TWM561906U - Chip detection apparatus - Google Patents

Abstract

A wafer inspection device for solving problems such as difficulty in wafer inspection operations in the past. The wafer inspection apparatus of the present invention comprises: a base having a work platform; a detection module disposed on the base, the detection module having at least one camera facing the work platform; and a package module disposed on the base The susceptor has a thermal head movable to the working platform; wherein the working platform defines a conveying direction, the at least one camera is located at the front end of the conveying direction, and the thermal head is located at the The rear end of the conveying direction.

Description

Wafer inspection equipment

The present invention relates to a testing apparatus, and more particularly to a wafer detecting apparatus for detecting a wafer and repackaging the wafer carrier after the detecting.

In order to ensure the quality of the shipment, at present, after packaging a plurality of chips in a carrier tape, the carrier tape needs to be pulled by a screening device, and each wafer on the carrier tape is screened one by one to check whether it is a non-conforming product. Then rewind the carrier tape. When the screening device screens the defective wafer, the screening device pauses the scrolling of the carrier tape, and the operator partially tears the sealing film on the carrier tape to take out the defective wafer. After the wafers on the entire roll are aligned, the operator needs to move the carrier tape to a packaged device, reopening and rewinding the carrier tape to pull the carrier tape apart. The heat sealing is again performed for a period of time to seal the portion which was previously partially torn open and the vicinity thereof, so as to prevent the wafer in the carrier tape from falling out during the handling, resulting in loss.

However, since the above-mentioned comparison screening and resealing process requires the use of two different functions of the device, it not only occupies more space for setting and operating the device, but also needs to be reopened and retracted in the operation process. The carrier tape is twice, and the operator needs to move and reposition the carrier tape, etc., which also consumes a lot of work time and effort.

Moreover, since the partial sealing film is torn to take out the defective wafer, the sealing film at the same place cannot be heat-sealed to the carrier tape in the same equipment, so if a qualified wafer is re-inserted, the qualified wafer may be Will fall out before being repackaged by the packaged device; therefore, it is currently only allowed to leave a vacancy there, so that the number of wafers loaded on each roll of the tested tape is not necessarily the same. At the same time, additional notes are required, and the inventory needs to be counted one by one, which causes a lot of inconvenience and is necessary to improve.

In order to solve the above problems, the purpose of the present invention is to provide a wafer inspection apparatus which can perform the processes of comparison screening, replacement of defective products and re-sealing on the same equipment to reduce the setting and operation of the wafer inspection equipment. Space, and ease of operation and efficiency of the inspection process.

Another object of the present invention is to provide a wafer inspection apparatus capable of resealing a portion of the carrier tape on which the film is torn before winding the carrier tape, thereby enabling replacement of the wafer to complete the detection. The carrier tape will not leave a vacancy for non-conforming products.

The following directional or similar terms, such as "before", "after", "upper (top)", "lower", "inside", "outside", "side", etc. With reference to the orientation of the additional drawings, the directionality or its approximation is only used to assist in the description and understanding of the embodiments of the present invention, and is not intended to limit the present invention.

The wafer detecting device of the present invention comprises: a pedestal, the pedestal is provided with a working platform; and a detecting module is disposed on the pedestal, the detecting module having at least one camera facing the working platform; And a package module, the package module is disposed on the base, the package module has a thermal head movable to the work platform; wherein the work platform defines a transport direction, and the at least one camera is located The front end of the conveying direction, the thermal head is located at the rear end of the conveying direction.

According to this, the wafer testing equipment of the present invention can carry out the processes of comparison screening, replacement of non-conforming products and re-sealing on the same equipment, and can not only reduce the space required for setting and operating the equipment, but also pull only The process of detecting the wafer can be completed by opening and winding the tape once, so that the operator can save the time and effort required for moving and repositioning the carrier tape, thereby saving the equipment cost and improving the detection efficiency. .

In addition, the wafer inspection apparatus of the present invention can be loaded before the carrier tape is taken up. The portion where the sealing film is torn is resealed, so that the wafer can be replaced, and there is no fear that the replaced wafer will fall out during the process of winding or transporting the carrier tape; on the other hand, The detected carrier tape will not leave the vacancies of the non-conforming product, so that the number of wafers loaded on the tested carrier tape can be the same, so there is no need to additionally note the number of wafers, and it is not necessary to calculate the inventory one by one. Can greatly improve the convenience of storage or sales management.

