TWM427666U - Die pickup device - Google Patents

Die pickup device Download PDF

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Publication number
TWM427666U
TWM427666U TW100220221U TW100220221U TWM427666U TW M427666 U TWM427666 U TW M427666U TW 100220221 U TW100220221 U TW 100220221U TW 100220221 U TW100220221 U TW 100220221U TW M427666 U TWM427666 U TW M427666U
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Taiwan
Prior art keywords
film
pick
picking
die
stage
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TW100220221U
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Chinese (zh)
Inventor
Pei-Feng Huang
Jia-Bin Yang
dao-xin Lin
Cong-Xian Fang
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Gillion Technology Corp
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Priority to TW100220221U priority Critical patent/TWM427666U/en
Publication of TWM427666U publication Critical patent/TWM427666U/en

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Description

M427666 五、新型說明: 【新型所屬之技術領域】 本新型是關於一種拾取裝置,特別是指一種以黏著方 式挑除不良晶粒之晶粒拾取裝置。 【先前技術】 在一般晶圓的製程中’晶圓經過磊晶形成半導體結構 後’通常會切割成一顆顆半導體晶粒(以下簡稱晶粒),再將 晶粒排列地黏在一俗稱藍膜(blue tape)的承載黏膜上,之後 對晶粒進行品質檢測,並且將有瑕疵的晶粒挑除。 參閱圖1,是顯示一種習知晶粒檢測拾取機2 ,該晶粒 檢測拾取機2可供一承載黏膜U擺放,同時檢測黏貼在該 承載黏膜11上的數個晶粒10的品質,當發現晶粒1〇有瑕 疵時再予以挑除。而該晶粒檢測拾取機2包含一個位於下 方的拾取裝置21,以及一個位於上方的檢測裝置22。該拾 取裝置21包括一個位於該承載黏膜u下方並可產生負壓的 吸附座211、一個安裝在所述吸附座211之一通孔212内並 可上下往復移動的頂針213,以及一個位在該吸附座2ιι上 方的黏取單元214,該黏取單元214具有一個放膜輪215、 個收膜輪216,以及一個捲收在該放膜輪215及收膜輪 216之間的拾取黏膜217,前述拾取黏膜Η?亦具有黏著性 所述檢/則裝置22是利用光檢測方式檢測該等晶粒丨〇的 。《質,由於本新型之改良與如何檢測晶粒1〇品質無關,不 再詳述。 s知尨取裝置21在使用時,黏貼有晶粒10的承載黏 3 M427666 膜u是吸附在該吸附座211之頂面’當檢測結果發現晶粒 ⑺有缺損時,可選擇移動該承載黏膜u或者移動該吸附座 21〗,使該吸附座211之通孔212對應有瑕疵的晶粒1〇,之 後驅動該頂針213上移,將有瑕疵的晶粒1〇往上頂撐並黏 貼在6亥拾取黏膜217的下表面,由於在該頂針213頂起該 晶粒10的過程中,該晶粒1〇的底面周圍會逐漸地和同樣 具有黏性之承載黏膜n分離,故前述頂撐的動作可以讓具 有瑕疵的晶粒10轉黏到該拾取黏膜217的下方,藉由該放 膜輪215及收膜輪216的配合捲收,即可將不良的晶粒1〇 的黏收在該拾取黏膜217的下方。 習知晶粒檢測拾取機2的拾取裝置21雖然可以黏收具 有瑕疵的晶粒10,但是在拾取晶粒1〇的過程中,該頂針 213需要將承載黏膜丨丨往上頂起,即為了方便將該晶粒忉 自具有黏性的承載黏膜11上剝離,該吸附座2 i丨需要產生 負壓將承載黏膜11吸住,同時以頂針213將該承載黏膜“ 連同晶粒10往上頂起,此種拾取結構及拾取方式會造成該 承載黏膜11之局部區域變形,嚴重時會戳破該承載黏膜η ,由於前述承載黏膜11會連同晶粒1〇 一起送到客戶端,屬 於產品的一部分,當該承載黏膜u的局部區域有破損時雖 然無損於晶粒10的品質,但整體呈現的品質觀感不佳,嚴 重時會遭到客戶退貨。 【新型内容】 本新型之目的是提供一種可確保承載黏膜之完整性及 品質的晶粒拾取裝置。 M427666M427666 V. New description: [New technical field] The present invention relates to a pick-up device, and more particularly to a die pick-up device for picking up defective grains by adhesive means. [Prior Art] In the general wafer process, after the wafer is epitaxially formed into a semiconductor structure, it is usually cut into individual semiconductor grains (hereinafter referred to as grains), and then the crystal grains are arranged in a common order. (blue tape) is carried on the mucus, and then the quality of the crystal grains is detected, and the defective crystal grains are removed. Referring to FIG. 1, there is shown a conventional crystal grain detecting picker 2 which can be placed on a carrying film U and simultaneously detects the quality of a plurality of crystal grains 10 adhered to the carrying film 11, when found If the grain 1 is defective, it will be removed. The die detecting picker 2 includes a picking device 21 located below, and a detecting device 22 located above. The picking device 21 includes a suction seat 211 located under the carrier film u and capable of generating a negative pressure, a thimble 213 mounted in the through hole 212 of the adsorption seat 211 and reciprocally movable up and down, and a position in the adsorption a stripping unit 214 above the 2 inch, the sticking unit 214 has a film releasing wheel 215, a film collecting wheel 216, and a picking film 217 wound between the film releasing wheel 215 and the film collecting wheel 216, the foregoing Picking up the mucous membranes is also adhesive. The inspection/detection device 22 detects the grain defects by photodetection. "Quality, because the improvement of this new type has nothing to do with how to detect the quality of the grain, it will not be detailed. When the device 21 is in use, the load-carrying 3 M427666 film u adhered to the die 10 is adsorbed on the top surface of the adsorption seat 211. When the detection result is that the die (7) is defective, the carrier film can be selectively moved. u or moving the adsorption seat 21, so that the through hole 212 of the adsorption seat 211 corresponds to the 晶粒1 晶粒, then the ejector 213 is driven up, and the 晶粒 晶粒 晶粒 晶粒 并 并 并 并 并 并 并 并 并6H picks up the lower surface of the mucous membrane 217. Since the apex 213 is lifted up in the process of lifting the die 10, the bottom surface of the die 1 逐渐 is gradually separated from the same viscous carrier film n, so the above-mentioned top support The action of the die 10 can be adhered to the lower side of the pick-up film 217, and the unloading of the defective die 1 can be achieved by the cooperation of the film-release wheel 215 and the film-retracting wheel 216. The pickup film 217 is below the pickup. Although the pick-up device 21 of the conventional grain detecting picker 2 can adhere the die 10 having the germanium, in the process of picking up the die 1 , the pin 213 needs to push the carrying film up, that is, for convenience The die 忉 is peeled off from the viscous carrier film 11 , and the absorbing pad 2 丨 needs to generate a negative pressure to suck the carrier film 11 while the thimble 213 pushes the carrier film up together with the die 10 . The pick-up structure and the pick-up method cause deformation of a part of the carrier film 11 , and in severe cases, the carrier film η is punctured, since the carrier film 11 is sent to the client together with the die 1 , which is part of the product. When the local area of the bearing mucus u is damaged, although the quality of the crystal grain 10 is not impaired, the quality of the overall appearance is not good, and in serious cases, it will be returned by the customer. [New content] The purpose of the novel is to provide a guarantee A die picking device that carries the integrity and quality of the mucosa. M427666

本新型之晶粒拾取裝置是用來挑除一承載黏膜上之一 晶粒,並包含··一基架、一個安震在該基架上並承載該承 載黏膜及晶粒的載台機構,以及一個架設在該基架上並對 應該載台機構的拾取機構。該拾取機構包括一個黏取單元 ’以及-個將祕取單元之-拾取㈣往該晶粒方向推送 以黏貼該晶粒的取粒單元。 本新型的有益功效在於:由於本新型是利用該取粒單 元讓該拾取黏膜靠近並黏貼該晶粒,上述結構及作動方式 由於不需要頂擇承載晶粒的承載黏膜,因&,前述設計可 、避免在取下不良晶粒時戳破或戳傷該承載黏膜,藉此達 到維護該承載黏臈的外觀完整性及品質的目的。【實施方式】 有關本新型之前述及其他技術内容、特點與功效,在 以下配合參考圖式之較佳實施例的詳細說明中將可清楚 的呈現。The novel crystal pick-up device is used for picking up a die on a carrier film, and comprises a base frame, a stage mechanism for accommodating the substrate and carrying the bearing film and the die, And a picking mechanism mounted on the base frame and corresponding to the stage mechanism. The pick-up mechanism includes a pick-up unit and a pick-up unit that pushes (4) the pick-up unit to the die direction to adhere the die. The beneficial effect of the novel is that: the present invention utilizes the granulating unit to bring the pick-up mucous membrane close to and adhere to the crystal grain, and the above structure and the operation mode do not need to select the bearing mu of the bearing crystal grain, because the above design It can avoid the puncture or puncture of the bearing film when removing the bad crystal grains, thereby achieving the purpose of maintaining the appearance integrity and quality of the bearing adhesive. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments.

