TWI585022B - Grain sorting methods and equipment - Google Patents

Description

Grain sorting method and equipment

The present invention relates to a die selection process, and more particularly to a die sorting method and a grain sorting apparatus for picking up defective grains or selecting grains according to grain classification levels for further classification and storage.

In the bad die selection or sorting process of the die, the wafer is first adhered to a soft film commonly known as blue tape, and then cut into a plurality of die. Then, in the case of the bad crystal selection operation, the image capturing device (for example, a CCD camera) can be used to detect the appearance of the crystal grain to perform the grain good judgment and the position confirmation, and then the defective product is removed from the soft film, and finally, The remaining grains are simultaneously removed from the flexible film for further processing such as packaging. Secondly, in the case of the die sorting operation, the image picking device can be used to confirm the position of the classified crystal grains, and the picking-and-place arm is used to select the crystal grains according to the specifications or Levels are removed and sorted separately.

The conventional pick-and-place device includes a single pick-and-place mode and a dual pick-and-place mode, wherein the driving method uses a rotary driver and a linear driver to drive a swing arm to vertically move and horizontally swing so as to be disposed on the swing arm and have The suction function of the vacuum suction function can move downward to suck the crystal grains, move up, and then take the crystal grains over the other soft film, and then move down to classify the crystal grains on the soft film.

The single pick-and-place mode selection device uses a linear driver to drive a rotary actuator having a swing arm and a suction head, or a rotary driver can be used to drive a linear actuator having a swing arm and a suction head. Regardless of the above-mentioned form, one of the drivers must drive the other of the driver, the swing arm and the suction head, and the operating speed is limited due to the heavy load, which makes the grain sorting efficiency difficult to increase.

The dual pick-and-place mode selection device uses a rotary driver to simultaneously drive the two linear actuators, and the two linear actuators respectively have a swing arm and a suction head, although the two The suction head can simultaneously perform the action of sucking the die and placing the die to improve the efficiency of the grain sorting. However, the rotary drive must drive the two-linear actuator, the second swing arm and the two-tip, and the load is relatively single-handed. The head mode is heavier and therefore the actuation speed is lower, resulting in a limited increase in the efficiency of grain sorting.

In addition, in the above-mentioned dual pick and place mode selection and placement device, and the linear drive is driven by the rotary drive in the form of a single pick and place mode, the linear drive wire is easily pulled during the swing. A disconnection problem has occurred.

In view of the above-mentioned deficiencies, the main object of the present invention is to provide a method for sorting crystal grains, which is suitable for use in bad crystal picking or grain sorting operations, for removing crystal grains adhered to a soft film, and the efficiency thereof. High and can avoid the problem of wire breakage.

In order to achieve the above object, a grain sorting method provided by the present invention is for removing a die adhered to a flexible film from the flexible film. The die selection method comprises the following steps: a Providing a suction head, a pusher having a vacuum suction function, and a thimble, the thimble being slidably disposed along the axial direction of the ejector; b) translating the tip to a spacing a first position of the selected die; c) causing the vacuum attraction function ejector and the thimble to be spaced apart from the preparation position of the die to be selected from the soft film Pushing the soft film and the die to be selected until the die to be selected is adsorbed to the tip; d) causing the pusher to adsorb the soft film and moving away from the tip to the preparatory position e) moving the thimble away from the tip to the preparatory position; and f) translating the tip from the first position to a second position for placing the die.

Therefore, when the grain sorting method is performed, since the tip for adsorbing the crystal grains only performs the translational action, the method does not need to be arranged to actuate the tip to be displaced along the grain pushing direction. The linear actuator, so that the actuator used to actuate the tip, will have a lower load to allow the tip to move relatively quickly, and even if the drive is a rotary drive, the problem of wire tearing can be avoided.

Preferably, in the foregoing grain sorting method, the tip is disposed on a swing arm, and the swing arm is driven to be swung by a driver, so that the tip can be in the first position and the second Pan between positions. Thereby, the driver only needs to drive the swing arm and the suction head, and the operation efficiency is high due to the small load.

Preferably, in the foregoing method of grain sorting, the swing arm is provided with two suctions. The head, wherein one of the tips is in the first position, the other of the tips is in the second position, and vice versa.

Another object of the present invention is to provide a die based on the above method The sorting method is suitable for the bad crystal picking or grain sorting operation, and is used for removing the crystal grains adhered to a first soft film, and then placing the crystal grains on a second soft film, and High efficiency and avoid the problem of wire breakage.

