US10361395B2 - Display device - Google Patents

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US10361395B2
US10361395B2 US15/718,022 US201715718022A US10361395B2 US 10361395 B2 US10361395 B2 US 10361395B2 US 201715718022 A US201715718022 A US 201715718022A US 10361395 B2 US10361395 B2 US 10361395B2
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substrate
insulating layer
opening
area
layer
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US20180108863A1 (en
Inventor
Kenta Kajiyama
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Japan Display Inc
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Japan Display Inc
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Assigned to JAPAN DISPLAY INC. reassignment JAPAN DISPLAY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAJIYAMA, KENTA
Publication of US20180108863A1 publication Critical patent/US20180108863A1/en
Priority to US16/433,249 priority Critical patent/US10658617B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H01L51/5253—
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • H01L27/3276—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
    • G09G2300/0809—Several active elements per pixel in active matrix panels
    • G09G2300/0842—Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0281—Arrangement of scan or data electrode driver circuits at the periphery of a panel not inherent to a split matrix structure
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00—Specific applications
    • G09G2380/02—Flexible displays
    • H01L2251/5338—
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • One embodiment of the present invention is related to a display device using a flexible substrate.
  • An information terminal device (also called a smartphone) having both a calling function and a computer function as an example of an electronic device having a display is spreading to consumers.
  • Such an electronic device has an appearance in which a display is arranged on one surface of a main body and the size of the screen occupying the casing strongly influences an impression given to the appearance.
  • the tendency of the design in such an electronic device is that the area where the display is exposed on the front surface of the main body is increased, a periphery area in which the casing surrounds the display (also called a “frame area”) is narrowed, and a smart appearance is sometimes formed. Narrowing the periphery area of the display to make it slimmer is sometimes referred to as “narrowing of a frame” of a display panel.
  • a display panel is divided into a display area where pixels are arranged and a periphery area where a drive circuit and an input terminal are arranged. Narrowing of a frame of the display panel is for reducing the area of the periphery area. Therefore, a technique in which narrowing of the frame by bending an area where the driving circuit and the input terminal are arranged is disclosed.
  • a display device in which a stainless-steel substrate or a plastic substrate having flexibility is used and the substrate is curved at an outer part of a display area is disclosed (for example, see Japanese Laid Open Patent Application No. 2011-209405, Japanese Laid Open Patent Application No. 2012-128006, Japanese Laid Open Patent Application No. 2011-034066, Japanese Laid Open Patent Application No.
  • a display device in an embodiment according to the present invention includes a substrate including a first surface and a second surface opposing the first surface, a display area on the first surface of the substrate and including a plurality of pixels, a periphery area on an outer side of the display area of the first surface, and a sealing layer covering the display area and the periphery area.
  • the periphery area includes a drive circuit outputting a signal to the display area, an input terminal part input with a signal for driving the drive circuit, and a plurality of wirings arranged between the drive circuit and the input terminal part
  • the sealing layer includes at least one opening part exposing the first surface of the substrate in an area inside a corner part of the substrate in the periphery area.
  • a display device in an embodiment according to the present invention includes a substrate having flexibility and including a first surface and a second surface opposing the first surface, a display area on the first surface of the substrate and including a plurality of pixels, a periphery area on an outer side of the display are of the first surface, and an insulating layer spreading to the display area and the periphery area.
  • the periphery area includes a drive circuit outputting a signal to the display area, an input terminal part input with a signal for driving the drive circuit, and a plurality of wirings arranged between the drive circuit and the input terminal part
  • the substrate includes a first curved part along a first side of the substrate and a second curved part along a second side intersecting the first side of the substrate, the first curved part and the second curved part are arranged inside an edge part of the substrate
  • the insulating layer includes an opening part exposing the first surface of the substrate in an area where the first curved part and the second curved part intersect.
