US11101395B2 - Wiring module - Google Patents

Wiring module Download PDF

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Publication number
US11101395B2
US11101395B2 US15/325,034 US201515325034A US11101395B2 US 11101395 B2 US11101395 B2 US 11101395B2 US 201515325034 A US201515325034 A US 201515325034A US 11101395 B2 US11101395 B2 US 11101395B2
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region
land
width
wire
power generating
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US20170200836A1 (en
Inventor
Kazumasa Toya
Takashi Iwasaki
Youichi Nagai
Koji Mori
Kenji Saito
Rui Mikami
Takeshi Yamana
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMANA, TAKESHI, MIKAMI, RUI, NAGAI, YOUICHI, IWASAKI, TAKASHI, MORI, KOJI, SAITO, KENJI, TOYA, Kazumasa
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0543—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/30—Supporting structures being movable or adjustable, e.g. for angle adjustment
    • H02S20/32—Supporting structures being movable or adjustable, e.g. for angle adjustment specially adapted for solar tracking
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H02S30/10—Frame structures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/20—Optical components
    • H02S40/22—Light-reflecting or light-concentrating means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/42—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Definitions

  • the present invention relates to wiring modules, and in particular, relates to wiring modules to be used in power generation.
  • a concentrator solar cell module includes: a plurality of solar cell elements; an elongated receiver substrate having the solar cell elements arranged thereon in a single line at constant intervals; and a module substrate having a plurality of the receiver substrates arranged thereon in parallel at constant intervals.
  • each receiver substrate includes: an elongated receiver base; and a plurality of wiring members arranged on the receiver base in a single line along the longitudinal direction, with their adjacent ends facing each other.
  • a positive electrode pad portion is provided on one end of each wiring member, and a negative electrode pad portion is provided on the other end thereof.
  • the positive electrode terminal of each solar cell element is connected to the positive electrode pad portion and the negative electrode terminal of the solar cell element is connected to the negative electrode pad portion, whereby a solar cell element mounting portion is formed.
  • PATENT LITERATURE 1 Japanese Laid-Open Patent Publication No. 2013-84855
  • An object of the present invention is to provide a wiring module that can suppress decrease in the power generating efficiency due to influence of heat.
  • a wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate is configured to have a power generating element mounted thereto, the wiring substrate includes: a land portion configured to have the power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.
  • FIG. 1 is a perspective view of a photovoltaic apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view of the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 3 is a plan view of the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 4 is a plan view showing a state of the photovoltaic module with a concentrating portion removed according to the first embodiment of the present invention.
  • FIG. 5 is a perspective view showing a state of a power generating portion mounted to a wiring substrate according to the first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing a cross section, along a VI-VI line in FIG. 4 , of the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a cross section, along a VII-VII line in FIG. 4 , of a wiring module and the power generating portion in the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 8 shows a pattern of a conductive portion of an FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 9 shows the wiring substrate according to the first embodiment of the present invention.
  • FIG. 10 shows the FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 11 shows a reinforcement plate in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 12 shows the wiring module with the wiring substrate according to the first embodiment of the present invention.
  • FIG. 13 shows a modification of the wiring substrate according to the first embodiment of the present invention.
  • FIG. 14 shows a modification of the wiring substrate according to the first embodiment of the present invention.
  • FIG. 15 shows a modification of the wiring substrate according to the first embodiment of the present invention.
  • FIG. 16 shows a modification of the wiring substrate according to the first embodiment of the present invention.
  • FIG. 17 shows a modification of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 18 shows a modification of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 19 shows a modification of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 20 shows a modification of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • FIG. 21 is a perspective view showing a state of the power generating portion mounted to the wiring substrate according to a second embodiment of the present invention.
  • FIG. 22 is a cross-sectional view showing a cross section, along a line that corresponds to the VI-VI line in FIG. 4 , of the photovoltaic module according to the second embodiment of the present invention.
  • FIG. 23 is a cross-sectional view showing a cross section, along a line that corresponds to the VII-VII line in FIG. 4 , of the wiring module and the power generating portion in the photovoltaic module according to the second embodiment of the present invention.
  • FIG. 24 shows the wiring substrate according to the second embodiment of the present invention.
  • a wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate is configured to have a power generating element mounted thereto, the wiring substrate includes: a land portion configured to have the power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.
  • the wire portion comes to be more easily detached from the base portion than the land portion. Accordingly, for example, even in a case where compressive stress in the extending direction is applied to the wiring substrate as a result of thermal expansion of the wiring substrate, the wire portion bends while being detached from the base portion so as to absorb the expansion in the extending direction, whereby deformation and positional shift of the land portion can be prevented. Accordingly, for example, in a case where the power generating element is mounted to the land portion and a lens having its focal point set at the power generating element is provided above the power generating element, the position of the power generating element can be prevented from being shifted from the focal point of the lens. Therefore, decrease in the power generating efficiency due to influence of heat can be suppressed.
  • the land adhesion region has a length along an extending direction of the wiring substrate
  • the wire adhesion region has a length along the extending direction of the wiring substrate
  • the length of the land adhesion region is smaller than the length of the wire adhesion region
  • the wire portion can be more easily detached than the land portion.
  • the width of the wire adhesion region is not less than 0.1% and not greater than 50% of the width of the land adhesion region.
  • the width of the wire adhesion region can be reduced at a predetermined proportion relative to the width of the land adhesion region.
  • the wire portion can be more reliably detached from the base portion.
  • the entirety of the wiring substrate can be fixed to the base portion with an appropriate strength.
  • a thickness of the adhesive layer is not less than 0.25% and not greater than 5% of the width of the land adhesion region.
  • the thickness of the adhesive layer is sufficiently smaller than the width of the land adhesion region, it is possible to enhance the heat dissipation performance of dissipating, to the base portion via the adhesive layer, the heat transferred from the power generating element to the land portion, for example.
  • the thickness of the adhesive layer can be increased to some extent so as not to cause too weak adhesive strength of the wiring substrate to the base portion.
  • a thickness of the adhesive layer is not less than 0.5% and not greater than 20% of the width of the wire adhesion region.
  • the thickness of the adhesive layer can be reduced such that heat in the land portion can be appropriately dissipated to the base portion. Further, the thickness of the adhesive layer can be increased to some extent so as not to cause a problem of adhesive strength of the wiring substrate to the base portion.
  • the land adhesion region has a length along an extending direction of the wiring substrate, and the width of the land adhesion region is smaller than the length of the land adhesion region.
  • the distance from the border between the wire portion and the land portion to the power generating element can be ensured to some extent.
  • the power generating element can be made less likely to receive influence due to the bending of the wire portion.
  • the land adhesion region has a first region and a second region, the first region has a first width, the second region is positioned at at least one end in a length direction of the land adhesion region, the second region being connected to the first region, the second region having a second width, and the second width is smaller than the first width and is greater than the width of the wire adhesion region.
  • the land adhesion region has a first region and a second region
  • the first region has a first width
  • the second region is positioned at each of both ends in a length direction of the land adhesion region, the second region being connected to the first region, the second region having a second width, and
  • the second width is smaller than the first width and becomes smaller from the first region toward the wire adhesion region.
