JP5371127B2 - Electronic component processing apparatus and processing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device for an electronic part which can perform a conveyance control at high speeds and which is facilitated, and also provide a method of processing the electronic part. <P>SOLUTION: This processing device 1 for an electronic part includes a turn table 3 rotated while repeating a cycle of running and stopping by a direct drive motor 2, a supply mechanism 4 for supplying an electronic part S fed from a conveying means such as a parts feeder, and various types of processing units 5a-5k which are disposed on the turn table 3 circumferentially at equal intervals and apply processings to the electronic part S, respectively. Satellite tables 10 for delivering the electronic part S from the turn table 3 to a marking unit 5f and an appearance inspection unit 5i, are installed between the marking unit 5f and the appearance inspection unit 5i, the processing times of which are relatively long among those processings such as an electric characteristic inspection, a characteristic classification, a marking, an appearance inspection. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component processing apparatus and a processing method therefor for performing various process processes in the process of transporting small electronic components such as semiconductor elements.

  A number of semiconductor elements are produced on a Si wafer in a process called a pre-process, and then separated into individual pieces in a process called a post-process, and then subjected to processes such as electrical characteristic inspection, characteristic classification, marking, and appearance inspection. After that, it is packaged in a tape, a container tube or the like and shipped.

  In such a process after the semiconductor element is separated into individual pieces, it is transported by the transport mechanism while being held by the holding mechanism, and in each process processing unit provided in the transport path, an electrical characteristic inspection or the like is performed. Each said process is performed. The transfer method by the transfer mechanism includes linear transfer, turntable transfer, etc., but in any case, the step of moving the holding mechanism according to a predetermined process sequence and the start and end of processing of the semiconductor element in each process processing unit In many cases, so-called intermittent conveyance, in which the step of stopping the holding mechanism is repeated, is used.

  By the way, the process processing by intermittent conveyance as described above has a problem that it is difficult to cope with a long processing time and to increase the speed. First, 1 transport cycle time = transport time + transport stop time, and stop time> maximum process processing time + delivery time. Here, if the maximum process processing time is 70 ms and the delivery time during the stop time is 20 ms, the lower limit of the stop time is 90 ms. If the transport time is 30 ms, the lower limit of one transport cycle time is 120 ms, and it is difficult to increase the speed further.

As described above, the reasons why it is difficult to increase the speed include the following.
(1) Due to mechanical limitations, it is necessary to simultaneously carry and stop the entire carrying mechanism. For this reason, the stop time must be determined by the maximum process processing time, and the transport stop time is limited.
(2) Although productivity has been improved by speeding up the transfer, it is reaching its limit. For example, in the above example, the transport time is only 30 ms in one cycle of 120 ms, and it is difficult to further shorten the transport time.
(3) For example, when a process that requires a long process is included, such as an electrical characteristic inspection that requires a complicated test cycle, the maximum processing time becomes longer and the one transport cycle time becomes longer.

  As a process processing apparatus for an electronic component provided with a transport mechanism for performing such intermittent transport, Patent Document 1 discloses a device that performs various processing on an electronic component by arranging a plurality of turntables and sequentially delivering them. Has been proposed. This is an apparatus for carrying out process processing in parallel while carrying a plurality of semiconductor elements in parallel, and carrying out and carrying out process processing in parallel increases productivity as a whole. Also, a method of arranging a plurality of processing mechanisms for the same process on the transport path and performing process processing in parallel, that is, a method of performing transport = one by one and process processing = parallel, can be considered.

JP-A-5-229509

  By the way, as in the prior art as described above, in the process of intermittently transporting each process, it is difficult to individually cope with a long-time process, to increase the speed and to simplify the apparatus configuration. For example, in a turntable transport mechanism composed of a main table and a sub table as shown in FIG. 14, position correction, direction change, electrical characteristic inspection, appearance inspection, taping, etc. An example is given in which process processing units for performing each process are arranged, and each process such as marking and marking inspection is arranged at each circumferentially equidistant position of the sub-table.

