CN121001847A - 激光照射装置、激光加工装置、激光加工方法、掩模的设置方法、激光加工装置的设置方法、以及掩模 - Google Patents

激光照射装置、激光加工装置、激光加工方法、掩模的设置方法、激光加工装置的设置方法、以及掩模

Info

Publication number
CN121001847A
CN121001847A CN202480025567.6A CN202480025567A CN121001847A CN 121001847 A CN121001847 A CN 121001847A CN 202480025567 A CN202480025567 A CN 202480025567A CN 121001847 A CN121001847 A CN 121001847A
Authority
CN
China
Prior art keywords
mask
laser
irradiation
laser irradiation
optical functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480025567.6A
Other languages
English (en)
Chinese (zh)
Inventor
大谷义和
山冈裕
仓田昌实
宇佐美健人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of CN121001847A publication Critical patent/CN121001847A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202480025567.6A 2023-04-19 2024-04-18 激光照射装置、激光加工装置、激光加工方法、掩模的设置方法、激光加工装置的设置方法、以及掩模 Pending CN121001847A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2023/015669 WO2024218918A1 (ja) 2023-04-19 2023-04-19 レーザ照射装置、レーザ加工装置、レーザ加工方法、レーザ露光装置、レーザ露光方法、マスクの設置方法、レーザ加工装置の設置方法、レーザ露光装置の設置方法、マスク及びレーザ照射システム
JPPCT/JP2023/015669 2023-04-19
PCT/JP2024/015412 WO2024219462A1 (ja) 2023-04-19 2024-04-18 レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク

Publications (1)

Publication Number Publication Date
CN121001847A true CN121001847A (zh) 2025-11-21

Family

ID=93152126

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202480025567.6A Pending CN121001847A (zh) 2023-04-19 2024-04-18 激光照射装置、激光加工装置、激光加工方法、掩模的设置方法、激光加工装置的设置方法、以及掩模
CN202420802967.0U Active CN222429562U (zh) 2023-04-19 2024-04-18 激光照射系统以及激光加工系统

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202420802967.0U Active CN222429562U (zh) 2023-04-19 2024-04-18 激光照射系统以及激光加工系统

Country Status (6)

Country Link
EP (1) EP4699733A1 (https=)
JP (2) JP7732128B2 (https=)
KR (1) KR20250166219A (https=)
CN (2) CN121001847A (https=)
TW (3) TWM671671U (https=)
WO (2) WO2024218918A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152567A (ja) * 1995-11-30 1997-06-10 Hitachi Ltd レジストパターン形成方法およびその装置
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP4884148B2 (ja) * 2005-09-28 2012-02-29 株式会社半導体エネルギー研究所 レーザー処理装置、露光装置及び露光方法
US20090305171A1 (en) * 2008-06-10 2009-12-10 Nikon Corporation Apparatus for scanning sites on a wafer along a short dimension of the sites
JP7393087B2 (ja) 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法
EP4375002A4 (en) * 2021-07-20 2025-07-09 Shinetsu Chemical Co SCANNING-TYPE REDUCTION PROJECTION OPTICAL SYSTEM AND LASER MACHINING APPARATUS USING SAME

Also Published As

Publication number Publication date
WO2024219462A1 (ja) 2024-10-24
JPWO2024219462A1 (https=) 2024-10-24
JP2025172782A (ja) 2025-11-26
CN222429562U (zh) 2025-02-07
EP4699733A1 (en) 2026-02-25
WO2024218918A1 (ja) 2024-10-24
TWM664974U (zh) 2025-01-01
TWM671671U (zh) 2025-06-21
TW202442360A (zh) 2024-11-01
KR20250166219A (ko) 2025-11-27
JP7732128B2 (ja) 2025-09-01

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