  • the second region has a length along an extending direction of the wiring substrate, and relationship between the second width and the length of the second region satisfies a formula below, 0 ⁇ ( La 12/ Wa 2) ⁇ 10 where Wa 2 is the second width and La 12 is the length of the second region.
  • the land adhesion region has a shape that allows the power generating portion to be disposed such that a center portion of the power generating portion is positioned in the first region.
  • the power generating element can be mounted to a portion that is further less likely to be influenced by the bending of the wire portion.
  • an area of the first region is not less than 200% and not greater than 1000% of an area of the second region.
  • an area of the land adhesion region is not less than 20% and not greater than 1000% of an area of the wire adhesion region.
  • the adhesive strength of the land portion to the base portion can be made sufficiently greater than the adhesive strength of the wire portion to the base portion.
  • the land portion can be less likely to be detached.
  • a distance from the power generating element to the wire adhesion region in the extending direction is greater than a distance from the power generating element to an end of the land adhesion region in a width direction of the land adhesion region.
  • the distance from the border between the wire portion and the land portion to the power generating element can be ensured to some extent.
  • the power generating element can be made less likely to receive influence due to the bending of the wire portion.
  • a distance from the power generating element to the wire adhesion region in the extending direction is not less than 200% and not greater than 2000% of a distance from the power generating element to an end of the land adhesion region in a width direction of the land adhesion region.
  • the distance from the border between the wire portion and the land portion to the power generating element can be ensured to some extent.
  • the power generating element can be made less likely to receive influence due to the bending of the wire portion.
  • the heat transferred from the power generating element to the land portion can be efficiently dissipated to the wire portion.
  • FIG. 1 is a perspective view of a photovoltaic apparatus according to a first embodiment of the present invention.
  • a photovoltaic apparatus 101 includes a photovoltaic panel 12 and a pedestal 40 .
  • the photovoltaic panel 12 includes a plurality of photovoltaic modules 10 , a sun direction sensor 13 , and a frame part 14 .
  • the pedestal 40 includes a base 46 , a post 48 , a function part 90 , and a position changeable part not shown.
  • the photovoltaic apparatus 101 is a concentrator photovoltaic apparatus, for example.
  • the photovoltaic panel 12 includes 5 rows ⁇ 5 columns of the photovoltaic modules 10 , i.e., 25 photovoltaic modules 10 , for example.
  • the photovoltaic modules 10 are mounted side by side on top of the frame part 14 .
  • Each photovoltaic module 10 receives sunlight to generate power, and outputs, by using wiring not shown, direct-current power which is the generated power, to the function part 90 mounted to a side face of the post 48 .
  • the post 48 is set, for example, on the base 46 provided on the ground, so as to be perpendicular to the ground.
  • the position changeable part not shown includes a motor. On the basis of a control signal from the function part 90 , the position changeable part operates so as to direct toward the sun the direction of a light receiving surface FL of the photovoltaic panel 12 , i.e., the direction of the normal line of the light receiving surface FL indicated by an arrow As. Accordingly, the orientation of the light receiving surface FL of the photovoltaic panel 12 changes so as to track the sun from sunrise till sunset.
  • the sun direction sensor 13 is used for detecting the direction of the sun, and outputs a sensor signal indicating the detection result, to the function part 90 .
  • the function part 90 includes a housing and various types of units accommodated in the housing.
  • the housing accommodates: a junction box which connects wires from the respective photovoltaic modules 10 ; a power conditioner which converts direct-current power outputted from the photovoltaic modules 10 , into alternating-current power; a control unit for controlling the orientation of the light receiving surface FL of the photovoltaic panel 12 ; and the like.
  • FIG. 2 is a perspective view of the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 3 is a plan view of the photovoltaic module according to the first embodiment of the present invention.
  • the photovoltaic module 10 includes a wall portion 27 , a bottom not shown, and a concentrating portion 25 .
  • the concentrating portion 25 includes a plurality of Fresnel lenses 26 .
  • the Fresnel lenses 26 are arranged in a square lattice pattern, for example. Specifically, the Fresnel lenses 26 are arranged such that the distance between the centers of Fresnel lenses 26 that are adjacent to each other is W 1 , for example. The size of each Fresnel lens 26 is 50 mm ⁇ 50 mm, for example.
  • FIG. 4 is a plan view showing a state of a photovoltaic module with the concentrating portion removed according to the first embodiment of the present invention.
  • the photovoltaic module 10 includes the wall portion 27 , a wiring module 49 , a plurality of power generating portions 30 , and two lead wires 39 .
  • the wiring module 49 includes: a base portion 38 being the bottom of the photovoltaic module 10 ; and a wiring substrate 69 .
  • the wiring substrate 69 includes: strip-shaped substrates 32 A, 32 B, 32 C, 32 D, 32 E, 32 F, 32 G 32 H, 32 I, and 32 J; and coupling portions 33 H, 33 I, 33 J, 33 K, 33 L, 33 M, 33 N, 33 O, and 33 P.
  • the coupling portion 33 H couples the strip-shaped substrate 32 A and the strip-shaped substrate 32 B together.
  • the coupling portion 33 I couples the strip-shaped substrate 32 B and the strip-shaped substrate 32 C together.
  • the coupling portion 33 J couples the strip-shaped substrate 32 C and the strip-shaped substrate 32 D together.
  • the coupling portion 33 K couples the strip-shaped substrate 32 D and the strip-shaped substrate 32 E together.
  • the coupling portion 33 L couples the strip-shaped substrate 32 E and the strip-shaped substrate 32 F together.
  • the coupling portion 33 M couples the strip-shaped substrate 32 F and the strip-shaped substrate 32 G together.
  • the coupling portion 33 N couples the strip-shaped substrate 32 G and the strip-shaped substrate 32 H together.
  • the coupling portion 33 O couples the strip-shaped substrate 32 H and the strip-shaped substrate 32 I together.
  • the coupling portion 33 P couples the strip-shaped substrate 32 I and the strip-shaped substrate 32 J together.
  • each of the strip-shaped substrates 32 A, 32 B, 32 C, 32 D, 32 E, 32 F, 32 G, 32 H, 32 I, and 32 J will also be referred to as a strip-shaped substrate 32 .
  • each of the coupling portions 33 H, 33 I, 33 J, 33 K, 33 L, 33 M, 33 N, 33 O, and 33 P will also be referred to as a coupling portion 33 .
  • the strip-shaped substrates 32 are arranged parallel to each other.
  • the wiring substrate 69 may be configured to include a larger number of or a smaller number of the strip-shaped substrates 32 .
  • the wiring substrate 69 may be configured to include a single strip-shaped substrate 32 .
  • each strip-shaped substrate 32 of the wiring substrate 69 has an elongated shape.
  • the strip-shaped substrate 32 of the wiring substrate 69 has a length along the extending direction.
  • the wiring substrate 69 has a thickness.
  • the wiring substrate 69 has a width along a direction that crosses the length direction and the thickness direction of the wiring substrate 69 .
  • the lead wires 39 are respectively connected to the two ends of the wiring substrate 69 .
  • the lead wires 39 respectively pass through holes provided in the base portion 38 , and are connected to the junction box in the function part 90 shown in FIG. 1 , for example.