  In the case of such a turntable transport mechanism, the speed of the apparatus can be increased due to the problem of the electronic component delivery mechanism between the main table and the subtable and the control technology associated therewith, and the arrangement space of the marking unit in the subtable. It has been difficult to simplify the apparatus configuration and control technology.

  Further, in the technology for performing parallel processing, even in a process that requires a short processing time, the same number of processing mechanisms as processes having a long process time must be arranged, resulting in waste and increasing the cost of the apparatus. I was supposed to. In addition to the high cost for the parallel processing, there is a possibility that the transport mechanism becomes complicated for the parallel transport, and the reliability of the operation of the apparatus is lowered. In addition, since the processing conditions of the individual processing mechanisms vary, it may be necessary to periodically perform corrections such as matching. The same problem occurs when transport = one by one and process processing = parallel, leading to an increase in driving force and an increase in running cost due to an increase in inertial mass of the transport mechanism.

  The present invention has been proposed to solve the above-described problems of the prior art, and its purpose is to perform position correction, direction change, electrical property inspection, marking, appearance inspection in one turntable. By providing all process processing units such as taping, it is possible to provide a processing apparatus for electronic parts and a processing method thereof that enable high-speed processing of conveyance control and simplify the mechanism of the apparatus and facilitate control. There is to do.

  In addition, the second object of the present invention is to influence the other process processing by processing a process with a long process processing time using a satellite table among the process processing units provided around the turntable. It is another object of the present invention to provide an electronic component processing apparatus and a processing method thereof that can secure process processing time and shorten the processing time as a whole.

In order to achieve the above object, the invention described in claim 1 has the following configuration.
(1) Provided on the outer periphery of the turntable, which is provided with a plurality of holding mechanisms for holding electronic components, and which is rotated and stopped intermittently by repeating rotation and stop as one cycle while holding the electronic components by the holding mechanism A plurality of process processing mechanisms, and a plurality of satellite tables provided continuously between the turntable and the process processing mechanism .
(2) The satellite table includes a position for receiving an electronic component from the holding mechanism, a position for processing the electronic component in the process processing mechanism, and a position for delivering the electronic component after process processing to the holding mechanism. Yes.
(3) the satellite table, all of which carry from the holding mechanism at the same time to the processing position of said step processing mechanism receives the electronic components, as passed to the re-holding mechanism electronic components have been processed as Engineering It is configured.
(4) All the satellite tables receive and deliver electronic components from the holding mechanism after the turntable repeats the cycle for the number of satellite tables.
The invention described in claim 2 is characterized by having the following configuration.
(5) The satellite table includes a plurality of the processing positions.
(6) A plurality of types of process processing mechanisms whose processing times approximate to the plurality of processing positions are provided for the satellite table.

  Further, an electronic component processing method for performing each process in the electronic component processing apparatus as described above is also one aspect of the present invention.

  According to the present invention, all process processing mechanisms are accommodated in one turntable, and electronic parts are delivered and received at a single processing point, so that high-speed processing of conveyance control and simple apparatus can be achieved. It is possible to provide an electronic component processing apparatus and a processing method thereof that can be realized.

  In addition, among the process processing units provided around the turntable, by processing a process with a long process time using the satellite table, process process time is ensured without affecting other process processes. As a result, the processing time can be shortened.

  In particular, the satellite table performs the necessary process processing by receiving the electronic component and transporting it to the process processing position within the stop time in the last cycle among the operations of the plurality of cycles of the turntable. Then, after the turntable operates again for a predetermined cycle, it rotates and delivers the processed electronic components to the turntable. As a result, in electrical characteristic inspections that require a longer processing time compared to other process processes, the process processing time is ensured without affecting other process processes by preparing and installing a satellite table for that process time. be able to.

The top view which shows the whole structure of the processing apparatus of the electronic component in the 1st Embodiment of this invention. Sectional drawing which shows the structure of the processing apparatus of the electronic component in the 1st Embodiment of this invention. Sectional drawing which shows the structure of the satellite table in the 1st Embodiment of this invention. Sectional drawing which shows the structure of the marking unit in the 1st Embodiment of this invention. The timing chart of each apparatus in the 1st Embodiment of this invention. The figure which shows the effect | action of the satellite table in the 1st Embodiment of this invention. The top view which shows the whole structure of the processing apparatus of the electronic component in the 2nd Embodiment of this invention. Sectional drawing which shows the structure of the satellite table in the 2nd Embodiment of this invention. The timing chart of each apparatus in the 2nd Embodiment of this invention. The top view which shows the effect | action of the processing apparatus of the electronic component in the 2nd Embodiment of this invention. The figure which shows the structure of the satellite table in other embodiment of this invention. The timing chart of each apparatus in other embodiment of this invention. The figure which shows the comparison of the structure of the satellite table of this invention, and the conventional subtable. The top view which shows the structure of the conventional process processing apparatus.

  Next, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the overall configuration of the apparatus of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 shows a cross section of a satellite table which is a characteristic part of the present invention. FIG. 4 is a diagram showing a configuration of a marking unit which is a second characteristic part of the present invention.

[1. First Embodiment]
[1-1. Basic configuration]
As shown in FIGS. 1 and 2, an electronic component processing apparatus 1 according to the present embodiment includes a turntable 3 that rotates while repeating an intermittent conveyance cycle that is advanced and stopped by a direct drive motor 2, and conveyance means such as a parts feeder. A supply mechanism 4 for supplying the electronic component S sent from the vehicle, and various process processing units 5a to 5k that are arranged at equal intervals on the circumference of the turntable 3 and perform the process on the electronic component S.

  Of the process processes such as electrical characteristic inspection, characteristic classification, marking, appearance inspection, etc., the marking unit 5f and the external appearance inspection process are required for the marking unit and the external appearance inspection process that require a long installation space or a relatively long processing time, respectively. Assuming the inspection unit 5i, between the marking unit 5f and the appearance inspection unit 5i and the turntable 3, there is a satellite table 10a or 10b that delivers the electronic component S from the turntable 3 to the marking unit 5f or the appearance inspection unit 5i. Each is provided.

  A holding unit 6 is provided at the circumferentially equidistant position of the turntable 3 to deliver and receive the electronic component S from the turntable 3 to each process unit 5. As shown in FIG. A drive unit 7 for moving the holding unit 6 in the vertical direction is provided above.

  The holding unit 6 includes a suction nozzle 6 a such as a suction nozzle or a mechanical chuck in order to deliver and receive the electronic component S to the process processing unit 5. These suction nozzles 6 a are configured to rotate intermittently in accordance with the cycle in which the turntable 3 advances and stops, and to move up and down the transport position and the processing position as the drive unit 7 moves up and down.

[1-2. Configuration of satellite table]
A specific configuration of the satellite tables 10a and 10b (hereinafter collectively referred to as the satellite table 10) will be described with reference to FIG. As shown in the figure, the satellite table 10 is provided with four mounting surfaces 21 on which the central axis is inclined to the rotation outer side of the turntable 3 (here, 45 degrees) and the electronic components S are mounted at intervals of 90 degrees (see FIG. 1). The mounting surface 21 is further provided 45 degrees outward with respect to the central axis, and includes a suction hole 22 that sucks and holds the electronic component S, and communicates from the suction hole 22 to a vacuum device (not shown). Therefore, the electronic component S is sucked and held.

  As shown in FIG. 1 or FIG. 3, the satellite table 10 has an electronic component S delivery position T at the same vertical position as the center position of the suction nozzle 6a provided on the turntable 3, and a position rotated 180 degrees therefrom. And a processing position D of the electronic component S for performing marking or appearance inspection.

[1-3. Configuration of marking unit]
The electronic component processing apparatus 1 of this embodiment also has structural features in the marking unit 5f used in combination with the satellite table 10 having the above-described configuration. Referring to FIG. 4, the marking unit 5f includes a laser marking body 31 that performs a marking process on the electronic component S by irradiation from the irradiation unit 31a, a plate 32 that fixes the laser marking body 31, and the plate 32. And a support base 33 that is connected and supports the tilt angle of the laser marking body 31 so as to be changeable.

