JP5429921B2 - Semiconductor device manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor device manufacturing apparatus excellent in cleaning performance capable of efficiently collecting soot generated during marking processing by a laser.

  A number of semiconductor elements are produced on a Si wafer in a process called a pre-process, and then separated into individual pieces in a process called a post-process, and then subjected to processes such as electrical characteristic inspection, characteristic classification, marking, and appearance inspection. After that, it is packaged in a tape, a container tube or the like and shipped. In such a process after the semiconductor element is separated into individual pieces, it is transported by the transport mechanism while being held by the holding mechanism, and in each process processing unit provided in the transport path, an electrical characteristic inspection or the like is performed. Each said process is performed.

  In addition, as a transfer method by a transfer mechanism, there are a straight line transfer, a turntable transfer, etc., but in any case, from the step of moving the holding mechanism according to a predetermined process order and the start of processing of semiconductor elements in each process processing unit In many cases, so-called intermittent conveyance is used in which the step of stopping the holding mechanism until completion is repeated.

  As a conventional example of such a semiconductor element manufacturing apparatus, there has been proposed one having a transport mechanism for transporting a semiconductor element while intermittently stopping at each process processing unit. For example, the technique described in Patent Document 1 provides a plurality of process processing units at a single stop position, increases the number of process processes per stop of the transport mechanism, and processes a plurality of processes in a complex manner. Is. According to this prior art, since the number of times the transport mechanism is stopped is reduced, it is possible to contribute to improvement in work efficiency and productivity.

  By the way, when performing the laser marking process which implements a marking process with a laser among the process processes in a semiconductor element manufacturing apparatus, it is known that soot will come out on the surface of a semiconductor element. Therefore, a technique for collecting dust is indispensable so that soot does not scatter from the surface of the semiconductor element to the surroundings. In particular, when manufacturing semiconductor elements in a clean room, which is a highly clean environment, the soot dust collection technology is an extremely important technology.

  Here, an outline of a marking unit that performs laser marking processing in the semiconductor element manufacturing apparatus will be described. As shown in FIG. 7, the marking unit includes a marking unit main body 31 having a laser irradiation lens 31 a at the tip, a plate 32 for fixing the marking unit main body 31, a support base 33, and a receiving base 34. It is configured. In FIG. 7, S is a semiconductor element, 3 is a turntable which is a transport mechanism for the semiconductor element S, and 10 is a table on which the semiconductor element S is held by suction.

  The plate 32 is rotatably connected to the support base 33 around the pin 36 as an axis, and the marking unit main body 31 is fixed at a predetermined irradiation angle by a fixing screw 37. The support base 33 is connected to the plate 32 and supports the tilt angle of the laser marking main body 31 so as to be changeable.

  Further, the cradle 34 is in contact with the plate 32 when the marking unit main body 31 is inclined, and maintains the inclination of the marking unit main body 31. Further, a stopper 35 is provided at a support portion where the cradle 34 is in contact with the plate 32. The stopper 35 supports the marking unit body 31 when the lower end of the plate 32 hits when the marking unit body 31 is lowered to the lower limit position.

  In such a marking unit, the following soot dust collector is installed. That is, a box-shaped dustproof cover 39 is provided so as to completely wrap the tip portion of the marking unit main body 31. The tube 40 is pulled out from the dust cover 39, and a dust collector 41 for sucking soot is connected.

Further, a dust-proof film 38 is provided on the surface of the marking unit main body 31 on the laser irradiation side in addition to the dust-proof cover 39. The dust-proof film 38 is for preventing the soot generated during the laser marking process from adhering to the lens 31a of the marking unit main body 31, and is detachably provided so as to cover the lens 31a. ing.
JP 2006-306617 A

However, the following problems have been pointed out in conventional semiconductor element manufacturing apparatuses.
That is, the dust collector 41 shown in FIG. 7 must be a high-pressure dust collector in order to enhance the dust collection capability. In this case, because of the high pressure, the soot penetrates the filter built in the dust collector 41, and the semiconductor There was a risk of soot being scattered in the manufacturing chamber in which the element manufacturing apparatus is arranged. In particular, it is a serious problem when the manufacturing room is a clean room with a high clean environment.