  • the material of the base portion 38 is, for example, aluminium, copper, or the like which has a high heat conductivity and a relatively light weight.
  • the wiring substrate 69 is placed at and adhered to the upper main surface of the base portion 38 , i.e., the main surface on the Fresnel lens 26 side of the base portion 38 .
  • the strip-shaped substrate 32 of the wiring substrate 69 includes seven land portions 60 and wire portions 63 each connected to opposite sides of each land portion. Each wire portion 63 connects the land portions 60 together, for example. The width of the land portion 60 is greater than the width of the wire portion 63 .
  • Each power generating portion 30 is mounted to the upper main surface of its corresponding land portion 60 .
  • the strip-shaped substrate 32 in the wiring substrate 69 may be configured to include a larger number of or a smaller number of the land portions 60 and the wire portions 63 .
  • the strip-shaped substrate 32 may be configured to include a single land portion 60 and a single wire portion 63 .
  • the strip-shaped substrate 32 E includes power generating portions 30 P 1 , 30 Q 1 , and 30 R 1 mounted thereto as the power generating portions 30 .
  • the strip-shaped substrate 32 F includes power generating portions 30 P 2 , 30 Q 2 , and 30 R 2 mounted thereto as the power generating portions 30 .
  • the power generating portion 30 P 1 and the power generating portion 30 P 2 are arranged along a direction perpendicular to the extending direction of the strip-shaped substrate 32 and are adjacent to each other.
  • the power generating portion 30 Q 1 and the power generating portion 30 Q 2 are arranged along a direction perpendicular to the extending direction of the strip-shaped substrate 32 and are adjacent to each other.
  • the power generating portion 30 R 1 and the power generating portion 30 R 2 are arranged along a direction perpendicular to the extending direction of the strip-shaped substrate 32 and are adjacent to each other.
  • a distance W 2 between the power generating portions 30 that are arranged along a direction perpendicular to the extending direction of the strip-shaped substrate 32 and that are adjacent to each other is equal to a distance W 3 between the power generating portions 30 that are adjacent to each other in the strip-shaped substrate 32 .
  • the distance W 2 between the power generating portion 30 P 1 and the power generating portion 30 P 2 is equal to the distance W 3 between the power generating portion 30 P 2 and power generating portion 30 Q 2 .
  • the distance W 2 and the distance W 3 are equal to the distance W 1 between the centers of the Fresnel lenses 26 shown in FIG. 3 .
  • each Fresnel lenses 26 shown in FIG. 3 is provided for one power generating portion 30 , correspondingly.
  • Each power generating portion 30 is disposed on the optical axis of its corresponding Fresnel lens 26 .
  • the photovoltaic module 10 includes a power generation module 29 .
  • the power generation module 29 includes: the wiring substrate 69 and the power generating portions 30 mounted to the wiring substrate 69 .
  • the wiring substrate 69 includes the land portions 60 and the wire portions 63 described above.
  • FIG. 5 is a perspective view showing a state of the power generating portion mounted to the wiring substrate according to the first embodiment of the present invention.
  • the wiring substrate 69 includes an FPC (flexible printed circuit) 79 , and a reinforcement plate 89 .
  • the FPC 79 includes a conductive portion 77 and an insulating portion 78 which covers the conductive portion 77 .
  • the power generating portion 30 is mounted to the land portion 60 of the wiring substrate 69 . Specifically, in the land portion 60 , an opening 68 is provided in the FPC 79 . In the opening 68 , the insulating portion 78 does not cover the upper side of the conductive portion 77 , and thus, the conductive portion 77 is exposed. The power generating portion 30 is electrically connected to the conductive portion 77 in the opening 68 .
  • the reinforcement plate 89 is provided to the main surface on the base portion 38 side of the strip-shaped substrate 32 in the wiring substrate 69 , and provides slight hardness to the strip-shaped substrate 32 , thereby facilitating handling of the wiring substrate 69 during production of the photovoltaic module 10 .
  • the reinforcement plate 89 is formed of metal such as aluminium, copper, or the like.
  • FIG. 6 is a cross-sectional view showing a cross section, along the VI-VI line in FIG. 4 , of the photovoltaic module according to the first embodiment of the present invention.
  • each power generating portion 30 includes a ball lens 17 , a package 18 , and a power generating element 19 . It should be noted that the power generating portion 30 may be configured not to include, except the power generating element 19 , any or some of these components.
  • the wiring substrate 69 is placed at the upper main surface of the base portion 38 .
  • the reinforcement plate 89 is provided above the base portion 38 .
  • the FPC 79 is provided above the reinforcement plate 89 . Specifically, the FPC 79 is provided above the base portion 38 via the reinforcement plate 89 .
  • the power generating element 19 is housed in the package 18 .
  • the power generating element 19 is mounted to the FPC 79 in a state of being housed in the package 18 .
  • an electrode not shown of the power generating element 19 is connected to the conductive portion 77 of the FPC 79 , via a package electrode 20 provided so as to penetrate the bottom of the package 18 .
  • the size of power generating element 19 is 3.2 mm ⁇ 3.2 mm, for example.
  • Each Fresnel lens 26 converges sunlight onto its corresponding ball lens 17 .
  • the ball lens 17 further converges the sunlight converged by the Fresnel lens 26 , onto the power generating element 19 .
  • the power generating element 19 receives the sunlight converged by the Fresnel lens 26 and the ball lens 17 , and generates power corresponding to the amount of the received light.
  • FIG. 7 is a cross-sectional view showing a cross section, along the VII-VII line in FIG. 4 , of the wiring module and the power generating portion in the photovoltaic module according to the first embodiment of the present invention.
  • FIG. 7 also shows an adhesive layer not shown in FIG. 5 , for example.
  • the power generating portion 30 is mounted to the wiring module 49 , specifically, to the wiring substrate 69 of the wiring module 49 .
  • the FPC 79 and the reinforcement plate 89 are adhered together by an intra-substrate adhesive layer 58 .
  • the wiring substrate 69 and the base portion 38 are adhered together by a base adhesive layer 59 .
  • the intra-substrate adhesive layer 58 and the base adhesive layer 59 are each formed from an adhesive agent, an adhesive tape, or the like, for example.
  • the power generating element 19 includes an element electrode 42 A and an element electrode 42 B, and outputs voltage from the element electrode 42 A and the element electrode 42 B.
  • the package 18 includes a package electrode 20 A and a package electrode 20 B.
  • the package electrode 20 A and the package electrode 20 B are provided so as to penetrate the bottom of the package 18 , and are exposed both on the upper side and the lower side of the bottom.
  • the element electrode 42 A of the power generating element 19 is connected to the package electrode 20 A by wire bonding, for example.
  • the element electrode 42 B is connected to the package electrode 20 B by a conductive paste, for example.
  • the insulating portion 78 does not cover the upper side of the conductive portion 77 , and thus, a part of the conductive portion 77 , specifically, a part of a conductive portion 77 A and a part of a conductive portion 77 B, is exposed.
  • the package electrode 20 A and the package electrode 20 B are connected by, for example, soldering to the conductive portion 77 A and the conductive portion 77 B, respectively.
  • the package 18 supports the ball lens 17 at the edge of the side wall of the package 18 , and fixes the focal point of the ball lens 17 to the power generating element 19 .