  • FIG. 1 is a planar view diagram showing a structure of a display device related to the present embodiment
  • FIG. 2 is a planar view diagram showing a structure of a display device related to the present embodiment and shows a form in which a substrate is curved from the form shown in FIG. 1 ;
  • FIG. 3 is a cross-sectional diagram showing a structure of a display device related to the present embodiment and shows a form in which a substrate is curved from the form shown in FIG. 1 ;
  • FIG. 4 is a cross-sectional diagram showing a structure of a display device related to the present embodiment
  • FIG. 5 is a cross-sectional diagram showing a structure of a display device related to the present embodiment
  • FIG. 6A and FIG. 6B are cross-sectional diagrams showing a structure of a display device related to the present embodiment
  • FIG. 7 is a cross-sectional diagram showing a structure of a display device related to the present embodiment.
  • FIG. 8 is a perspective view diagram showing a structure of a display device related to the present embodiment.
  • FIG. 1 is a planar view diagram showing a structure of a display device 100 related to the present embodiment.
  • the display device 100 is arranged with a display area 104 in which pixels 108 are arranged on a substrate 102 .
  • the display device 100 includes a periphery area 106 in which a driving circuit part 110 and an input terminal part 112 are arranged in an area outside the display area 104 .
  • the substrate 102 has a first surface and a second surface opposing the first surface.
  • the display area 104 and the periphery area 106 are arranged on the first surface of the substrate 102 .
  • a pixel 108 includes a light emitting element 114 , a transistor 116 connected to the light emitting element 114 , and a first capacitor element 115 connected to the transistor 116 and the like.
  • the drive circuit part 110 includes first drive circuits 118 a and 118 b which output a scanning signal to a scanning signal line 122 and a second drive circuit 120 which outputs a video signal to a video signal line 124 .
  • Each circuit included in the drive circuit part 110 is formed including a transistor the same as the pixel 108 .
  • the input terminal part 112 includes a plurality of input terminals 134 arranged in an end part area of the substrate 102 .
  • the plurality of input terminals 134 included in the input terminal part 112 are respectively connected to the first drive circuits 118 a , 118 b and the second drive circuit 120 by the wiring 130 .
  • the input terminal 134 included in the input terminal part 112 is also connected to a first power supply line 126 and second power supply line 128 arranged in the display area 104 .
  • the input terminal 134 is electrically connected to a flexible wiring substrate 132 .
  • a video signal, a timing signal and drive power and the like are supplied to the input terminal part 112 from an external control circuit via the flexible wiring substrate 132 .
  • At least one sealing layer is arranged on roughly the entire surface excluding the upper surface of the input terminal 134 in the input terminal part 112 including the display area 104 and the periphery area 106 .
  • the sealing layer is arranged as to cover the transistor 116 and the light emitting element 114 of the pixel 108 .
  • the roughly entire first surface of the substrate 102 is covered by this sealing layer.
  • the sealing layer is formed by an insulating film.
  • the sealing layer is formed including at least one inorganic insulating film. A silicon nitride film and a silicon oxide film or the like is applied as the inorganic insulating film.
  • the substrate 102 is formed by a member having flexibility. It is possible to use a resin substrate having flexibility, such as polyimide, polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, a cyclic olefin copolymer, a cycloolefin polymer or other resin substrate having flexibility as a member forming the substrate 102 .
  • a resin substrate having flexibility such as polyimide, polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, a cyclic olefin copolymer, a cycloolefin polymer or other resin substrate having flexibility as a member forming the substrate 102 .
  • FIG. 1 shows a state before the substrate 102 is curved.
  • the substrate 102 can be curved at a first curved part 136 a along a line Y 1 -Y 2 in the diagram, a second curved part 136 b along a line Y 3 -Y 4 , a third curved part 136 c along a line X 1 -X 2 , and a fourth curved part 136 d along a line X 3 -X 4 .