  Further, the laser marking main body 31 supported by the support base 33 is provided with a receiving base 34 that contacts the plate 32 and maintains the inclination of the laser marking main body 31 when the laser marking main body 31 is inclined at the irradiation angle. A stopper 35 is provided at a support portion where the cradle 34 is in contact with the plate 32. In other words, when the laser marking main body 31 is lowered to the lower limit position, the lower end of the plate 32 hits the stopper 35 to support the laser marking main body 31.

  Next, the connection configuration of the plate 32 and the support base 33 will be described. The plate 32 is rotatably connected to the support base 33 around a pin 36 as an axis, and laser marking is performed by a fixing screw 37. The main body 31 is fixed at the irradiation angle.

  The surface of the laser marking body 31 on the laser irradiation side is provided with a dustproof film 38 and a dustproof cover 39 for preventing soot generated during laser marking from adhering to the laser marking lens. This dust-proof film 38 is detachably provided on the irradiation lens 31a of the laser marking body 31 so as to cover the irradiation lens.

  Further, the dustproof cover 39 is configured in a box shape so as to completely wrap the irradiated portion of the laser marking main body 31. The tube 40 is drawn out from the dust cover 39, and the dust collector 41 is configured to absorb the soot.

[1-4. Action]
The operation of the present embodiment having the above configuration will be described with reference to FIGS. First, the pre-process is completed, and the electronic component S conveyed from the supply mechanism 4 shown in FIG. 2 to the electronic component processing apparatus 1 of the present embodiment via the conveying means such as a parts feeder is supplied to the turntable 3. Is intermittently rotated by the drive of the direct drive motor 2, and each process is sequentially performed in each of the process units 5a to 5k.

  Next, with reference to the turntable 3 and the satellite table 10, the operation timing of each mechanism of the present embodiment will be described with reference to the timing chart of FIG. 5 and FIG. As shown in FIG. 5, the turntable 3 performs intermittent rotation that repeats rotation and stop in one cycle. Further, the suction nozzle 6a starts to descend when the turntable 3 stops, holds the lowered position during the stop, rises before the turntable 3 restarts the rotation operation, and moves to the raised position during rotation. Configured to hold. That is, the suction nozzle 6a descends while the rotation of the turntable 3 is stopped, and delivers and receives the electronic components to the supply mechanism and the process processing unit.

  Next, the operation timing of the satellite table 10, the turntable 3, and the suction nozzle 6a will be described taking the case of the marking unit 5f as an example. First, as shown in FIG. 5 and FIG. 6A, the suction nozzle 6 a moves to the suction nozzle 6 a ascending position on the satellite table 10 while holding the electronic component S <b> 1 by the rotation of the turntable 3. At this time, the turntable 3 and the satellite table 10 are stopped.

  As shown in FIGS. 2B and 2B, when the suction nozzle 6a starts the lowering operation and reaches the lowered position, the electronic component S1 is delivered from the suction nozzle 6a to the mounting surface 21 of the satellite table 10. Then, the satellite table 10 rotates by a quarter, and the already marked electronic component S4 reaches the position of the suction nozzle 6a. The state at this time is the state shown in FIGS. Next, the suction nozzle 6a receives the electronic component S4 from the stopped satellite table 10, and performs the ascending operation as shown in FIG.

  In this way, from the states (a) to (d) of FIGS. 5 and 6, the turntable 3 is stopped, and only the satellite table 10 rotates by a quarter. Further, during the transition from (d) to (a), the turntable 3 rotates and the satellite table 10 stops. At this time, the electronic component S2 at the marking position of the marking unit 5f is marked.

  Here, in the marking unit 5f, as shown in FIG. 4, a laser marking main body 31 for performing a marking process on the electronic component S is fixed to the plate 32, and further, the laser marking main body 31 is connected to the plate 32 by a support base 33. The tilt angle is supported to be changeable.