  In addition, a large amount of soot adheres to the dust-proof film 38 due to the presence of soot in the manufacturing chamber. Therefore, frequent maintenance is required so that the lens 31a is not adversely affected. Furthermore, when trying to secure the dust collecting force of the dust collector 41 with a vacuum pump, the vacuum pump itself is expensive and many are large, so the cost and size of the semiconductor element manufacturing apparatus are increased. Was invited.

  The present invention has been proposed in order to solve the above-described problems. The object of the present invention is to reliably remove and collect soot generated at the time of laser marking with a simple configuration, and to disperse soot indoors. An object of the present invention is to provide a semiconductor device manufacturing apparatus that has no fear, has high work efficiency of maintenance work, and can obtain good economic efficiency and space characteristics.

In order to achieve the above object, the present invention provides a semiconductor device manufacturing apparatus for manufacturing a semiconductor device by performing a marking process using a laser, and a turntable for rotating and transporting the semiconductor device, and the turntable is disposed around the turntable. a plurality of step processing units, and the turntable, the are al provided between the step processing unit for performing marking, and satellite table rotating transporting the placed semiconductor device, said marking of the satellite table is arranged close to the semiconductor device to be made, takes in compressed air from the upstream side outside inside that pulls the soot generated during the marking process by the compressed air, the downstream side the compressed air from the inside an ejector to flow toward the dust collecting unit to capture the soot which is arranged outside, bra scraping the surface of the semiconductor element When, is installed, the installation position of the brush is characterized in that the brush with rotation of the satellite table is positioned scraping the surface of the semiconductor element.

  In the present invention having the above-described configuration, since the soot generated during the marking process is sucked in by the negative pressure of the ejector, a dust collector having a high dust collection capacity is unnecessary, and the soot penetrates the filter of the dust collector because of the high pressure. There is no harmful effect such as scattering into the room. The ejector is a vacuum generator that generates a negative pressure using compressed air that flows at a high speed. The vacuum generator does not have a movable part and has a simple structure, improving economy and space. In addition, since the exhaust of compressed air containing soot flows out of the ejector, the ejector itself does not capture the soot. Therefore, it is possible to avoid soot from being scattered from the ejector, and it is possible to maintain the periphery of the semiconductor element manufacturing apparatus in a high clean environment.

  According to the present invention as described above, a good clean environment can be maintained by collecting the soot generated during the marking process using an ejector, and the maintenance work has high work efficiency. It is possible to provide an excellent semiconductor device manufacturing apparatus.

(1) Representative Embodiment [1] Configuration The best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be specifically described below with reference to FIGS. In addition, about the member same as the prior art shown in said FIG. 7, the same code | symbol is attached | subjected and description is abbreviate | omitted.

[1-1] Overall Configuration First, the overall configuration of the semiconductor element manufacturing apparatus 1 according to the present embodiment will be described with reference to FIG. As shown in FIG. 4, the semiconductor element manufacturing apparatus 1 is provided with a turntable 3 as a transport mechanism for the semiconductor element S.

  The turntable 3 is configured to rotate while repeating an intermittent conveyance cycle that advances and stops by the direct drive motor 2. Further, around the turntable 3, a supply mechanism 4 for supplying the semiconductor element S sent from a conveying means such as a parts feeder onto the turntable 3, and a process process for performing a predetermined process on the semiconductor element S Units 5a to 5k are arranged at equal intervals.

  Among the process units 5a to 5k, 5f is a marking unit, 5i is an appearance inspection unit, and between these two process units 5f and 5i and the turntable 3, satellite tables 10a and 10b are provided. Each is provided. Further, at the circumferentially equidistant position of the turntable 3, there is provided a suction holding unit 6 for delivering and receiving the semiconductor element S between the turntable 3, the supply mechanism 4 and the process processing units 5a to 5k. It has been.

