JP7732128B2 - レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク - Google Patents

レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク

Info

Publication number
JP7732128B2
JP7732128B2 JP2025505524A JP2025505524A JP7732128B2 JP 7732128 B2 JP7732128 B2 JP 7732128B2 JP 2025505524 A JP2025505524 A JP 2025505524A JP 2025505524 A JP2025505524 A JP 2025505524A JP 7732128 B2 JP7732128 B2 JP 7732128B2
Authority
JP
Japan
Prior art keywords
mask
laser
irradiation
optical function
function unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025505524A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024219462A1 (https=
Inventor
義和 大谷
裕 山岡
昌実 倉田
健人 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of JPWO2024219462A1 publication Critical patent/JPWO2024219462A1/ja
Priority to JP2025136648A priority Critical patent/JP2025172782A/ja
Application granted granted Critical
Publication of JP7732128B2 publication Critical patent/JP7732128B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2025505524A 2023-04-19 2024-04-18 レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク Active JP7732128B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025136648A JP2025172782A (ja) 2023-04-19 2025-08-20 レーザ照射装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2023/015669 WO2024218918A1 (ja) 2023-04-19 2023-04-19 レーザ照射装置、レーザ加工装置、レーザ加工方法、レーザ露光装置、レーザ露光方法、マスクの設置方法、レーザ加工装置の設置方法、レーザ露光装置の設置方法、マスク及びレーザ照射システム
JPPCT/JP2023/015669 2023-04-19
PCT/JP2024/015412 WO2024219462A1 (ja) 2023-04-19 2024-04-18 レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025136648A Division JP2025172782A (ja) 2023-04-19 2025-08-20 レーザ照射装置

Publications (2)

Publication Number Publication Date
JPWO2024219462A1 JPWO2024219462A1 (https=) 2024-10-24
JP7732128B2 true JP7732128B2 (ja) 2025-09-01

Family

ID=93152126

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025505524A Active JP7732128B2 (ja) 2023-04-19 2024-04-18 レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク
JP2025136648A Pending JP2025172782A (ja) 2023-04-19 2025-08-20 レーザ照射装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025136648A Pending JP2025172782A (ja) 2023-04-19 2025-08-20 レーザ照射装置

Country Status (6)

Country Link
EP (1) EP4699733A1 (https=)
JP (2) JP7732128B2 (https=)
KR (1) KR20250166219A (https=)
CN (2) CN121001847A (https=)
TW (3) TWM671671U (https=)
WO (2) WO2024218918A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122027A (ja) 2005-09-28 2007-05-17 Semiconductor Energy Lab Co Ltd レーザー処理装置、露光装置及び露光方法
US20090303454A1 (en) 2008-06-10 2009-12-10 Nikon Corporation Exposure apparatus with a scanning illumination beam
WO2023002555A1 (ja) 2021-07-20 2023-01-26 信越化学工業株式会社 走査型縮小投影光学系及びこれを用いたレーザ加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152567A (ja) * 1995-11-30 1997-06-10 Hitachi Ltd レジストパターン形成方法およびその装置
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP7393087B2 (ja) 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122027A (ja) 2005-09-28 2007-05-17 Semiconductor Energy Lab Co Ltd レーザー処理装置、露光装置及び露光方法
US20090303454A1 (en) 2008-06-10 2009-12-10 Nikon Corporation Exposure apparatus with a scanning illumination beam
WO2023002555A1 (ja) 2021-07-20 2023-01-26 信越化学工業株式会社 走査型縮小投影光学系及びこれを用いたレーザ加工装置

Also Published As

Publication number Publication date
WO2024219462A1 (ja) 2024-10-24
JPWO2024219462A1 (https=) 2024-10-24
JP2025172782A (ja) 2025-11-26
CN222429562U (zh) 2025-02-07
EP4699733A1 (en) 2026-02-25
WO2024218918A1 (ja) 2024-10-24
TWM664974U (zh) 2025-01-01
CN121001847A (zh) 2025-11-21
TWM671671U (zh) 2025-06-21
TW202442360A (zh) 2024-11-01
KR20250166219A (ko) 2025-11-27

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