  • the first curved part 136 a to the fourth curved part 136 d are areas along each edge of the rectangular substrate 102 and can be arranged in an arbitrary area further to the interior than an end part of the substrate 102 .
  • the curved part 136 is arranged in the periphery area 106 in order to reduce a substantial area of the so-called frame area.
  • FIG. 1 shows a form in which four curved parts are arranged along each edge of the substrate 102
  • the present invention is not limited to this structure.
  • the first curved part 136 a and the fourth curved part 136 d may be arranged as one group of curved parts
  • the second curved part 136 b and the third curved part 136 c may be arranged as one group of curved parts.
  • the display device 100 has an opening part 138 in which the sealing layer is removed in an area where a curved part along a first edge of the substrate 102 and a curved part along a second edge intersecting the first edge intersect each other.
  • An example is shown in FIG. 1 in which a first opening part 138 a is arranged in an area where the first curved part 136 a and the third curved part 136 c intersect and in an area where the second curved part 136 b and the third curved part 136 c intersect, and a third opening part 138 c is arranged in an area where the first curved part 136 a and the fourth curved part 136 d intersect, and in an area where the second curved part 136 b and the fourth curved part 136 d intersect.
  • the opening parts 138 are arranged in an area inside from a corner part of the substrate 102 which is an area where the sealing layer is removed. It is preferred that the opening parts 138 (first opening part 138 a , second opening part 138 b , third opening part 138 c , fourth opening part 138 d ) expose the first surface of the substrate 102 where the sealing layer is removed.
  • the first drive circuits 118 a and 118 b , the second drive circuit 120 , the display area 104 , and the wiring 130 connecting input terminal parts 112 are arranged in the periphery area 106 .
  • the wiring 130 arranged in the periphery area 106 is arranged so as not to overlap the opening part 138 in a planar view.
  • a plurality of wires 130 arranged in the periphery area 106 are arranged in an area other than the opening part 138 .
  • the wiring 130 is arranged in an area between the third opening part 138 c and the end part of the substrate 102 .
  • wirings are also arranged in an area between the third opening part 138 c and the display area 104 .
  • an opening part or groove 166 is arranged in an area outside the display area 104 .
  • This opening part 166 is also called a moisture blocking area. Details of the opening part 166 are explained in the second embodiment.
  • the opening part 166 is arranged between the display area 104 and the peripheray area 106 .
  • the opening part 138 arranged in the periphery area 106 is arranged further to the exterior than the opening part 166 .
  • FIG. 2 shows a state in which the substrate 102 is bent toward the second surface side along the first curved part 136 a and the fourth curved part 136 d .
  • the opening parts 138 (first opening part 138 a , second opening part 138 b , third opening part 138 c , fourth opening part 138 d ) are arranged at the end parts of the four edges.
  • a bending stress acts on a wiring or a sealing layer if they are arranged in an area where the substrate 102 is bent double. Specifically, a bending stress due to bending of the substrate 102 in one direction and bending stress due to bending in a direction crossing this first direction both act on the wiring and the sealing layer. In this case, wiring breakage becomes a problem. In addition, problems such as the occurrence of cracks and peeling of a film occur in the sealing layer. When cracks occur in this area in the sealing layer, the cracks eventually grow to the display area 104 which causes a light emitting element 114 to deteriorate.
  • the opening part 138 (first opening part 138 a , second opening part 138 b , third opening part 138 c , fourth opening part 138 d ) is arranged in the substrate 102 , it is possible to prevent such defects from occurring. That is, in the case where the substrate 102 is bent in two directions, by arranging the opening part 138 at the intersection of at least two directions, removing the sealing layer without arranging wiring in this part, it is possible to prevent bending stress from acting directly on these members.
  • FIG. 3 schematically shows a cross-sectional structure along the line Y 1 -Y 2 shown in FIG. 2 .
  • FIG. 3 shows a form in which the first surface of the substrate 102 is bent at the first curved part 136 a toward the second surface side and further bent at the third curved part 136 c and fourth curved part 136 d .