[1-2] Satellite Table Next, a specific configuration of the satellite tables 10a and 10b (hereinafter collectively referred to as the satellite table 10) will be described with reference to FIG. As shown in FIG. 5, the satellite table 10 includes four mounting surfaces 21 on which the semiconductor element S is mounted at intervals of 90 degrees with the central axis C tilted to the rotation outer side of the turntable 3 (here, 45 degrees). (Indicated by a circle on the satellite table 10 in FIG. 5).

  The mounting surface 21 is provided 45 degrees outward with respect to the central axis C, and includes a suction hole 22 that sucks and holds the semiconductor element S, and the semiconductor element is communicated from the suction hole 22 to the vacuum device. S is configured to be held by suction. An ejector 8 is incorporated in this vacuum device.

  As shown in FIGS. 4 and 5, the satellite table 10 has a semiconductor element S delivery position T at the same vertical position as the center position of the suction nozzle 6a provided on the turntable 3, and rotated 180 degrees therefrom. The processing position D of the semiconductor element S for performing marking or visual inspection or the like is provided at the position.

[1-3] Adsorption holding unit Next, the adsorption holding unit 6 shown in FIGS. 4 and 5 will be described. The suction holding unit 6 is a suction holding mechanism for sucking and holding the semiconductor element S. The suction holding unit 6 is provided on the turntable 3 and is configured to be movable in the vertical direction by the drive unit 7. As shown in FIG. 5, a holding nozzle 6 a for delivering and receiving the semiconductor element S to the process processing units 5 a and 5 g is installed below the suction holding unit 6.

  The suction nozzle 6 a is configured to intermittently rotate in accordance with the cycle in which the turntable 3 advances and stops, and to move up and down the transport position and the processing position as the drive unit 7 moves up and down. More specifically, the holding nozzle 6a starts to descend when the turntable 3 stops, holds the lowered position during the stop, and further rises before the turntable 3 resumes the rotation operation. It comes to hold.

[1-4] Dust Collector of Marking Unit The structural feature of this embodiment is the dust collector of the marking unit 5f. That is, as shown in FIGS. 1 and 2, the ejector 8 is installed on the dustproof cover 39 of the marking unit main body 31. As shown in FIGS. 1 and 5, two brushes 23 for rubbing the surface of the semiconductor element S are installed in the vicinity of the satellite table 10.

  Here, the ejector 8 will be described in detail with reference to the principle diagram of FIG. The ejector 8 is a vacuum generator that generates a negative pressure, that is, a vacuum by flowing compressed air. As shown in the principle diagram of FIG. 3, the ejector 8 is provided with a diffusion chamber 8a for diffusing the compressed air. ing.

  A positive pressure side opening 8b and a negative pressure side opening 8c are formed in the diffusion chamber 8a, and an internal nozzle 8d is attached to the positive pressure side opening 8b. Further, a diffuser portion 8e for exhausting compressed air is provided so as to face the internal nozzle 8d. Furthermore, the dust collection part 11 is connected to the diffuser part 8e.

  The ejector 8 can also be used to obtain the suction holding force of the suction holding unit 6 and the suction force of the vacuum device on the satellite table 10, and in that case, the suction member 8 is sucked into the suction side opening 8c. The holding nozzle 6a of the holding unit 6 and the suction hole 22 of the satellite table 10 are connected.

[2] Action [2-1] Overall Action The overall action in the present embodiment having the above-described configuration is as follows. That is, when the pre-process is completed, the supply mechanism 4 supplies the semiconductor element S to the turntable 3 through a conveying unit such as a parts feeder.

  The turntable 3 performs intermittent rotation that repeats rotation and stop in one cycle. At this time, the suction nozzle 6a starts to descend when the turntable 3 stops, and maintains the lowered position during the stop. Further, the turntable 3 rises before restarting the rotation operation again, and maintains the raised position during rotation. In this way, the holding nozzle 6a descends while the turntable 3 is stopped rotating, and delivers and receives the semiconductor element S to the supply mechanism 4 and the process units 5a to 5k. In each of the process units 5a to 5k, a predetermined process is performed on the semiconductor element S.

