TWM480761U - Thimble cover wiping apparatus - Google Patents

Description

Thimble cover wiping device

This creation is related to the thimble cover in the grain sorting device, and in particular to a thimble cover wiping device.

In the process of die, the wafer is first adhered to a soft film commonly known as blue tape, and then cut into a plurality of crystal grains, and the flexible film is disposed on a wafer ring ( Please refer to the invention patent of the Chinese Patent No. I363394. The wafer ring can expand the soft film to increase the distance between the crystal grains for subsequent grain sorting operations.

For the bad die selection operation, the image capturing device (for example, CCD camera) can be used to detect the appearance of the crystal grain for grain good judgment and position confirmation, and then pick and place device (pick-and-place) Arm) removes defective products from the soft film. For the operation of selecting the grain classification, the image capturing device can be used to confirm the position of the classified crystal grains, and the crystal grains are respectively removed and classified according to the specifications or grades by using the pick-and-place device.

In addition to the image capturing device and the pick-and-place device, the conventional die-splitting device may further include a pushing device including a thimble cover and a thimble disposed under the ejector pin. The thimble is disposed under the soft film to push the soft film and the selected one of the selected crystal grains upwardly, and then the ejector pin protrudes upward to select the selected crystal grain. Further upward, so that the selected crystal grain is adsorbed to the pick and place The suction head of the device.

However, the thimble cover described above may adhere to dust or other foreign matter after being used for a period of time, so that the soft film pushed by the ejector pin is uneven, and affects the visual positioning effect of the image capturing device, so that the grain picking error is easily caused. . Although the air hole for generating the vacuum suction function on the thimble cover of the conventional one can also be used for the air blowing function, it is still difficult to remove the dust and foreign matter on the thimble cover.

In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide a thimble cover wiping device which can effectively remove dust and foreign matter on the top surface of the ejector cap.

In order to achieve the above object, the thimble cover wiping device provided by the present invention is for wiping a top surface of a thimble cover, the top surface of the thimble cover is substantially facing a pushing direction; the thimble cover wiping device comprises a mechanical arm And a wiping block disposed on the robot arm, the wiping block being movable by the mechanical arm to move substantially perpendicular to the pushing direction and simultaneously contacting the top surface of the ejector cap.

Thereby, the thimble cover wiping device can perform a wiping process after the thimble cover is used for a predetermined number of times, that is, the wiping block is moved by the mechanical arm to a position where the top surface of the ejector cap can be contacted, so that the wiping The block wipes the top surface by a movement movement substantially perpendicular to the pushing direction, thereby removing dust and foreign matter on the top surface of the thimble cover. The mechanical arm can further move the wiping block to reciprocate on the top surface of the ejector cap to repeatedly wipe the top surface multiple times for better cleaning effect.

Preferably, in the foregoing thimble cover wiping device, the robot arm is rotatable about an imaginary axis substantially parallel to the urging direction to drive the wipe by the action of rotation The wiper moves substantially perpendicular to the thrust direction. Alternatively, the robot arm can be linearly displaced substantially perpendicular to the thrust direction such that the wiper block is also linearly displaced substantially perpendicular to the thrust direction.

Preferably, in the thimble cover wiping device, the mechanical arm and the wiping block can be linearly displaced substantially parallel to the pushing direction; thereby, the wiper block of various sizes and the thimble cover of various specifications are used. The wiper block can be brought into contact with the top surface of the ejector pin.

Preferably, the thimble cover wiping device further includes a fixing member disposed on the mechanical arm, and a clamping member detachably disposed on the fixing member, the wiping block is clamped to the fixing member Between the clamping member and the clamping member, the wiping block can be disposed indirectly on the mechanical arm by the fixing member and the clamping member, and the wiping block can be easily replaced.

Preferably, the thimble cover wiping device further includes a cleaning liquid container, and a conveying pipe communicating with the cleaning liquid container and connected to the wiping block to inject a cleaning liquid (for example, alcohol) into the wiping block. And enhance its cleaning effect.

Preferably, in the foregoing thimble cover wiping device, the robot arm is further configured to carry and transport a wafer ring, that is, the robot arm can be used for transporting the wafer ring in a conventional die sorting device. Mechanical arm.

The detailed construction, features, assembly or use of the thimble cover wiping device provided by this creation will be described in the detailed description of the subsequent embodiments. However, those of ordinary skill in the art should understand that the detailed description and specific embodiments of the present invention are merely used to illustrate the present invention and are not intended to limit the scope of the patent application.

10‧‧‧Top needle cover wiping device

20‧‧‧ thimble cover

22‧‧‧ top surface

30‧‧‧Motor

32‧‧‧ shaft

40‧‧‧ Robotic arm

42‧‧‧Mounting holes

50‧‧‧Clamp

52‧‧‧Fixed parts

54‧‧‧Clamping parts

56, 58‧‧‧ bolts

60‧‧‧wiping block

70‧‧‧Top needle cover wiping device

72‧‧‧cleaning liquid container

74‧‧‧ delivery tube

80‧‧‧Top needle cover wiper

82‧‧‧linear orbit

90‧‧‧displacement device

L‧‧‧ imaginary axis

1 and 2 are schematic perspective views of a thimble cover wiping device and a thimble cover according to a first preferred embodiment of the present invention, respectively showing the thimble cover wiping device not wiping and wiping the ejector cap FIG. 3 is a perspective view of a thimble cover wiping device and a thimble cover provided by a second preferred embodiment of the present invention; and FIG. 4 is a thimble cover wiping device according to a third preferred embodiment of the present invention; And a perspective view of a needle cover.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below. In the following, when an element is disposed on another element, it means that the element is directly disposed on the other element, or the element is indirectly disposed on the other element, that is, between the two elements. Set up one or more other components.

Please refer to FIG. 1 . FIG. 1 is a perspective view of a thimble cover wiping device 10 and a thimble cover 20 according to a first preferred embodiment of the present invention. The thimble cover wiping device 10 includes a motor 30 and a mechanical mechanism. The arm 40, a clamp 50, and a wiper block 60.

The ejector pin 20 is a part of a conventional die sorting device mounted on a displacement device (not shown) and can be along a single axis (Z-axis) or three-axis (X-axis, Y-axis) And Z axis) displacement. When the grain sorting operation is performed, a soft film (not shown) having a plurality of crystal grains is disposed on the top of the ejector cap, instead of the thimble cover wiping device 10 shown in FIG. The wafer ring carrying the soft film can be displaced along the X-axis and the Y-axis by a displacement device (such as an XY-axis displacement platform), and the die to be selected is displaced under the ejector cover 20 Alternatively, the ejector cap 20 can be driven to be displaced along the X-axis and the Y-axis to a selected die, and then the thimble cover 20 can be driven to be displaced along the Z-axis to be separated by the flexible film. Push the selected die. The flexible film and the wafer ring may also be disposed upright, for example, in the XZ plane or the YZ plane. In this case, the thimble cover 20 is horizontally disposed and displaced along the Y-axis or the X-axis. The film pushes the selected grain.

In other words, the top surface 22 of the ejector cap 20 is substantially facing a pushing direction (in the embodiment, the pushing direction is the positive direction of the Z axis, when the flexible film and the wafer ring are erected, the The pushing direction is perpendicular to the Z axis, for example, the X axis or the Z axis direction. The ejector cap 20 is pushed toward the pushing direction to push the die through the soft film through the top surface 22. The function of the present thimble cover wiping device 10 is that in the case where there is no wafer ring above the ejector cap 20, for example, when the wafer ring loaded with the soft film is removed from the ejector cap 20, The thimble cover wiping device 10 can wipe the top surface 22 over the thimble cover 20.

In detail, one end of the mechanical arm 40 is coupled to a rotating shaft 32 of the motor 30. The clamp 50 is fixed to the other end of the mechanical arm 40. The clamp 50 includes a fixing member 52 and a clamping member. The fixing member 52 is detachably fixed to the robot arm 40 by two bolts 56. The clamping member 54 is detachably provided to the fixing member 52 by a bolt 58. The wiping block 60 is provided. A clip is placed between the fixing member 52 and the holding member 54. Thereby, the robot arm 40 is rotatable about an imaginary axis L substantially parallel to the thrust direction (ie substantially parallel to the Z axis), and the wiping block 60 can be driven by the robot arm 40. A plane that is substantially perpendicular to the thrust direction (ie, the XY plane) moves along the arcuate trajectory.

The thimble cover wiping device 10 can perform a wiping process after the thimble cover 20 is used for a predetermined number of times, that is, the rotation of the robot arm 40 on the X-Y plane alone. Or, in conjunction with the movement of the ejector cap 20 along the X-axis and the Y-axis, the wiping block 60 is in contact with the top surface 22 of the thimble cover 20 (as shown in FIG. 2). Wherein, the wiping block 60 can be a block having a sponge or a dust-free cloth on the surface, or itself is a sponge or a wiping cloth, and the wiping block 60 is driven to perform a direction substantially perpendicular to the pushing direction (also That is, moving in the XY plane and simultaneously contacting the top surface 22, the top surface 22 can be wiped to remove dust and foreign matter on the top surface 22. The mechanical arm 40 can also reciprocate the wiping block 60 on the top surface 22 of the ejector cap 20 by reciprocatingly oscillating in a small angle, thereby repeatedly wiping the top surface 22 multiple times to achieve a better cleaning effect.

It should be noted that the wiping block 60 of the present embodiment is indirectly disposed on the robot arm 40 by the clamp 50, so that the wiping block 60 can be set and replaced quite conveniently. However, the manner in which the wiping block 60 is disposed on the robot arm 40 is not limited to the manner provided by the embodiment, and may be directly adhered to the robot arm 40, for example.

