JP6551409B2 - 配線モジュール - Google Patents
配線モジュール Download PDFInfo
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- JP6551409B2 JP6551409B2 JP2016532923A JP2016532923A JP6551409B2 JP 6551409 B2 JP6551409 B2 JP 6551409B2 JP 2016532923 A JP2016532923 A JP 2016532923A JP 2016532923 A JP2016532923 A JP 2016532923A JP 6551409 B2 JP6551409 B2 JP 6551409B2
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- 238000010248 power generation Methods 0.000 claims description 190
- 239000000758 substrate Substances 0.000 claims description 146
- 239000012790 adhesive layer Substances 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 description 27
- 238000012986 modification Methods 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000005452 bending Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 238000013459 approach Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
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Description
0<(La12/Wa2)≦10
但し、Wa2は前記第2の幅であり、La12は前記第2領域の前記長さである。
図1は、本発明の第1の実施の形態に係る太陽光発電装置の斜視図である。
0<Lb12/Wb2≦10 ・・・(1)
0<Lf12/Wf2≦10・・・(2)
外側領域52の幅Wa2は、内側領域51から配線接着領域53に近づくに従い連続的に小さくなる。すなわち、外側領域52の幅Wa2は、当該外側領域52と接続された配線接着領域53に近づくに従い連続的に小さくなる。
で表される。
0<La12/Wa2≦10・・・(3)
図13〜図16は、本発明の第1の実施の形態に係る配線基板の変形例を示す図である。
0<(La12/Wa2)≦10
本実施の形態は、第1の実施の形態に係る配線基板と比べて、FPCを含まない配線基板に関する。以下で説明する内容以外は、第1の実施の形態に係る太陽光発電装置と同様である。
0<Lr12/Wr2≦10 ・・・(4)
配線モジュールであって、
配線基板と、
前記配線基板が載置されたベース部と、
前記配線基板を前記ベース部に接着する接着層とを備え、
前記配線基板は、
発電素子が実装されるランド部と、
前記発電素子と電気的に接続される配線部とを含み、
前記接着層は、
前記ランド部を前記ベース部に接着するランド接着領域と、
前記配線部を前記ベース部に接着する配線接着領域とを有し、
前記配線接着領域の幅は、前記ランド接着領域の幅より小さく、
前記配線部は、前記配線基板の延伸方向における前記ランド部の端に接続されており、
前記配線モジュールは、太陽光発電装置において用いられ、
前記太陽光発電装置において、レンズによって収束された太陽光が前記発電素子へ照射される、配線モジュール。
12 太陽光発電パネル
13 太陽方向センサ
14 フレーム部
17 ボールレンズ
18 パッケージ
19 発電素子
20,20A,20B パッケージ電極
25 集光部
26 フレネルレンズ
27 壁部
29 発電モジュール
30,30P1,30P2,30Q1,30Q2,30R1,30R2 発電部
31 実装領域
32,32A,32B,32C,32D,32E,32F,32G,32H,32I,32J 帯状基板
33,33H,33I,33J,33K,33L,33M,33N,33O,33P 連結部
38 ベース部
39 リード線
40 架台
42A,42B 素子電極
46 土台
48 支柱
49 配線モジュール
50 ランド接着領域
51,61,71,261 内側領域
52,62,72,262 外側領域
