member to the structure, which has the substantially the same thermal expansion as the heat leveling plate 30 .
  • a body of the heat leveling plate 30 may be formed of a material which has thermal conductivity but which does not have electrical conductivity, for example, a ceramic material such as aluminum nitride and alumina.
  • a wiring pattern capable of supplying electric power from the electrode 32 may be formed of a material which has electrical conductivity.
  • a member for supplying electric power to the electronic devices 24 , 26 may be provided separately from the heat leveling plate 30 .
  • the electronic devices 24 , 26 are sandwiched between the heat leveling plate 30 and the heat radiation plate 40 .
  • the heat leveling plate 30 is provided so as to advance uniformity of temperature among the electronic devices 24 , 26 and the electrode 32 . Therefore, the electronic devices 24 , 26 may be mounted to a face of the heat leveling plate 30 which does not face the heat radiation plate 40 , for example, to a lateral face or a front face of the heat leveling plate 30 .
  • the invention may be applied to a multichip module having three or more electronic devices.
  • heat generated in a multichip module 20 b having four electronic devices 24 , 24 b , 26 , 26 b , as shown in FIGS. 5 and 6, can be released in the same manner as described above.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US09/747,517 1999-12-21 2000-12-21 Cooling structure for multichip module Abandoned US20010022395A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/262,865 US6969907B2 (en) 1999-12-21 2002-10-03 Cooling structure for multichip module

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP36205899 1999-12-21
JP11-362058 1999-12-21
JP2000343677A JP2001244391A (ja) 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/262,865 Continuation US6969907B2 (en) 1999-12-21 2002-10-03 Cooling structure for multichip module

Publications (1)

Publication Number Publication Date
US20010022395A1 true US20010022395A1 (en) 2001-09-20

Family

ID=26581343

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/747,517 Abandoned US20010022395A1 (en) 1999-12-21 2000-12-21 Cooling structure for multichip module
US10/262,865 Expired - Lifetime US6969907B2 (en) 1999-12-21 2002-10-03 Cooling structure for multichip module

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/262,865 Expired - Lifetime US6969907B2 (en) 1999-12-21 2002-10-03 Cooling structure for multichip module

Country Status (4)

Country Link
US (2) US20010022395A1 (https=)
EP (1) EP1111677B1 (https=)
JP (1) JP2001244391A (https=)
DE (1) DE60043767D1 (https=)

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DE10260663B4 (de) * 2001-12-27 2011-02-10 DENSO CORPORATION, Kariya-shi Kühleinheit und Halbleitervorrichtung

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Also Published As

Publication number Publication date
EP1111677A3 (en) 2003-10-15
EP1111677B1 (en) 2010-01-27
DE60043767D1 (de) 2010-03-18
EP1111677A2 (en) 2001-06-27
US6969907B2 (en) 2005-11-29
US20030025197A1 (en) 2003-02-06
JP2001244391A (ja) 2001-09-07

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Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:IMAI, MAKOTO;OGAWA, NAOKI;YAGI, YUJI;AND OTHERS;REEL/FRAME:011427/0757

Effective date: 20001213

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION