TWI634338B - Hybrid ic detection device - Google Patents

Abstract

A composite IC detecting device for solving the problem that it is impossible to detect wafers, trays, tapes and the like of different carrying methods. The system includes: a substrate controlled by a first driving member to move along the X axis; a platform disposed above the substrate, controlled by a second driving member to move along the Y axis, the substrate and the platform a ring hole is disposed along a Z-axis; a ring seat is disposed above the platform, and has a ring hole communicating with the through hole. The ring hole has a bearing ring above the ring hole, and the inner bottom of the ring has a light-transmitting plate An outer ring is disposed on an outer edge of the carrier ring, and an outer edge of the outer ring has a clamp, and two ends of the clamp have two reel positioning frames; and a detecting module has a first lens The Z axis moves movably from above the ring seat toward the ring seat, and a second lens is movable from the underside of the ring seat toward the ring seat in the Z-axis.

Description

Composite IC detecting device

The present invention relates to a composite IC detecting device, and more particularly to a composite IC detecting device capable of detecting wafers, trays, tapes, and tapes (Tape-On-Reel) in different carrying modes.

The integrated circuit (IC) is the most important component of electronic information products. It integrates circuit components such as transistors, resistors, capacitors and diodes into a device. The manufacturing process is complicated. The steps from round design to wafer package have cumbersome inspections and tests. Therefore, the wafers have different types of wafers, trays, and tapes (Tape-On-Reel) depending on their needs and manufacturing processes.

However, different types of wafers require different carrier modes, and different carrier modes need to be detected by different composite IC detection devices, which leads to sufficient space for the existing IC process to display different composite IC detections. The device is tested for different types of wafers.

In view of this, the existing composite IC detecting device does have a need for improvement.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a composite IC detecting device which can detect a wafer, a tray (Tray), a tape (Tape-On-Reel), or the like in a different carrying manner.

The following directionality or its similar terms, such as "before", "after", "upper (top)", "lower", "inside", "outside", "side", etc. With reference to the orientation of the additional drawings, the directionality or its approximation is only used to assist in the explanation and understanding of the embodiments of the present invention. In addition, the X-axis, the Y-axis and the Z-axis of the present invention are at right angles. The three axes (X-axis, Y-axis, and Z-axis) that are perpendicular to each other in the coordinate system are set and are not intended to limit the present invention.

The composite IC detecting device of the present invention comprises: a substrate having a first guiding block slidably coupled to a first guiding rod, the first guiding rod is disposed along an X-axis In a plane, the first guiding rod can be driven by a first driving member to control the substrate to move along the X-axis by the first driving member; a platform having a second guiding block, the second guiding The block is slidably coupled to a second guide rod disposed on the substrate along the Y-axis, the second guide rod being drivable by a second drive member to be driven by the second drive The member controls the platform to move along the Y-axis, the substrate and the platform have a through hole together along a Z-axis; a ring seat is disposed above the platform, the ring seat has a ring hole along the Z-axis, the ring hole The outer ring has a carrier ring, and the inner bottom of the ring has a light-transmitting plate. The ring seat further supports an outer ring, and the outer ring is disposed outside the carrier ring. The outer edge of the outer ring has a clamp, and the clamp has two reels at both ends in a conveying direction And a detection module having a first lens and a second lens facing the ring seat, the first lens being located above the ring seat by a first seat rail movable along the Z axis The second lens is located below the ring seat by a second seat rail in the through hole so as to be movable along the Z axis.

Accordingly, the composite IC detecting device of the present invention can transmit wafers, trays and tapes (Tape-On) via different carrying modes by moving the substrate and the platform in the X and Y axes. A wafer such as -Reel) can share a lens located in the Z-axis. As described above, the composite IC detecting device of the present invention has a function of detecting a wafer of a different carrying type.

Wherein the substrate has at least one first slider, and the at least one first slider is Slidably coupled to at least one first slide rail, the at least one first slide rail is disposed on a plane along the X-axis. As such, there is an effect that the substrate can be stably moved in the X-axis direction.

The platform has at least one second slider, the at least one second slider is slidably coupled to the at least one second slide rail, and the at least one second slide rail is disposed on the substrate along the Y-axis. As such, there may be an effect of allowing the platform to move stably along the Y-axis.

Wherein, the ring wall forming the ring hole has at least one support member supported by the at least one support member above the ring hole. In this way, the upward pushing force can be provided from below the carrier ring by the at least one support member to prevent the wafer from slacking downward.

The inner edge of the outer ring has a positioning member that can protrude toward the carrier ring. In this way, the protruding distance of the positioning member can be adjusted according to the size of the wafer to sandwich the wafer, thereby having the effect that the wafer can be fixed to the carrier ring.

Wherein, the first lens is an infrared camera. As such, it is possible to have an effect of photographing the wafer or the wafer on the web.

Wherein, the second lens is a marker or a locator. As such, there may be an effect to mark or position the wafer of the ring.

Wherein, the clamp is adjacent to an outer edge of the outer ring along the X-axis. As such, the effect can be moved to the underside of the first lens by controlling the substrate to move along the X-axis.

Wherein the clamp is adjacent to the outer edge of the outer ring along the Y axis. As such, the effect can be moved to the underside of the first lens by controlling the platform to move along the Y axis.

〔this invention〕

1‧‧‧Substrate

11‧‧‧First guide block

12‧‧‧First guide

13‧‧‧First drive member

14‧‧‧First slider

15‧‧‧First slide rail

2‧‧‧ platform

21‧‧‧Second guide block

22‧‧‧Second guide

23‧‧‧Second drive member

24‧‧‧second slider

25‧‧‧Second rail

3‧‧‧ ring seat

31‧‧‧ ring hole

32‧‧‧Circle

33‧‧‧Support

34‧‧‧ Carrying ring

35‧‧‧light board

36‧‧‧Outer Ring

37‧‧‧ Positioning parts

38‧‧‧Clamp

39‧‧‧Reel positioning frame

4‧‧‧Test module

41‧‧‧ first shot

42‧‧‧First track

43‧‧‧ Positioning frame

44‧‧‧second lens

45‧‧‧Second rail

F‧‧‧ plane

W‧‧‧ wafer

R‧‧‧Reel

H‧‧‧through hole

T‧‧‧Tray

Figure 1 is a perspective view of a preferred embodiment of the present invention.

Figure 2 is a plan view of a preferred embodiment of the invention.

Figure 3: Front view of a preferred embodiment of the invention applied to wafer inspection.

Figure 4 is a front elevational view of a preferred embodiment of the invention applied to tray inspection.

Figure 5 is a front elevational view of a preferred embodiment of the present invention applied to tape take-up detection.

The above and other objects, features and advantages of the present invention will become more <RTIgt; It is a preferred embodiment of the composite IC detecting device of the present invention. The detecting device has three axes of X, Y and Z at right angles to each other, and the detecting device comprises a substrate 1, a platform 2, a ring seat 3 and a The detecting module 4 is disposed above the substrate 1 , and the ring seat 3 is disposed above the platform 2 , and the detecting module 4 faces the ring seat 3 .

The substrate 1 can have a first guiding block 11 slidably coupled to a first guiding rod 12, and the first guiding rod 12 is disposed on a plane F along the X-axis. The plane F can be a ground or a table top, etc., and the present invention is not limited. The first guiding rod 12 can be driven by a first driving member 13 to control the substrate 1 to move along the X-axis. In this embodiment, the substrate 1 can also have at least one first slider 14 slidably coupled to at least one first rail 15 , the at least one first rail 15 The substrate F is disposed along the X-axis, so that the at least one first slider 14 can carry the substrate 1 together with the first guiding block 11 so that the substrate 1 can be stably along the X-axis. mobile.

The platform 2 can have a second guiding block 21 slidably coupled to a second guiding rod 22, and the second guiding rod 22 is disposed on the substrate 1 along the Y axis. The second guide 22 is drivable by a second drive member 23 to control the movement of the substrate 1 in the Y-axis. In this embodiment, the platform 2 can further have at least one second slider 24 slidably coupled to the at least one second slide rail 25, the at least one second slide rail 25 The substrate 1 is disposed along the Y-axis. Thus, the at least one second slider 24 can carry the platform 2 together with the second guiding block 21, so that the platform 2 can be stably along the Y-axis. mobile.

Referring to FIG. 3 together, the ring seat 3 is disposed above the platform 2, and the ring seat 3 can have a ring hole 31 disposed along the Z-axis, and the ring wall 32 forming the ring hole 31 has at least one support. The at least one support member 33 is configured to support a carrier ring 34 above the ring hole 31. When a wafer W is carried on the carrier ring 34, the at least one support member 33 can be supported from the carrier ring The force of the upward pushing is provided on the bottom of the 34 to prevent the wafer W from being loosened downward. The inner bottom of the ring of the bearing ring 34 further has a light-transmitting plate 35, which may be glass, light-transmitting material, etc. Light transmissive material. In addition, the ring seat 3 can also support an outer ring 36, and the outer ring 36 is disposed on the outer edge of the carrier ring 34. The inner edge of the outer ring 36 can have a positioning member 37. The positioning member 37 And protruding from the center of the outer ring 36 to adjust the protruding distance according to the size of the wafer W by the positioning member 37, and forming a state of clamping the wafer W with the at least one supporting member 33, so that The wafer W may be fixed to the carrier ring 34; the outer edge of the outer ring 36 may have a clamp 38, and the clamp 38 may have two reel positioning frames 39 at both ends in a conveying direction, the two rolls A wheel locator 39 can be used to erect a reel R, respectively.

The detecting module 4 can have a first lens 41 that is movably coupled to a first seat rail 42 along the Z-axis. The first rail 42 can be erected by a positioning frame 43. Above the ring seat 3, for example, the first lens 41 can be an infrared camera for photographing the wafer W or the wafer on the tape R from above the ring seat 3 to further The wafer W or the wafer on the tape R is inspected. In addition, the detecting module 4 can also have a second lens 44 that is movably coupled to a second seat rail 45 along the Z-axis. The second rail 45 can be disposed on the second lens rail 45. The plane F and the second lens 44 are directly opposite to the first lens 41. For example, the second lens 44 can be a marker or a positioner for the ring from below the ring seat 3. The wafer of the pad 3 is marked or positioned.

