TWI396963B - Notebook computer having heat dissipation device - Google Patents

Description

Notebook computer with heat sink

The present invention relates to a portable electronic device, and more particularly to a notebook computer having a heat sink.

As the power of heating electronic components continues to increase, the problem of heat dissipation has received more and more attention. This is especially true in notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the current industry mainly adopts heat pipes. A heat sink composed of a heat sink and a fan is mounted on a heat-generating electronic component such as a central processing unit (CPU) to bring the heat pipe into contact with the CPU to absorb the heat generated by the heat pipe. The heat transfer path of the mode is: the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air flow generated by the fan carries away the heat transferred to the heat sink.

However, with the rapid advancement of technology and the pursuit of portability and practicality, notebook computers on the market generally tend to be light, thin, short and small to conform to the lifestyle of modern society. In the design of the ultra-thin model, the heat-generating electronic components and the heat sink in the above-mentioned heat-dissipating module are close to the upper and lower covers of the casing, so that the temperature of the casing near the heat-generating electronic components and the radiator is significantly higher than other parts. As a result, the local temperature of the surface of the casing is too high, which may cause discomfort to the user.

Therefore, how to uniformly dissipate the heat generated by the heating element and avoid the local temperature of the casing is too high has become an urgent problem to be solved.

In view of this, it is necessary to provide a heat that can generate heat evenly generated by the heat-generating electronic components. A notebook that achieves a uniform case surface temperature.

A notebook computer having a heat dissipating device, comprising a heat-generating electronic component, a keyboard frame and a first heat pipe, the first heat pipe having an evaporation section and a condensation section, the keyboard frame being made of a metal heat conductive material, the first An evaporation section of a heat pipe is disposed at a position of the heat-generating electronic component, and a condensation section thereof is coupled to a position of the keyboard frame away from the heat-generating electronic component, wherein the keyboard frame is provided with a plurality of buttons, and each adjacent two buttons A gap is formed, and the condensation section of the first heat pipe extends through the gap between the buttons.

Compared with the prior art, the notebook computer is disposed at the position of the heat-generating electronic component by the evaporation section of the first heat pipe, and the condensation section is combined with the position of the keyboard frame away from the heat-generating electronic component, so that the heat-generating electronic component is generated. The heat is transferred to the keyboard frame and evenly distributed on the keyboard frame for distribution.

10‧‧‧First heat pipe

10a, 10b, 10c‧‧‧ second heat pipe

12, 12a, 12b, 12c‧‧Evaporation section

14, 14a, 14b, 14c‧‧ ‧ condensation section

20, 20a‧‧‧Fever electronic components

30‧‧‧ keyboard frame

32‧‧‧ button

34‧‧‧ gap

1 is a perspective view of a first embodiment of a notebook computer having a heat sink according to the present invention.

2 is a schematic view of the bottom surface of the keyboard frame of FIG. 1.

3 is a schematic view of a second embodiment of a notebook computer having a heat sink according to the present invention.

4 is a schematic view of a third embodiment of a notebook computer having a heat sink according to the present invention.

Figure 5 is a partial side elevational view of a fourth embodiment of a notebook computer having a heat sink according to the present invention.

Hereinafter, a notebook computer having a heat sink according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 show a first embodiment of a notebook computer having a heat sink according to the present invention. The heat dissipating device includes a first heat pipe 10. In the embodiment, the first heat pipe 10 has an L shape, and one end thereof is steamed. The hair extension 12 is at the other end and is the condensation section 14. The evaporation section 12 is disposed at a position of a heat generating electronic component 20 such as a CPU, and the condensation section 14 is combined with a keyboard frame 30 of the notebook computer. In the present embodiment, the evaporation section 12 is directly coupled to the heat-generating electronic component 20.

The keyboard frame 30 is a one-piece plate-like body made of a metal material having a good thermal conductivity, such as aluminum or magnesium alloy. The keyboard frame 30 is provided with a plurality of square buttons 32. The plurality of buttons 32 are arranged in a rectangular structure on the keyboard frame 30, and an elongated gap 34 is formed between each adjacent two buttons 32. The plurality of gaps 34 are mutually Connected. The condensation section 14 of the first heat pipe 10 is inserted into a portion of the gap 34 of the button 32 and away from the heat-generating electronic component 20, and the condensation section 14 of the first heat pipe 10 can be welded or tightly fitted to the keyboard frame 30. Combine.

When the notebook computer is in operation, the heat generated by the heat-generating electronic component 20 is absorbed by the evaporation section 12 of the first heat pipe 10, and is transferred to the condensation section 14 of the first heat pipe 10 via the liquid phase change in the first heat pipe 10, by the condensation section 14 It is transmitted to the keyboard frame 30. Since the keyboard frame 30 is made of a heat conductive metal material and has a large heat dissipation area, the heat transferred to the condensation section 14 along the first heat pipe 10 can be evenly distributed to improve user comfort. degree.

In addition, the heat dissipating device is disposed only by using the smaller volume of the first heat pipe 10 to introduce heat into the keyboard frame 30 which is necessary in the notebook computer. This type of setting occupies a small space and can be adapted to its ultra-thin and short notebook type. The cooling needs of the computer.

3 is a second embodiment of a notebook computer having a heat dissipating device according to the present invention. The difference between this embodiment and the previous embodiment is that two second heat pipes 10a, 10b are added in the embodiment, and the second One end of the heat pipes 10a, 10b is an evaporation section 12a, 12b, and the other end is a condensation section 14a, 14b, respectively. The two second heat pipes 10a, 10b are integrally combined with the keyboard frame 30, and are also interposed and inserted in the keyboard. Within the gap 34 between the keys 32 on the frame 30. The evaporation section 12a of the second heat pipe 10a is disposed near the condensation section 14 of the second heat pipe 10, the condensation section 14a of the second heat pipe 10a is close to the evaporation section 12b of the next second heat pipe 10b, and the condensation section 14b of the second heat pipe 10h is Close to the second heat pipe 10 The evaporation section 12 is such that the first heat pipe 10 and the second heat pipes 10a, 10b have an approximately annular structure successively on the keyboard frame 30. When the notebook computer of the heat sink of the embodiment is used, the heat generated by the heat-generating electronic component 20 is transferred to the condensation section 14 through the evaporation section 12 of the first heat pipe 10, and is transmitted from the condensation section 14 to the keyboard frame 30, and a part of the heat can be Directly distributed by the keyboard frame 30, another portion is transferred from the portion of the keyboard frame 30 adjacent to the condensation section 14 of the first heat pipe 10 to the evaporation section 12a of the second heat pipe 10a, and then to the condensation section 14a along the second heat pipe 10a. And then transferred to the keyboard frame 30, and so on, the heat is radiated from a certain position of the keyboard frame 30, and is transmitted from the first heat pipe 10 and the second heat pipes 10a, 10b to another position of the keyboard frame 30 until uniform. It is distributed over the entire keyboard frame 30 to improve heat dissipation efficiency.

4 is a third embodiment of a notebook computer having a heat dissipating device according to the present invention. The difference between this embodiment and the first two embodiments is that in the present embodiment, a heat generating electronic component 20a and a second heat pipe 10c are added. The evaporation section 12c is combined with the heat-generating electronic component 20a, and the condensation section 14c is inserted into the gap 34 between the keys 32 of the keyboard frame 30 like the condensation section 14 of the first heat pipe 10, and the condensation section 14 of the first heat pipe 10 The condensation section 14c of the second heat pipe 10c extends in the opposite direction to allow the heat of the heat-generating electronic components 20, 20a to be more uniformly transmitted to different portions of the keyboard frame 30. Of course, in the present embodiment, it is not limited to the case where only the first heat pipe 10 and the second heat pipe 10c are provided, and in the second embodiment, the gaps 34 of the buttons 32 on the keyboard frame 30 may be additionally arranged. The two heat pipes 10a, 10b are used to accelerate the uniform emission of heat.