53 配線接着領域
58 基板内接着層
59 ベース接着層
60,260 ランド部
63,263 配線部
64,74 接続部
65,66,75,76,160,163,170,173,265,266 縁
68,268 開口部
69,269 配線基板
70 FPCランド部
73 FPC配線部
77,77A,77B,277,277A,277B 導電部
78,278 絶縁部
79 FPC
80 ランド補強部
83 配線補強部
89 補強板
90 機能部
101 太陽光発電装置
Cc,Ce 中心
FL 受光面
Claims (14)
- 配線基板と、
前記配線基板が載置されたベース部と、
前記配線基板を前記ベース部に接着する接着層とを備え、
前記配線基板は、発電素子が実装されるものであり、
前記配線基板は、前記発電素子が実装されるランド部と、
前記発電素子と電気的に接続される配線部とを含み、
前記接着層は、
前記ランド部を前記ベース部に接着するランド接着領域と、
前記配線部を前記ベース部に接着する配線接着領域とを有し、
前記配線接着領域の幅は、前記ランド接着領域の幅より小さい、配線モジュール。 - 前記ランド接着領域は、前記配線基板の延伸方向に沿った長さを有し、
前記配線接着領域は、前記配線基板の延伸方向に沿った長さを有し、
前記ランド接着領域の前記長さは、前記配線接着領域の前記長さより小さい、請求項1に記載の配線モジュール。 - 前記配線接着領域の幅は、前記ランド接着領域の幅の0.1%以上であり、かつ50%以下である、請求項1または請求項2に記載の配線モジュール。
- 前記接着層の厚みは、前記ランド接着領域の幅の0.25%以上であり、かつ5%以下である、請求項1から請求項3のいずれか1項に記載の配線モジュール。
- 前記接着層の厚みは、前記配線接着領域の幅の0.5%以上であり、かつ20%以下である、請求項1から請求項3のいずれか1項に記載の配線モジュール。
- 前記ランド接着領域は、前記配線基板の延伸方向に沿った長さを有し、
前記ランド接着領域の幅は、前記ランド接着領域の前記長さより小さい、請求項1から請求項5のいずれか1項に記載の配線モジュール。 - 前記ランド接着領域は、第1領域と、第2領域とを有し、
前記第1領域は、第1の幅を有し、
前記第2領域は、前記ランド接着領域の長さ方向の少なくとも一端に位置し、かつ、前記第1領域と接続されており、かつ、第2の幅を有し、
前記第2の幅は、前記第1の幅より小さく、かつ、前記配線接着領域の幅より大きい、請求項1から請求項6のいずれか1項に記載の配線モジュール。 - 前記ランド接着領域は、第1領域と、第2領域とを有し、
前記第1領域は、第1の幅を有し、
前記第2領域は、前記ランド接着領域の長さ方向の両端に位置し、かつ、前記第1領域と接続されており、かつ、第2の幅を有し、
前記第2の幅は、前記第1の幅より小さく、かつ、前記第1領域から前記配線接着領域に近づくに従い小さくなる、請求項1から請求項7のいずれか1項に記載の配線モジュール。 - 前記第2領域は、前記配線基板の延伸方向に沿った長さを有し、
前記第2の幅と前記第2領域の前記長さとの関係が以下の式を満たす、請求項7または請求項8に記載の配線モジュール。
0<(La12/Wa2)≦10
但し、Wa2は前記第2の幅であり、La12は前記第2領域の前記長さである。 - 前記配線基板の上方からの平面視において、前記ランド接着領域は、前記発電素子の中央部が前記第1領域に位置するように前記発電素子が配置される形状を有する、請求項7から請求項9のいずれか1項に記載の配線モジュール。
- 前記第1領域の面積は、前記第2領域の面積の200%以上であり、かつ1000%以下である、請求項7から請求項10のいずれか1項に記載の配線モジュール。
- 前記ランド接着領域の面積は、前記配線接着領域の面積の20%以上であり、かつ1000%以下である、請求項1から請求項11のいずれか1項に記載の配線モジュール。
- 前記配線基板の上方からの平面視において、前記配線基板の延伸方向における前記発電素子から前記配線接着領域までの距離は、前記ランド接着領域の幅方向における前記発電素子から前記ランド接着領域の端部までの距離より大きい、請求項1から請求項12のいずれか1項に記載の配線モジュール。
- 前記配線基板の上方からの平面視において、前記配線基板の延伸方向における前記発電素子から前記配線接着領域までの距離は、前記ランド接着領域の幅方向における前記発電素子から前記ランド接着領域の端部までの距離の200%以上であり、かつ2000%以下である、請求項1から請求項13のいずれか1項に記載の配線モジュール。
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