JP2007214385A - Tape punching device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape punching device which enables an electronic component mounting film to be obtained by travelling and punching a tape in its stable state. <P>SOLUTION: In the device, a COF4 is punched from a long tape 1. It has a supply reel 12 for supplying the tape 1; a pulling roll 16 for pulling the tape 1 hanging from the supply reel 12; a sprocket 18 for travelling the tape 1 intermittently; and a punching die 24 which is disposed between a lowermost point of the hanging tape 1 and the pulling roll 16, and punches the COF4 from the tape 1 travelling almost in a vertical direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a tape punching device for punching an electronic component mounting film used in a liquid crystal display device or the like.

  In recent liquid crystal display devices, electronic component mounting films such as TAB (Tape Automated Bonding), TCP (Tape Carrier Package), and COF (Chip On Film) are used for ICs mounted on an array substrate or the like. .

This electronic component mounting film is manufactured by attaching a chip such as an IC to a long tape in advance at predetermined intervals and punching it with a punching device (see, for example, Patent Document 1).
JP 2004-291102 A

  In the conventional tape punching apparatus as described above, the tape for punching the electronic component mounting film is positioned horizontally between the pair of fixed rolls.

  By the way, in recent liquid crystal display devices, instead of TCP, COFs that can be more narrowed and shrunk in IC chips and can be easily bent are becoming mainstream. However, since COF has a thinner tape than TCP, deformation of the tape after punching becomes more prominent and there is a problem that it is difficult to transport the tape.

  In view of the above problems, an object of the present invention is to provide a tape punching device capable of obtaining an electronic component mounting film by running and punching a tape in a stable state.

  The present invention relates to a tape punching device for punching an electronic component mounting film from a long tape on which electronic components such as IC chips are attached at predetermined intervals, the supply reel supplying the tape, and the supply reel A pulling roll for pulling up the tape that has been suspended; a sprocket for intermittently running the tape; and a tape disposed between the pulling rolls from the lowest point of the tape that has been drooped and traveling in a substantially vertical direction from the tape. A tape punching device having a punching die for punching a component mounting film.

  According to the present invention, since the tape tension due to the weight of the tape that hangs down is only applied at the time of punching, the tape tension is always constant, and deformation or the like does not occur in the punched electronic component mounting film.

  Hereinafter, a tape punching device 10 according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a plan view of a film carrier tape (hereinafter simply referred to as a tape) 1 for mounting electronic components. An IC chip 2 is attached to the tape 1 at predetermined intervals, and conveying sprocket holes 3 are opened at both ends of the tape 1 at predetermined intervals. The COF 4 is formed by punching out a rectangular dotted line portion by the tape punching device 10.

  FIG. 2 is an explanatory diagram of the tape punching device 10.

  The tape 1 described above is wound around a supply reel 12 together with a long spacer 5. The tape 1 and the spacer 5 wound around the supply reel 12 are supplied downward, and only the spacer 5 is taken up by the spacer take-up roll 14. On the other hand, the tape 1 hanging down is pulled up by a pulling roll 16 after hanging down by 20 to 30 cm. The tape 1 is turned in a substantially horizontal direction by the pulling roll 16 and reaches a winding roll 20 through a driving sprocket 18.

  The drive sprocket 18 is driven by a motor 22 and causes the tape 1 to run intermittently. The drive sprocket 18 meshes with the sprocket holes 3 at both ends of the tape 1 to run the tape 1.

  A punching die 24 is provided between the position of the lowest point of the tape 1 that hangs down and the pulling roll 16. This punching die 24 has a punching base 26 and a punching blade 28, and the punching blade 28 obtains the punched COF 4 in a state where the tape 1 running almost vertically is received by the punching base 26. Further, a guide roll 30 for guiding the tape 1 is provided between the lowest point of the tape 1 and the punching table 26.

  Further, a suction device 34 is provided that sucks the COF 4 punched by the punching die 24 and transports it to the horizontal table 32.

  Further, an upper limit sensor 36, a stop sensor 38, and a lower limit sensor 40 are provided near the lowest point of the tape 1. Each sensor 36, 38, 40 comprises a light emitting portion and a light receiving portion, respectively, and detects the position of the tape 1 depending on whether the light receiving portion receives light from the light emitting portion or is blocked. The role of each sensor 36, 38, 40 will be described later.

  Next, the operation state of the tape punching device 10 will be described.