  • the first curved part 136 a is arranged so as to overlap with the first drive circuit 118 a and the third curved part 136 c and the fourth curved part 136 d are arranged on the outer side of the first drive circuit 118 a and the second drive circuit 120 b .
  • a part of the first drive circuit 118 a is bent.
  • a first opening part 138 a is arranged in an area where the first curved part 136 a and the third curved part 136 c intersect, and a third opening part 138 c is arranged in an area where the first curved part 136 a and the fourth curved part 136 d intersect.
  • the first opening part 138 a and the third opening part 138 c are areas from which the sealing layer 135 is removed, and are areas in which the first surface of the substrate 102 is exposed. As a result, the first surface of the substrate 102 is exposed in the first opening part 138 a and the third opening part 138 c .
  • the substrate 102 is bent in two directions. However, as is shown in FIG.
  • a sealing layer 135 is removed from the first opening part 138 a and the third opening part 138 c , and the wiring 130 is not arranged. Therefore, bending stress due to bending the substrate 102 has a structure that does not act on the sealing layer 135 and the wiring 130 .
  • the first opening part 138 a , the second opening part 138 b , the third opening part 138 c and the fourth opening part 138 d are positioned at the four corners of the substrate 102 respectively.
  • a sealing layer including an inorganic insulating film is removed in the first opening part 138 a , the second opening part 138 b , the third opening part 138 c and the fourth opening part 138 d , even if impact is applied to a corner part of the substrate 102 by dropping or the like, damage to a sealing layer can be prevented.
  • the opening part 138 in an area where the curved part 136 which bends the substrate 102 intersects, it is possible to relieve stress applied to the wiring 130 and a sealing layer and prevent the occurrence of defects.
  • FIG. 4 shows a cross-sectional view of the display device 100 .
  • FIG. 5 is a cross-sectional view for explaining the details of a pixel 108 .
  • an explanation is made with reference to FIG. 4 and FIG. 5 as appropriate.
  • the periphery area 106 and the display area 104 are arranged from an end of the substrate 102 .
  • an opening part or groove 166 is arranged between the display area 104 and the periphery area 106 .
  • a first drive circuit 118 a is arranged in the periphery area 106 .
  • a third opening part 138 c is arranged between the first drive circuit 118 a and an end part of the substrate 102 .
  • wirings 130 a and 130 b are arranged between the third opening part 138 c and an end part of the substrate 102 .
  • the pixel 108 arranged in the display area 104 is formed including a transistor 116 , light emitting element 114 , first capacitor element 115 and a second capacitor element 117 .
  • the light emitting element 114 is electrically connected to the transistor 116 .
  • the transistor 116 has a function for controlling light emission of the light emitting element 114 .
  • the first capacitor element 115 holds a gate voltage of the transistor 116
  • the second capacitor element 117 operates to maintain the gate voltage of the transistor 116 and is arranged to suppressing fluctuation of a current flowing in the light emitting element 114 .
  • a first insulating layer 140 is arranged on the first surface of the substrate 102 , and the transistor 116 is arranged over the first insulating layer 140 .
  • the first insulating layer 140 is also called an underlying insulating layer and is formed from an inorganic insulating film having barrier properties against moisture and the like.
  • the transistor 116 has a structure in which a semiconductor layer 142 , second insulating layer 144 which functions as a gate insulating layer, and a gate electrode 146 are stacked.
  • the semiconductor layer 142 is formed from amorphous or polycrystalline silicon or an oxide semiconductor layer and the like.
  • a source-drain electrode 149 is connected to a source-drain area formed in the semiconductor layer 142 .
  • the source-drain electrode 149 is formed above a third insulating layer 148 arranged on an upper layer side of the second insulating layer 144 .
  • a fourth insulating layer 150 is arranged above the source-drain electrode 149 as a planarization layer.