  • FIG. 8 shows a pattern of the conductive portion of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • a part of the conductive portion 77 is exposed in the opening 68 of the FPC 79 . Specifically, in the opening 68 , a part of the conductive portion 77 A and a part of the conductive portion 77 B are exposed.
  • the conductive portion 77 A and the conductive portion 77 B are connected to the element electrode 42 A and the element electrode 42 B of the power generating element 19 , respectively.
  • the conductive portion 77 connects, in series, the power generating portion 30 mounted in a land portion 60 and the power generating portion 30 mounted in another land portion 60 adjacent to the land portion 60 , for example.
  • FIG. 9 shows the wiring substrate according to the first embodiment of the present invention.
  • FIG. 9 shows a plan view and a side view of a part of the wiring substrate 69 , specifically, a part of the strip-shaped substrate 32 in the wiring substrate 69 .
  • the wiring substrate 69 to which the power generating portions 30 are mounted includes a plurality of the land portions 60 and a plurality of the wire portions 63 , as described above.
  • Each land portion 60 has a shape that allows the power generating portion 30 to be mounted to the upper side of the land portion 60 , i.e., the main surface on the Fresnel lens 26 side of the land portion 60 . That is, the land portion 60 has a space that allows the power generating portion 30 to be mounted therein. In addition, the land portion 60 has a length Lb 1 along the extending direction of the wiring substrate 69 .
  • the power generating portion 30 including the power generating element 19 is mounted to the land portion 60 .
  • the wire portion 63 is electrically connected to the power generating element 19 .
  • the wire portion 63 electrically connects the land portions 60 that are adjacent to each other, i.e., the power generating portions 30 that are adjacent to each other.
  • the wire portion 63 has a length Lb 2 along the extending direction of the wiring substrate 69 .
  • the length Lb 2 of the wire portion 63 is greater than the length Lb 1 of the land portion 60 . That is, the length Lb 2 of the wire portion 63 in the extending direction of the wiring substrate 69 is greater than the length Lb 1 of the land portion 60 in the extending direction.
  • the extending direction of the wiring substrate 69 will also be referred to as a substrate extending direction.
  • a width Wb 3 of the wire portion 63 is smaller than a width Wb 0 of the land portion 60 .
  • the width Wb 0 of the land portion 60 and the width Wb 3 of the wire portion 63 respectively are the length of the land portion 60 and the length of the wire portion 63 in a direction that crosses the substrate extending direction, specifically, for example, in a direction perpendicular to the substrate extending direction.
  • the direction that crosses the substrate extending direction i.e., the width direction of the land portion 60 , will also be referred to as a substrate width direction.
  • the width Wb 0 of the land portion 60 is not less than 200% and not greater than of 1000% of the width Wb 3 of the wire portion 63 , for example.
  • the length Lb 1 in the substrate extending direction of the land portion 60 is greater than the width Wb 0 of the land portion 60 .
  • the land portion 60 has an inside region 61 and two outside regions 62 .
  • the outside regions 62 are respectively connected to both ends in the substrate extending direction of the inside region 61 . That is, the outside regions 62 are respectively positioned at both ends in the length direction of the land portion 60 and connected to the inside region 61 . That is, each outside region 62 is connected between an end in the substrate extending direction of the inside region 61 and a wire portion 63 .
  • the number of the outside regions 62 of the land portion 60 may be one.
  • the outside region 62 is connected to either one of the ends in the substrate extending direction of the inside region 61 , for example. That is, the outside region 62 is positioned at one end in the length direction of the land portion 60 , and is connected to the inside region 61 .
  • the inside region 61 has a width Wb 1 that corresponds to the width Wb 0 of the land portion 60 .
  • the outside region 62 has a width Wb 2 .
  • the width Wb 1 of the inside region 61 and the width Wb 2 of the outside region 62 are the length of the inside region 61 and the length of the outside region 62 in the substrate width direction, respectively.
  • the width Wb 2 of the outside region 62 is smaller than the width Wb 1 of the inside region 61 .
  • the width Wb 2 of the outside region 62 is greater than the width Wb 3 of the wire portion 63 .
  • the width Wb 2 of the outside region 62 continuously becomes smaller from the inside region 61 toward the wire portion 63 . That is, the width Wb 2 of the outside region 62 continuously becomes smaller toward the wire portion 63 to which the outside region 62 is connected.
  • the outside region 62 has a length Lb 12 along the extending direction of the wiring substrate 69 .
  • the relationship between the width Wb 2 of the outside region 62 and the length Lb 12 of the outside region 62 , i.e., the length Lb 12 in the substrate extending direction of the outside region 62 is expressed by the formula (1) below. 0 ⁇ Lb 12/ Wb 2 ⁇ 10 (1)
  • an area Sb 1 of the inside region 61 is greater than an area Sb 2 of the outside region 62 .
  • the area Sb 1 of the inside region 61 is not less than 200% and not greater than 1000% of the area Sb 2 of the outside region 62 .
  • the wiring substrate 69 includes the FPC 79 and the reinforcement plate 89 as described above, for example. That is, each land portion 60 and each wire portion 63 include the reinforcement plate 89 .
  • the land portion 60 has a shape that allows the power generating portion 30 to be disposed such that a center portion of the power generating portion 30 , specifically, the center Ce of the power generating portion 30 , is positioned in the inside region 61 .
  • the power generating portion 30 is disposed such that the center Ce of the power generating portion 30 is included in the inside region 61 .
  • a distance db 1 from the power generating portion 30 to the wire portion 63 in the substrate extending direction is greater than a distance db 2 from the power generating portion 30 to an end of the land portion 60 in the substrate width direction.
  • the wiring substrate 69 has an electrode for soldering the power generating portion 30 .
  • the electrode is the exposed portion of the conductive portion 77 in the opening 68 shown in FIG. 8 , and is provided so as to be included in the inside region 61 .
  • the land portion 60 has a mounting region 31 that comes into contact with the power generating portion 30 when the power generating portion 30 is mounted to the land portion 60 .
  • a mounting region 31 that comes into contact with the power generating portion 30 when the power generating portion 30 is mounted to the land portion 60 .
  • not less than 80% of the mounting region 31 is positioned in the inside region 61 .
  • 80% to 100% of the mounting region 31 is included in the inside region 61 , the mounting region 31 being the region where the power generating portion 30 is mounted in the land portion 60 .
  • 100% of the mounting region 31 is included in the inside region 61 .
  • a thickness Tb 3 of the wire portion 63 is not less than 1% and not greater than 50% of the width Wb 3 of the wire portion 63 .
  • the reinforcement plate 89 has a thickness Ts 0 .
  • the thickness Ts 0 of the reinforcement plate 89 is not less than 10% and not greater than 90% of a thickness Tb 0 of the wiring substrate 69 .
  • the inside region 61 has edges 65 . Each edge 65 is positioned at an end of the inside region 61 in the substrate width direction.
  • the outside region 62 has edges 66 . Each edge 66 is positioned at an end of the outside region 62 in the substrate width direction.
  • the edge 65 and the edge 66 are connected to each other.
  • An angle ⁇ between the edge 65 and the edge 66 is greater than 90 degrees and not greater than 170 degrees, for example.
