M429994 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種熱管散熱結構，尤指一種兼具有較 佳熱傳效率及可承受較大的熱功率衝擊之熱管散熱結構 改良。 【先前技術】 [0002] 近年來電子技術迅速發展，電子元件之高頻、高速以及 積體電路之密集及微型化，使得單位容積電子元件發熱 Φ 量劇增。習知之散熱方式包括散熱鰭片、熱管及導熱介 面等方式。如何提高散熱效率以解決電子元件所發出之 熱能，防止因積體電路密集度增加而產生之高熱高溫造 成電子元件之損壞，成為當今重要課題。 熱管係依靠自身内部工作流體相變實現導熱之導熱元 件，其具有高導熱性、優良等溫性等特性，導熱效果好 ，應用廣泛。且，熱管技術以其高效、緊凑以及靈活可 靠等特點，適合解决目前電子元件因性能提升所衍生之 Φ 散熱問題。 然，雖習知之熱管可將電子元件的熱量傳導至遠端散 熱，但卻延伸出另一問題，亦即習知之熱管其内腔室壁 面上的毛細結構有限，相對的於蒸發部上的毛細結構所 吸附的工作流體亦必定受限，所以若當熱管之蒸發部吸 附較大功率電子元件所產生的熱量時，常致使蒸發部其 上毛細結構的工作流體來不及處理大量熱量即造成乾燒 ，進而使熱管喪失傳熱性能而令電子元件因不能及時散 熱而燒毁，故，增強毛細結構之液體傳送能力以設計出 10120126(^單编號 AG1(n 第 3 頁 / 共 19 頁 1012003756-0 M429994 具較高傳熱性能的熱管係為目前業者亟需解決的課題。 以上所述，習知具有下列之缺點： 1. 熱傳效率不佳； 2. 因於蒸發部之毛細結構的單位面積有限，故使得無法 承受較大熱功率衝擊； 3. 熱傳量有限。 是以，要如何解決上述習用之問題與缺失，即為本案 之創作人與從事此行業之相關廠商所亟欲研究改善之方 向所在者。 【新型内容】 [0003] 爰此，為有效解決上述之問題，本創作之主要目的在提 供一種具有較佳熱傳效率之熱管散熱結構改良。 本創作之次要目的，係在提供一種具有單位面積可承 受較大熱功率衝擊及熱傳量較大之熱管散熱結構改良。 為達上述目的，本創作係提供一種熱管散熱結構改良 ，係包括：一本體，該本體具有一蒸發部、一從該蒸發 部向外延伸之冷凝部、一填充有工作流體之腔室及至少 一第一毛細結構，該第一毛細結構係設於腔室内壁上， 且其具有至少一凸出毛細部，該凸出毛細部係從第一毛 細結構於該蒸發部上凸伸構成；透過該凸出毛細部，得 藉以增加第一毛細結構的單位面積，以有效承受較大熱 功率衝擊，進而大幅提升熱傳量效率。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 附圖式之較佳實施例予以說明。 1012003756-0 第4頁/共19頁 t創作係—種熱管散熱結構改良，m參閱第ΙΑ、1B圖 不係顯不本創作之第一較佳實施例之立體及剖面圖示 ’ «官散熱結構改良係包括一本體i，該本體1係呈圓 狀之熱官，且其具有—蒸發部10、一從該蒸發部10向外 延伸之冷凝部11、-腔室12及至少-第-毛細結構13， 其中该腔室12本創作於該較佳實施巾似光滑壁面做說 明’且腔室12内填充有工作流體，並該卫作流體可係為 純水、無機化合物、醇類、酮類、液態金屬、冷煤及有 機化合物其中任一。 另者前述第一毛細結構13係設於該腔室12内壁上，且 其具有至少一凸出毛細部丨3 i，該凸出毛細部丨3丨與第一 毛細結構13於本較佳實施都係以燒結粉末體做說明，但 並不侷限於此，亦可選擇為網目、纖維體、網目及燒結 粉末組合及微結構體其中任一。 再者所述凸出毛細部131係從所述蒸發部1〇處之部分 第一毛細結構13上凸伸構成；換言之，亦即所述該凸出 毛細部131係一體形成在相對該蒸發部1〇内的部分第一毛 細結構13上。 此外’參閱第2圖所示’於具體實施時，使用者可以 事先根據貼設發熱元件2(如中央處理器、繪圖晶片、南 北橋晶片或其他執行處理晶片）的數量與體積大小，或是 擺設空間的需求，設計調整前述凸出毛細部131的轴向延 伸體積，並則述冷凝部11内的第一毛細結構13上的凸出 毛細部131則可以視需求選擇設置或不設置。 續參閱第ΙΑ、1B圖示’該凸出毛細部131具有一自由 端1311，該自由端1311係從於前述腔室12内該蒸發部1〇 m脈，單編號删1 1012003756-0 第5頁/共19頁 的部/7第一毛細結構13上經向擴展構成。所以透過前述 邛分的第一毛細結構13上增生有凸出毛細部131，使相對 該凸出毛細部131的蒸發部1〇外側可承受吸附對應較大功 率的發熱元件2所產生之熱量，換言之，就是該部分之第 一毛細結構13與其上凸出毛細部131共同的單位面積較大 ，使得可承受板大的熱功率衝擊，相對的熱傳量亦比較 大，進而還可有效避免熱管乾燒。 因此，藉由本創作所述本體1腔室12内的部分第一毛 細結構13上一體形成有凸出毛細部131的設計，得有效達 到較佳熱傳效率及絕佳的散熱效果。 請參閱第3Α、3Β圖，係顯示本創作之第二較佳實施例 之立體及剖面示意圖；該本較佳實施例主要是將前述第 一較佳實施例之本體1係貼設在相對的至少一發熱元件2( 如中央處理器、繪圖晶片、南北橋晶片或其他執行處理 晶片）上，亦即前述本體！内相對該部分第一毛珅結構13 其上有凸出毛細部131的蒸發部1 〇其外側係與相對至少一 發熱元件2相貼設’而該冷凝部11則與對應的一散熱單元 3相接，其中前述散熱單元3係為一散熱器、一散熱鰭片 組及一水冷裝置其中任一。 所以當發熱元件2產生熱量時，透過該第一毛細結構 13及凸出毛細部131其上的液態工作流體5迅速吸附熱量 而產生蒸發，以轉換為汽態工作流體4，使汽態工作流體 4於腔室12内會朝相對的冷凝部11方向流動，直到該汽態 工作流體4流動到冷凝部11内側上（即位於冷凝部11的腔 室12内壁上）受冷卻的同時，該散熱單元3會將吸附到該 冷凝部11上的熱量向外散熱，以加速該汽態工作流體4冷 1012003756-0 10120126^^ Α〇101 M429994 卻而冷凝轉換為液態工作流體5後，該液態工作流體5便 藉由重力及毛細力回流至蒸發部1 〇上繼續汽液循環，藉 以有效達到絕佳的散熱效果。 凊參閱第4圖示，係顯示本創作之第三較佳實施例之 立體剖面示意圖，並輔以參閱第^圖示；該較佳實施例 的結構及連結關係及其功效大致與前述第一較佳實施例 相同，故在此不重新贅述，其兩者差異在於：前述蒸發 部ίο其内部分之第一毛細結構13上的凸出毛細部131朝相 對的冷凝部11軸向連續延伸構成，泛指就是所述凸出毛 細。P131係一體形成在相對該蒸發部丨〇與冷凝部丨1之間内 的部分第一毛細結構13上》 並前述凸出毛細部131的自由端係從於前述腔室12内 該蒸發部10與冷凝部1丨間的部分第一毛細結構丨3上徑向 擴展構成。 清參閱第5圖示，係顯示本創作之第四較佳實施例之 剖面示意圖.；該較佳實施例的結構及連結關係及其功效 大致與前述第一較佳實施例相同，故在此不重新贅述， 該本較佳實施例主要是將前述第一較佳實施例之本體i改 變5X sf成為一側為平面及另一側非平面亦即前述本體夏 。又有一平面161及一非平面162，前述凸出毛細部131係 形成在該平面161内侧（即於所述腔室12内的平面161相 對非平面162的-側）的第一毛細結構13上，並該非平面 162係相反該平面ι61，且其形狀係大致呈D字狀 ，但並不 侷限於此，亦可為如矩狀或半圓狀。 請參閱第6圖示’係顯示本創作之第五較佳實施例之 剖面不意圖；該較佳實施例的結構及連結關係及其功效 l〇12〇126(f·單編號 A0101 1012003756-0 第7頁/共19頁 M429994 大致與前述第一較佳實施例相同，故在此不重新贅述， 該本較佳實施例主要是將前述第一較佳實施例之本體1改 變設計成為一側及其另一側都為平面，亦即該本體1係大 致呈扁平狀，且其設有一第一平面163及一相反該第一平 面163之第二平面164，前述凸出毛細部131係形成在該 第一平面163内側（即於所述腔室12内的第一平面163相 對第二平面164的一側）的第一毛細結構13上。