[2-2] Operation Timing of Satellite Table in Marking Unit Next, operation timings of the satellite table 10, the turntable 3, and the holding nozzle 6a in the marking unit 5f will be described with reference to FIG. First, the holding nozzle 6a moves to the rising position of the holding nozzle 6a on the satellite table 10 while holding the electronic component S1 by the rotation of the turntable 3. At this time, the turntable 3 and the satellite table 10 are stopped (see FIG. 6A).

  Subsequently, as shown in FIG. 6B, when the holding nozzle 6 a starts the lowering operation and reaches the lowered position, the semiconductor element S <b> 1 is delivered from the holding nozzle 6 a to the mounting surface 21 of the satellite table 10. Then, the satellite table 10 rotates by a quarter, and the semiconductor element S4 that has already been marked comes to the position of the holding nozzle 6a. The state at this time is the state of FIG. Next, the holding nozzle 6a receives the semiconductor element S4 from the stopped satellite table 10, and performs the ascending operation as shown in FIG.

  In this way, from the states (a) to (d) of FIG. 6, the turntable 3 is stopped, and only the satellite table 10 rotates 1/4. Further, during the transition from (d) to (a) in FIG. 6, the turntable 3 rotates and the satellite table 10 stops. At this time, the semiconductor element S2 at the marking position of the marking unit 5f is marked.

  As a characteristic operation of the present embodiment, the brush 23 rubs the surface of the semiconductor element S as the satellite table 10 rotates. For this reason, soot can be efficiently removed from the semiconductor element S.

[2-3] Action of Ejector In the present embodiment having the above-described configuration, the ejector 8 is incorporated as a dust collecting device of the marking unit 5f, and soot is sucked using the ejector 8. That is, as shown in FIG. 3, in the ejector 8, the compressed air is taken in from the positive pressure side opening 8b, is squeezed by the internal nozzle 8d, and is discharged into the diffusion chamber 8a. The compressed air constricted by the internal nozzle 8d expands rapidly when released into the diffusion chamber 8a, and flows into the diffuser portion 8e at a high speed.

  Due to this high-speed flow, the pressure in the diffusion chamber 8a is reduced, and a negative pressure is generated. Thereby, the air flows into the diffusion chamber 8a from the negative pressure side opening 8c, that is, from the dust cover 39 side. The atmosphere that has flowed into the diffusion chamber 8a is mixed with the high-speed compressed air that has passed through the internal nozzle 8d, and then flows into the dust collecting portion 11 through the diffuser portion 8e. Such an ejector 8 can maintain a negative pressure generation state by continuously supplying compressed air to the positive pressure side, and the semiconductor element S is held by the holding nozzle 6a using this negative pressure. It is possible to hold.

[3] Effects As described above, in the semiconductor element manufacturing apparatus 1 according to the present embodiment, the brush 23 rubs the surface of the semiconductor element S to remove soot, and further uses the negative pressure generated by the ejector 8. Soot generated during the marking process is sucked in, so it is possible to efficiently remove and collect soot.

  In addition, in the present embodiment, the exhaust of the compressed air containing soot flows out of the ejector 8, so the ejector 8 itself does not directly capture the soot but only passes so that the soot contained in the compressed air is The dust collection part 11 collect | recovers. At this time, the dust collecting unit 11 does not suck in soot, but only captures soot, and therefore does not need to have a high dust collecting ability like the dust collector 11 of the prior art. Therefore, there is no worry that soot penetrates from the dust collecting part 11 and scatters in the room, and a high clean environment can be obtained. For this reason, this embodiment is suitable for use in a clean room.

  Furthermore, since soot does not scatter in the manufacturing chamber, soot does not adhere to each device or component, including the dust-proof film 38, and the maintenance work can be reduced. Further, since the ejector 8 has no movable part in the part where the vacuum is generated and has a simple configuration, the operation reliability is high. Furthermore, a vacuum pump is not necessary for securing the dust collecting power, and good economic efficiency and space can be obtained.

(2) Other Embodiments The present invention is not limited to the above-described embodiment. For example, the diffuser portion 8e of the ejector 8 is connected to the concentrated vacuum pipe of the factory instead of the dust collecting portion 11. May be. In such an embodiment, the existing equipment can be used effectively, and the ejector 8 is installed for each semiconductor element manufacturing apparatus. Therefore, even if the number of semiconductor element manufacturing apparatuses increases, the vacuum pressure decreases. There is no risk of instability, and excellent reliability can be maintained. Moreover, the arrangement | positioning location, the number of arrangement | positioning, etc. of each structural member including the brush 23 can be selected suitably. For example, if the brush 23 is rotatably installed, the soot removal efficiency can be further increased.

