TWM432999U - Circuit board and a storage device using the circuit board - Google Patents

Circuit board and a storage device using the circuit board

Info

Publication number
TWM432999U
TWM432999U TW100221567U TW100221567U TWM432999U TW M432999 U TWM432999 U TW M432999U TW 100221567 U TW100221567 U TW 100221567U TW 100221567 U TW100221567 U TW 100221567U TW M432999 U TWM432999 U TW M432999U
Authority
TW
Taiwan
Prior art keywords
circuit board
storage device
board
circuit
storage
Prior art date
Application number
TW100221567U
Other languages
English (en)
Inventor
Chih-Sheng Huang
Original Assignee
Innostor Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innostor Tech Corporation filed Critical Innostor Tech Corporation
Priority to TW100221567U priority Critical patent/TWM432999U/zh
Priority to US13/429,450 priority patent/US20130118783A1/en
Publication of TWM432999U publication Critical patent/TWM432999U/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • H01R12/718Contact members provided on the PCB without an insulating housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0397Tab
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09409Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09445Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1028Thin metal strips as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
TW100221567U 2011-11-16 2011-11-16 Circuit board and a storage device using the circuit board TWM432999U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100221567U TWM432999U (en) 2011-11-16 2011-11-16 Circuit board and a storage device using the circuit board
US13/429,450 US20130118783A1 (en) 2011-11-16 2012-03-26 Circuit board and storage device having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100221567U TWM432999U (en) 2011-11-16 2011-11-16 Circuit board and a storage device using the circuit board

Publications (1)

Publication Number Publication Date
TWM432999U true TWM432999U (en) 2012-07-01

Family

ID=48279532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100221567U TWM432999U (en) 2011-11-16 2011-11-16 Circuit board and a storage device using the circuit board

Country Status (2)

Country Link
US (1) US20130118783A1 (zh)
TW (1) TWM432999U (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102440366B1 (ko) * 2018-01-04 2022-09-05 삼성전자주식회사 메모리 카드 및 이를 포함하는 전자 장치
US10847909B2 (en) 2019-02-21 2020-11-24 Western Digital Technologies, Inc. Data storage devices and connectors for same
CN112151081B (zh) 2019-06-26 2022-05-31 西部数据技术公司 数据存储设备和用于其的连接器

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Also Published As

Publication number Publication date
US20130118783A1 (en) 2013-05-16

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees