M430144 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱結構，特別是一種應用於 電子裝置且易於清理之可清潔式散熱結構。 【先前技術】 現今大部分電子裝置，仍使用風扇配合散熱鰭片 等元件所構成之散熱模組，來達到裝置内部之散熱功 能。由於空氣中佈滿了灰塵等雜質，對於需要運用空氣 產生熱對流效果的風扇而言，很容易在風扇或鰭片上積 聚灰塵，灰塵一多會導致散熱效能降低、風扇轉動噪音 變大等，更甚者將會使風扇停止轉動而造成裝置過熱等 狀況。 為防止上述情況發生，使用者必須定期清理裝置 内部，避免灰塵嚴重累積的情況，此時需要將裝置殼體 拆開以便於清理。然而對於可攜式電子裝置（例如筆記 型電腦、平板電腦等）來說，目前均採輕薄化的趨勢發 展，其内部元件配置較為複雜精密，並且會考量整體電 磁屏蔽等問題。一旦使用者自行拆開殼體，可能會因為 組裝不易而影響裝置之使用穩定性，甚至無法正常運作 等問題，對使用者來說極為困擾。 因此，如何能設計出讓使用者容易清理之散熱結 3 M430144 構，以防止灰塵等雜質之累積，實為一值得研究之課題。 【新型内容】 本創作之主要目的係提供一種應用於電子裝置且 易於清理之可清潔式散熱結構。 本創作之另一目的係提供一種應用前述可清潔式 散熱結構之電子裝置。 為達成上述之目的，本創作之可清潔式散熱結構 係應用於電子裝置之散熱模組，散熱模組包括風扇及熱 導管。可清潔式散熱結構包括主體、鰭片模組及操作 件；主體包括貫通部，貫通部以供容置熱導管；鰭片模 組係結合於主體之外表面，鰭片模組對應於風扇之出風 口位置設置；操作件係連接於主體。藉由操作操作件， 使得主體帶動鰭片模組相對於熱導管轉動，以調整鰭片 模組之位置。 _· 本創作之電子裝置包括殼體、至少一發熱元件及 散熱模組，至少一發熱元件及散熱模組係設置於殼體 内。散熱模組包括至少一熱導管、風扇及如前所述之可 清潔式散熱結構，至少一熱導管係接觸至少一發熱元件 以導熱，並將熱傳遞至可清潔式散熱結構之主體及鰭片 模組；風扇係對應於可清潔式散熱結構之鰭片模組而設 置。藉此設計，使用者可操作操作件以調整鰭片模組之 4 M430144 位置，以便於針對鰭片模組内部朝風扇之一側進行清 潔。 由於本創作構造新穎，能提供產業上利用，且確 有增進功效，故依法申請新型專利。 【實施方式】 為了讓本創作之上述和其他目的、特徵和優點能 更明顯易懂，下文特舉出本創作之具體實施例，並配合 所附圖式，作詳細說明如下。 本創作之可清潔式散熱結構係應用於電子裝置， 在下述本創作之實施例中，電子裝置係以筆記型電腦為 例加以說明，但電子裝置亦可為桌上型電腦、小筆電、 平板電腦或或其他類似之電子裝置，本創作並不以此為 限。 請先參考圖1係本創作之可清潔式散熱結構1應 用於電子裝置100之一實施例之系統方塊圖。如圖1所 示，電子裝置100包括殼體110、至少一發熱元件120 及散熱模組130。至少一發熱元件120及散熱模組130 係設置於殼體110内。散熱模組130包括至少一熱導管 131、風扇132及可清潔式散熱結構1，風扇132係對 應於可清潔式散熱結構1之位置而設置。電子裝置1〇〇 係利用各熱導管131對應接觸於各發熱元件120，以藉 5 M430144 由各熱導管131將各發熱元件120所產生的熱導出以傳 遞至可清潔式散熱結構1，再利用風扇132對可清潔式 散熱結構1吹送空氣進行冷卻，並將熱空氣送出至殼體 110外。此處發熱元件120可為CPU、GPU或其他處理 晶片等容易產生而溫之元件*但本創作不以此為限。 請參考圖2係本創作之可清潔式散熱結構1之結 構爆炸圖。如圖2所示，在本創作之一實施例中，本創 作之可清潔式散熱結構1包括主體10、鰭片模組20及 操作件30。主體10包括貫通部11，貫通部11以供容 置前述之熱導管131，藉由熱導管131與貫通部11内 面之接觸，讓熱導管131將熱量傳遞至主體10。其中 貫通部11之徑長不小於熱導管131之徑長，以保持兩 者間之接觸狀態。在本創作之一實施例中，主體總長度 約為7cm，而貫通部11之徑長約為6mm至8mm之間， 但依設計不同，主體10之對應尺寸大小亦會隨之改變。 此外，為增加導熱效果及填補熱導管131與貫通. 部11間之間隙，於兩者間更可包括一散熱材料，例如 一般常見之散熱膏等，此散熱材料係以塗布方式設置於 貫通部11内面或熱導管131之外表面，但本創作不以 此為限。 鰭片模組20係結合於主體10之外表面，鰭片模組 20係由複數鰭片所構成，相鄰鰭片間係保持一間隙以 6 排列設置。其中鰭片模組20對應於風扇132之出風口 位置設置，以便藉由風扇132所吹出之冷空氣，將自主 體10傳遞至鰭片模組20之熱量帶走。在本創作之一實 施例中，鰭片模組20之各鰭片係採用一圓形鰭片之設 計，以便於其被調整過程中不易與殼體110或其他元件 碰觸而受干擾，但本創作不以此為限，鰭片模組20之 各鰭片亦可採用其他形式如矩形、任意曲面或其他能提 供較大散熱面積之形式。 此外，前述主體10與鰭片模組20係採用導熱性 佳、熱阻係數低之金屬材料來製成，例如銅、鋁等，以 提高其散熱效果，但主體10與鰭片模組20亦可使用其 他具類似散熱效果之材料所取代。 操作件30係連接於主體10，使得主體10及鰭片 模組20可隨著操作件30而產生連動效果。在本創作之 一實施例中，操作件30係為一旋轉件，例如轉盤，方 便使用者轉動以進行對應調整，但操作件30亦可採用 桿件、推移件等形式，不以本實施例為限。而操作件 30可採用緊配或黏合等方式，連接於主體10。此外， 操作件30之外侧更包括複數止滑部31，以便於使用者 以手動方式進行操作，各止滑部31可為如圖所示之凸 部，或是外形可容納指尖以供操作之凹部等類似結構， 亦可採用橡膠圈等部件套設於操作件30上，不以本實 施例為限。 請參考圖3係本創作之可清潔式散熱結構1之操作 示意圖。如圖3所示，使用者可手動轉動操作件30， 藉由此操作使得主體10能帶動鰭片模組20相對於熱導 管131轉動，以調整鰭片模組20之位置。由於鰭片模 組20迎向出風口處最容易堆積灰塵等雜質，因此經調 整後可讓原本朝向風扇132之出風口的鰭片模組20部 位朝外翻轉以外露。此時使用者便可利用具有尖端之物 件，例如夾子、筆、竹籤等，以伸入鰭片間的間隙進行 清潔，並且能清潔到鰭片模組20之不同部位，進而達 到本創作之清潔效果。 以下請一併參考圖2、圖3及圖4。圖4係本創作 之電子裝置100之一實施例之局部示意圖。如圖2及圖 4所示，本創作之電子裝置100包括殼體110及散熱模 組，散熱模組係設置於殼體110内。散熱模組包括至少 一熱導管131、風扇132及如前所述之可清潔式散熱結. 構1，至少一熱導管131係將熱傳導至可清潔式散熱結 構1之主體10及鰭片模組20，並藉由風扇132吹送空 氣以將熱導出殼體100外。可清潔式散熱結構1之相關 結構及操作狀態請參照前述說明，在此不多加贅述。 在本創作之一實施例中，殼體110包括掀蓋111， 係對應於鰭片模組20設置，且掀蓋111係樞接於殼體 M430144 20外露以方便使用者進行清潔；又如圖4所示，在掀 蓋111呈關閉狀態時，則隱藏住鰭片模組2(^其中掀蓋 111包括複數出風孔112，用以供掀蓋lu呈關閉狀熊 時’可將熱空氣自複數出風孔112排出。 ~M430144 V. New Description: [New Technology Field] This creation is about a heat dissipation structure, especially a cleanable heat dissipation structure that is easy to clean and applied to electronic devices. [Prior Art] Most of today's electronic devices still use a heat dissipation module composed of a fan and a heat sink fin to achieve the heat dissipation function inside the device. Since the air is covered with dust and other impurities, it is easy for the fan that needs to use the air to generate the heat convection effect to accumulate dust on the fan or the fin. The dust will cause the heat dissipation performance to decrease, the fan rotation noise to become larger, and the like. It will cause the fan to stop rotating and cause the device to overheat. In order to prevent this from happening, the user must periodically clean the inside of the device to avoid serious accumulation of dust. In this case, the device housing needs to be disassembled for cleaning. However, for portable electronic devices (such as notebook computers, tablet computers, etc.), the trend of thinner and lighter is currently being developed, the internal component configuration is more complicated and precise, and the problems of overall electromagnetic shielding are considered. Once the user disassembles the casing by himself, it may be extremely troublesome for the user because of the difficulty in assembly, the stability of the device, and the inability to operate normally. Therefore, how to design a heat-dissipating junction 3 M430144 structure that is easy for the user to clean to prevent accumulation of impurities such as dust is a subject worthy of study. [New content] The main purpose of this creation is to provide a cleanable heat dissipation structure that is applied to an electronic device and is easy to clean. Another object of the present invention is to provide an electronic device using the aforementioned cleanable heat dissipation structure. In order to achieve the above objectives, the cleanable heat dissipation structure of the present invention is applied to a heat dissipation module of an electronic device, and the heat dissipation module includes a fan and a heat pipe. The cleanable heat dissipation structure comprises a main body, a fin module and an operating member; the main body includes a through portion for receiving the heat pipe; the fin module is coupled to the outer surface of the main body, and the fin module corresponds to the fan The outlet position is set; the operating member is connected to the main body. By operating the operating member, the body drives the fin module to rotate relative to the heat pipe to adjust the position of the fin module. The electronic device of the present invention comprises a housing, at least one heating element and a heat dissipation module, and at least one heating element and a heat dissipation module are disposed in the housing. The heat dissipation module includes at least one heat pipe, a fan and a cleanable heat dissipation structure as described above, at least one heat pipe contacting at least one heat generating component to conduct heat, and transferring heat to the body and the fin of the cleanable heat dissipation structure The module is provided corresponding to the fin module of the cleanable heat dissipation structure. With this design, the user can operate the operating member to adjust the position of the M430144 of the fin module so as to clean the inside of the fin module toward one side of the fan. Due to the novel structure of this creation, it can provide industrial use, and it has improved efficiency. Therefore, it applies for a new type of patent according to law. [Embodiment] The above and other objects, features and advantages of the present invention will become more apparent and understood. The cleanable heat dissipation structure of the present invention is applied to an electronic device. In the following embodiments of the present invention, the electronic device is described by taking a notebook computer as an example, but the electronic device may also be a desktop computer or a small notebook. This creation is not limited to tablets or other similar electronic devices. Please refer to FIG. 1 for a block diagram of a system for applying the cleanable heat dissipation structure 1 of the present invention to an embodiment of the electronic device 100. As shown in FIG. 1 , the electronic device 100 includes a housing 110 , at least one heating element 120 , and a heat dissipation module 130 . At least one of the heating element 120 and the heat dissipation module 130 are disposed in the housing 110. The heat dissipation module 130 includes at least one heat pipe 131, a fan 132, and a cleanable heat dissipation structure 1. The fan 132 is disposed corresponding to the position of the cleanable heat dissipation structure 1. The electronic device 1 is connected to each of the heat generating elements 120 by using the heat pipes 131, and the heat generated by each of the heat generating elements 120 is led out by the heat pipes 131 to be transferred to the cleanable heat dissipating structure 1 by the 5 M430144, and reused. The fan 132 cools the blown air of the cleanable heat dissipation structure 1 and sends the hot air out of the casing 110. Here, the heating element 120 can be a component that is easy to generate and temperature, such as a CPU, GPU, or other processing chip*, but the present invention is not limited thereto. Please refer to FIG. 2, which is an exploded view of the structure of the cleanable heat dissipation structure 1 of the present invention. As shown in FIG. 2, in one embodiment of the present invention, the cleanable heat dissipation structure 1 of the present invention includes a main body 10, a fin module 20, and an operating member 30. The main body 10 includes a penetrating portion 11 for accommodating the heat pipe 131, and the heat pipe 131 is in contact with the inner surface of the penetrating portion 11, so that the heat pipe 131 transfers heat to the main body 10. The diameter of the through portion 11 is not less than the diameter of the heat pipe 131 to maintain the contact state between the two. In one embodiment of the present invention, the total length of the main body is about 7 cm, and the diameter of the through portion 11 is between about 6 mm and 8 mm. However, depending on the design, the corresponding size of the main body 10 also changes. In addition, in order to increase the heat conduction effect and fill the gap between the heat pipe 131 and the through portion 11, a heat dissipating material may be further included between the two, for example, a common heat dissipating paste, etc., and the heat dissipating material is disposed on the through portion by coating. 11 inner surface or outer surface of heat pipe 131, but this creation is not limited to this. The fin module 20 is coupled to the outer surface of the main body 10. The fin module 20 is composed of a plurality of fins, and a gap is maintained between the adjacent fins in a 6 arrangement. The fin module 20 is disposed corresponding to the air outlet of the fan 132 to carry away the heat transferred from the autonomous body 10 to the fin module 20 by the cold air blown by the fan 132. In one embodiment of the present invention, each of the fins of the fin module 20 is designed with a circular fin so as to be less susceptible to interference with the housing 110 or other components during adjustment, but The present invention is not limited thereto, and the fins of the fin module 20 may also take other forms such as a rectangle, an arbitrary curved surface or other forms capable of providing a large heat dissipation area. In addition, the main body 10 and the fin module 20 are made of a metal material having good thermal conductivity and low thermal resistance coefficient, such as copper or aluminum, to improve the heat dissipation effect, but the main body 10 and the fin module 20 are also It can be replaced with other materials with similar heat dissipation effects. The operating member 30 is coupled to the main body 10 such that the main body 10 and the fin module 20 can be interlocked with the operating member 30. In an embodiment of the present invention, the operating member 30 is a rotating member, such as a turntable, for the user to rotate for corresponding adjustment, but the operating member 30 can also be in the form of a lever member, a pushing member, etc., not in this embodiment. Limited. The operating member 30 can be attached to the main body 10 by means of tight fitting or bonding. In addition, the outer side of the operating member 30 further includes a plurality of anti-slip portions 31 for the user to manually operate, and each of the anti-slip portions 31 can be a convex portion as shown, or can be shaped to accommodate a fingertip for operation. The recessed portion or the like may be sleeved on the operating member 30 by means of a rubber ring or the like, and is not limited to the embodiment. Please refer to FIG. 3, which is a schematic diagram of the operation of the cleanable heat dissipation structure 1 of the present invention. As shown in FIG. 3, the user can manually rotate the operating member 30, whereby the main body 10 can rotate the fin module 20 relative to the heat pipe 131 to adjust the position of the fin module 20. Since the fin mold set 20 is most likely to accumulate dust and the like at the air outlet, the fin module 20 originally facing the air outlet of the fan 132 can be turned out and exposed. At this time, the user can use the object with the tip, such as a clip, a pen, a bamboo stick, etc., to extend into the gap between the fins for cleaning, and can be cleaned to different parts of the fin module 20, thereby achieving the creation. Cleaning effect. Please refer to Figure 2, Figure 3 and Figure 4 below. 4 is a partial schematic view of one embodiment of the electronic device 100 of the present invention. As shown in FIG. 2 and FIG. 4, the electronic device 100 of the present invention includes a housing 110 and a heat dissipation module, and the heat dissipation module is disposed in the housing 110. The heat dissipation module includes at least one heat pipe 131, a fan 132, and a cleanable heat dissipation structure as described above. At least one heat pipe 131 conducts heat to the body 10 and the fin module of the cleanable heat dissipation structure 1. 20, and air is blown by the fan 132 to conduct heat out of the casing 100. For the structure and operation status of the cleanable heat dissipation structure 1, please refer to the above description, and will not be repeated here. In one embodiment of the present invention, the housing 110 includes a flip cover 111 corresponding to the fin module 20, and the flip cover 111 is pivotally attached to the housing M430144 20 for convenient cleaning by the user; As shown in FIG. 4, when the flip cover 111 is in the closed state, the fin module 2 is concealed (wherein the flip cover 111 includes a plurality of air outlet holes 112 for the cover lid lu to be a closed bear) Exhaust from the plurality of air outlets 112. ~
此外，殼體no更包括開孔113,係對應於操作件 3〇設置，操作件3〇可通過開孔113以露出於殼體ιι〇 之表面，以易於使用者操作。 藉由前㈣計’本創作之電子裝置⑽可提供使用 方便清條減構之魏，並#由操作操作件即能調整 鰭片模組之位置，以清潔平時無法見到的㈣免除一Further, the housing no further includes an opening 113 corresponding to the operating member 3, and the operating member 3 can be exposed through the opening 113 to be exposed on the surface of the housing to facilitate user operation. By the former (four) meter, the electronic device (10) of the present invention can provide the use of the convenience of the strip, and the position of the fin module can be adjusted by the operation of the operating member to clean the ordinary (4) exempt one.
110以相對於殼體110呈一開啟狀態及一關閉狀態。如 圖3所示，當掀蓋111呈開啟狀態時，將使得讀片模組 置必，機殼清潔之繁瑣工序，大幅減少清 為所而時間及提尚凊潔之便利性。 ^上所陳’本創作無論就目的、手段及功效，在 料異於習知技術之特徵，惟應注意的是，上 2夕實施例僅係為了便於說明而舉例而已，本創作所 =範圍自應以申請專利範圍所述為準，而非僅 丨艮於上;4實施例。 【圖式簡單說明】 子裝置之 圖1係本創作之可清潔式散熱結構應用於電 9 M430144 一實施例之系統方塊圖。 圖2係本創作之可清潔式散熱結構之結構爆炸圖。 圖3係本創作之可清潔式散熱結構之操作示意圖。 圖4係本創作之電子裝置之一實施例之局部示意圖。 【主要元件符號說明】 可清潔式散熱結構1 主體10 貫通部11 鰭片模組20 操作件30 止滑部31 可攜式電子裝置100 殼體110 掀蓋111 出風孔112 開孔113 發熱元件120 散熱模組130 熱導管131 風扇132110 is in an open state and a closed state with respect to the housing 110. As shown in Fig. 3, when the flip cover 111 is opened, the reading module is set, and the complicated process of cleaning the casing greatly reduces the time and the convenience of cleaning. ^上本陈's creation, regardless of the purpose, means and efficacy, is different from the characteristics of the conventional technology, but it should be noted that the last two eves are only for the convenience of illustration, this creation = scope It shall be based on the scope of the patent application, not just the above; 4 embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a system block diagram of an embodiment of the present invention. Figure 2 is a structural exploded view of the cleanable heat dissipation structure of the present invention. FIG. 3 is a schematic diagram of the operation of the cleanable heat dissipation structure of the present invention. 4 is a partial schematic view of an embodiment of an electronic device of the present invention. [Main component symbol description] Cleanable heat dissipation structure 1 Main body 10 Penetration portion 11 Fin module 20 Operation member 30 Slip portion 31 Portable electronic device 100 Housing 110 Cover 111 Outlet hole 112 Opening 113 Heating element 120 heat dissipation module 130 heat pipe 131 fan 132