M429994 V. New Description: [New Technology Field] [0001] This creation is about a heat pipe heat dissipation structure, especially a heat pipe heat dissipation structure that has better heat transfer efficiency and can withstand large thermal power impact. Improvement. [Prior Art] [0002] In recent years, electronic technology has rapidly developed, and the high frequency, high speed, and intensive and miniaturized circuit of electronic components have caused a rapid increase in the amount of heat generated per unit volume of electronic components. The conventional heat dissipation methods include heat sink fins, heat pipes and heat conduction interfaces. How to improve the heat dissipation efficiency to solve the thermal energy emitted by the electronic components and prevent the damage caused by the high heat and high temperature caused by the increase in the density of the integrated circuits has become an important issue today. The heat pipe relies on its internal working fluid phase change to realize the heat conduction of the heat conducting element, which has the characteristics of high thermal conductivity, excellent isothermal property, good heat conduction effect and wide application. Moreover, the heat pipe technology is suitable for solving the Φ heat dissipation problem caused by the performance improvement of current electronic components because of its high efficiency, compactness, flexibility and reliability. However, although the conventional heat pipe can conduct heat of the electronic component to the remote end to dissipate heat, it extends another problem, that is, the capillary structure of the inner wall of the heat pipe of the conventional heat pipe is limited, and the capillary on the evaporation portion is opposite. The working fluid adsorbed by the structure must also be limited. Therefore, if the heat generated by the high-power electronic component is adsorbed by the evaporation portion of the heat pipe, the working fluid of the capillary structure on the evaporation portion is often too late to process a large amount of heat, thereby causing dry burning. In turn, the heat pipe loses the heat transfer performance and the electronic component is burned due to the inability to dissipate heat in time. Therefore, the liquid transfer capability of the capillary structure is enhanced to design 10120126 (^ page number 1 AG1 (n page 3 / 19 pages 1012003756-0) M429994 Heat pipe with high heat transfer performance is an urgent problem for the current industry. As mentioned above, it has the following disadvantages: 1. The heat transfer efficiency is not good; 2. The unit area of the capillary structure due to the evaporation part Limited, it can not withstand large thermal power impact; 3. The heat transfer is limited. Therefore, how to solve the above problems and lack of use, that is, the creation of this case People and those involved in this industry are eager to study the direction of improvement. [New content] [0003] In order to effectively solve the above problems, the main purpose of this creation is to provide a better heat transfer efficiency. The heat pipe heat dissipation structure is improved. The secondary purpose of the present invention is to provide a heat pipe heat dissipation structure with a large heat shock per unit area and a large heat transfer amount. To achieve the above purpose, the present invention provides a heat pipe heat dissipation system. The structural improvement includes: a body having an evaporation portion, a condensation portion extending outward from the evaporation portion, a chamber filled with a working fluid, and at least a first capillary structure, the first capillary structure Provided on the inner wall of the chamber, and having at least one protruding capillary portion, the protruding capillary portion is formed by protruding from the first capillary structure on the evaporation portion; through the protruding capillary portion, the first capillary is increased The unit area of the structure is effective to withstand large thermal power impact, thereby greatly improving the heat transfer efficiency. [Embodiment] [0004] The above purpose of the creation and The structural and functional characteristics will be described in accordance with the preferred embodiment of the drawings. 