In order to achieve the above object, the grain sorting method provided by the present invention is used to A die adhered to a first flexible film is removed from the first flexible film, and the die is placed on a second flexible film, wherein the first flexible film and the second flexible film respectively have a first a surface, and a second surface facing the first surface opposite to the first surface, the die is located on the first surface of the first flexible film; the step of the grain sorting method comprises: a) providing a suction device a ejector capable of generating a vacuum suction function, a thimble axially extending through the ejector seat substantially perpendicular to the first flexible film and the second flexible film, and a seeding The suction device comprises at least one suction head capable of generating a vacuum suction function, the suction head being axially movable substantially perpendicular to the thrust, and capable of being opposite to the first surface of the first flexible film, Opposite the first surface of the second flexible film; the ejector pin and the thimble are opposite to the second surface of the first flexible film, and are respectively movable substantially along the thrust axis; the crystal system is Opposite the second surface of the second flexible film And moving substantially along the thrust axial direction; b) positioning the suction head of the suction device, the ejector and the ejector at a position corresponding to the die; c) causing the pusher and the ejector toward the suction Moving in the direction of the tip of the device to push the first flexible film and the die, thereby adsorbing the die to the tip; d) moving the pusher toward the tip away from the suction device, Simultaneously adsorbing the second surface of the first flexible film to the ejector, thereby separating the first surface of the first flexible film from the die; e) moving the thimble away from the tip of the suction device Moving; f) moving the tip of the suction device together with the die to make the die opposite the first surface of the second flexible film and corresponding to the crystallizing table; g) causing the crystal plate to face the suction Moving in the direction of the tip of the device to push the second flexible film to adhere the die to the first surface of the second flexible film; and h) moving the crystal plate away from the tip of the suction device Move in direction.

Thereby, the grain sorting method can be used for grain sorting operation, meaning A plurality of crystal grains adhered on the first flexible film are classified and placed on the second flexible film, wherein the suction device does not need to be provided with a linear actuator capable of generating a displacement action substantially along the thrust axis, and thus the suction device The load of the driver is small to allow the tip to move relatively quickly, and the problem of the wire being torn off can be avoided even if the driver of the suction device is a rotary drive.

Preferably, in the foregoing grain sorting method, the step f), the step g) And the step of performing the step h), the other die attached to the first surface of the first flexible film is displaced relative to the ejector and the thimble to a position corresponding to the pusher and the ejector; Thus, the grain sorting method can continuously and quickly classify a plurality of crystal grains one by one.

Another object of the present invention is to provide a die sorting device that can be used to perform The foregoing method of grain sorting which can be used for grain sorting selection operations.

In order to achieve the above object, the die sorting device provided by the present invention is used for A die that is adhered to a first flexible film is removed from the first flexible film, and the die is placed on a second flexible film, and the first flexible film and the second flexible film respectively have a a first surface, and a second surface facing the first surface opposite to the first surface, the die is located on the first surface of the first flexible film; the die sorting device comprises a suction device, a pusher, a thimble, and a crystal setting table; the suction device comprises at least one suction head capable of generating a vacuum suction function, the suction head being movable substantially parallel to the first flexible film and the second soft film, and capable of The first surface of the first flexible film is opposite to the first surface of the second flexible film; the push-pull seat can generate a vacuum suction function and is opposite to the second surface of the first flexible film. And moving substantially along an axial direction perpendicular to the first flexible film and the second flexible film; the thimble is substantially axially disposed along the thrusting axis of the ejector, and Second surface phase of the first soft film , And to substantially axially along the pushing movement; of the die table surface of the second system with a second film of relatively flexible, substantially along the pushing capable of axial movement.

Preferably, in the foregoing grain sorting method and grain sorting apparatus, the sucking The picking device further includes a driver, and a swing arm disposed on the driver, the nozzle is disposed on the swing arm, and the driver can drive the swing arm to swing around the jacking direction, thereby driving the nozzle to A first position of the step b) is reached, and the suction head is driven to reach a second position of the step f); thereby, the driver only needs to drive the swing arm and the suction head, because the load is small The efficiency of the operation is high.