  • FIG. 10 shows the FPC in the wiring substrate according to the first embodiment of the present invention.
  • the FPC 79 includes a plurality of FPC land portions 70 and a plurality of FPC wire portions 73 .
  • the FPC land portion 70 and the FPC wire portion 73 are included in the land portion 60 and the wire portion 63 shown in FIG. 9 , respectively.
  • the power generating portion 30 is mounted to the FPC land portion 70 .
  • the FPC wire portion 73 connects the FPC land portions 70 together, i.e., the power generating portions 30 together.
  • the FPC land portion 70 has a length Lf 1 along the extending direction of the wiring substrate 69 .
  • the FPC wire portion 73 has a length Lf 3 along the extending direction of the wiring substrate 69 .
  • the length Lf 3 of the FPC wire portion 73 is greater than the length Lf 1 of the FPC land portion 70 . That is, the length Lf 3 in the substrate extending direction of the FPC wire portion 73 is greater than the length Lf 1 in the substrate extending direction of the FPC land portion 70 .
  • the length Lf 3 in the substrate extending direction of the FPC wire portion 73 is greater than 100% and not greater than 600% of the length Lf 1 in the substrate extending direction of the FPC land portion 70 .
  • a width Wf 3 of the FPC wire portion 73 is smaller than a width Wf 0 of the FPC land portion 70 .
  • the width Wf 3 of the FPC wire portion 73 is not less than 0.1% and not greater than 50% of the width Wf 0 of the FPC land portion 70 .
  • an area Sf 1 of the FPC land portion 70 is not less than 20% and not greater than 1000% of an area Sf 3 of the FPC wire portion 73 .
  • the FPC land portion 70 has an inside region 71 and two outside regions 72 .
  • the inside region 71 has a width Wf 1 .
  • the outside regions 72 each have a width Wf 2 .
  • the outside regions 72 are respectively positioned at both ends in the length direction of the FPC land portion 70 and connected to the inside region 71 .
  • the outside regions 72 are respectively connected to both ends in the substrate extending direction of the inside region 71 .
  • each outside region 72 is connected between an end in the substrate extending direction of the inside region 71 and a FPC wire portion 73 .
  • the number of the outside regions 72 of the FPC land portion 70 may be one.
  • the outside region 72 is connected to either one of the ends in the substrate extending direction of the inside region 71 . That is, the outside region 72 is positioned at one end in the length direction of the FPC land portion 70 , and is connected to the inside region 71 .
  • the inside region 71 has the width Wf 1 that corresponds to the width Wf 0 of the FPC land portion 70 .
  • the outside region 72 has the width Wf 2 .
  • the width Wf 1 of the inside region 71 and the width Wf 2 of the outside region 72 are the length of the inside region 71 and the length of the outside region 72 in the substrate width direction, respectively.
  • the width Wf 2 of the outside region 72 is smaller than the width Wf 1 of the inside region 71 .
  • the width Wf 2 of the outside region 72 is greater than the width Wf 3 of the FPC wire portion 73 .
  • the width Wf 2 of the outside region 72 continuously becomes smaller from the inside region 71 toward the FPC wire portion 73 . That is, the width Wf 2 of the outside region 72 continuously becomes smaller toward the FPC wire portion 73 connected to the outside region 72 .
  • the outside region 72 has a length Lf 12 along the extending direction of the wiring substrate 69 .
  • the relationship between the width Wf 2 of the outside region 72 and the length Lf 12 of the outside region 72 , i.e., the length Lf 12 in the substrate extending direction of the outside region 72 is expressed by the formula (2) below. 0 ⁇ Lf 12/ Wf 2 ⁇ 10 (2)
  • the power generating portion 30 is disposed such that a center portion of the power generating portion 30 , specifically, the center Ce of the power generating portion 30 , is included in the inside region 71 .
  • the FPC 79 has an electrode for soldering the power generating portion 30 .
  • the electrode is the exposed portion of the conductive portion 77 in the opening 68 shown in FIG. 8 , and is provided so as to be included in the inside region 71 .
  • the inside region 71 has edges 75 . Each edge 75 is positioned at an end of the inside region 71 in the width direction of the FPC land portion 70 , i.e., in the substrate width direction.
  • the outside region 72 has edges 76 . Each edge 76 is positioned at an end of the outside region 72 in the substrate width direction.
  • the edge 75 and the edge 76 are connected to each other.
  • An angle ⁇ between the edge 75 and the edge 76 is greater than 90 degrees and not greater than 170 degrees, for example.
  • FIG. 11 shows the reinforcement plate in the wiring substrate according to the first embodiment of the present invention.
  • the reinforcement plate 89 includes land reinforcement portions 80 and wire reinforcement portions 83 .
  • the land reinforcement portion 80 and the wire reinforcement portion 83 are included in the land portion 60 and the wire portion 63 shown in FIG. 9 , respectively.
  • the land reinforcement portion 80 is adhered to the FPC land portion 70 .
  • the wire reinforcement portion 83 is adhered to the FPC wire portion 73 .
  • a width Ws 3 of the wire reinforcement portion 83 is smaller than a width Ws 0 of the land reinforcement portion 80 .
  • FIG. 12 shows the wiring module with the wiring substrate according to the first embodiment of the present invention.
  • FIG. 12 shows a plan view and a side view of a state in which the wiring substrate 69 is adhered to the base portion 38 by the base adhesive layer 59 , that is, a plan view and a side view of the wiring module 49 .
  • the land adhesion region 50 adheres the land reinforcement portion 80 in the land portion 60 to the base portion 38 .
  • the wire adhesion region 53 adheres the wire reinforcement portion 83 in the wire portion 63 to the base portion 38 .
  • a width Wa 3 of the wire adhesion region 53 is smaller than a width Wa 0 of the land adhesion region 50 .
  • the width Wa 3 of the wire adhesion region 53 is not less than 0.1% and not greater than 50% of the width Wa 0 of the land adhesion region 50 .
  • the width Wa 0 of the land adhesion region 50 may be smaller than the width Wb 0 of the land portion 60 or may be equal to the width Wb 0 of the land portion 60 .
  • the width Wa 3 of the wire adhesion region 53 may be smaller than the width Wb 3 of the wire portion 63 or may be equal to the width Wb 3 of the wire portion 63 .
  • the land adhesion region 50 has a length La 1 along the substrate extending direction.
  • the wire adhesion region 53 has a length La 3 along the extending direction of the wiring substrate 69 .
  • the length La 1 of the land adhesion region 50 is smaller than the length La 3 of the wire adhesion region 53 .
  • the length La 1 in the substrate extending direction of the land adhesion region 50 is smaller than the length La 3 in the substrate extending direction of the wire adhesion region 53 .
  • the width Wa 0 of the land adhesion region 50 is smaller than the length La 1 in the substrate extending direction of the land adhesion region 50 .
  • an area Sa 0 of the land adhesion region 50 is not less than 20% and not greater than 1000% of an area Sa 3 of the wire adhesion region 53 .
  • a thickness Ta 0 of the base adhesive layer 59 is not less than 0.25% and not greater than 5% of the width Wa 0 of the land adhesion region 50 .