  That is, the laser marking main body 31 is maintained in a state where the laser marking main body 31 is inclined at the irradiation angle by the stopper 35 of the cradle 34 that maintains the inclination of the laser marking main body 31 being in contact with the plate 32. The plate 32 and the support base 33 are rotatably connected with a pin 36 as an axis, and the laser marking body 31 is fixed at an irradiation angle by a fixing screw 37.

  Thus, since the marking unit 5f of the present embodiment is configured by the support mechanism capable of rotating the laser marking main body 31, the plate 32 can be rotated around the pin 36 together. When the rotational position is determined, the position and angle can be fixed by the fixing screw 37. Therefore, when the marking unit 5f is not used, such as during maintenance of the satellite table 10, the laser marking main body 31 can be fixed upward, so that the maintenance is not hindered.

  Further, the dust-proof film 38 and the dust-proof cover 39 provided on the surface of the laser marking body 31 on the laser irradiation side prevent soot generated during laser marking from adhering to the laser marking lens. The dust cover 39 is formed in a box shape so as to completely wrap the irradiated portion of the laser marking main body 31, and the dust collector 41 absorbs soot through the tube 40 drawn from the dust cover 39.

  In the above-described operation, the marking process in the marking unit 5f has been described as an example, but the same can be performed in the appearance inspection process of the appearance inspection unit 5i.

[1-5. effect]
Thus, according to this embodiment, in the satellite table, the stop is maintained when the turntable is rotated, and the rotation operation is performed when the turntable is stopped. The operation time is compared with the operation time of the turntable. The time is short and the stop time is long. Therefore, when the turntable is stopped, the electronic component is received, rotated by a quarter, and the next electronic component is delivered, and by securing a sufficient stop time than the turntable, Since a series of operations may be completed within this stop time, the raising / lowering operation of the suction nozzle can be moderated, and the impact can be mitigated. In addition, it is possible to reliably perform marking or appearance inspection with a relatively long processing time.

  Further, the satellite table can be processed at high speed by reducing the size, simplifying the mechanism and simplifying the control as compared with the conventional sub-table mechanism. This will be described with reference to FIG. As shown in FIG. 13 (a), the conventional main table / sub table method requires two processing points for delivery and receipt of electronic components, so the sub table must also be rotated at the rotation timing of the main table. did not become. Therefore, it has been difficult to increase the speed of control associated with delivery / reception of electronic components. In addition, since there were two processing points for delivery / reception of electronic parts, it was necessary to have enough space.

  On the other hand, as shown in FIG. 13 (b), according to the satellite table of the present embodiment, the processing point for delivery / reception of electronic parts is set to one place, and the ascending / descending operation of the holding mechanism once and the satellite table. Therefore, the control is simple and high-speed processing is possible.

  Furthermore, since the center axis of the satellite table is inclined to the outside in the circumferential direction of the turntable, the distance between the turntable and the process processing unit can be narrowed compared to the case where the table is provided on a horizontal plane, The entire space can be saved.

  In this way, the satellite table is provided, and all process processing units are placed in one turntable, so there is no need to provide a sub-table, and the processing points for delivery / reception of electronic components can be changed from two conventional locations. It can be simplified to one place. In addition, since control associated with delivery / reception can be simplified, high-speed processing and simplification of the apparatus can be achieved. Furthermore, a marking unit that requires a large space can be removed from the turntable to form a separate unit.

  In addition, since the marking unit 5f of the present embodiment is constituted by a support mechanism capable of rotating the laser marking main body 31, the plate 32 can be rotated around the pin 36 together. When the rotational position is determined, the position and angle can be fixed by the fixing screw 37. Accordingly, when the marking unit 5f is not used, such as during maintenance of the satellite table 10, the laser marking body 31 can be fixed upward. Therefore, it does not interfere with maintenance.

  Further, since the dust-proof film 38 and the dust-proof cover 39 are provided in the laser irradiation portion of the laser marking body 31, it is possible to prevent soot generated during laser marking from adhering to the laser marking lens. Furthermore, since the dust-proof film 38 is detachably attached to the laser marking main body 31, it can be exchanged with one touch each time the film gets dirty with soot.