Preferably, in the foregoing grain sorting method and grain sorting apparatus, the sucking The picking device comprises two nozzles, wherein one of the picking heads is located at the first position, and the other of the picking heads is located at the second position; thereby, the two picking heads can simultaneously pick up the crystal grains and place the crystal grains respectively Therefore, the efficiency of grain sorting can be further improved.

Detailed construction and method of the grain sorting method and apparatus provided by the present invention The manner of point, assembly or use will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

10‧‧‧Grading sorting equipment

11, 12‧‧‧ Carrying platform

13‧‧‧ suction device

132‧‧‧ drive

134‧‧‧ swing arm

136‧‧‧ tips

14‧‧‧ 推座

142‧‧‧Perforation

15‧‧‧ thimble

16‧‧‧ crystal table

21‧‧‧First soft film

211‧‧‧ first surface

212‧‧‧ second surface

22‧‧‧Second soft film

221‧‧‧ first surface

222‧‧‧ second surface

23, 24‧‧‧ ring frame

30, 31, 32, 33, 34‧‧ ‧ grains

40‧‧‧Grad sorting equipment

43‧‧‧ suction device

432‧‧‧ drive

434‧‧‧ swing arm

436, 438‧‧ ‧ tips

P1‧‧‧ first position

P2‧‧‧ second position

1 is a top plan view of a die sorting apparatus according to a first preferred embodiment of the present invention; FIGS. 2 to 8 are graphs of grain sorting provided by the first preferred embodiment of the present invention; A front view of the device and showing the steps of the grain sorting method provided by the present invention; FIG. 9 is a top plan view of the die sorting apparatus provided by a second preferred embodiment of the present invention; 10 to 13 are front views of the die sorting apparatus provided by the second preferred embodiment of the present invention, and show the steps of the grain sorting method provided by the present invention.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below. In the following, when an element is referred to as the other element, it is meant that the element is directly facing the other element, or the element is indirectly connected to the other element.

Please refer to FIG. 1 to FIG. 8. FIG. 1 is a top plan view of a die sorting apparatus 10 according to a first preferred embodiment of the present invention, and FIG. 2 to FIG. 8 show the die sorting. A front schematic view of apparatus 10 and showing the various steps of the grain sorting method provided by the present invention. The die sorting apparatus 10 includes two carrying stages 11, 12, a suction device 13, a pusher 14, a thimble 15, and a crystal stage 16. The die sorting device 10 is used to be glued to a first soft The crystal grains 30 of the film 21 (including the crystal grains 31, 32, and 33) are separated from the first flexible film 21, and the crystal grains 30 are placed on a second flexible film 22.

The first flexible film 21 and the second flexible film 22 may be a conventional blue tape or other viscous opaque, translucent or transparent film, and are respectively framed by an annular frame 23, 24. The two annular frames 23 and 24 are respectively fixed to the two carriers 11 and 12. The first flexible film 21 and the second flexible film 22 respectively have a first surface 211, 221, and a second surface 212, 222 opposite to the first surface 211, 221, the first flexible film 21 The first surface 211 is adhered to a plurality of crystal grains 30. It is worth mentioning that the crystal grains 30 are cut by a wafer adhered to the first surface 211 of the first flexible film 21, and therefore, the crystal grains 30 are closely spaced. The distance is arranged in a circular shape. In the first drawing, all the crystal grains 30 to which the first flexible film 21 is adhered are shown in a circular shape. FIGS. 2 to 8 show only three of the crystal grains 30. The grains 31, 32, 33 are for illustration.

The two stages 11 and 12 are respectively driven by a pair of axial displacement mechanisms (not shown) to be displaced along the X-axis and the Y-axis as shown in the drawings to respectively drive the displacement of the two flexible films 21 and 22. Thereby, the selected one of the first flexible film 21 can be moved to a position absorbable by the suction device 13, and the second flexible film 22 is used for the selected die to be placed. The portion can be displaced to a particular position to enable the suction device 13 to place the selected die at the location. Since the aforementioned biaxial displacement mechanism is a mechanism commonly used in general automation machinery to generate a reciprocating displacement motion along a plane (XY plane), and is not a technical feature of the present invention, the applicant will not repeat the detailed structure here. It is not shown in the drawing.