  • the thickness Ta 0 of the base adhesive layer 59 is not less than 0.5% and not greater than 20% of the width Wa 3 of the wire adhesion region 53 .
  • the land adhesion region 50 has an inside region (first region) 51 and two outside regions (second regions) 52 , for example.
  • the outside regions 52 are respectively positioned at both ends in the length direction of the land adhesion region 50 and are connected to the inside region 51 .
  • the outside regions 52 are respectively connected to both ends in the substrate extending direction of the inside region 51 .
  • each outside region 52 is connected between an end in the substrate extending direction of the inside region 51 and a wire adhesion region 53 .
  • the land adhesion region 50 may be configured to have one outside region 52 , instead of two outside regions 52 .
  • the outside region 52 is positioned at one end in the length direction of the land adhesion region 50 and is connected to the inside region 51 .
  • the inside region 51 has a width Wa 1 that corresponds to the width Wa 0 .
  • the outside region 52 has a width Wa 2 .
  • the width Wa 1 of the inside region 51 and the width Wa 2 of the outside region 52 are the length of the inside region 51 and the length of the outside region 52 in the substrate width direction, respectively.
  • the width Wa 2 of the outside region 52 is smaller than the width Wa 1 of the inside region 51 .
  • the width Wa 2 of the outside region 52 is greater than the width Wa 3 of the wire adhesion region 53 .
  • the width Wa 2 of the outside region 52 continuously becomes smaller from the inside region 51 toward the wire adhesion region 53 . That is, the width Wa 2 of the outside region 52 continuously becomes smaller toward the wire adhesion region 53 connected to the outside region 52 .
  • the outside region 52 has a length La 12 along the extending direction of the wiring substrate 69 .
  • the relationship between the width Wa 2 of the outside region 52 and the length La 12 of the outside region 52 is expressed by the formula (3) below. 0 ⁇ La 12/ Wa 2 ⁇ 10 (3)
  • an area Sa 1 of the inside region 51 is not less than 200% and not greater than 1000% of an area Sa 2 of the outside region 52 .
  • the power generating element 19 is disposed such that a center portion of the power generating element 19 , specifically, the center Cc of the power generating element 19 , is included in the inside region 51 .
  • a distance da 1 from the power generating element 19 to the wire adhesion region 53 in the substrate extending direction is greater than a distance da 2 from the power generating element 19 to its corresponding end of the land adhesion region 50 in the width direction of the land adhesion region 50 , i.e., in the substrate width direction.
  • the distance da 1 from the power generating element 19 to the wire adhesion region 53 in the substrate extending direction is not less than 200% and not greater than 2000% of the distance da 2 from the power generating element 19 to the end of the land adhesion region 50 in the substrate width direction, for example.
  • FIG. 13 to FIG. 16 each show a modification of the wiring substrate according to the first embodiment of the present invention.
  • the shape of the land portion 60 is different from the shape of the land portion 60 shown in FIG. 9 .
  • each connection portion 64 between the edge 65 positioned at an end of the inside region 61 and its corresponding edge 66 positioned at an end of the outside region 62 forms a curve.
  • the land portion 60 has a rounded hexagonal shape.
  • connection portion 64 between the edge 65 and the edge 66 may form a continuous curve, i.e., a smoother curve.
  • edge 65 and the edge 66 may form an arc, for example.
  • the shape of the land portion 60 is different from the shape of the land portion 60 shown in FIG. 9 .
  • the land portion 60 has an elliptic shape.
  • the land portion 60 has a rectangular shape.
  • an edge 160 positioned at an end in the substrate width direction of the land portion 60 and its corresponding edge 163 positioned at an end in the substrate width direction of the wire portion 63 form a straight line.
  • FIG. 17 to FIG. 20 each show a modification of the FPC in the wiring substrate according to the first embodiment of the present invention.
  • the shape of the FPC land portion 70 is different from the shape of the FPC land portion 70 shown in FIG. 10 .
  • each connection portion 74 between the edge 75 positioned at an end of the inside region 71 and its corresponding edge 76 positioned at an end of the outside region 62 forms a curve.
  • the FPC land portion 70 has a rounded hexagonal shape.
  • connection portion 74 between the edge 75 and the edge 76 may form a continuous curve, i.e., a smoother curve.
  • edge 65 and the edge 66 may form an arc, for example.
  • the shape of the FPC land portion 70 is different from the shape of the FPC land portion 70 shown in FIG. 10 .
  • the FPC land portion 70 has an elliptic shape.
  • the FPC land portion 70 has a rectangular shape.
  • an edge 170 positioned at an end in the substrate width direction of the FPC land portion 70 and its corresponding edge 173 positioned at an end in the substrate width direction of the FPC wire portion 73 form a straight line.
  • the FPC 79 and the reinforcement plate 89 are configured to be fixed by the intra-substrate adhesive layer 58 , but the configuration is not limited thereto.
  • the FPC 79 and the reinforcement plate 89 may be configured to be fixed by being screwed.
  • the wiring substrate 69 is configured to be fixed to the base portion 38 by the base adhesive layer 59 , but the configuration is not limited thereto.
  • the wiring substrate 69 may be configured to be fixed to the base portion 38 by being screwed.
  • the receiver substrate in a situation where the receiver substrate is adhered to a surface at which the receiver substrate is placed, if the receiver substrate expands due to heat, the receiver substrate comes to be easily detached from the surface. Then, for example, if the portion of the receiver substrate to which the solar cell element is mounted is detached from the surface, the position of the solar cell element is shifted from the focal point of the lens, thus causing decrease in the power generating efficiency of the solar cell element in some cases.
  • the wiring substrate 69 is placed at the base portion 38 .
  • the base adhesive layer 59 adheres the wiring substrate 69 to the base portion 38 .
  • the power generating element 19 is mounted in the land portion 60 .
  • the wire portion 63 is electrically connected to the power generating element 19 .
  • the land adhesion region 50 adheres the land portion 60 to the base portion 38 .
  • the wire adhesion region 53 adheres the wire portion 63 to the base portion 38 .
  • the width Wa 3 of the wire adhesion region 53 is smaller than the width Wa 0 of the land adhesion region 50 .
  • the wire portion 63 comes to be more easily detached from the base portion 38 than the land portion 60 . Accordingly, for example, even in a case where compressive stress in the extending direction is applied to the wiring substrate 69 as a result of thermal expansion of the wiring substrate 69 , the wire portion 63 bends while being detached from the base portion 38 so as to absorb the expansion in the extending direction, whereby deformation and positional shift of the land portion 60 can be prevented. Accordingly, for example, in a case where the power generating element 19 is mounted to the land portion 60 and a lens having its focal point set at the power generating element 19 is provided above the power generating element 19 , the position of the power generating element 19 can be prevented from being shifted from the focal point of the lens.
  • the land adhesion region 50 has the length La 1 along the extending direction of the wiring substrate 69 .
  • the wire adhesion region 53 has the length La 3 along the extending direction of the wiring substrate 69 .
  • the length La 1 of the land adhesion region 50 is smaller than the length La 3 of the wire adhesion region 53 .
  • the wire portion 63 can be more easily detached than the land portion 60 .
  • the width Wa 3 of the wire adhesion region 53 is not less than 0.1% and not greater than 50% of the width Wa 0 of the land adhesion region 50 .