FIG. 5 is a fourth embodiment of a notebook computer having a heat dissipating device according to the present invention. The difference between this embodiment and the above embodiment is that the evaporating end 12 of the first heat pipe 10 is disposed at the heat generating electronic component 20 in this embodiment. The position is not directly coupled to the heat-generating electronic component 20, but is disposed directly above the heat-generating electronic component 20, and is disposed near the position of the heat-generating electronic component 20 corresponding to the keyboard frame 30. Thus, when the heat-generating electronic component 20 generates heat and the ambient temperature is high, the first heat pipe 10 can also absorb heat from the evaporation section 12 and pass to a position away from the condensation section 14 of the heat-generating electronic component 20. . This embodiment can be applied to any of the above three embodiments, that is, the evaporation section 12 (12c) of the first heat pipe 10 (the second heat pipe 10c) close to the heat-generating electronic component 20 (20a) can be combined with the heat-generating electronic component 20 ( 20a) Direct bonding may also be provided in the vicinity of the position of the keyboard frame 30 corresponding to the heat-generating electronic component 20 (20a).

Of course, the arrangement of the first heat pipe 10 and the second heat pipes 10a, 10b, 10c on the keyboard frame 30 is not limited to the above-described embodiment, and may be based on the layout of the buttons 32 on the keyboard frame 30 and the position of the heat-generating electronic components 20, 20a. The number and the number of the first heat pipe 10 and the second heat pipes 10a, 10b, and 10c can also be adjusted according to specific conditions, so that the first heat pipe 10 and the second heat pipe 10a, 10b are adjusted accordingly. The layout of 10c can make the heat evenly spread throughout the entire keyboard frame 30.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧First heat pipe

12‧‧‧Evaporation section

14‧‧‧Condensation section

20‧‧‧Fever electronic components

30‧‧‧ keyboard frame

32‧‧‧ button

34‧‧‧ gap

Claims (9)

A notebook computer having a heat dissipating device, comprising a heat-generating electronic component, a keyboard frame and a first heat pipe, the first heat pipe having an evaporation section and a condensation section, wherein the keyboard frame is made of a metal heat conductive material The evaporation section of the first heat pipe is disposed at a position of the heat-generating electronic component, and the condensation section thereof is combined with a position of the keyboard frame away from the heat-generating electronic component. The keyboard frame is provided with a plurality of buttons, each phase A gap is formed between the adjacent two buttons, and the condensation section of the first heat pipe extends through the gap between the buttons. The notebook computer with a heat sink according to claim 1, wherein the notebook computer further comprises at least one second heat pipe, and the at least one second heat pipe is distributed and coupled to the keyboard frame. The notebook computer with a heat sink according to claim 2, wherein the first heat pipe and the at least one second heat pipe are arranged end to end on the keyboard frame, and the overall arrangement is in a ring structure. A notebook computer having a heat sink according to claim 1, wherein the notebook computer further includes a second heat pipe, and an evaporation section of the second heat pipe is disposed at a position of the other heat-generating electronic component. The condensation section of the second heat pipe is coupled to a location on the keyboard frame that is remote from the other heat-generating electronic component. A notebook computer having a heat sink according to claim 1, wherein the keyboard frame is made of aluminum or magnesium alloy. A notebook computer having a heat sink according to claim 1, wherein the condensation section of the first heat pipe and the keyboard frame are joined by welding. A notebook computer having a heat sink according to claim 1, wherein the condensation section of the first heat pipe and the keyboard frame are combined by a tight fit. A notebook computer having a heat sink according to claim 1, wherein the evaporation section of the first heat pipe is directly coupled to the heat generating electronic component. A notebook computer having a heat sink according to claim 1, wherein the evaporation section of the first heat pipe is disposed directly above the heat-generating electronic component and is not directly coupled to the heat-generating electronic component.