US10149410B2 - Heat control device for power equipment - Google Patents

Heat control device for power equipment Download PDF

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Publication number
US10149410B2
US10149410B2 US14/653,121 US201314653121A US10149410B2 US 10149410 B2 US10149410 B2 US 10149410B2 US 201314653121 A US201314653121 A US 201314653121A US 10149410 B2 US10149410 B2 US 10149410B2
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Prior art keywords
heat
heat sink
dissipation
thermal insulation
conductive material
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US14/653,121
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English (en)
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US20150373878A1 (en
Inventor
Xijie Wu
Qinlian Bu
Guangying Xiao
Chunping Yu
Yuxiang Yang
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Accelink Technologies Co Ltd
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Accelink Technologies Co Ltd
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Assigned to ACCELINK TECHNOLOGIES CO., LTD. reassignment ACCELINK TECHNOLOGIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BU, Qinlian, WU, XIJIE, XIAO, Guangying, YANG, YUXIANG, YU, CHUNPING
Publication of US20150373878A1 publication Critical patent/US20150373878A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Embodiment of invention involves a heat dissipation control device for power equipment, in particular, a structural device in the communication field capable of heat dissipation at a high temperature and thermal insulation at a low temperature for power equipment.
  • the heat source and other devices of the power equipment has to work within a certain temperature range, whereas the ambient temperature of power equipment might could reach below zero or above 50° C.
  • the power equipment should demonstrate good performance in both thermal insulation at low temperature and heat dissipation at high temperature, so as to provide an effective and stable temperature mechanism for the heat source and other devices.
  • embodiment of invention provides a control device for communication power equipment, with functions of thermal insulation at low temperature and heat dissipation at high temperature.
  • a heat control device for power equipment comprises a heat source, a heat sink substrate, a thermal insulation layer, a dissipation heat sink and a thermal control switch, wherein the heat source is placed on and in contact with the dissipation heat sink, and bottom surface of the heat source is in direct lap joint with the heat sink substrate, wherein the thermal insulation layer is placed around the heat sink substrate, wherein the thermal control switch is placed on the heat sink substrate.
  • the thermal control switch is a high heat transfer performance element with varied heat conduction performances at high and low temperatures, wherein one end of the high heat transfer performance element contacts with the heat sink substrate, another end of high heat transfer performance element is embedded in the dissipation heat sink, and the thermal insulation layer is under the high heat transfer performance element, wherein the thermal insulation layer is made up of clearances and thermal insulation material filled within the clearances around the heat source, wherein the high heat transfer performance element is coated in the thermal insulation layer.
  • the thermal control switch comprises high heat-conductive material device and low heat-conductive material device, Wherein multiple low heat-conductive material devices are set between the heat sink substrate and the dissipation heat sink with a certain distance therebetween, wherein low heat-conductive material devices are in full lap joint contact with the heat sink substrate and the dissipation heat sink, wherein high heat-conductive material device is set among low heat-conductive material device, heat sink substrate and dissipation heat sink, wherein high heat-conductive material device contacts with dissipation heat sink, wherein the thermal insulation layer is made up of closed stagnant air layer between the heat sink substrate and the high heat-conductive material device.
  • the high heat transfer performance element comprises heat-conductive heat pipes or thermal columns.
  • the thermal insulation material comprises solid material with low thermal conductivity.
  • the heat control device for power equipment is characterized in that the thermal insulation material is filled gas with low thermal conductivity.
  • the heat control device for power equipment is characterized in that the gas with low thermal conductivity is air.
  • Embodiment of invention provides a heat control device for power equipment, which has good heat dissipation performance at high temperatures and good thermal insulation performance at low temperatures.
  • the heat control device of embodiment of invention is such a device that demonstrates excellent thermal insulation performance at low temperature, for key components or heat-sensitive components of power equipment.
  • the heat control device applying technical solutions described in embodiment of invention features easy manufacturing, low cost and reliable performance.
  • FIG. 1 is a vertical sectional drawing of structure of the First Embodiment of the Invention
  • FIG. 2 is a top view of structure of the First Embodiment of the Invention
  • FIG. 3 is a vertical sectional drawing of structure of the Second Embodiment of the Invention.
  • heat source 2 heat sink substrate 3: thermal insulation layer 4: dissipation heat sink 5: high heat-conductive material device 6: low heat-conductive 7: high heat transfer performance element material device
  • the temperature control device for power equipment of embodiment of the invention with functions of heat dissipation and thermal insulation comprises: heat sink substrate of heat source, thermal insulation structure, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with the dissipation heat sink, and bottom surface of the heat source is in direct lap joint with the heat sink substrate, the thermal insulation layer is set around the heat sink substrate, the thermal control switch is set on the heat sink substrate.
  • the heat source of the heat control device for power equipment of embodiment of the invention may be an optical module.
  • the control device for power equipment of embodiment of the invention has two embodiments of structural configuration.
  • the first embodiment is shown in FIG. 1 , comprising heat sink substrate 2 in contact with heat source 1 , thermal insulation layer 3 , dissipation heat sink 4 and thermal control switch, wherein the thermal control switch is a high heat transfer performance element 7 , wherein heat source 1 is placed on dissipation heat sink 4 , with bottom surface of the heat source 1 in direct lap joint with heat sink substrate ( 2 ), area around the heat source 1 is hollowed, and clearance is provided around the heat source 1 .
  • thermal insulation layer 3 is set in the clearance, that is, thermal insulation layer 3 is made up of thermal insulation material filled in the clearance around the heat source.