The suction device 13 includes a driver 132, a swing arm 134 disposed on the driver 132, and a suction head 136 disposed on the swing arm 134 and capable of generating a vacuum suction function. The driver 132 can be a general servo rotation motor to drive the swing arm 134 around an axial direction perpendicular to the first flexible film 21 and the second flexible film 22 (ie, the Z axis shown in the drawing). Swinging, so that the tip 136 can be translated to be opposite to the first surface 211 of the first flexible film 21 and spaced corresponding to a first position P1 of the die 32 to be selected (as shown in Figures 2 to 5) It can also be driven to a second position P2 (as shown in FIGS. 6 to 8) opposite to the first surface 221 of the second flexible film 22 for placing the die.

It should be noted that the configuration of the suction device 13 and the manner in which the suction head 136 is driven are not limited to those provided in the embodiment, as long as the suction head 136 can be substantially perpendicular to the The thrusting axis (Z-axis) moves (i.e., moves along the XY plane) and can reciprocate between the first and second positions P1, P2 opposite to the first surfaces 211, 221 of the two flexible films 21, 22. Panning it.

The ejector pin 15 is disposed substantially in the thrusting axial direction (Z axis) The seat 14 is also slidably disposed along the axial direction of the pedestal 14 and has a plurality of perforations 142 parallel to the thrust axis (Z-axis). The perforations 142 are used. The ejector pin 14 is caused to have a vacuum suction function in communication with a vacuum suction device (not shown). The ejector 14 and the ejector pin 15 are opposite to the second surface 212 of the first flexible film 21, and are respectively driven by a linear actuator (not shown) to substantially follow the thrust axis (Z). Each of the linear actuators may be a voice coil motor (VCM), but is not limited thereto.

The crystal stage 16 is opposite to the second surface 222 of the second flexible film 22, It is also driven by a linear actuator (not shown) to move substantially along the thrust axis (Z-axis). The crystal stage 16 can also, but is not limited to, be provided with a plurality of perforations to communicate with a vacuum suction device to create a vacuum suction function.

Hereinafter, a grain sorting method provided by the present invention will be described by taking the grain sorting apparatus 10 to displace the crystal grain 32 from the first flexible film 21 to the second flexible film 22 as an example, and the grain sorting method is provided. The steps include:

a) A suction head 136, a push-pull seat 14 having a vacuum suction function, and a ejector pin 15 are provided. The ejector pin 15 is slidably disposed along the ejector seat 14 along its axial direction. For the specific implementation of the foregoing components, the above-described grain sorting apparatus 10 can be considered.

b) Translating the tip 136 to a first position P1 corresponding to a die 32 to be selected. In detail, as shown in FIG. 2, the suction head 136 of the suction device 13, the ejector 14 and the ejector pin 15 are located at positions corresponding to the die 32. In this embodiment, the ejector 14 and the ejector pin 15 are only moved along the thrust axis (Z-axis) without moving along the X-axis or the Y-axis. This step is performed by the carrier 11 and the The swing arm 134 respectively drives the die 32 and the tip 136 to a position corresponding to the pusher 14 and the ejector pin 15. At this time, the tip 136 is located at the first position P1 as described above. However, the first flexible film 21 and the die 32 can also be fixed, and the suction device and the ejector for generating X-axis and Y-axis displacement can be used to achieve this step.

c) as shown in Fig. 3, the ejector 14 and the ejector pin 15 are spaced apart from each other by the flexible film 21, corresponding to the preliminary position of the die 32 to be selected (as shown in Fig. 2) The direction of the suction head 136 of the suction device 13 is moved, and the first flexible film 21 and the die 32 are pushed up until the die 32 contacts and is adsorbed to the tip 136. In FIG. 3, the top is The pusher 14 and the ejector pin 15 are located in an thrust position.

d) causing the ejector 14 to adsorb the flexible film 21 and away from the tip 136 The direction of movement is reset to the original preparatory position as shown in Fig. 2. In detail, as shown in FIG. 4, the ejector 14 is moved away from the tip 136 of the suction device 13, while the second surface 212 of the first flexible film 21 is adsorbed. The pedestal 14 further separates the first surface 211 of the first flexible film 21 from the die 32. In this step, the suction force of the die 32 by the tip 136, the suction force of the ejector 14 against the first flexible film 21, and the urging force of the ejector pin 15 on the die 32 ensure The die 32 is quickly separated from the first flexible film 21 to avoid a situation in which the pusher 14 is lowered but the first flexible film 21 is not lowered or the die 32 is lowered.