  • the width Wa 3 of the wire adhesion region 53 can be reduced at a predetermined proportion relative to the width Wa 0 of the land adhesion region 50 .
  • the wire portion 63 can be more reliably detached from the base portion 38 .
  • the entirety of the wiring substrate 69 can be fixed to the base portion 38 with an appropriate strength.
  • the thickness Ta 0 of the base adhesive layer 59 is not less than 0.25% and not greater than 5% of the width Wa 0 of the land adhesion region 50 .
  • the thickness Ta 0 of the base adhesive layer 59 is sufficiently smaller than the width Wa 0 of the land adhesion region 50 , it is possible to enhance the heat dissipation performance of dissipating, to the base portion 38 via the base adhesive layer 59 , the heat transferred from the power generating element 19 to the land portion 60 , for example.
  • the thickness Ta 0 of the base adhesive layer 59 can be increased to some extent so as not to cause too weak adhesive strength of the wiring substrate 69 to the base portion 38 .
  • the thickness Ta 0 of the base adhesive layer 59 is not less than 0.5% and not greater than 20% of the width Wa 3 of the wire adhesion region 53 .
  • the thickness of the base adhesive layer 59 can be reduced such that heat in the land portion 60 can be appropriately dissipated to the base portion 38 . Further, the thickness of the base adhesive layer 59 can be increased to some extent so as not to cause a problem of adhesive strength of the wiring substrate 69 to the base portion 38 .
  • the land adhesion region 50 has the length La 1 along the extending direction of the wiring substrate 69 .
  • the width Wa 0 of the land adhesion region 50 is smaller than the length La 1 of the land adhesion region 50 .
  • the distance from the border between the wire portion 63 and the land portion 60 to the power generating element 19 can be ensured to some extent.
  • the power generating element 19 can be made less likely to receive influence due to the bending of the wire portion 63 .
  • the land adhesion region 50 has the inside region 51 and the outside region 52 .
  • the inside region 51 has the width Wa 1 .
  • the outside region 52 is positioned at at least one end in the length direction of the land adhesion region 50 , is connected to the inside region 51 , and has the width Wa 2 .
  • the width Wa 2 of the outside region 52 is smaller than the width Wa 1 of the inside region 51 and is greater than the width Wa 3 of the wire adhesion region 53 .
  • the land adhesion region 50 has the inside region 51 and the outside region 52 .
  • the inside region 51 has the width Wa 1 .
  • the outside region 52 is positioned at each of both ends in the length direction of the land adhesion region 50 , is connected to the inside region 51 , and has the width Wa 2 .
  • the width Wa 2 of the outside region 52 is smaller than the width Wa 1 of the inside region 51 , and becomes smaller from the inside region 51 toward the wire adhesion region 53 .
  • the outside region 52 has the length La 12 along the extending direction of the wiring substrate 69 .
  • the relationship between the width Wa 2 of the outside region 52 and the length La 12 of the outside region 52 satisfies the formula below. 0 ⁇ ( La 12/ Wa 2) ⁇ 10
  • the land adhesion region 50 in a plan view from above the wiring substrate 69 , has a shape that allows the power generating portion 30 to be disposed such that a center portion of the power generating portion 30 is positioned in the inside region 51 .
  • the power generating element 19 can be mounted to a portion that is further less likely to be influenced by the bending of the wire portion 63 .
  • the area Sa 1 of the inside region 51 is not less than 200% and not greater than 1000% of the area Sa 2 of the outside region 52 .
  • the area Sa 0 of the land adhesion region 50 is not less than 20% and not greater than 1000% of the area Sa 3 of the wire adhesion region 53 .
  • the adhesive strength of the land portion 60 to the base portion 38 can be made sufficiently greater than the adhesive strength of the wire portion 63 to the base portion 38 .
  • the land portion 60 can be less likely to be detached.
  • the distance da 1 from the power generating element 19 to the wire adhesion region 53 in the extending direction is greater than the distance da 2 from the power generating element 19 to an end of the land adhesion region 50 in the width direction of the land adhesion region 50 .
  • the distance from the border between the wire portion 63 and the land portion 60 to the power generating element 19 can be ensured to some extent.
  • the power generating element 19 can be made less likely to receive influence due to the bending of the wire portion 63 .
  • the distance da 1 from the power generating element 19 to the wire adhesion region 53 in the extending direction is not less than 200% and not greater than 2000% of the distance da 2 from the power generating element 19 to an end of the land adhesion region 50 in the width direction of the land adhesion region 50 .
  • the distance from the border between the wire portion 63 and the land portion 60 to the power generating element 19 can be ensured to some extent.
  • the power generating element 19 can be made less likely to receive influence due to the bending of the wire portion 63 .
  • the heat transferred from the power generating element 19 to the land portion 60 can be efficiently dissipated to the wire portion 63 .
  • the present embodiment relates to a wiring substrate that does not include the FPC, compared with the wiring substrate according to the first embodiment. Except the contents described below, this photovoltaic apparatus is the same as that according to the first embodiment.
  • the photovoltaic module 10 includes a wiring substrate 269 instead of the wiring substrate 69 in the photovoltaic module 10 according to the first embodiment.
  • the wiring substrate 269 includes another kind of substrate instead of the FPC 79 , and does not include the reinforcement plate 89 .
  • the wiring substrate 269 is the same as the wiring substrate 69 , except the contents described below.
  • FIG. 21 is a perspective view showing a state of the power generating portion mounted to the wiring substrate according to the second embodiment of the present invention.
  • the wiring substrate 269 includes: a conductive portion 277 ; and an insulating portion 278 which covers the conductive portion 277 .
  • the power generating portion 30 is mounted to a land portion 260 of the wiring substrate 269 .
  • an opening 268 is provided to the land portion 260 .
  • the insulating portion 278 does not cover the upper side of the conductive portion 277 , and thus, the conductive portion 277 is exposed.
  • the power generating portion 30 is electrically connected to the conductive portion 277 in the opening 268 .
  • the conductive portion 277 connects, in series, the power generating portion 30 mounted in the land portion 260 and the power generating portion 30 mounted in another land portion 260 adjacent to the land portion 260 , for example.
  • FIG. 22 is a cross-sectional view showing a cross section, along a line that corresponds to the VI-VI line in FIG. 4 , of the photovoltaic module according to the second embodiment of the present invention.
  • the wiring substrate 269 is placed at the upper main surface of the base portion 38 .
  • the power generating element 19 is housed in the package 18 .
  • the power generating element 19 is mounted to the wiring substrate 269 in a state of being housed in the package 18 .
  • the electrode not shown of the power generating element 19 is connected to the conductive portion 277 of the wiring substrate 269 , via the package electrode 20 provided so as to penetrate the bottom of the package 18 .
  • FIG. 23 is a cross-sectional view showing a cross section, along a line that corresponds to the VII-VII line in FIG. 4 , of the wiring module and the power generating portion in the photovoltaic module according to the second embodiment of the present invention.
  • FIG. 23 also shows an adhesive layer not shown in FIG. 22 , for example.
  • the power generating portion 30 is mounted to the wiring module 49 , specifically, the wiring substrate 269 of the wiring module 49 .
