TWM671671U - 雷射照射系統、雷射加工系統及曝光系統 - Google Patents

雷射照射系統、雷射加工系統及曝光系統 Download PDF

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Publication number
TWM671671U
TWM671671U TW113213355U TW113213355U TWM671671U TW M671671 U TWM671671 U TW M671671U TW 113213355 U TW113213355 U TW 113213355U TW 113213355 U TW113213355 U TW 113213355U TW M671671 U TWM671671 U TW M671671U
Authority
TW
Taiwan
Prior art keywords
mask
laser
optical functional
laser irradiation
irradiated object
Prior art date
Application number
TW113213355U
Other languages
English (en)
Chinese (zh)
Inventor
大谷義和
山岡裕
倉田昌実
宇佐美健人
Original Assignee
日商信越工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越工程股份有限公司 filed Critical 日商信越工程股份有限公司
Publication of TWM671671U publication Critical patent/TWM671671U/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW113213355U 2023-04-19 2024-04-18 雷射照射系統、雷射加工系統及曝光系統 TWM671671U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2023/015669 2023-04-19
PCT/JP2023/015669 WO2024218918A1 (ja) 2023-04-19 2023-04-19 レーザ照射装置、レーザ加工装置、レーザ加工方法、レーザ露光装置、レーザ露光方法、マスクの設置方法、レーザ加工装置の設置方法、レーザ露光装置の設置方法、マスク及びレーザ照射システム

Publications (1)

Publication Number Publication Date
TWM671671U true TWM671671U (zh) 2025-06-21

Family

ID=93152126

Family Applications (3)

Application Number Title Priority Date Filing Date
TW113213355U TWM671671U (zh) 2023-04-19 2024-04-18 雷射照射系統、雷射加工系統及曝光系統
TW113114410A TW202442360A (zh) 2023-04-19 2024-04-18 雷射照射裝置、雷射加工裝置、雷射加工方法、罩幕的設置方法、雷射加工裝置的設置方法、以及罩幕
TW113203851U TWM664974U (zh) 2023-04-19 2024-04-18 雷射照射系統以及雷射加工系統

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW113114410A TW202442360A (zh) 2023-04-19 2024-04-18 雷射照射裝置、雷射加工裝置、雷射加工方法、罩幕的設置方法、雷射加工裝置的設置方法、以及罩幕
TW113203851U TWM664974U (zh) 2023-04-19 2024-04-18 雷射照射系統以及雷射加工系統

Country Status (6)

Country Link
EP (1) EP4699733A1 (https=)
JP (2) JP7732128B2 (https=)
KR (1) KR20250166219A (https=)
CN (2) CN121001847A (https=)
TW (3) TWM671671U (https=)
WO (2) WO2024218918A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152567A (ja) * 1995-11-30 1997-06-10 Hitachi Ltd レジストパターン形成方法およびその装置
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP4884148B2 (ja) * 2005-09-28 2012-02-29 株式会社半導体エネルギー研究所 レーザー処理装置、露光装置及び露光方法
US20090305171A1 (en) * 2008-06-10 2009-12-10 Nikon Corporation Apparatus for scanning sites on a wafer along a short dimension of the sites
JP7393087B2 (ja) 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法
EP4375002A4 (en) * 2021-07-20 2025-07-09 Shinetsu Chemical Co SCANNING-TYPE REDUCTION PROJECTION OPTICAL SYSTEM AND LASER MACHINING APPARATUS USING SAME

Also Published As

Publication number Publication date
WO2024219462A1 (ja) 2024-10-24
JPWO2024219462A1 (https=) 2024-10-24
JP2025172782A (ja) 2025-11-26
CN222429562U (zh) 2025-02-07
EP4699733A1 (en) 2026-02-25
WO2024218918A1 (ja) 2024-10-24
TWM664974U (zh) 2025-01-01
CN121001847A (zh) 2025-11-21
TW202442360A (zh) 2024-11-01
KR20250166219A (ko) 2025-11-27
JP7732128B2 (ja) 2025-09-01

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