MA39684B1 - Module de câblage - Google Patents

Module de câblage

Info

Publication number
MA39684B1
MA39684B1 MA39684A MA39684A MA39684B1 MA 39684 B1 MA39684 B1 MA 39684B1 MA 39684 A MA39684 A MA 39684A MA 39684 A MA39684 A MA 39684A MA 39684 B1 MA39684 B1 MA 39684B1
Authority
MA
Morocco
Prior art keywords
wiring
wiring board
adheres
adhesion region
adhesion
Prior art date
Application number
MA39684A
Other languages
English (en)
Other versions
MA39684A1 (fr
Inventor
Kazumasa Toya
Takashi Iwasaki
Youichi Nagai
Koji Mori
Kenji Saito
Rui Mikami
Takeshi Yamana
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of MA39684A1 publication Critical patent/MA39684A1/fr
Publication of MA39684B1 publication Critical patent/MA39684B1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/02002Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0543Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00Supporting structures for PV modules
    • H02S20/30Supporting structures being movable or adjustable, e.g. for angle adjustment
    • H02S20/32Supporting structures being movable or adjustable, e.g. for angle adjustment specially adapted for solar tracking
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00Structural details of PV modules other than those related to light conversion
    • H02S30/10Frame structures
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/20Optical components
    • H02S40/22Light-reflecting or light-concentrating means
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40Thermal components
    • H02S40/42Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/046Planar parts of folded PCBs making an angle relative to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09263Meander
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/52PV systems with concentrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne un module de câblage (49) qui comprend : une carte de câblage (69) ; une partie de base (38) sur laquelle est agencée la carte de câblage (69) ; et une couche d'adhérence (59) qui fait adhérer la carte de câblage (69) à la partie de base (38). La carte de câblage (69) comprend : une partie pastille (60) sur laquelle est monté un élément de génération de puissance (19) ; et une partie de câblage (63) qui est électriquement connectée à l'élément de génération de puissance (19). La couche d'adhérence (59) possède : une région d'adhérence (50) de pastille qui fait adhérer la partie pastille (60) à la partie de base (38) ; et une région d'adhérence (53) de câblage qui fait adhérer la partie de câblage (63) à la partie de base (38). La largeur de la région d'adhérence (53) de câblage est plus petite que la largeur de la région d'adhérence (50) de pastille.
MA39684A 2014-07-10 2015-07-06 Module de câblage MA39684B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014142327 2014-07-10
PCT/JP2015/069407 WO2016006570A1 (fr) 2014-07-10 2015-07-06 Module de câblage

Publications (2)

Publication Number Publication Date
MA39684A1 MA39684A1 (fr) 2018-02-28
MA39684B1 true MA39684B1 (fr) 2020-03-31

Family

ID=54829518

Family Applications (4)

Application Number Title Priority Date Filing Date
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39682A MA39682B2 (fr) 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique.
MA39684A MA39684B1 (fr) 2014-07-10 2015-07-06 Module de câblage

Family Applications Before (3)

Application Number Title Priority Date Filing Date
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39682A MA39682B2 (fr) 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique.

Country Status (7)