e) as shown in Fig. 5, the ejector pin 15 is attracted away from the suction device 13 The direction of movement of the head 136 is reset to the original preparatory position. It should be noted that the ejector pin 15 may remain substantially stationary during the resetting process of the ejector 14 from the push-up position to the preparatory position until the ejector 14 is returned to the aforementioned preparatory position. The returning action is performed to ensure that when the ejector 14 is reset, the die 32 is still held by the ejector pin 15 so that the die can be surely detached from the flexible film 21: alternatively, the ejector 14 begins to move away from the push position and toward the preparation. When the position moves but has not stopped at the aforementioned preparatory position, the ejector pin 15 leaves the push-pull position to perform the ejector reset operation in this step (that is, the time during which the thimble 15 remains substantially stationary is relatively short), which can be improved. effectiveness. In addition, as shown in FIGS. 4 and 5, during the movement of the ejector 14 to move back, the ejector pin 15 substantially pierces the flexible film 21 and directly abuts against the die 32. However, this is not necessary. The limitation condition is that, as long as the spacing distance between the suction head 136 and the die to be selected when the suction head 136 is stopped at the first position P1 is properly designed, the urging seat 14 and the thimble 15 can push up the stroke of the flexible film 21 upward. Appropriately reduced so that the ejector pin 15 can remain in the condition of indirectly abutting against the die 32 via the flexible film 21 during the movement reset (i.e., the flexible film 21 is not pierced). ), and the subsequent ejector 15 reset operation is performed.

In general, the suction force of the tip on the grain is less than the adhesion of the soft film to the grain. Therefore, the conventional technology uses the thimble to push the die through the soft film, that is, the soft film and the die are pushed a distance by the thimble having a small cross-sectional area, so that the die and the soft film The contact area is reduced, thereby reducing the adhesion of the soft film to the grains. However, in the method and apparatus for grain sorting in which the tip of the present invention does not move along the thrust axis (Z-axis), the distance between the ejector pin pushing soft film and the die may be longer (equivalent to the conventional thimble). The distance between the top die and the drop distance of the conventional tip). If only the thimble is used instead of pushing the die with the pusher, the crystal may be caused by the long distance between the soft film and the die. The position of the particles is easily offset, which in turn affects the accuracy of subsequent placement of the grains. For example, in the subsequent steps of this embodiment, the arrangement accuracy of the crystal grains in the second flexible film 22 is affected. In other words, the present invention utilizes the urging seat and the thimble to push the die through the soft film at the same time, which can effectively avoid the problem that the prior art is caused by the ejector pin pushing distance and the grain position shifting, thereby maintaining the subsequent placement of the crystal. The positional accuracy of the granules, and further, after the ejector pin and the thimble are used to push the dies to the position, the ejector pin and the thimble can be separated from the pushing position, so that the crystal grains are surely adsorbed to the suction head.

f) translating the tip 136 from the first position P1 to place the die The second position P2. In detail, as shown in FIG. 6, the suction head 136 of the suction device 13 is moved along with the die 32 so that the die 32 is opposite to the first surface 221 of the second flexible film 22 and corresponds to the The crystal stage 16 is placed. At this time, the tip 136 is located at the second position P2 as described above.

g) as shown in Fig. 7, the crystal table 16 is directed toward the suction head of the suction device 13 The second flexible film 22 is pushed up by the direction of the 136, and the die 32 is adhered to the first surface 221 of the second flexible film 22.

h) as shown in Fig. 8, the crystal stage 16 is moved away from the suction device 13 The direction of the tip 136 moves. At this time, as long as the suction head 136 releases the vacuum suction function, the die 32 can be smoothly adhered to the second flexible film 22. However, if the crystal plate 16 has a vacuum suction function, the film can be further ensured. The second flexible film 22 and the die 32 are lowered with the crystal stage 16.

Thereby, the grain sorting method can be used for bad crystal picking operation or grain sorting selection The operation is performed by dividing the die 30 adhered on the first flexible film 21 into the second flexible film 22. As shown in FIG. 6 to FIG. 8 , another film adhered to the first surface 211 of the first flexible film 21 during the step f), the step g) and the step h) are performed. (for example, the die 33) is displaceable relative to the ejector 14 and the ejector pin 15 to a position corresponding to the ejector 14 and the ejector pin 15, such that the die sorting apparatus 10 utilizes the aforementioned die sorting After the die 32 is displaced to the second flexible film 22, the step b) of the grain sorting method can be repeated immediately. The die 33 is displaced to the second flexible film 22 to the step h), so that the sorting operation of all the crystal grains 30 can be completed continuously and quickly.