>閲圖2 3、4,本新型晶粒拾取裝置之一較佳實施例 可供一黏貼有數個晶粒31之承載黏膜32擺放,並吸取該 承載黏膜32上的晶粒31 ’該晶粒拾取裝置包含—基架*、 -個安裝在該基架4上並供所述承載黏膜32鋪放的載台機 構5個懸掛在該基架4上並與該載台機構$上下對 應的拾取機構6。 本實施例之基架4包括—片基板4ι 架設在該基板41上的立柱42。 以及兩支間隔地 本實施例之载台機構5 包括一個安裝在該基板41頂面 5 M427666 並沿著一第一方向50設置的載台滑座51、一個安裝在所述 載台滑座51上方的載台52’以及一個驅動該載台52沿著 該第一方向50往復移動的載台壓缸53,該載台52具有一 個位於下方的加熱板52卜以及一個與該加熱板521二下疊 靠結合的吸附板522’該吸附板522具有一個供所述承載黏 膜32鋪放的承載面523,以及數個可產生負壓地吸附該承 載黏膜32的吸附孔524。本實施例之載台壓缸53為一般的 氣壓缸,由於利用氣壓缸驅動構件水平移動為已知技術, 不再說明。 本實施例之拾取機構6包括一個可沿著一直立方向6〇 升降地架設在該基架4之該等立柱42間的升降座61、一個 安裝在該升降座61前方的平移單元62,以及安裝在所述平 移單元62上的一黏取單元64、一取粒單元65。該升降座 61具有兩個分別藉-定位件613滑套地安裝在該等立柱42 的其中之上的滑套部611 ’以及一個連接在該等滑套部 611前方的升降板部612,藉此可依據需要調整該升降座6ι 的高度。而該平移單元62具有一個架設在該升降座61之 升降板部612前方的平移滑座621、-個架設在該平移滑座 621前方的平移架板622,以及—個驅動該平移架板⑵沿 著一第二方向63往復移動的平移壓缸023,上述第二方向 63垂直於該第一方向5〇。 本實%例之黏取單元64具有一個架設在平移架板622 前方的放膜滚輪641 —個驅動該放膜滚輪641旋轉的放膜 馬達642、—個與該放膜滾輪641左右間隔的收膜滾輪643 6 M427666 、一個驅動該收膜滾輪643同步旋轉的收臈馬達644、兩個 左右間隔地安裝在該平移架板622上並鄰近下方的導輪 、一個鄰近該收膜滾輪643的張力輪組646、一個對應該張 力輪組646之步進馬達647,以及一個捲收在該放膜滾輪 641上並繞經該等導輪645、該張力輪組646後捲收在該收 膜滚輪643上的拾取點膜648。 而該取粒單元65 *有一個固定地安裝在該平移架板> Referring to Figures 2 and 3, a preferred embodiment of the novel die picking device can be placed on a carrier film 32 having a plurality of die 31 adhered thereto, and the die 31 on the carrier film 32 is sucked. The die picking device includes a base frame*, a stage mechanism 5 mounted on the base frame 4 and disposed for the load bearing film 32, and suspended on the base frame 4 and corresponding to the stage mechanism Picking mechanism 6. The pedestal 4 of the present embodiment includes a column 42 on which the substrate 4 ー is mounted. And the two stages of the stage mechanism 5 of the present embodiment include a stage slider 51 mounted on the top surface 5 M427666 of the substrate 41 and disposed along a first direction 50, and one mounted on the stage slider 51. An upper stage 52' and a stage cylinder 53 for driving the stage 52 to reciprocate along the first direction 50. The stage 52 has a heating plate 52 located below and a heating plate 521 The adsorption plate 522' is stacked on the lower side of the adsorption plate 522. The adsorption plate 522 has a bearing surface 523 for depositing the carrier film 32, and a plurality of adsorption holes 524 for adsorbing the carrier film 32 under negative pressure. The stage cylinder 53 of the present embodiment is a general pneumatic cylinder, and since the horizontal movement of the pneumatic cylinder driving member