  • Thermal insulation material in this embodiment may be solid material with low thermal conductivity, or filled gas with low thermal conductivity, which is generally filled air.
  • Heat sink substrate 2 is in well contact with one end of the high heat transfer performance element 7 with thermal insulation layer 3 thereunder, and this end of the high heat transfer performance element 7 is coated with the thermal insulation layer 3 while another end is well embedded into dissipation heat sink 4 .
  • Thermal conductivity coefficient of the high heat transfer performance element 7 is very large at high temperature and decreases at low temperature. With its varying conductivity at high and low temperatures, it is possible for this device to realize desirable heat dissipation at high temperature and thermal insulation at low temperature.
  • the thermal control switch of this embodiment may be an element with high heat transfer performance, one type of which is heat-conductive heat pipe or thermal column Since working medium of the thermal conductivity of heat-conductive heat pipe or thermal column changes physically at high and low temperatures, and heat-conductive capacity of the thermal conductivity of heat-conductive heat pipe or thermal column changes differently at high and low temperatures, temperature variations of the heat source at high and low temperatures can be controlled to achieve fast heat dissipation at high temperature and thermal insulation at low temperature of the heat source.
  • heat generated by power consumption of the heat source 1 is quickly conducted to the heat sink substrate 2 of the heat source, which is in close lap joint with the high heat transfer performance element 7 , another end of which is well embedded into the dissipation heat sink ( 4 ).
  • heat generated by heat source 1 is quickly conducted to dissipation heat sink 4 , and the dissipation heat sink 4 has good heat dissipation performance to reduce the temperature of heat source 1 .
  • heat generated by power consumption of heat source 1 is conducted by the same heat-conductive path as above-described, wherein heat generated by power consumption of the heat source 1 is dissipated mainly by dissipation heat sink 4 .
  • heat source is coated by thermal insulation layer 3 and its generated heat can only be conducted through the high heat transfer performance element 7 .
  • working medium of the high heat transfer performance element 7 is solidified at low temperature, leading to lower thermal conductivity and lower heat conduction speed of the high heat transfer performance element 7 , so as to slow down the cooling rate of heat source 1 and realize the purpose of thermal insulation.
  • the target of thermal insulation for heat source 1 in this embodiment is achieved through reducing the thermal conductivity and conduction speed of the high heat transfer performance element 7 , slowing down the cooling rate of heat source 1 when the working medium of the high heat transfer performance element 7 is solidified at low temperature and high heat-conductive mechanism stops working.
  • the second embodiment is shown in FIG. 3 , comprising heat sink substrate 2 in contact with heat source 1 , thermal insulation layer 3 , dissipation heat sink 4 and thermal control switch, wherein the thermal control switch comprises high heat-conductive material device 5 and low heat-conductive material device 6 , wherein the bottom surface of the heat source 1 is in direct lap joint with heat sink substrate 2 , below which there are multiple low heat-conductive material devices 6 , wherein there is a dissipation heat sink 4 set below the low heat-conductive material devices 6 , wherein multiple low heat-conductive material devices 6 are set between heat sink substrate 2 and dissipation heat sink 4 with a certain distance therebetween, wherein low heat-conductive material devices 6 are in complete lap joint contact with heat sink substrate 2 of heat source and dissipation heat sink 4 , wherein high heat-conductive material device 5 is set among low heat-conductive material device 6 , heat sink substrate 2 and dissipation heat sink 4 , wherein high heat-conductive material device 5 contacts with dissipation heat sink 4
  • high heat-conductive material device 5 when the power equipment is working at high temperature, high heat-conductive material device 5 itself expands due to the high temperature and deforms to fill up the air layer and completely contacts with the heat sink substrate 2 of the heat source, thereby heat generated by power consumption of the heat source 1 is quickly conducted to dissipation heat sink 4 through high heat-conductive material device 5 , the heat of the heat source 1 is dissipated via the dissipation heat sink, so as to reduce the temperature of heat source 1 .
  • high heat-conductive material device 5 shrinks and deforms and detaches from heat sink substrate 2 of heat source to form a closed stagnant air layer, which functions as a thermal insulation layer.
  • Heat generated by power consumption of heat source 1 is conducted to dissipation heat sink 4 mainly through low heat-conductive material devices 6 and air layer, both of which have low thermal conductivity coefficient and poor conduction performance. As a result, the heat conduction speed of heat generated by power consumption of heat source 1 to dissipation heat sink 4 is very slow, satisfying the purpose of thermal insulation with the second embodiment.
  • thermal control switch involved in embodiment of invention is realized through the above-mentioned two embodiments, which comprise such components as a heat sink substrate in contact with a heat source, a thermal control switch, a dissipation heat sink, wherein the thermal control switch can be made up of high heat-conductive material device and low heat-conductive material device, or made up of high heat transfer performance element.
  • Thermal control heat-conductive material has high heat-conductivity at high temperature and low heat-conductivity at low temperature.
  • the thermal control switch When the power equipment operates at a high temperature, the thermal control switch is turned on, and heat energy from the heat source is transferred to dissipation heat sink through the high heat-conductive material device or high heat transfer performance element which is in high heat-conductivity performance. Dissipation heat sink dissipates heat and reduces the temperature of the heat source.
  • heat transfer path between the heat source and dissipation heat sink is formed from lap joint through low heat-conductive material structure, or the high heat transfer performance element which is in high heat-conductivity condition, while the thermal insulation layer can isolate or prevent heat transferring from heat source to the dissipation heat sink, so as to fulfill its function of thermal insulation for the heat source.
US14/653,121 2012-12-18 2013-03-28 Heat control device for power equipment Active 2033-10-04 US10149410B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201210551000 2012-12-18
CN201210551000.1 2012-12-18
CN201210551000.1A CN103002722B (zh) 2012-12-18 2012-12-18 一种功率设备的热控制装置
PCT/CN2013/073345 WO2014094395A1 (zh) 2012-12-18 2013-03-28 一种功率设备的热控制装置