  In the first step, the tape 1 is supplied from the supply reel 12, and the supply reel 12 is rotated until the stop sensor 38 detects the tape 1. In this case, if the tape 1 is supplied excessively and the light receiving portion of the lower limit sensor 40 is shielded from light, the driving sprocket 18 is rotated to slightly lift the tape 1 that has dropped.

  In the second step, the driving sprocket 18 is rotated and stopped so that the IC chip 2 of the tape 1 is positioned at the center of the punching hole of the punching table 26.

  In the third step, the pulling roll 16 and the guide roll 30 are moved to the right side in FIG. 2 so that the tape 1 is in close contact with the punching table 26.

  In the fourth step, the tape 1 that is in close contact with the punching table 26 is punched with the punching blade 28 to obtain the COF 4. The remaining tape 1 after being punched is taken up by a take-up roll 20.

  In the fifth step, the punched COF 4 is vacuum-sucked by the suction device 34.

  In the sixth step, the suction device 34 that vacuum-sucks the COF 4 is rotated counterclockwise, and the COF 4 is placed on the horizontal table 32 (in the state of the dotted line in FIG. 2). To release. On the other hand, the table 32 fixes the COF 4 by vacuum suction.

  In the seventh step, the COF 4 adsorbed on the table 32 is transported by a transport robot in order to attach it to the array substrate of the liquid crystal display device.

  In the eighth step, the first to seventh steps are repeated until the light receiving portion of the upper limit sensor 36 receives light from the light emitting portion. That is, only the drive sprocket 18 is intermittently rotated without rotating the supply reel 12 by the distance from the stop sensor 38 to the upper limit sensor 36, the tape 1 is pulled up, and the COFs 4 are punched in order.

  In the ninth step, when the light receiving portion of the upper limit sensor 36 receives light, the tape 1 that has been hung down is positioned above the position of the upper limit sensor 36 and the supply reel 12 is rotated again to supply the tape 1. Then, the tape 1 is allowed to hang down to the stop sensor 38. Thereafter, the above steps are repeated.

  In the tape punching device 10 having the above-described configuration, when the COF 4 is punched by the punching die 24, the tape 1 hangs down by its own weight, and the tape tension is determined by its own weight. 1 can be carried out. In this case, since the COF 4 can be punched without contact without contacting the guide roll 30 until the tape 1 is punched, the IC chip 2 or the like is not defective. In addition, since the COF 4 is punched out with a low tape tension and the same tape tension, the COF 4 is not deformed and no defect or the like occurs.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist thereof.

  For example, in the above-described embodiment, the case where the COF is punched as the electronic component mounting film has been described.

It is a top view of the tape which shows one Embodiment of this invention. It is explanatory drawing of a tape punching apparatus similarly.

Explanation of symbols

1 Tape 2 IC chip 3 Sprocket hole 4 COF
DESCRIPTION OF SYMBOLS 5 Spacer 10 Tape punching device 12 Supply reel 14 Spacer winding roll 16 Lifting roll 18 Drive sprocket 20 Winding roll 22 Motor 24 Punching part 26 Punching stand 28 Punching blade 30 Guide roll 32 Table 34 Suction device 36 Upper limit sensor 38 Stop sensor 40 Lower limit sensor

Claims (6)

A tape punching device for punching an electronic component mounting film from a long tape to which electronic components such as IC chips are attached at predetermined intervals,
A supply reel for supplying the tape;
A pulling roll for pulling up the tape hanging from the supply reel;
A sprocket that intermittently runs the tape;
A die for punching the electronic component mounting film from the tape that is disposed between the pulling rolls from the lowest point of the hanging tape and that runs in a substantially vertical direction;
A tape punching device characterized by comprising: The tape punching device according to claim 1, further comprising a guide roll for guiding the tape traveling in the substantially vertical direction between the punching die and the lowest point of the hanging tape. The punching die is
A punching table for receiving the tape running in the substantially vertical direction;
A punching blade that moves in a substantially horizontal direction with respect to the punching table and punches the electronic component mounting film from the tape located on the punching table;
Have
The tape punching device according to claim 2, wherein the pulling roll and the guide roll move in a substantially horizontal direction in synchronization with the punching blade. The tape punching device according to claim 1, further comprising a lowest point detecting unit that detects a lowest point of the hanging tape. The tape punching device according to claim 1, further comprising suction means for sucking the punched electronic component mounting film and moving it onto a horizontal table. The tape punching apparatus according to claim 1, wherein the electronic component mounting film is COF.

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