In addition, the foregoing grain sorting method is mainly used to adhere to the first softness. The die (32) of the film (21) is removed from the first flexible film, and the die 32 is placed on the second flexible film (22). However, the foregoing method is only applied to be adhered to The grain of the flexible film is taken away, for example, to remove and move the grain of the bad crystal or the specific classification grade to a specific position for discarding or placing. The above grain sorting method can substantially only perform step a) to In the step f), the object is achieved, that is, only the crystal grains on the first flexible film 21 are removed without further placing the crystal grains on the second flexible film 22.

The above two kinds of grain sorting methods, whether applied to grain classification or not Or the bad crystal picking operation, since the suction device 13 does not need to be provided with a linear actuator capable of generating a displacement action substantially along the thrust axis (Z axis) (ie, the axial direction of the ejector pin 15), The driver 132 of the suction device 13 only needs to drive the swing arm 134 and the suction head 136, so that there is no problem that the wire of the driver is broken by the swing, and the load of the driver 132 of the suction device 13 is small, so that the suction can be performed. The head 136 moves relatively quickly, so the efficiency of the aforementioned grain sorting apparatus 10 and the grain sorting method is higher than that of the conventional one.

Referring to FIG. 9 to FIG. 13 , FIG. 9 is a top plan view of a die sorting apparatus 40 according to a second preferred embodiment of the present invention, and FIGS. 10 to 13 show the die sorting. A front schematic view of apparatus 40 and showing the various steps of the grain sorting method provided by the present invention. The die sorting device 40 is similar to the foregoing grain sorting device 10. However, in the picking device 43 of the die sorting device 40, the driver 432 drives a longer swing arm 434, and two separate The tips 436, 438 disposed at the two ends of the swing arm 434, wherein the tip 436 is located at the first position P1, the tip 438 is located at the second position P2, and vice versa.

The die sorting device 40 can also perform the foregoing grain sorting method, and when the nozzle 436 performs the steps b) to e), the nozzle 438 can simultaneously perform steps f) to h). For example, in the process in which the tip 436 draws the die 32 from the first flexible film 21, the tip 438 can place the previously sucked die 34 on the second flexible film 22. As a result, the die sorting device 40 not only has the efficacy of the die sorting device 10 as described above, but the grain sorting device 40 is more efficient.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧Grading sorting equipment

13‧‧‧ suction device

132‧‧‧ drive

134‧‧‧ swing arm

136‧‧‧ tips

14‧‧‧ 推座

142‧‧‧Perforation

15‧‧‧ thimble

16‧‧‧ crystal table

21‧‧‧First soft film

211‧‧‧ first surface

212‧‧‧ second surface

22‧‧‧Second soft film

221‧‧‧ first surface

222‧‧‧ second surface

32‧‧‧ grain

P1‧‧‧ first position

Claims (17)