  • the fourth insulating layer 150 buries a step of an underlying surface formed by the source-drain electrode 149 and the like, and flattens a surface on which the light emitting element 114 is formed.
  • the second insulating layer 144 and the third insulating layer 148 are formed of an inorganic insulating film such as a silicon oxide film or a silicon nitride film
  • the fourth insulating layer 150 is formed of an organic insulating film such as an acrylic resin or a polyimide resin and the like.
  • the first capacitor element 115 is formed in an area where the semiconductor layer 142 , second insulating layer 144 and the first capacitor electrode 147 overlap.
  • a pixel electrode 154 is arranged on an upper layer side of the fourth insulating layer 150 .
  • the pixel electrode 154 is connected to the source-drain electrode 149 via a contact hole formed in the fourth insulating layer 150 .
  • a sixth insulating layer 156 which exposes the central part of the pixel electrode 154 and covers a periphery part is arranged on the upper layer side of the pixel electrode 154 .
  • the sixth insulating layer 156 is formed from an organic resin film the same as the fourth insulating layer 150 .
  • An organic layer 158 is arranged above the pixel electrode 154 and the sixth insulating layer 156 .
  • An opposing electrode 160 is arranged above the organic layer 158 and is arranged from the upper surface of the pixel electrode 154 to the upper surface part of the sixth insulating layer 156 .
  • the light emitting element 114 is formed in an area where the pixel electrode 154 , organic layer 158 and the opposing electrode 160 overlap.
  • the second capacitor element 117 is formed in an area where the pixel electrode 154 , fifth insulating layer 152 and the second capacitor electrode 151 overlap.
  • the organic layer 158 is a layer including a light emitting material such as an organic electroluminescent material, and is formed using a low molecular or high molecular organic material.
  • the organic layer 158 is formed from, for example, a low molecular organic material.
  • the organic layer 158 includes, in addition to the light emitting layer, a carrier injection layer such as a hole injection layer and an electron injection layer, a carrier transport layer such as a hole transport layer and an electron transport layer, and a carrier block layer such as a hole blocking layer and an electron block layer.
  • a carrier injection layer such as a hole injection layer and an electron injection layer
  • a carrier transport layer such as a hole transport layer and an electron transport layer
  • a carrier block layer such as a hole blocking layer and an electron block layer.
  • One of the pixel electrode 154 and the opposing electrode 160 serves as an anode and the other serves as a cathode.
  • the anode is a layer contacting the hole injection layer, and a conductive material having a high work function such as indium tin oxide (also called ITO) is used.
  • the cathode is formed of a conductive material including an alkali metal or an alkaline earth metal as a layer contacting the electron injection layer. Since the organic layer 158 deteriorates due to moisture, a sealing layer is required in an upper layer of the light emitting element 114 .
  • a seventh insulating layer 162 is arranged above the light emitting element 114 as a sealing layer.
  • the seventh insulating layer 162 covers the light emitting element 114 and is arranged to prevent moisture or the like from entering the organic layer 158 .
  • the seventh insulating layer 162 has a stacked structure of a first inorganic insulating layer 163 , an organic insulating layer 164 and a second inorganic insulating layer 165 .
  • the first inorganic insulating layer 163 and the second inorganic insulating layer 165 are formed from an inorganic insulating material such as silicon nitride or aluminum oxide and the like.
  • the organic insulating layer 164 is formed from an organic insulating material such as a polyimide resin, acrylic resin or an epoxy resin and the like.
  • an organic insulating material such as a polyimide resin, acrylic resin or an epoxy resin and the like.
  • the first drive circuit 118 a is arranged adjacent to the display area 104 where a pixel 108 is arranged.
  • FIG. 4 shows a form in which an n-channel transistor 168 and a p-channel transistor 169 are arranged in the first drive circuit 118 a .