  The dust-proof cover 39 is configured in a box shape so as to completely wrap the irradiated portion of the laser marking main body 31. Since the tube 40 is drawn out from the dust-proof cover 39 and soot can be absorbed by the dust collector 41, Soot generated at the time of laser marking can be efficiently absorbed.

[2. Second Embodiment]
[2-1. Constitution]
In the second embodiment, the configuration of the satellite table and the operation timing of the turntable and the satellite table in the first embodiment are improved. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment, and description is abbreviate | omitted when there is no change in particular.

  As shown in FIG. 7, around the turntable 3, four small satellite tables 50a to 50d are continuously provided, for example, downstream of the marking unit 5f. Further, an electrical characteristic inspection unit (hereinafter referred to as “test contact”) 5n is provided for each satellite table on the outwardly extending side of the satellite tables 50a to 50d as viewed from the turntable 3.

  All of the satellite tables 50a to 50d have the same configuration, and as shown in the cross-sectional view of FIG. 8, a pair, that is, two mounting surfaces 51 on which the electronic component S is mounted are provided on the diameter of the table. Further, the mounting surface 51 includes a suction hole 52 for sucking and holding the electronic component S, and the electronic component S to be placed is sucked and held by communicating from the suction hole 52 to a vacuum device (not shown). Has been.

  Further, as shown in FIG. 7 or FIG. 8, the satellite tables 50a to 50d are provided with a delivery position T of the electronic component S provided at the same vertical position as the center position of the suction nozzle 6a provided on the turntable 3. A processing position D for transferring the electronic component S to the test contact is provided at a position rotated 180 degrees therefrom. That is, the satellite tables 50a to 50d receive the electronic component S held by the suction nozzle 6a of the turntable 3 and placed on the placement surface 51, and receive the received electronic component S. It is configured to rotate 180 degrees while being sucked and held on 51 and deliver it to the process processing mechanism.

  In this embodiment, the satellite tables 50a to 50d are used for the processing of the test contact 5n as an example of the process processing. However, as in the first embodiment, which process processing unit such as a marking unit or an appearance inspection unit is used. Can also be used.

[2-2. Action]
Next, regarding the operation of the satellite tables 50a to 50d, the intermittent rotation timing of the turntable 3, the vertical movement timing of the suction nozzle 6a, and the test contact processing timing will be described with reference to the timing chart of FIG. 9 and the conceptual diagram of FIG. I will explain.

  First, the pre-process is completed, and the electronic component S conveyed from the supply mechanism 4 shown in FIG. 7 to the electronic component processing apparatus 1 of the present embodiment via the conveying means such as a parts feeder is supplied to the suction nozzle 6a. The electronic component S is conveyed onto the satellite table 50 while each process processing is sequentially performed in each process processing unit 5 in accordance with the intermittent rotation of the turntable 3 driven by the direct drive motor 2 while being held in the state. Come.

  As shown in FIG. 9, the satellite tables 50a to 50d receive, deliver, and rotate the electronic component S only once while the turntable 3 rotates for four cycles. This will be described with reference to FIG. 10. Assuming that the electronic component a is the first electronic component to be transported after the start of processing, the satellite tables 50a to 50d have one cycle in which the turntable 3 rotates and stops. Since the operation is not performed until four cycles, the electronic component “a” has advanced from the satellite table 50a to the satellite table 50d, that is, the state shown in FIG. This is also shown as (1) in FIG.

  Next, since the turntable 3 has been operated for 4 cycles, as shown in FIG. 9, the suction nozzle 6 a is lowered, vacuumed and transferred to the placement surface 51 of the satellite table 50. The electronic component is vacuum-sucked from the suction hole 52 of the surface 51. In this state, the satellite tables 50a to 50d rotate all at once. During this time, the test contact is in an OFF state as shown in FIG.

  When the satellite tables 50a to 50d rotate by 180 degrees and stop, the satellite table 50 delivers the electronic components a to d to the test contact 5n, and the test contact 5n performs an electrical characteristic test. Next, the turntable 3 rotates intermittently, and the state (2) shown in FIG. 10, that is, the next electronic component e is held by the suction nozzle 6a and is conveyed onto the satellite table 50a.