A grain sorting method for removing a die adhered to a flexible film from the flexible film, the die selection method comprising the steps of: a) providing a nozzle, and having a vacuum suction a pusher seat and a thimble, the thimble being slidably disposed along the axial direction of the ejector; b) translating the tip to a first position corresponding to a die to be selected; c The ejector having the vacuum suction function and the thimble are spaced apart from the preparation position of the die to be selected in the direction of the tip from the soft film to push the soft film and the to-be-selected a grain until the die to be selected is adsorbed to the tip; d) causing the ejector to adsorb the flexible film and moving away from the tip to the preparatory position; e) moving the ejector away from the tip Moving in the direction to the preparatory position; and f) translating the tip from the first position to a second position for placing the die. The method of grain sorting according to claim 1, wherein the tip is disposed on a swing arm, and the swing arm is driven by a driver to swing, so that the tip can be in the first position The second position is translated between. The method of grain sorting according to claim 2, wherein the swing arm is provided with two of the tips, wherein one of the tips is in the first position and the other is in the second position. . The grain sorting method according to claim 1, wherein in the step d), the thimble is substantially immobilized. The method of grain sorting according to claim 1, wherein in step d), when the ejector is still moving and has not been stopped at the preparatory position, step e) is performed. A method for sorting a crystal grain from a first flexible film from the first flexible film, and then placing the die on a second flexible film, the first softness The film and the second flexible film respectively have a first surface and a second surface opposite to the first surface, the die is located on the first surface of the first flexible film; the die sorting method The method includes the following steps: a) providing a suction device, an ejector capable of generating a vacuum suction function, and substantially axially penetrating along an axis perpendicular to the first flexible film and the second flexible film a ejector pin of the ejector base, and a crystal setting table; the suction device includes at least one suction head capable of generating a vacuum suction function, the suction head being axially movable substantially perpendicular to the ejector, and capable of The first surface of the flexible film is opposite to the first surface of the second flexible film; the ejector pin and the thimble are opposite to the second surface of the first flexible film, and can respectively substantially follow the Pushing axial movement; the crystal table is A second surface opposite the flexible film, and can substantially axially along the pushing movement; b) so that the tip of the suction means, the pushing base and the position of the thimble should be positioned on the die; c) moving the ejector and the thimble toward the tip of the suction device to push the first flexible film and the die, thereby adsorbing the die to the tip; d) causing the push The seat is moved away from the suction head of the suction device, and the second surface of the first flexible film is adsorbed to the ejector, thereby separating the first surface of the first flexible film from the die; e) Moving the thimble in a direction away from the suction head of the suction device; f) moving the suction head of the suction device together with the die to make the die face opposite the first surface of the second flexible film and corresponding to the position a crystal table; g) moving the crystal table toward the tip of the suction device to push the second flexible film to adhere the die to the first surface of the second flexible film; and h) The crystal stage moves in a direction away from the tip of the suction device. The method of grain sorting according to claim 6, wherein the suction device further comprises a driver, and a swing arm disposed on the driver, the nozzle is disposed on the swing arm, and the driver can drive the The swing arm pivots about the jacking direction, whereby the tip is brought to a first position in which step b) can be achieved, and the tip is brought to a second position in which step f) can be achieved. The method of grain sorting according to claim 7, wherein the suction device comprises two such nozzles, wherein one of the tips is in the first position and the other is in the second position . The method of grain sorting according to claim 6, wherein the step f), the step g) and the step h) are performed, and the other is adhered to the first soft The grain of the first surface of the film is displaced relative to the ejector and the thimble to a position corresponding to the urging seat and the thimble. The grain sorting method according to claim 6, wherein in the step d), the thimble is substantially fixed. The grain sorting method according to claim 6, wherein in the step d), when the ejector is still moving, the step e) is performed. A die sorting device for removing a die adhered to a first flexible film from the first flexible film, and then placing the die on a second flexible film, the first softness The film and the second flexible film respectively have a first surface and a second surface facing the first surface opposite to the first surface, the die is located on the first surface of the first flexible film; the die sorting device The invention comprises: a suction device comprising at least one suction head capable of generating a vacuum suction function, the suction head being movable substantially parallel to the first flexible film and the second flexible film, and capable of interacting with the first flexible film The first surface is opposite to the first surface of the second flexible film; the ejector is capable of generating a vacuum suction function and is opposite to the second surface of the first flexible film and substantially Moving along an axial direction perpendicular to the first flexible film and the second flexible film; a thimble is substantially axially disposed along the ejector pin along the ejector, and is coupled to the first soft The second surface of the film is opposite and capable of Axially moving the pushing direction; and a chip mounting table, based opposite the second surface of the second flexible film, the substantially along the pushing capable of axial movement. The lens sorting apparatus of claim 12, wherein the suction device further comprises a driver, and a swing arm disposed on the driver, the nozzle is disposed on the swing arm, and the driver can drive the The swing arm swings about the thrust axial direction, so that the suction head can be driven to a first position opposite to the first surface of the first flexible film, and can also be driven to a second soft film A surface is opposite the second position. The grain sorting apparatus of claim 13, wherein the suction device comprises two such a tip, wherein one of the tips is located in the first position, and the other of the tips is located in the second position . The die sorting apparatus according to any one of claims 12 to 14, wherein the ejector pin and the ejector pin are configured to simultaneously move from a preparatory position toward a tip of the suction device to a tip Pushing the first soft film and the die to push the die to the tip, and then the pusher and the pin move away from the push position and move toward the preparatory position. Thereby the crystal grain is separated from the first soft film. The grain sorting apparatus of claim 15, wherein the thimble is substantially stationary during movement of the ejector from the push-up position to the preparatory position. The grain sorting apparatus of claim 15, wherein the thimble is moved away from the push position when the ejector has not been stopped at the preparatory position.