The working platform is provided with a guiding slot, so that the working platform defines the conveying direction according to the extending direction of the guiding slot, and the top edge of the guiding slot is open; the at least one camera faces the guiding slot At the top edge, the thermal head can be controlled to move to the top edge of the guide trough. In this way, the structure is simple and easy to manufacture and assemble, and has the effects of reducing manufacturing cost and improving assembly convenience.

Wherein, the base can be provided with two reel positioning frames, the working platform is located between the two reel positioning frames, and the two reel positioning frames and the working platform are disposed along the conveying direction. In this way, it has the effect of improving the smoothness of the guide carrier tape.

The pedestal can be provided with two supporting guide wheels respectively located between the two reel locating frames and the working platform, and each of the supporting guiding wheels is higher than the adjacent reel locating frame. In this way, the carrier tape can maintain smoothness and is not easy to bend and lift, and has the effect of further improving the smoothness of the guide carrier tape.

Wherein, the highest tread of the two supporting guide wheels is preferably about the same height as the guiding groove. In this way, the carrier tape can be less easily rubbed to the end of the base or the working platform when penetrating or passing through the guide groove, and has the effects of reducing the probability of damage to the carrier tape or the wafer therein.

The wafer detecting apparatus of the present invention may further include a counting module disposed on the base, the counting module has a counting wheel and a limiting wheel, and the counting wheel can be controlled to partially remove the same The bottom end is moved into the guiding slot, and the limiting wheel is disposed at a top edge of the guiding slot and opposite to the counting wheel. In this way, the limit wheel can be used to restrict the carrier tape from being warped easily, and can be surely maintained in a state of being combined with the local portion of the counting wheel, thereby improving the accuracy of counting and the like.

The wafer detecting apparatus of the present invention may further comprise a marking module disposed on the base, the marking module having a marker movable to a top edge of the guiding slot, the marker being located at the camera and the heat Between the indenters. In this way, the marker can mark the defective wafer on the carrier tape, which can effectively reduce the probability of the operator changing the wrong wafer, and can also improve the replacement efficiency.

The marking module can have a fixing base and a moving base. The fixing base is coupled to the base, and the moving base is displaceably disposed on the fixing base, and the marking device is assembled to the moving base. In this way, the structure is simple and easy to manufacture and assemble, and has the effects of reducing manufacturing cost and improving assembly convenience.

Wherein, the marker can be, for example, a pen filled with ink, and the marking module has a cover seat coupled to the working platform; the movable seat controls the writing end of the marker to penetrate into the pen holder, or the mark The writing end of the device is detached from the pen holder and moved to the top edge of the guide slot. In this way, the pen holder can prevent the ink of the marker from evaporating, and has the effect of prolonging the life of the marker.

1‧‧‧Base

11‧‧‧Working platform

111‧‧‧Training trough

12‧‧‧Reel positioning frame

12a‧‧‧First reel positioning frame

12b‧‧‧Second reel locator

13‧‧‧Support guide wheel

13a‧‧‧First support guide wheel

13b‧‧‧Second support guide wheel

2‧‧‧Test module

21‧‧‧ camera

3‧‧‧Package Module

31‧‧‧Hot head

4‧‧‧Marking module

41‧‧‧Marker

42‧‧‧ fixed seat

43‧‧‧Mobile seat

44‧‧‧ pen holder

5‧‧‧ Counting Module

51‧‧‧ count wheel

52‧‧‧Limited wheel

C‧‧‧ wafer

D‧‧‧Transport direction

R‧‧‧ reel

T‧‧‧ carrier tape

Fig. 1 is a perspective view showing the structure of an embodiment of the present invention.

Fig. 2 is a plan view showing the structure of an embodiment of the present invention.

Fig. 3 is a schematic plan view showing the structure of a marking module according to an embodiment of the present invention.

Fig. 4 is a schematic view showing the implementation of the marking module of the embodiment of the present invention when the marker is lifted.

Fig. 5 is a schematic view showing the implementation of the marking module of the present embodiment when the marker is moved over the carrier tape.

Fig. 6 is a schematic view showing the implementation of the marking module of the embodiment of the present invention when marking the carrier tape.

Fig. 7 is a schematic view showing the implementation of an embodiment of the present invention when replacing a wafer.