  The satellite tables 50a to 50d do not receive, deliver and rotate the electronic component S until the turntable 3 operates for 4 cycles. That is, while the turntable 3 operates for 4 cycles, the test contact continuously performs the electrical characteristic inspection as shown in FIG.

  The turntable 3 proceeds as (3), (4), (5) in FIG. 9 or FIG. Then, as shown in FIG. 10, the electronic components e to h are held on the suction nozzle 6 a side of the turntable 3, that is, on the delivery position T. Further, the electronic components a to d are held on the placement surface 51 at the processing position D of the satellite tables 50a to 50d.

  From this state, the electrical characteristics inspection of the electronic components a to d is turned off at the processing position D, and the satellite tables 50a to 50d place the electronic components ed from the suction nozzle 6a on the placement surface 51 at the delivery position T. Then, it is rotated by 180 degrees to be in the state shown in FIG. 10 (6), and the electronic components a to d that have undergone the electrical characteristic inspection are delivered to the suction nozzle 6a. After the electronic components a to d are delivered to the suction nozzle 6a, the test contact 5n starts an electrical property inspection for the electronic components e to h. As described above, the processed electronic components a to d are sequentially conveyed to the next process. For the electronic components e to h, the processes (2) to (6) shown in FIG. 9 or 10 are repeated.

[2-3. effect]
According to the present embodiment as described above, the satellite table receives the electronic component within the stop time in the last cycle among the operations of a plurality of cycles (here, four cycles) of the turntable, and the process processing position. The electrical property inspection process is performed by transporting to the surface. Then, after the turntable operates again for a predetermined cycle, it rotates and delivers the processed electronic components to the turntable. As a result, in electrical characteristic inspections that require a longer processing time compared to other process processes, the process processing time is ensured without affecting other process processes by preparing and installing a satellite table for that process time. be able to.

  For example, when processing is performed with all process processing units arranged evenly around the turntable, and without a satellite table, the turntable stop time must be set to the longest processing time. For this reason, in an appearance inspection or the like that normally ends in a short time, the stop time becomes longer than necessary, and time is taken. On the other hand, in this embodiment, a specific process is provided by providing a plurality of satellite tables and rotating the turntable one time while delivering the electronic components to the process processing unit. The processing time can be increased only for the processing unit.

  More specifically, if three satellite tables are provided in succession and electronic components are received, delivered, and rotated in these satellite tables once in one turn of the three turntables, the turntable These three cycles can be spent on the process processing by the process processing unit. In addition, if there are two satellite tables, the time for two cycles of the turntable can be spent on the process process, and if five satellite tables, the time for five cycles can be spent on the process process.

  In this way, by arbitrarily setting the number of satellite tables, flexible processing according to the processing time of each process can be performed, and the processing time can be shortened as a whole.

[Other Embodiments]
In addition, this invention is not limited to the said embodiment, The following other embodiment is also included. That is, the satellite table is configured in the shape of a circular turntable. However, the present invention is not limited to this configuration, and the receiving position and the delivery position are made common and the electronic component is received from the holding mechanism while the turntable is stopped. As long as the processed electronic component can be delivered, the shape or the number of mounting locations can be changed as appropriate, for example, a triangular shape.

  In the first embodiment, the central axis of the satellite table is tilted to reduce the space, but it goes without saying that the effects of the present invention can be obtained even if the central axis is provided vertically. On the contrary, in the second embodiment, the aspect in which the central axis of the satellite table is provided vertically is shown. However, in this embodiment, the central axis of the satellite table may be inclined to further save space. Is possible.

  In the above embodiment, the marking unit and the appearance inspection unit are provided at different positions as shown in FIG. 1 and the satellite table is provided in each step. However, the present invention is not limited to such a case. That is, as shown in FIG. 11, a plurality of types of process processing, for example, a marking unit 5l and an appearance inspection unit m are provided at different processing positions on the satellite table 10 on the same satellite table. It is also possible to process a plurality of types of process processes simultaneously.