Country Link
US (5) US11101395B2 (fr)
JP (4) JP6565912B2 (fr)
CN (6) CN106663711B (fr)
AU (4) AU2015288771B2 (fr)
MA (4) MA39681B1 (fr)
TW (5) TWI656653B (fr)
WO (4) WO2016006573A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6759778B2 (ja) 2016-07-07 2020-09-23 住友電気工業株式会社 集光型太陽光発電モジュール、集光型太陽光発電装置及び水素精製システム
US20200252027A1 (en) * 2017-08-07 2020-08-06 Sumitomo Electric Industries, Ltd. Concentrator photovoltaic module, concentrator photovoltaic panel, concentrator photovoltaic apparatus, and method for manufacturing concentrator photovoltaic module
MA49972B1 (fr) * 2017-08-07 2023-11-30 Sumitomo Electric Industries Module photovoltaïque à concentrateur, panneau photovoltaïque à concentrateur et dispositif photovoltaïque à concentrateur
CN107453699B (zh) * 2017-08-28 2024-01-23 江西清华泰豪三波电机有限公司 一种光伏组件及光伏装置
US10529881B2 (en) * 2018-03-01 2020-01-07 Solaero Technologies Corp. Interconnect member
WO2020004148A1 (fr) * 2018-06-27 2020-01-02 住友電気工業株式会社 Module de génération d'énergie solaire à concentration et panneau de génération d'énergie solaire à concentration
CN112369128A (zh) * 2018-06-27 2021-02-12 住友电气工业株式会社 柔性印刷线路板的前体、制造柔性印刷线路板的方法、聚光型光伏发电模块和发光模块
CN109067346A (zh) * 2018-07-20 2018-12-21 上海空间电源研究所 刚挠结合板太阳电池阵
CN111609370A (zh) * 2020-05-19 2020-09-01 田聪 一种基于电容传感的太阳能路灯雨天可保证亮度的装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298217A (ja) * 2000-04-13 2001-10-26 Sumitomo Electric Ind Ltd 光モジュール
JP2005051133A (ja) 2003-07-31 2005-02-24 Canon Inc プリント配線基板
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
US8153886B1 (en) * 2003-10-20 2012-04-10 Amonix, Inc. Method of improving the efficiency of loosely packed solar cells in dense array applications
JP4648063B2 (ja) 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
JP2007019334A (ja) * 2005-07-08 2007-01-25 Mitsubishi Electric Corp 太陽電池装置
US8759138B2 (en) * 2008-02-11 2014-06-24 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells
WO2009130856A1 (fr) * 2008-04-21 2009-10-29 住友ベークライト株式会社 Unité de câblage souple et dispositif électronique
JP5180306B2 (ja) 2008-08-08 2013-04-10 京セミ株式会社 採光型太陽電池モジュール
JP5360223B2 (ja) 2009-10-05 2013-12-04 株式会社村田製作所 回路基板
EP2362432B1 (fr) * 2010-02-25 2017-06-07 Saint-Augustin Canada Electric Inc. Ensemble de cellule solaire
JP5853374B2 (ja) 2010-03-12 2016-02-09 オムロン株式会社 照明装置
JP2011210747A (ja) * 2010-03-26 2011-10-20 Mitsubishi Chemicals Corp 太陽電池モジュール及びその製造方法
US8677639B2 (en) * 2010-10-21 2014-03-25 K-2 Corporation Ski pole with inclinometer
JP2013012605A (ja) * 2011-06-29 2013-01-17 Sharp Corp 集光型太陽光発電装置、および集光型太陽光発電装置の製造方法
WO2013031298A1 (fr) * 2011-08-31 2013-03-07 三洋電機株式会社 Module de cellules solaires, et procédé de fabrication de celui-ci
WO2013042417A1 (fr) * 2011-09-23 2013-03-28 三洋電機株式会社 Module de cellules solaires et cellule solaire
JP5814725B2 (ja) * 2011-10-03 2015-11-17 住友電気工業株式会社 集光型太陽光発電モジュール及び集光型太陽光発電パネル
JP5214005B2 (ja) 2011-10-12 2013-06-19 シャープ株式会社 集光型太陽電池モジュール及び太陽光発電システム
US20130104958A1 (en) * 2011-10-31 2013-05-02 E I Du Pont De Nemours And Company Integrated back-sheet for back contact photovoltaic module
JP5948899B2 (ja) * 2012-01-25 2016-07-06 住友電気工業株式会社 集光型太陽光発電モジュール及び集光型太陽光発電パネル
US9008122B2 (en) * 2012-07-23 2015-04-14 Cisco Technology, Inc. Method and apparatus for triggering bandwidth upspeeding within an existing reservation
JP5643792B2 (ja) * 2012-08-10 2014-12-17 株式会社東具 電飾広告用のライン照明装置