is known as a known technique, it will not be described. The picking mechanism 6 of the present embodiment includes a lifting base 61 that is erected between the uprights 42 of the base frame 4 in an upright direction 6 〇, a translation unit 62 mounted in front of the lifting base 61, and An adhesive unit 64 and a granule unit 65 are mounted on the translating unit 62. The lifting base 61 has two sliding sleeve portions 611 ′ which are respectively slidably mounted on the upper pillars 42 by a positioning member 613 and a lifting plate portion 612 connected in front of the sliding sleeve portions 611. This can adjust the height of the lifting seat 6ι as needed. The translating unit 62 has a translating slide 621 which is arranged in front of the lifting plate portion 612 of the lifting base 61, a translating plate 622 which is arranged in front of the translating sliding block 621, and a driving translating plate (2). The translation cylinder 023 reciprocates along a second direction 63, the second direction 63 being perpendicular to the first direction 5 〇. The sticking unit 64 of the present embodiment has a film releasing roller 641 which is disposed in front of the translating frame 622, and a film releasing motor 642 which drives the filming roller 641 to rotate, and a film is spaced apart from the film releasing roller 641. a film roller 643 6 M427666, a retracting motor 644 that drives the reeling roller 643 to rotate synchronously, two tension rollers mounted on the translating frame 622 and spaced adjacent to the lower side, and a tension adjacent to the take-up roller 643 a wheel set 646, a stepping motor 647 corresponding to the tension wheel set 646, and a roll received on the film release roller 641 and wound around the guide wheel 645 and the tension wheel set 646, and then wound up on the take-up roll A pick-up film 648 is placed on 643. And the granule unit 65* has a fixed installation on the translation frame

622前方正中央的較座651 一個安裝在該平移架板 上並位於該固定座651正下方的吸附座652,以及一個安裝 在該口疋I 651上並可往復運動地穿出該吸附座的取 粒桿653,而該拾取黏膜648是通過並貼附在吸附座的 下方。a seat 651 at the center of the front of the 622 is a suction seat 652 mounted on the translation frame and directly below the fixing base 651, and a suction seat 652 mounted on the port I 651 and reciprocally extending through the suction seat The pellet 653 is taken and the pick-up mucous membrane 648 is passed through and attached to the underside of the adsorption block.