  • the wiring substrate 269 and the base portion 38 are adhered together by the base adhesive layer 59 .
  • the insulating portion 278 does not cover the upper side of the conductive portion 277 , and thus, a part of the conductive portion 277 , specifically, a part of a conductive portion 277 A and a part of a conductive portion 277 B, is exposed.
  • the package electrode 20 A and the package electrode 20 B are connected by, for example, soldering to the conductive portion 277 A and the conductive portion 277 B, respectively.
  • the package 18 supports the ball lens 17 at the edge of the side wall of the package 18 , and fixes the focal point of the ball lens 17 to the power generating element 19 .
  • FIG. 24 shows the wiring substrate according to the second embodiment of the present invention.
  • FIG. 24 shows a plan view and a side view of a part of the wiring substrate 269 .
  • the wiring substrate 269 includes a plurality of land portions 260 and a plurality of wire portions 263 .
  • the power generating portion 30 including the power generating element 19 is mounted to the land portion 260 .
  • the wire portion 263 is electrically connected to the power generating element 19 .
  • the wire portion 263 electrically connects the land portions 260 that are adjacent to each other, i.e., the power generating portions 30 that are adjacent to each other.
  • a length Lr 2 of the wire portion 263 in the extending direction of the wiring substrate 269 is greater than a length Lr 1 of the land portion 260 in the extending direction.
  • the extending direction of the wiring substrate 269 will also be referred to as a substrate extending direction.
  • a width Wr 3 of the wire portion 263 is smaller than a width Wr 0 of the land portion 260 .
  • the width Wr 0 of the land portion 260 and the width Wr 3 of the wire portion 263 respectively are the length of the land portion 260 and the length of the wire portion 263 , in a direction that crosses the substrate extending direction, specifically, in a direction perpendicular to the substrate extending direction, for example.
  • the direction that crosses the substrate extending direction i.e., the width direction of the land portion 260 , will also be referred to as a substrate width direction.
  • the width Wr 0 of the land portion 260 is not less than 200% and not greater than 1000% of the width Wr 3 of the wire portion 263 , for example.
  • the length Lr 1 in the substrate extending direction of the land portion 260 is greater than the width Wr 0 of the land portion 260 .
  • the land portion 260 has an inside region 261 and two outside regions 262 .
  • the outside regions 262 are respectively connected to both ends in the substrate extending direction of the inside region 261 .
  • each outside region 262 is connected between an end in the substrate extending direction of the inside region 261 and a wire portion 263 .
  • the number of the outside regions 262 of the land portion 260 may be one.
  • the outside region 262 is connected to either one of the ends in the substrate extending direction of the inside region 261 , for example.
  • the inside region 261 has a width Wr 1 that corresponds to the width Wr 0 .
  • the outside region 262 has a width Wr 2 .
  • the width Wr 1 of the inside region 261 and the width Wr 2 of the outside region 262 are the length of the inside region 261 and the length of the outside region 262 in the substrate width direction, respectively.
  • the width Wr 2 of the outside region 262 is smaller than the width Wr 1 of the inside region 261 .
  • the width Wr 2 of the outside region 262 is greater than the width Wr 3 of the wire portion 263 .
  • the width Wr 2 of outside region 262 continuously becomes smaller toward its corresponding wire portion 263 to which the outside region 262 is connected.
  • the relationship between the width Wr 2 of the outside region 262 and the length Lr 12 in the substrate extending direction of the outside region 262 is expressed by the formula (4) below. 0 ⁇ Lr 12/ Wr 2 ⁇ 10 (4)
  • an area Sr 1 of the inside region 261 is greater than an area Sr 2 of the outside region 262 .
  • the area Sr 1 of the inside region 261 is not less than 200% and not greater than 1000% of the area Sr 2 of the outside region 262 .
  • the power generating portion 30 is disposed such that a center portion of the power generating portion 30 , specifically, the center Ce of the power generating portion 30 , is included in the inside region 261 .
  • a distance dr 1 from the power generating portion 30 to the wire portion 263 in the substrate extending direction is greater than a distance dr 2 from the power generating portion 30 to an end of the land portion 260 in the substrate width direction.
  • the wiring substrate 269 has an electrode for soldering the power generating portion 30 .
  • the electrode is the exposed portion of the conductive portion 277 in the opening 268 , and is provided so as to be included in the inside region 261 .
  • the mounting region 31 is included in the inside region 261 , the mounting region 31 being the region where the power generating portion 30 is mounted in the land portion 260 .
  • 100% of the mounting region 31 is included in the inside region 261 .
  • a thickness Tr 3 of the wire portion 263 is not less than 1% and not greater than 50% of the width Wr 3 of the wire portion 263 .
  • the inside region 261 has edges 265 . Each edge 265 is positioned at an end of the inside region 261 in the substrate width direction.
  • the outside region 262 has edges 266 . Each edge 266 is positioned at an end of the outside region 262 in the substrate width direction.
  • the edge 265 and the edge 266 are connected to each other.
  • An angle ⁇ between the edge 265 and the edge 266 is greater than 90 degrees and not greater than 170 degrees, for example.
  • a wiring module including:
  • the wiring substrate includes:
  • a width of the wire adhesion region is smaller than a width of the land adhesion region
  • the wire portion is connected to an end of the land portion in an extending direction of the wiring substrate
  • the wiring module is used in a photovoltaic apparatus, and

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  • Photovoltaic Devices (AREA)
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US15/325,006 Active 2036-02-05 US10680127B2 (en) 2014-07-10 2015-07-06 Power generation circuit unit
US15/325,045 Active 2036-01-21 US10985286B2 (en) 2014-07-10 2015-07-06 Power generation module and wiring substrate
US15/324,984 Abandoned US20170201208A1 (en) 2014-07-10 2015-07-06 Wiring substrate and photovoltaic apparatus
US14/795,653 Active 2035-07-29 US9923107B2 (en) 2014-07-10 2015-07-09 Photovoltaic module, photovoltaic apparatus, and method for producing photovoltaic module

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US15/324,984 Abandoned US20170201208A1 (en) 2014-07-10 2015-07-06 Wiring substrate and photovoltaic apparatus
US14/795,653 Active 2035-07-29 US9923107B2 (en) 2014-07-10 2015-07-09 Photovoltaic module, photovoltaic apparatus, and method for producing photovoltaic module

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TW201607057A (zh) 2016-02-16
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AU2015288774A1 (en) 2017-01-12
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US20170213923A1 (en) 2017-07-27
US20170213928A1 (en) 2017-07-27
MA39684A1 (fr) 2018-02-28
CN105261661B (zh) 2019-01-08
US20170200836A1 (en) 2017-07-13
JP6565912B2 (ja) 2019-08-28
US10985286B2 (en) 2021-04-20
US20160013337A1 (en) 2016-01-14
CN106537610A (zh) 2017-03-22
MA39681B1 (fr) 2019-06-28
TW201613120A (en) 2016-04-01
MA39684B1 (fr) 2020-03-31
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TW201613119A (en) 2016-04-01
MA39683B1 (fr) 2019-06-28
WO2016006571A1 (fr) 2016-01-14
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AU2015288772A1 (en) 2017-01-12
AU2015288769A1 (en) 2017-01-12
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