Referring to FIG. 3, when the composite IC detecting device of the present invention is applied to detecting the wafer W of the carrier ring 32, the movement of the substrate 1 and the platform 2 in the X and Y axes is controlled, and Controlling the movement of the first lens 41 and the second lens 44 in the Z axis The substrate W and the second lens 44 are disposed on the first lens 41 and the second lens 44. The substrate 1 and the platform 2 have a through hole H, and the through hole H and the ring hole of the ring 3 The through hole H is used for the second lens 44 to extend, so that the second lens 44 can move along the Z axis under the ring seat 3, and the light transmissive plate 35 is permeable to light. Therefore, the second lens 44 can act on the wafer W from below the wafer W.

Referring to FIG. 4, the composite IC detecting device of the present invention can also carry a tray T by the transparent plate 35, so that the tray T can be located on the first lens 41, so that the composite of the present invention can be The IC detecting device can be applied to detect a wafer on the tray T. It is noted that the second lens 44 can be moved outside the through hole H by controlling the movement of the second lens 44 along the Z axis toward the plane F to avoid obstructing the substrate 1 and the platform 2 The movement.

Referring to FIG. 5, when the composite IC detecting device of the present invention is applied to detect a wafer on the tape reel, the second lens 44 is located outside the through hole H, so that the jig 38 can be controlled by the The substrate 1 or the platform 2 is moved to move under the first lens 41. In this embodiment, the clamp 38 can be disposed along the X-axis at the outer edge of the outer ring 36, so that it can be controlled by The substrate 1 is moved along the X-axis such that the clamp 38 can be moved under the first lens 41. In other embodiments, the clamp 38 can also be disposed on the outer ring 36 along the Y-axis. The outer edge can be moved in the Y-axis by controlling the platform 2 so that the jig 38 can be moved under the first lens 41, so that the first lens 41 can be moved from above the tape R The wafer on the tape R acts.

In summary, the composite IC detecting device of the present invention can transmit wafers, trays (Tray) and tapes (Tape) through different carrying modes by moving the substrate and the platform in the X and Y axes. The -On-Reel) wafer can share the lens located in the Z-axis. As described above, the composite IC detecting device of the present invention has a function of detecting a wafer of a different carrying type.

Although the present invention has been disclosed using the above preferred embodiments, it is not intended to be limiting The present invention is not limited to the spirit and scope of the present invention, and various modifications and changes to the above embodiments are still within the technical scope of the present invention. Therefore, the scope of protection of the present invention is attached. The scope defined in the scope of application for patent application shall prevail.

Claims (9)

A composite IC detecting device includes: a substrate having a first guiding block slidably coupled to a first guiding rod, the first guiding rod being disposed along an X axis Plane, the first guiding rod is driven by a first driving member to control the substrate to move along the X-axis by the first driving member; a platform disposed above the substrate and having a second guiding block, The second guiding block is slidably coupled to a second guiding rod, the second guiding rod is disposed on the substrate along the Y-axis, and the second guiding rod is driven by a second driving member to The second driving member controls the platform to move along the Y-axis, the substrate and the platform jointly have a through hole along a Z-axis; a ring seat is disposed above the platform, the ring seat has a ring hole along the Z-axis The ring hole is connected to the through hole. The ring hole has a bearing ring. The inner bottom of the ring has a light-transmitting plate. The ring seat further supports an outer ring, and the outer ring is disposed on the ring. The outer edge of the bearing ring, the outer edge of the outer ring has a clamp, the clamp is in a conveying direction The end has a two-reel positioning frame; and a detecting module having a first lens and a second lens facing the ring seat, the first lens being located along the Z-axis by a first seat rail Above the ring seat, the second lens is located below the ring seat by a second seat rail in the through hole so as to be movable along the Z axis. The composite IC detecting device of claim 1, wherein the substrate has at least one first slider, the at least one first slider being slidably coupled to the at least one first rail, the at least A first slide rail is disposed on a plane along the X-axis. The composite IC detecting device of claim 1, wherein the platform has at least one second slider, the at least one second slider being slidably coupled to the at least one second rail, the at least A second slide rail is disposed on the substrate along the Y-axis. The composite IC detecting device according to claim 1, wherein the ring wall forming the ring hole has at least one support member supported by the at least one support member on the ring Above the hole. The composite IC detecting device of claim 1, wherein the inner edge of the outer ring has a positioning member that can protrude toward the carrier ring. The composite IC detecting device according to claim 1, wherein the first lens is an infrared camera. The composite IC detecting device according to claim 1, wherein the second lens is a marker or a locator. The composite IC detecting device according to claim 1, wherein the jig is adjacent to an outer edge of the outer ring along the X-axis. The composite IC detecting device according to claim 1, wherein the jig is adjacent to an outer edge of the outer ring along the Y-axis.