Also Published As

Publication number Publication date
CN106663711A (zh) 2017-05-10
US11101395B2 (en) 2021-08-24
US10680127B2 (en) 2020-06-09
TW201607057A (zh) 2016-02-16
TWI666786B (zh) 2019-07-21
AU2015288774A1 (en) 2017-01-12
JPWO2016006571A1 (ja) 2017-04-27
US20170213923A1 (en) 2017-07-27
US20170213928A1 (en) 2017-07-27
MA39684A1 (fr) 2018-02-28
CN105261661B (zh) 2019-01-08
US20170200836A1 (en) 2017-07-13
JP6565912B2 (ja) 2019-08-28
US10985286B2 (en) 2021-04-20
US20160013337A1 (en) 2016-01-14
CN106537610A (zh) 2017-03-22
MA39681B1 (fr) 2019-06-28
TW201613120A (en) 2016-04-01
WO2016006573A1 (fr) 2016-01-14
JPWO2016006568A1 (ja) 2017-04-27
TW201613119A (en) 2016-04-01
MA39683B1 (fr) 2019-06-28
WO2016006571A1 (fr) 2016-01-14
AU2015288772B2 (en) 2020-06-25
TWI656653B (zh) 2019-04-11
TWI661569B (zh) 2019-06-01
TWI658604B (zh) 2019-05-01
CN105261661A (zh) 2016-01-20
JPWO2016006570A1 (ja) 2017-04-27
MA39682B2 (fr) 2020-06-30
AU2015288774B2 (en) 2020-03-12
CN106537611B (zh) 2019-03-15
WO2016006570A1 (fr) 2016-01-14
AU2015288769B2 (en) 2020-04-30
AU2015288772A1 (en) 2017-01-12
AU2015288769A1 (en) 2017-01-12
WO2016006568A1 (fr) 2016-01-14
AU2015288771B2 (en) 2020-06-25
TWI666781B (zh) 2019-07-21
JP6520943B2 (ja) 2019-05-29
CN106537611A (zh) 2017-03-22
CN204885177U (zh) 2015-12-16
TW201611311A (zh) 2016-03-16
JP6551409B2 (ja) 2019-07-31
US9923107B2 (en) 2018-03-20
CN106537612A (zh) 2017-03-22
US20170201208A1 (en) 2017-07-13
CN106663711B (zh) 2019-03-29
CN106537612B (zh) 2019-03-01
MA39683A1 (fr) 2018-01-31
JP6551408B2 (ja) 2019-07-31
JPWO2016006573A1 (ja) 2017-04-27
TW201607058A (zh) 2016-02-16
AU2015288771A1 (en) 2017-01-12
MA39681A1 (fr) 2018-01-31
CN106537610B (zh) 2018-05-08

Similar Documents

Publication Publication Date Title
MA39684B1 (fr) Module de câblage
EP2876985A3 (fr) Dispositif de conversion de puissance et ensemble de conversion de puissance
ATE437457T1 (de) Elektro-installationsgerät sowie zugehörige zentralabdeckung
EA201590566A1 (ru) Стекло с электрическим соединительным элементом
EA201791338A1 (ru) Стекло, имеющее электрический подключающий элемент и гибкий подключающий кабель
ATE530443T1 (de) Grossflächiger schaltkreis mit applikationen
EA201692178A1 (ru) Электрический соединительный элемент для контактирования электропроводной структуры на подложке
MX336669B (es) Tarjeta electronica que tiene un conector externo.
WO2013085071A3 (fr) Carte de circuit imprimé
WO2015126199A3 (fr) Dispositif de protection de matériel, et dispositifs électroniques incluant ce dispositif de protection
TW200701436A (en) Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit
NZ600463A (en) Body surfing suit with fins
TWD195134S (zh) Part of the electrical connector
WO2018148398A3 (fr) Module thermoélectrique et ensemble circuit thermoélectrique flexible
WO2011117468A3 (fr) Bande de lumière et fabrication de bande de lumière
WO2012028537A3 (fr) Cellule photovoltaïque avec conducteurs discontinus
MY176818A (en) A packaging structure for a laser diode
FR3033623B1 (fr) Module source de lumiere
EP4272687A3 (fr) Pièce à main chirurgicale à ultrasons
TWD185805S (zh) 熱電轉換模組
TW200723972A (en) Circuit board module and forming method thereof
TWD187158S (zh) 電連接器
GB201111725D0 (en) Lighting assembly
EP2447596A3 (fr) Dispositif électroluminescent et dispositif d'éclairage
WO2017021008A8 (fr) Système de mise en contact électrique