  • the first insulating layer 140 , the second insulating layer 144 , the third insulating layer 148 , the fourth insulating layer 150 , the fifth insulating layer 152 and the sixth insulating layer 156 are similarly arranged in an area where the first drive circuit 118 a is formed.
  • the fourth insulating layer 150 formed from an organic insulating material is arranged with an opening 166 between the display area 104 and an area where the first drive circuit 118 a is arranged.
  • the opening part 166 passes through the fourth insulating layer 150 and exposes the third insulating layer 148 formed from an inorganic insulating material.
  • the fifth insulating layer 152 is arranged covering a side surface of the opening part 166 and an upper surface of the third insulating layer 148 which is the bottom surface of the opening part 166 from an upper surface of the fourth insulating layer 150 .
  • the opening part 166 is arranged so as to enclose the display area 104 .
  • the opening part 166 divides the fourth insulating layer 150 into a display area 104 side and a periphery area 106 side.
  • the sixth insulating layer 156 formed from an organic insulating material is also similarly divided into a display area 104 side and a peripheral area 106 side where the first drive circuit 118 a is arranged in the opening part 166 .
  • the first inorganic insulating layer 163 of the seventh insulating layer 162 is arranged covering the opposing electrode 160 and the sixth insulating layer 156 and covers the opening part 166 .
  • the organic insulating layer 164 is arranged on roughly the entire surface of the display area 104 , it is arranged so that an end part does not reach the periphery area 106 beyond the opening part 166 .
  • the second inorganic insulating layer 165 covers an upper surface and an end surface of the organic insulating layer 164 and is arranged to contact with the first inorganic insulating layer 163 from a bottom surface of the opening part 166 to the periphery area 106 .
  • a first inorganic insulating layer 163 and a second inorganic insulating layer 165 extend to the opening part 166 from which the fourth insulating layer 150 is removed.
  • the bottom surface of the opening part 166 has a structure in which the fifth insulating layer 152 , the first inorganic insulating layer 163 and the second inorganic insulating layer 165 are stacked above the third insulating layer 148 .
  • An area where the opening 166 part is arranged can also be called a “moisture blocking area” or a “moisture blocking structure” since it prevents moisture from entering the light emitting element 114 .
  • a third opening part 138 c is arranged in an area on the outer side of the first drive circuit 118 a . End parts of the fourth insulating layer 150 and the sixth insulating layer 156 arranged in an area of the first drive circuit 118 a are respectively arranged in an area which does not reach the third opening part 138 c .
  • the first insulating layer 140 , second insulating layer 144 , third insulating layer 148 , fifth insulating layer 152 , first inorganic insulating layer 163 and second inorganic insulating layer 165 extend to an area where the third opening part 138 c is arranged.
  • the fifth insulating layer 152 covers an end part of the fourth insulating layer 150
  • the first inorganic insulating layer 163 is arranged to cover an end part of the sixth insulating layer 156 .
  • the third opening part 138 c in an area on the outer side of the opening part 166 functioning as a moisture blocking area, it is possible to prevent the entrance of moisture into the display area 104 even if a through hole exposing the first surface of the substrate 102 is arranged. That is, in the third opening part 138 c , even if the first inorganic insulating layer 163 and the second inorganic insulating layer 165 functioning as a sealing layer are removed and a through hole is arranged to expose the first surface of the substrate 102 , it is possible to block the entrance of moisture into the display area 104 by the moisture blocking structure formed in the opening part 166 .
  • the third opening part 138 c includes a through hole 167 b which passes through a stacked body of the first insulating layer 140 , fifth insulating layer 152 , first inorganic insulating layer 163 and the second inorganic insulating layer 165 formed of a silicon nitride film, and a through hole 167 a which passes through a stacked body of the second insulating layer 144 and the third insulating layer 148 formed of a silicon oxide film.
  • an opening end of the through hole 167 b is arranged further to the interior than an opening end of the through hole 167 a .