  In addition, the satellite table is configured as a circular turntable. However, the configuration is not limited to this configuration, and the receiving position and the delivery position are shared, and the semiconductor element is received from the holding mechanism while the turntable is stopped and the process has been completed. If it is the structure which can deliver the semiconductor element, you may comprise with a triangle. Furthermore, as described above, since the vacuum generating force of the ejector 8 can be used for the holding force of the semiconductor element S, it is possible to further reduce costs and save space by incorporating it in the vacuum device of the suction holding unit 6 and the satellite table 10. be able to.

  In the above-described embodiment, the center axis of the satellite table is inclined to further save space. However, it goes without saying that the effects of the present invention can be obtained even if the center axis is provided vertically. Furthermore, in the above embodiment, the marking unit and the appearance inspection unit are given as examples of the process processing unit provided with the satellite table interposed therebetween. However, what the process processing using the satellite table is performed depends on the purpose of the apparatus. Can be changed as appropriate.

  In the above embodiment, the suction holding unit is configured to move up and down by the moving mechanism while holding the semiconductor element. However, the present invention is not limited to such a configuration, and the suction holding unit. Can be moved in any direction depending on the arrangement of the process units.

  Specifically, each process processing unit in the process processing unit group of the present invention can be arranged in parallel from the center of the transport mechanism toward the outside, and the suction holding unit can be moved in the diameter direction. Further, the drive source of the suction holding unit can be selected as appropriate, and may be driven by any known drive means such as a linear motor, a rotary motor, a solenoid coil, or a cylinder. Further, any known driving force transmission mechanism such as a gear, a lever, a cam, a belt, and a ball screw may be combined.

The block diagram of the principal part in typical embodiment of this invention. The expanded block diagram of the principal part of this embodiment. The principle figure of the principal part of this embodiment. The top view which shows the whole structure of this embodiment. The partial expanded sectional view of this embodiment. The front view for demonstrating the operation timing of the satellite table of this embodiment. The partial block diagram of the conventional semiconductor element manufacturing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element manufacturing apparatus 2 ... Direct drive motor 3 ... Turntable 4 ... Supply mechanism 5, 5a-5k ... Process processing unit 5f ... Marking unit 5i ... Appearance inspection unit 6 ... Adsorption holding unit 6a ... Holding nozzle 7 ... Drive unit 8 ... Ejector 8a ... Diffusion chamber 8b ... Positive pressure side opening 8c ... Negative pressure side opening 8d ... Internal nozzle 8e ... Diffuser part 9 ... Solenoid valve 10, 10a, 10b ... Satellite table 11 ... Dust collecting part 21 ... Mounting surface 22 ... Adsorption hole 23 ... Brush 41 ... Dust collector D ... Semiconductor element processing position S ... Semiconductor element T ... Semiconductor element delivery position

Claims (2)

In a semiconductor device manufacturing apparatus for manufacturing a semiconductor device by performing a marking process using a laser,
A turntable for rotating and transporting semiconductor elements;
A plurality of process processing units disposed around the turntable;
Said turntable, said that we provided between the step processing unit for performing marking, and satellite table rotating transporting the placed semiconductor element,
Wherein the marking process satellite table is arranged in proximity to the semiconductor element to be made, takes in compressed air from the upstream side outside inside that pulls the soot generated during the marking process by the compressed air, the An ejector that flows compressed air from the inside toward the dust collection part that captures the soot disposed downstream ,
A brush for rubbing the surface of the semiconductor element is installed,
The installation position of the brush is a position where the brush rubs the surface of the semiconductor element as the satellite table rotates . The ejector is provided with a diffuser portion for exhausting compressed air,
The semiconductor element manufacturing apparatus according to claim 1, wherein the diffuser portion is connected to a dust collecting portion .

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