Publications (2)

Publication Number Publication Date
US20150373878A1 US20150373878A1 (en) 2015-12-24
US10149410B2 true US10149410B2 (en) 2018-12-04

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US (1) US10149410B2 (zh)
EP (1) EP2938172B1 (zh)
CN (1) CN103002722B (zh)
WO (1) WO2014094395A1 (zh)

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CN111885895A (zh) * 2020-08-07 2020-11-03 珠海格力电器股份有限公司 散热器、散热方法、示教器和散热系统

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CN103002722B (zh) 2012-12-18 2015-03-25 武汉光迅科技股份有限公司 一种功率设备的热控制装置
CN104378955B (zh) * 2014-11-03 2018-02-06 广东美的制冷设备有限公司 隔热组件和电路板
CN104661495B (zh) * 2015-01-19 2018-01-30 太仓市兴港金属材料有限公司 一种插片式散热器
CN105611810A (zh) * 2016-03-11 2016-05-25 奇华光电（昆山）股份有限公司 一种人工石墨/局部隔热复合散热片
CN106028743B (zh) * 2016-06-07 2018-04-03 西北工业大学 集成功率驱动芯片散热保护装置
CN109360814B (zh) * 2018-09-29 2020-09-29 上海华虹宏力半导体制造有限公司 集成电路芯片的封装结构及其制造方法
CN112954831B (zh) * 2021-01-27 2022-08-09 浙江万森电热设备股份有限公司 一种防爆型电加热设备的控制装置
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN111885895A (zh) * 2020-08-07 2020-11-03 珠海格力电器股份有限公司 散热器、散热方法、示教器和散热系统

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Publication number Publication date
EP2938172A1 (en) 2015-10-28
CN103002722A (zh) 2013-03-27
EP2938172B1 (en) 2021-03-24
US20150373878A1 (en) 2015-12-24
CN103002722B (zh) 2015-03-25
EP2938172A4 (en) 2017-01-04
WO2014094395A1 (zh) 2014-06-26

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