Referring to the invention patents described in the prior art, the soft film mentioned in the foregoing is usually disposed on a wafer ring, so the robot arm 40 can utilize the existing grain sorting device to transport the wafer ring. The robot arm can be used, that is, in addition to the manner of separately designing the mechanical arm 40 for driving the wiping block 60 to wipe the thimble cover 20, the conventional grain sorting device can also be used to carry and transport the crystal. The mechanical arm of the ring is used as the robot arm 40 of the present invention. In this case, the robot arm 40 of the present creation will temporarily suspend the wafer ring by three suction members (not shown) respectively disposed in the three mounting holes 42. Fixed under the robot arm 40 to transport the wafer ring between the wafer ring storage position and the die sorting position, and the clamp 50 and the wiping block 60 are disposed at positions that do not interfere with the wafer ring pick-and-place operation. In order to wipe the thimble cover 20 when needed or under a predetermined wiping cycle.

Please refer to FIG. 3 , which is a perspective view of a thimble cover wiping device 70 and a thimble cover 20 according to a second preferred embodiment of the present invention. The thimble cover wiping device 70 and the thimble cover wiping device 10 are provided. The thimble cover wiping device 70 further includes a cleaning liquid container 72 and a delivery tube 74 for accommodating a cleaning liquid (for example, alcohol), and the delivery tube 74 is connected to the cleaning liquid container. 72 is connected and connected to the wiping block 60 to inject a cleaning liquid into the wiping block 60 to enhance the cleaning effect thereof.

Please refer to FIG. 4 , which is a perspective view of a thimble cover wiping device 80 and a thimble cover 20 according to a third preferred embodiment of the present invention. The robot arm 40 of the thimble cover wiping device 80 is disposed on a line. On the orbit 82, and can be driven by a linear driving device (not shown) to slide along the linear track 82, in other words, the robot arm 40 can be substantially perpendicular to the pushing direction of the ejector cap 20 (also That is, the positive displacement of the Z-axis is linearly displaced (i.e., displaced along the X-axis), and the wiping block 60 is displaced in synchronization with the robot arm 40 to contact the top surface 22 of the ejector cap 20 while being linearly displaced. Wipe the top surface 22.

The thimble cover wiping devices 10, 70, 80 provided in the foregoing embodiments may further be provided with a Z-axis displacement device capable of driving the mechanical arm 40 to generate displacement in the Z-axis direction (for example, the displacements shown in FIGS. 1 and 2). The device 90) is configured such that the mechanical arm 40 and the wiping block 60 can be linearly reciprocally displaced parallel to the pushing direction of the ejector cap 20; thereby, various wiping blocks 60 of different sizes are used and various wipings are used. When the thimble cover 20 of the specification is unable to make the wiping block 60 contact the top surface 22 of the ejector cap 20 by the displacement of the mechanical arm 40 and the ejector cap 20 in the XY plane, the Z-axis displacement device can be along the Z The shaft adjusts the position of the robot arm 40 and the wiping block 60, or drives the robot arm 40 to reciprocally move in a small amplitude along the Z-axis direction, so that the wiping block 60 contacts the top surface 22 of the ejector cap 20.

Finally, it must be explained again that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. Alternatives or variations of other equivalent elements should also be the scope of patent application of the present application. Covered.

10‧‧‧Top needle cover wiping device

20‧‧‧ thimble cover

22‧‧‧ top surface

30‧‧‧Motor

32‧‧‧ shaft

40‧‧‧ Robotic arm

42‧‧‧Mounting holes

50‧‧‧Clamp

52‧‧‧Fixed parts

54‧‧‧Clamping parts

56, 58‧‧‧ bolts

60‧‧‧wiping block

90‧‧‧displacement device

L‧‧‧ imaginary axis

Claims (10)

A thimble cover wiping device for wiping a top surface of a thimble cover, the top surface of the thimble cover substantially facing a pushing direction; the thimble cover wiping device comprises a mechanical arm, and a mechanical arm is disposed on the mechanical arm The wiping block is movable by the mechanical arm to move substantially perpendicular to the pushing direction and simultaneously contact the top surface of the ejector cap. The thimble cover wiping device of claim 1, wherein the robot arm is rotatable about an imaginary axis substantially parallel to the thrust direction. The thimble cover wiping device of claim 1, wherein the robot arm is linearly displaceable substantially perpendicular to the thrust direction. The thimble cover wiping device according to any one of claims 1 to 3, wherein the mechanical arm and the wiping block are linearly displaceable substantially parallel to the thrust direction. The thimble cover wiping device according to any one of claims 1 to 3, further comprising a fixing member disposed on the mechanical arm, and a clamping member detachably disposed on the fixing member, the wiping A block clip is placed between the fixture and the clamp. The thimble cover wiping device according to any one of claims 1 to 3, further comprising a cleaning liquid container, and a delivery tube communicating with the cleaning liquid container and connected to the wiping block. The thimble cover wiping device of any one of claims 1 to 3, wherein the robot arm is further configured to carry and transport a wafer ring. The thimble cover wiping device of claim 7, wherein the mechanical arm and the wiping block are linearly displaceable substantially parallel to the thrust direction. The thimble cover wiping device according to claim 8, further comprising a fixing member disposed on the mechanical arm, and a clamping member disposed on the fixing member, the wiping block is clamped to the fixing member and Between the clamps. The thimble cover wiping device according to claim 9, further comprising a cleaning liquid container, and a conveying pipe connected to the cleaning liquid container and connected to the wiping block.