To make the above and other purposes, features and advantages of this creation more obvious, DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Referring to Figures 1 and 2, which is an embodiment of the present wafer detecting apparatus, the wafer detecting apparatus substantially comprises A pedestal 1, a detection module 2 and a package module 3 are provided. The detection module 2 and the package module 3 are both disposed on the pedestal 1. The "wafer" described in the present invention may be an electronic component such as an integrated circuit (IC).

The pedestal 1 can be used for assembly and positioning of a plurality of components, and the shape of the susceptor 1 can be adjusted according to requirements, and is not limited to the form disclosed in the drawings. In the embodiment, the pedestal 1 is provided with a working platform 11 , and the working platform 11 is provided with a guiding slot 111 , so that the working platform 11 can define a conveying direction D according to the extending direction of the guiding slot 111 , and In this embodiment, the X direction of the susceptor 1 is defined according to the transport direction D; the work platform 11 is erected on the XY plane of the susceptor 1; the guide slot 111 is open at the top edge of the susceptor 1 in the Z direction. shape.

The pedestal 1 can be further provided with two reel positioning frames 12, and the working platform 11 is located between the two reel positioning frames 12; preferably, the two reel positioning frames 12 and the working platform 11 are transported along the same Direction D is set to improve the smoothness of the guide carrier tape T. According to this, a reel R that is wound with a carrier tape T to be detected can be erected on a reel locator 12 (hereinafter referred to as "the first reel locator 12a") that is closer to the front end of the conveying direction D, and The other reel R is mounted on a reel positioning frame 12 (hereinafter referred to as "second reel positioning frame 12b") which is closer to the rear end of the conveying direction D.

The pedestal 1 can also be provided with two support guide wheels 13 (hereinafter referred to as "first support guide wheels 13a" and "second support guide wheels 13b"), and the first support guide wheels 13a are located at the first reel locator 12a is between the work platform 11 and the first support guide wheel 13a is higher than the first reel locator 12a in the Z direction of the susceptor 1; similarly, the second support guide wheel 13b is located The second reel positioning frame 12b is interposed between the work platform 11, and the second support guide wheel 13b is higher than the second reel positioning frame 12b in the Z direction of the base 1. In this way, the carrier tape T can be pulled out from the reel R on the first reel positioning frame 12a, and abutted by the first supporting guide wheel 13a and then penetrated into the guiding slot 111 of the working platform 11; And after the carrier tape T passes through the guiding slot 111, The second supporting guide wheel 13b is abutted and supported by the reel R on the second reel positioning frame 12b, so that the carrier tape T can be kept smooth and not easily bent and lifted, thereby further improving the guiding. The smoothness of the carrier tape T. The highest wheel surface of the two supporting guide wheels 13 is about the same height as the guiding slot 111 in the Z direction of the base 1, so that the carrier tape T is inserted into or out of the guiding slot 111. It is not easy to rub against the end edge of the susceptor 1 or the work platform 11, and the probability of damage to the carrier tape T or the wafer C therein (indicated in Fig. 7) can be reduced.

Referring to FIGS. 1 and 7 , the detection module 2 has at least one camera 21 , and the at least one camera 21 is located at the front end of the transport direction D. The at least one camera 21 faces the top edge of the guiding slot 111 of the working platform 11 to capture each wafer C on the carrier tape T transported in the guiding slot 111 by the at least one camera 21, and images the image An interpretation unit (not shown) sent to the detection module 2 compares the image of each wafer C with a standard product to determine whether each wafer C is a good product; when the interpretation unit interprets the wafer C as In the case of a defective product, the carrier tape T is suspended for the purpose of replacing the wafer C (described later in detail).

The package module 3 has a thermal head 31 located at the rear end of the transport direction D. After the foregoing operation of replacing the wafer C is completed, the thermal head 31 can be controlled to be moved to the top edge of the guiding groove 111 of the working platform 11 for heat sealing the carrier tape T in the guiding groove 111. And leaving the top edge of the guiding slot 111 after completing the heat sealing action, to avoid affecting the transport of the carrier tape T.