令1她例之晶粒拾取襄置在使用時,頂面點貼有晶粒 31的承載黏膜32是鋪放並吸附在該載台52的上方,上述 7載口 52可党到該載台壓缸53的驅動沿著該第-方向別往 復移動,而該拾取機構6則是懸空地架設在該基架4之該 :::42之間,並可藉由該等定位件613的旋鬆及螺緊調 正以移架板622的高度,即調签該點取單元64及取粒單 =65的高度,使其和該等晶粒31之間具有適當的高度。 Π移架板622亦受到該平繼⑵的驅動而沿著該 :一方向63往復移動,故可因此改變該取粒單元65及載 在第-及第二方向5〇、63的相對位置。 .^圖 田本實施例之晶粒拾取裝置在挑除品質 不良的晶粒3"夺,該載台壓缸53及平移壓紅⑶會受到 M427666 電腦控制分別帶動該載台52及平移架板622移動,使該取 粒單元65位在不良之晶粒31的正上方,之後該取粒桿653 就會^:到驅動下移,並因此帶動該拾取黏膜648的局部區 域下移且壓貼在該晶粒31的上方,由於該載台52之吸附 板522的下方為加熱板521,此加熱板521可以稍為降低該 承載黏膜32的黏性,使該晶粒3丨更容易被撕離該承載黏 膜32地黏貼在該拾取黏膜648上,因此,當該取粒桿653 上移時,刖述品質不良的晶粒31就會被吸附在該拾取黏膜 648上,之後藉由該收膜馬達644、放膜馬達642以及步進 馬達647的同步驅動,帶動該拾取黏膜648移動一設定的 行程。 在設計上,本新型在帶動該拾取黏膜648移動的過程 中,只要使該收膜滾輪643具有動力,即可達到預期之目 的,本實施例特別增設該放膜馬達642及步進馬達647,則 可進一步確保捲收及放膜的精確性,同時避免該拾取黏膜 648產生鬆垮影響到黏取的順暢性。 由以上說明可知,本新型該晶粒拾取裝置的設計不僅 結構創新,在挑除晶粒31的過程中,由於是帶動該拾取黏 膜648下移來黏貼晶粒31,因此,可以確保俗稱藍膜之承 載黏膜32的完整性,避免承載黏膜32在挑除品質不良的 晶粒31 _被戳破,故本新型確為一新穎並可維護承載黏膜 32的外觀完整性及品質的晶粒拾取裝置。 惟以上所述者,僅為本新型之較佳實施例而已,當不 能以此限定本新型實施之範圍,即大凡依本新型申請專利 8 M427666 範圍及新型說明内容所作之簡單的等效變化與修飾, 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 .圖1是一種習知晶粒檢測拾取機的一使用狀態參考圖 9 圖2是本新型晶粒拾取裝置之一較佳實施例的立體示 意圖; ' 圖3是該較佳實施例之一前視示意圖; 圖4是該較佳實施例之一側視示意圖;及 圖5是該較佳實施例之一使用狀態參考圖,顯示該晶 孝立拾取裝置在挑除一晶粒的狀況。 M427666 【主要元件符號說明】 31 晶粒 613 定位件 32 承載黏膜 62 平移單元 4 基架 621 平移滑座 41 基板 622 平移架板 42 立柱 623 平移壓缸 5 載台機構 63 第二方向 50 第一方向 64 黏取單元 51 載台滑座 641 放膜滚輪 52 載台 642 放膜馬達 521 加熱板 643 收膜滾輪 522 吸附板 644 收膜馬達 523 承載面 645 導輪 524 吸附孔 646 張力輪組 53 載台壓缸 647 步進馬達 6 拾取機構 648 拾取黏膜 60 直立方向 65 取粒單元 61 升降座 651 固定座 611 滑套部 652 吸附座 612 升降板部 653 取粒桿 10When the die picking device of the example 1 is used, the carrying film 32 with the die 31 attached to the top surface is laid and adsorbed on the top of the stage 52, and the 7-port 52 can be attached to the stage. The driving of the pressure cylinder 53 is reciprocated along the first direction, and the picking mechanism 6 is suspended between the bases of the base frame 4:::42, and can be rotated by the positioning members 613. The loose and the screw are tightly adjusted to the height of the shifting plate 622, that is, the height of the picking unit 64 and the granules=65, so as to have an appropriate height with the dies 31. The shifting plate 622 is also driven by the flat (2) to reciprocate along the one direction 63, so that the relative position of the granule unit 65 and the first and second directions 5 〇, 63 can be changed. ^图图图 The grain picking device of this embodiment picks up the poor quality die 3", the stage pressure cylinder 53 and the translation pressure red (3) are controlled by the M427666 computer to drive the stage 52 and the translation frame respectively. The movement of 622 causes the granule unit 65 to be positioned directly above the defective dies 31, after which the granule 653 is moved down to drive, and thus the local area of the picking 544 is moved down and pressed. Above the die 31, since the lower portion of the adsorption plate 522 of the stage 52 is a heating plate 521, the heating plate 521 can slightly reduce the viscosity of the bearing film 32, so that the die 3 is more easily torn off. The carrier film 32 is adhered to the pick-up film 648. Therefore, when the pick-up bar 653 is moved up, the poor-quality die 31 is adsorbed on the pick-up film 648, and then the film is removed by the film. The synchronous driving of the motor 644, the film discharge motor 642 and the stepping motor 647 drives the pickup film 648 to move by a set stroke. In the design, the present invention can achieve the intended purpose in the process of moving the