  • the through hole 167 b formed in a silicon nitride film in the inner side of the through hole 167 a formed in the silicon oxide film so as to cover an opening side surface of the silicon oxide film with the silicon nitride film, it is possible to more effectively prevent moisture from entering the periphery area 106 and the display area 104 .
  • the two through holes can be manufactured by utilizing the difference in etching rates between the silicon oxide film and the silicon nitride film.
  • the first insulating layer 140 , second insulating layer 144 , third insulating layer, fourth insulating layer 150 , fifth insulating layer 152 , first inorganic insulating layer 163 and the second inorganic insulating layer 165 can be arranged in an area between the third opening part 138 c and an end part of the substrate 102 the same as first drive circuit 118 a .
  • wirings 130 a and 130 b can also be arranged in this area. That is, by arranging the third opening part 138 c at a position away from an end part of the substrate 102 , it is possible to effectively utilize the area between the third opening part 138 c and the end part of the substrate 102 as a wiring routing area.
  • FIG. 4 explains the third opening 138 c , other opening parts (first opening part 138 a , second opening part 138 b , fourth opening part 138 d ) have the same structure and exhibit the same operation and effects.
  • the flexible display device 100 by providing the opening part 138 passing through an inorganic insulating layer in an area where the curved part 136 which bends the substrate 102 intersects, it is possible to relieve stress applied to the wiring 130 and the sealing layer and it is possible to prevent the occurrence of defects.
  • a through hole 170 may be arranged passing through the substrate 102 .
  • a bottomed hole 171 in which the substrate 102 has been trimmed so as to overlap with the opening part 138 may be arranged.
  • the substrate 102 is thinned and therefore the substrate can be easily bent.
  • FIG. 7 shows a form in which the first inorganic insulating layer 163 and the second inorganic insulating layer 165 arranged above the sixth insulating layer 156 are removed.
  • the first curved part 136 a overlaps an area of the first drive circuit 118 a as is shown in FIG. 1 , by removing the inorganic insulating layer, it is possible to ensure that stress due to bending of the substrate 102 does not act on other areas of the inorganic insulating layer.
  • FIG. 7 shows a form in which the first inorganic insulating layer 163 and the second inorganic insulating layer 165 are removed in the periphery area 106 , the present invention is not limited to this form, and only the area above the first drive circuit 118 a may be selectively removed.
  • FIG. 8 shows a form in which a support member 172 is arranged on the second surface side of the substrate 102 in the display device 100 .
  • the support member 172 has a plate shape and has elasticity. By arranging such a support member 172 in close contact with the substrate 102 , it is possible to achieve substantial thickening of a substrate while maintaining flexibility. It is preferred that the support member 172 is arranged with a notch part 174 corresponding to the curved part 136 . By providing the notch part 174 in the support member 172 , it is possible to define a curved part since a part of the substrate thereof is substantially thinned compared with other areas. It is possible to arrange the notch part 174 in a direction along a first edge of the substrate 102 and a direction intersecting the first edge.
  • the opening part 138 By arranging the opening part 138 in an area where a notch part 174 a along a first edge and a notch part 174 b along a direction intersecting the first edge intersect with each other, the same effects as in the first embodiment and the second embodiment are obtained and it is possible to improve reliability of the display device 100 having flexibility.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
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CN112038385B (zh) 2023-12-22
JP2018063388A (ja) 2018-04-19
CN107958636A (zh) 2018-04-24
KR101970068B1 (ko) 2019-04-17
US20180108863A1 (en) 2018-04-19
TW201830359A (zh) 2018-08-16
JP6815159B2 (ja) 2021-01-20
CN112038385A (zh) 2020-12-04
CN107958636B (zh) 2020-10-16
TWI684169B (zh) 2020-02-01
US20190288238A1 (en) 2019-09-19
KR20180041569A (ko) 2018-04-24
US10658617B2 (en) 2020-05-19

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