In addition, the wafer inspection apparatus of the present invention preferably further includes a marking module 4 disposed on the base 1. The marking module 4 has a marker 41. When the detecting module 2 determines that there is a defective wafer C and stops transporting the carrier tape T, the marking device 41 can be controlled to move to the guiding platform of the working platform 11. The top edge of the feeding slot 111; at this time, the marker 41 is located between the camera 21 and the thermal head 31, so that the carrier tape T in the guiding slot 111 is marked by the marker 41, so that the operator The position of the defective tape C on the carrier tape T can be clearly seen. The marker 41 will leave the top edge of the guide slot 111 after the marking operation is completed, to avoid affecting the transport of the carrier tape T.

In more detail, please refer to FIG. 2 and FIG. 3 , the marking module 4 of the embodiment may further include a fixing base 42 and a moving seat 43 . The fixing base 42 is coupled to the base 1 , and the moving seat 43 can be Displaceably disposed on the fixed seat 42 , the marker 41 is assembled to the movable seat 43 to drive the marker 41 to be displaced in the Z direction or the Y direction relative to the fixed seat 42 by the movable seat 43 . For example, but not limited to, the marker 41 of the present embodiment may be selected as a pen filled with ink, and the marker module 4 may be additionally provided with a cover holder 44 coupled to the work platform 11. When the marker 41 is not used, the movable seat 43 can control the writing end of the marker 41 to penetrate into the pen holder 44, and the pen holder 44 prevents the ink of the marker 41 from evaporating to extend the marker. When the marker 41 is to be used, the marker 41 is driven by the movable seat 43 to disengage the writing end of the marker 41 from the pen holder 44.

Moreover, the wafer detecting apparatus of the present invention may further include a counting module 5 provided on the susceptor 1. The counting module 5 has a counting wheel 51 and a limiting wheel 52. The counting wheel 51 can be controlled to move a part of the counting wheel 51 from the bottom end into the guiding slot 111, so that the counting wheel 51 can be partially In conjunction with the carrier tape T, the digitizing wheel 51 is synchronously rotated while the carrier tape T is being conveyed, and the length of the carrier tape T is calculated by the counting wheel 51. On the other hand, the limit wheel 52 is disposed on the top edge of the guide groove 111 and faces the counting wheel 51. The limit wheel 52 restricts the carrier tape T from being easily warped and can be surely counted. The local portion of the wheel 51 maintains the combined state, achieving the effect of improving the accuracy of the count.

Referring to the first and second figures, according to the foregoing structure, the operator can pull out one end of the to-be-detected carrier tape T that is mounted on the first reel positioning frame 12a, and penetrates from the front end of the guiding slot 111. Then, it is pulled out from the rear end of the guiding groove 111 and fixed to the reel R on the second reel positioning frame 12b. The portion of the counter wheel 51 is continuously controlled to penetrate the guide groove 111 to bond the carrier tape T. Then, the carrier tape T is continuously displaced in the guiding groove 111 along the conveying direction D, so that each of the carriers C in the carrier tape T can be passed through the camera 21 of the detecting module 2 Intercepting the image; when the detecting module 2 interprets the unqualified wafer C, the carrier tape T will pause shift.

Referring to FIGS. 3 and 4, after the carrier tape T is temporarily displaced, the moving seat 43 of the marking module 4 can first drive the marker 41 to be displaced upward in the Z direction relative to the fixing base 42 to make the marker. The writing end of 41 is detached from the pen holder 44. Continuing to refer to FIG. 5, the moving seat 43 can further displace the marker 41 in the Y direction relative to the fixing base 42 to move the writing end of the marker 41 to the guiding slot 111 of the working platform 11. . Then, as shown in FIG. 6, the marker 41 is further displaced downward relative to the holder 42 in the Z direction by the movable seat 43 so that the writing end of the marker 41 can contact the carrier tape T, thereby A mark is made on the carrier tape T corresponding to the defective wafer C. Finally, the movable seat 43 drives the marker 41 to operate in reverse, so that the marker 41 can return to the initial position shown in FIG.

Referring to Figures 1 and 7, the operator can partially tear the sealing film on the carrier tape T, take out the defective wafer C, and place a qualified wafer C into the vacancy. The operator controls the carrier tape T to continue to be displaced in the guide slot 111 along the transport direction D. In this case, since the marking module 4 can clearly mark the position of the defective wafer C on the carrier tape T, the probability of the operator changing the wrong wafer C can be effectively reduced, and the replacement efficiency can be improved.