pick-up film 648, and the film-sending motor 642 and the stepping motor 647 are added to the embodiment. The accuracy of the take-up and film release can be further ensured, and the looseness of the pick-up film 648 can be prevented from affecting the smoothness of the adhesive. It can be seen from the above description that the design of the novel crystal pick-up device is not only structurally innovative, but also in the process of picking up the die 31, since the pick-up film 648 is moved downward to adhere the die 31, the blue film can be ensured. The integrity of the bearing film 32 prevents the carrier film 32 from being punctured in the poor quality of the die 31. Therefore, the present invention is a novel and can maintain the appearance and quality of the die 32. . However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change made by the scope of the new application patent 8 M427666 and the new description content is Modifications are within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a conventional use of a conventional crystal grain picking and picking machine. FIG. 2 is a perspective view of a preferred embodiment of the present invention. FIG. 3 is a preferred embodiment of the present invention. FIG. 4 is a side view of the preferred embodiment; and FIG. 5 is a view of a state of use of the preferred embodiment, showing that the crystal cleavage device picks up a die The situation. M427666 [Description of main component symbols] 31 Die 613 Positioning member 32 Carrying mucous membrane 62 Translation unit 4 Base frame 621 Translation slide 41 Substrate 622 Translation frame 42 Column 623 Translation cylinder 5 Stage mechanism 63 Second direction 50 First direction 64 Adhesive unit 51 Stage slide 641 Film release roller 52 Stage 642 Film release motor 521 Heating plate 643 Film take-up roller 522 Adsorption plate 644 Film-receiving motor 523 Bearing surface 645 Guide wheel 524 Adsorption hole 646 Tension wheel set 53 Stage Cylinder 647 Stepping motor 6 Picking mechanism 648 Picking up the mucous membrane 60 Upright direction 65 Grabber unit 61 Lifting seat 651 Mounting seat 611 Sleeve part 652 Adsorption seat 612 Lifting plate part 653 Pellet rod 10

Claims (1)

M427666 、申請專利範圍: 粒 一種晶粒拾取裝置,用來挑除一承載黏膜上之 並包含: 一基架; 一載台機構,裝設在該基架上’並包括—個用來承 载該承載黏膜及晶粒的載台;及 一拾取機構,架設在該基架上並對應該載台,包括 一個具有一拾取黏膜的黏取單元,以及一個將該拾取黏 膜往該晶粒方向推送以黏貼該晶粒的取粒單元。 2.依據申請專利範圍第丨項所述之晶粒拾取裝置其中, 該取粒單元具有一個固定座、一個具有一供該拾取黏膜 貼附的吸附座,以及一個架設在該固定座上並可往復運 用地將貼附在該吸附座之拾取黏膜往該載台方向推送的 取粒桿。 3 -依據申請專利範圍第2項所述之晶粒拾取裝置,其中, 該黏取單元還具有一捲收該拾取黏膜的放膜滾輪、一個 用來捲收已黏取有晶粒之拾取黏膜的收膜滾輪、一個帶 動該收膜滾輪旋轉以捲取該拾取黏膜的收膜馬遠、一個 賦予該拾取黏膜張力的張力輪組,以及一個驅動該拾取 黏膜前進的步進馬達。 4.依據申請專利範圍第3項所述之晶粒拾取裝置,其中, 該黏取單元還具有一個帶動該放膜滾輪旋轉的放膜馬達 ,該放膜馬達、該收膜馬達及該步進馬達是同步作動。 5 ·依據申請專利範圍第1項或第4項所述之晶粒拾取裝置 11 ^中’該基架包括—基板,以及兩支自該基板往上突 柱’而該載台機構還包括一個安裝在該基板上的 口滑座’以及一個驅動該載台在該載台滑座上滑移的 載台壓缸’而該拾取機構還包括一個架設在該等立柱間 :升降座α及一個安裝在該升降座上並供所述黏取單 元及取粒單元組裝的平移單元,該平移單元具有一個安 裝在所述料座上时移滑座一供帅取單元及該取 粒單元安裝的平移架板,以及一個驅動該平移架板在該 平移滑座上滑移的平移壓缸,其中,該載台可沿著一第 一方向往復移動,而該平移架板可沿著一垂直於第一方 向之第一方向往復移動。 6. 依據申請專利範圍第5項所述之晶粒拾取裝置,其中, 该載台具有一個位於下方的加熱板,以及一個位於上方 並可吸附該承载黏膜的吸附板。M427666, the scope of patent application: a grain picking device for picking up a carrier film and comprising: a pedestal; a stage mechanism mounted on the pedestal 'and including one for carrying the a loading platform for carrying the mucous membrane and the die; and a picking mechanism mounted on the base frame and corresponding to the loading platform, including a pick-up unit having a pick-up mucous film, and a pushing the pick-up film toward the die direction Adhesive unit for adhering the crystal grains. 