  The timing chart in this case is as shown in FIG. In this case, as shown in the timing chart, it is desirable that a plurality of types of process processing provided on the satellite table have approximate processing times. Accordingly, the appearance inspection unit shown in FIG. 1 can be provided at the same processing position with respect to the marking unit and the turntable, and as a result, the number of process processing positions can be reduced. Can be simplified and simplified.

  Furthermore, in the above embodiment, the marking unit and the appearance inspection unit are given as examples of the process processing unit provided with the satellite table interposed therebetween. However, what the process processing using the satellite table is performed depends on the purpose of the apparatus. Can be changed as appropriate.

DESCRIPTION OF SYMBOLS 1 ... Electronic component processing apparatus 2 ... Direct drive motor 3 ... Turntable 4 ... Supply mechanism 5, 5a-5k ... Process processing unit 5f, 5l ... Marking unit 5i, 5m ... Appearance inspection unit 5n ... Electrical property inspection unit 6 ... Holding unit 6a ... Holding mechanism 7 ... Drive unit 10, 10a, 10b ... Satellite table 21 ... Mounting surface 22 ... Suction hole 31 ... Laser marking body 32 ... Plate 33 ... Supporting base 34 ... Stopper 35 ... Stopper 36 ... Pin 37 ... Fixing screw 38 ... Dustproof film 39 ... Dustproof cover 40 ... Tube 41 ... Dust collector D ... Electronic component processing position S ... Electronic component T ... Electronic component delivery position

Claims (4)

A plurality of holding mechanisms for holding electronic components, a turntable for rotating and stopping intermittently as one cycle while holding electronic components by the holding mechanism, and a plurality of steps provided on the outer periphery of the turntable a processing mechanism, a processor of an electronic component and a plurality provided satellite table in succession between said turntable step processing mechanism,
The satellite table is
A delivery / delivery position in which a position for receiving the electronic component from the holding mechanism and a position for delivering the electronic component after process processing to the holding mechanism are common ;
And a processing position for processing of electronic parts in the step processing mechanism,
The satellite table, all are configured to pass from the holding mechanism at the same time conveyed to the processing position of said step processing mechanism receives the electronic components, the re-holding mechanism electronic components have been processed as Engineering,
The all- satellite table receives and delivers the electronic component from the holding mechanism after the turntable repeats the cycle by the number of the satellite table. The satellite table includes a plurality of the processing positions,
The electronic component processing apparatus according to claim 1, wherein a plurality of types of process processing mechanisms whose processing times approximate to the plurality of processing positions are provided for the satellite table. A turntable that includes a plurality of holding mechanisms for holding electronic components, holds the electronic components by the holding mechanism, and rotates and stops repeatedly as one cycle. The turntable is provided on the outer periphery of the turntable. A plurality of process processing mechanisms that perform predetermined processing, and a plurality of process processing mechanisms that are continuously provided between the turntable and the process processing mechanism, receive an electronic component at a receiving position of the electronic component, and move to the processing position of the process processing mechanism In the electronic component processing method performed using the satellite table that conveys the electronic component,
The satellite table stops while the turntable is rotating, and performs processing to stop the electronic component at the processing position of the process processing mechanism,
All of the satellite tables receive the electronic components from the holding mechanism, rotate and receive the electronic components after process processing at the stop time of the last cycle by repeating the cycle for the number of the satellite tables. A method of processing an electronic component, wherein a process of delivering to the holding mechanism is performed at the same position as the position. The satellite table includes a plurality of processing positions for processing electronic components in a plurality of types of the process processing mechanisms having similar processing times, receives the electronic components at a reception position of the electronic components, and the plurality of processes of the process processing mechanism. Configured to transport electronic components to a location,
The satellite table is stopped while the turntable is rotating, and performs processing to sequentially stop electronic components at each processing position of the process processing mechanism,
The satellite table repeats the cycle as many times as the number of the satellite table, receives the electronic components from the holding mechanism at the stop time of the last cycle, rotates, and performs a plurality of types of process processing that approximate the processing time. The electronic component processing method according to claim 3, wherein the electronic component is transferred to the holding mechanism at the same position as the receiving position.

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