When the carrier tape T is displaced to the package module 3 at the replacement of the wafer C, the carrier tape T will be temporarily suspended again to be controlled by the package module 3 to move the thermal head 31 to the working platform. The top edge of the guide groove 111 of the 11 is heat-sealed to the carrier tape T in the guide groove 111, and the range of the heat sealing pressure covers the above-mentioned replaced wafer C and a plurality of wafers C before and after it. As a result, the sealing film partially torn by the operation of replacing the wafer C can be reliably bonded to the carrier tape T, thereby ensuring that the wafer C on the carrier tape T does not fall out.

After the carrier tape T is heat-sealed again by the package module 3, the carrier tape T can continue to be displaced in the guiding slot 111 along the conveying direction D, and the carrier tape T moves out of the guiding slot 111. Then, it can be taken up by the reel R fixed to the second reel positioning frame 12b.

In summary, the wafer inspection equipment of the present invention can carry out the processes of comparison screening, replacement of non-conforming products and re-sealing on the same equipment, which can not only reduce the space required for setting and operating the equipment, but also only It is necessary to open and roll the tape once to complete the process of detecting the wafer, so that the operator can save the time and effort required for moving and repositioning the carrier tape, thereby saving equipment cost and improving detection efficiency. And other effects.

In addition, the wafer inspection apparatus of the present invention can re-seal the portion where the sealing film is torn off before the carrier tape is taken up, so that the wafer replacement operation can be performed without worrying about replacing the inserted wafer. It will fall out during the process of winding up or transporting the carrier tape; on the other hand, it can also make the tested carrier tape not leave vacancies of non-conforming products, so that the wafer loaded on each tape of the tested tape is loaded. The quantity can be consistent, so there is no need to additionally note the number of wafers, and it is not necessary to calculate the inventory one by one when shipping, which can greatly improve the convenience of storage or sales management.

Although the present invention has been disclosed by the above-described preferred embodiments, it is not intended to limit the present invention, and it is still within the spirit and scope of the present invention to make various changes and modifications to the above embodiments. The technical scope of the protection is created, so the scope of protection of this creation is subject to the definition of the patent application scope attached.

Claims (9)

A wafer testing device comprising: a pedestal, the pedestal is provided with a working platform; a detecting module, the detecting module is disposed on the pedestal, the detecting module has at least one camera facing the working platform; and a a package module, the package module is disposed on the base, the package module has a thermal head movable to the work platform; wherein the work platform defines a transport direction, and the at least one camera is located at the transport The front end of the direction, the thermal head is located at the rear end of the conveying direction. The wafer inspection device of claim 1, wherein the working platform is provided with a guiding slot, so that the working platform defines the conveying direction according to the extending direction of the guiding slot, and the top edge of the guiding slot is Open at least; the at least one camera faces the top edge of the guiding slot, and the thermal head can be controlled to move to the top edge of the guiding slot. The wafer inspection apparatus of claim 2, wherein the base is provided with a two reel positioning frame, the working platform is located between the two reel positioning frames, and the two reel positioning frame and the operation The platform is arranged along the conveying direction. The wafer inspection apparatus of claim 3, wherein the base is provided with two supporting guide wheels, and the two supporting guide wheels are respectively located between the two reel positioning brackets and the working platform, and each of the supports The guide wheel is higher than the adjacent reel locator. The wafer inspection apparatus of claim 4, wherein the highest tread of the two supporting guide wheels is at the same height as the guiding groove. The wafer inspection device of claim 2, further comprising a counting module disposed on the base, the counting module having a counting wheel and a limiting wheel, the counting wheel being Controlling and moving it partially from the bottom end into the guiding slot, the limiting wheel is disposed at the top edge of the guiding slot and opposite to the counting wheel. The wafer inspection apparatus according to any one of claims 2 to 6, further comprising a marking module disposed on the base, the marking module having a mark movable to a top edge of the guiding slot The marker is located between the camera and the thermal head. The wafer inspection device of claim 7, wherein the marking module has a fixing base and a moving base, the fixing base is coupled to the base, and the movable seat is displaceably disposed on the fixing base. The marker is assembled to the mobile seat. The wafer inspection device of claim 8, wherein the marker is a pen filled with ink, the marker module having a cover coupled to the work platform; the movable seat controls the writing end of the marker The pen holder is inserted into the holder or the writing end of the marker is detached from the holder and moved to the top edge of the guide slot.