2. The die picking device according to the invention of claim 2, wherein the granulating unit has a fixing seat, a absorbing seat for attaching the picking film, and a pedestal mounted on the fixing seat The pelletizing rod attached to the picking film of the suction seat is pushed to the stage in a reciprocating manner. The die picking device according to claim 2, wherein the sticking unit further has a film releasing roller for taking up the picking film, and a picking film for picking up the adhered crystal grain. a film-receiving roller, a film-removing wheel that drives the film-rolling roller to rotate the pick-up film, a tension wheel set that imparts tension to the pick-up film, and a stepping motor that drives the pick-up film to advance. 4. The die picking device according to claim 3, wherein the sticking unit further has a film discharging motor for driving the film rolling roller, the film discharging motor, the film collecting motor and the stepping step The motor is synchronized. 5. The die picking device 11 according to claim 1 or 4, wherein the base comprises a substrate, and two from the substrate, the stage mechanism further includes a a port slide mounted on the base plate and a stage cylinder that drives the stage to slide on the stage slide, and the picking mechanism further includes a erected between the columns: a lift base α and a a translating unit mounted on the lifting seat and assembled by the sticking unit and the granulating unit, the translating unit having a time shifting slide seat mounted on the sump and a sculpt unit mounted a translating plate, and a translating cylinder that drives the translating plate to slide on the translating slide, wherein the stage is reciprocable along a first direction, and the translating plate can be perpendicular to The first direction of the first direction reciprocates. 6. The die pick-up device of claim 5, wherein the stage has a lower heating plate and an adsorption plate positioned above and capable of adsorbing the carrier film. 依據申請專利範圍第1項所述之晶粒拾取裝置,其中, °亥载台具有一個位於下方的加熱板,以及一個位於上方 並可吸附該承載黏膜的吸附板。The die picking device according to claim 1, wherein the gantry stage has a lower heating plate and an adsorption plate located above and capable of adsorbing the carrier film. 依據申請專利範圍第1項所述之晶粒拾取裝置,其中, 該黏取單元還具有一捲收該拾取黏膜的放膜滾輪、一個 用來捲收已黏取有晶粒之拾取黏膜的收膜滚輪、一個帶 動該收膜滾輪旋轉以捲取該拾取黏膜的收膜馬達、一個 賦予該拾取黏膜張力的張力輪組,以及一個驅動該拾取 點膜前進的步進馬達。 12The die picking device according to the first aspect of the invention, wherein the pick-up unit further has a film-rolling roller for taking up the pick-up film, and a pick-up film for picking up the film with the film adhered. a film roller, a film-splitting motor that drives the film-rolling roller to rotate the film to pick up the pickup film, a tension wheel set that imparts tension to the pick-up film, and a stepping motor that drives the film of the pick-up point. 12
TW100220221U 2011-10-27 2011-10-27 Die pickup device TWM427666U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624905B (en) * 2017-01-23 2018-05-21 Multi-die press
TWI728947B (en) * 2021-01-29 2021-05-21 梭特科技股份有限公司 Method for adjusting distances among chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624905B (en) * 2017-01-23 2018-05-21 Multi-die press
TWI728947B (en) * 2021-01-29 2021-05-21 梭特科技股份有限公司 Method for adjusting distances among chips

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