KR20250166219A - 레이저 조사 장치, 레이저 가공 장치, 레이저 가공 방법, 마스크의 설치 방법, 레이저 가공 장치의 설치 방법 및 마스크 - Google Patents

레이저 조사 장치, 레이저 가공 장치, 레이저 가공 방법, 마스크의 설치 방법, 레이저 가공 장치의 설치 방법 및 마스크

Info

Publication number
KR20250166219A
KR20250166219A KR1020257034357A KR20257034357A KR20250166219A KR 20250166219 A KR20250166219 A KR 20250166219A KR 1020257034357 A KR1020257034357 A KR 1020257034357A KR 20257034357 A KR20257034357 A KR 20257034357A KR 20250166219 A KR20250166219 A KR 20250166219A
Authority
KR
South Korea
Prior art keywords
mask
laser
optical function
irradiation
function unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257034357A
Other languages
English (en)
Korean (ko)
Inventor
요시카즈 오타니
히로시 야마오카
마사미 구라타
다케토 우사미
Original Assignee
신에츠 엔지니어링 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에츠 엔지니어링 가부시키가이샤 filed Critical 신에츠 엔지니어링 가부시키가이샤
Publication of KR20250166219A publication Critical patent/KR20250166219A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020257034357A 2023-04-19 2024-04-18 레이저 조사 장치, 레이저 가공 장치, 레이저 가공 방법, 마스크의 설치 방법, 레이저 가공 장치의 설치 방법 및 마스크 Pending KR20250166219A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2023/015669 WO2024218918A1 (ja) 2023-04-19 2023-04-19 レーザ照射装置、レーザ加工装置、レーザ加工方法、レーザ露光装置、レーザ露光方法、マスクの設置方法、レーザ加工装置の設置方法、レーザ露光装置の設置方法、マスク及びレーザ照射システム
JPPCT/JP2023/015669 2023-04-19
PCT/JP2024/015412 WO2024219462A1 (ja) 2023-04-19 2024-04-18 レーザ照射装置、レーザ加工装置、レーザ加工方法、マスクの設置方法、レーザ加工装置の設置方法及びマスク

Publications (1)

Publication Number Publication Date
KR20250166219A true KR20250166219A (ko) 2025-11-27

Family

ID=93152126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257034357A Pending KR20250166219A (ko) 2023-04-19 2024-04-18 레이저 조사 장치, 레이저 가공 장치, 레이저 가공 방법, 마스크의 설치 방법, 레이저 가공 장치의 설치 방법 및 마스크

Country Status (6)

Country Link
EP (1) EP4699733A1 (https=)
JP (2) JP7732128B2 (https=)
KR (1) KR20250166219A (https=)
CN (2) CN121001847A (https=)
TW (3) TWM671671U (https=)
WO (2) WO2024218918A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2021049560A (ja) 2019-09-26 2021-04-01 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152567A (ja) * 1995-11-30 1997-06-10 Hitachi Ltd レジストパターン形成方法およびその装置
JP4884148B2 (ja) * 2005-09-28 2012-02-29 株式会社半導体エネルギー研究所 レーザー処理装置、露光装置及び露光方法
US20090305171A1 (en) * 2008-06-10 2009-12-10 Nikon Corporation Apparatus for scanning sites on a wafer along a short dimension of the sites
EP4375002A4 (en) * 2021-07-20 2025-07-09 Shinetsu Chemical Co SCANNING-TYPE REDUCTION PROJECTION OPTICAL SYSTEM AND LASER MACHINING APPARATUS USING SAME

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2021049560A (ja) 2019-09-26 2021-04-01 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法

Also Published As

Publication number Publication date
WO2024219462A1 (ja) 2024-10-24
JPWO2024219462A1 (https=) 2024-10-24
JP2025172782A (ja) 2025-11-26
CN222429562U (zh) 2025-02-07
EP4699733A1 (en) 2026-02-25
WO2024218918A1 (ja) 2024-10-24
TWM664974U (zh) 2025-01-01
CN121001847A (zh) 2025-11-21
TWM671671U (zh) 2025-06-21
TW202442360A (zh) 2024-11-01
JP7732128B2 (ja) 2025-09-01

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