1012003756-0 Page 4 of 19 t-creation system - improved heat dissipation structure of the heat pipe, m see the first, 1B is not The stereoscopic and cross-sectional illustration of the first preferred embodiment of the present invention is characterized in that the main heat dissipation structure improvement system includes a body i, which is a circular heat member, and has an evaporation portion 10 and a slave. The evaporation portion 10 extends outwardly from the condensation portion 11, the chamber 12, and at least the - capillary structure 13, wherein the chamber 12 is originally described as a smooth wall surface of the preferred embodiment and is filled in the chamber 12. There is a working fluid, and the working fluid can be any of pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, and organic compounds. In addition, the first capillary structure 13 is disposed on the inner wall of the chamber 12, and has at least one protruding capillary portion i3 i, and the protruding capillary portion 丨3 丨 and the first capillary structure 13 are preferably implemented. The description is made of a sintered powder body, but it is not limited thereto, and may be selected from a mesh, a fiber body, a mesh, a sintered powder combination, and a microstructure. Further, the protruding capillary portion 131 is formed to protrude from a portion of the first capillary structure 13 at the evaporation portion 1A; in other words, the protruding capillary portion 131 is integrally formed with respect to the evaporation portion. A portion of the first capillary structure 13 is inside the crucible. In addition, as shown in Fig. 2, in the specific implementation, the user can pre-set the number and size of the heating element 2 (such as a central processing unit, a graphics chip, a north-south bridge wafer or other processing wafer), or The axially extending volume of the protruding capillary portion 131 is designed and adjusted, and the protruding capillary portion 131 on the first capillary structure 13 in the condensation portion 11 can be selected or not provided as needed. Continuing to refer to the second section, FIG. 1B shows that the convex capillary portion 131 has a free end 1311 which is from the evaporation chamber 1 m pulse in the chamber 12, single number deletion 1 1012003756-0 fifth The page/a total of 19 pages/7 first capillary structure 13 is formed by warp expansion. Therefore, the protruding capillary portion 131 is accentuated on the first capillary structure 13 passing through the aforementioned minute portion, so that the heat generated by the heat generating element 2 corresponding to the relatively high power can be absorbed by the outer side of the evaporation portion 1 of the protruding capillary portion 131. In other words, the first capillary structure 13 of the portion has a larger unit area together with the convex portion 131 thereon, so that the large thermal power impact of the plate can be withstood, and the relative heat transfer amount is relatively large, thereby further effectively preventing the heat pipe. Dry burning. Therefore, by designing a portion of the first capillary structure 13 in the body 1 chamber 12 of the present invention to integrally form the protruding capillary portion 131, it is effective to achieve better heat transfer efficiency and excellent heat dissipation effect. 3 and 3 are a perspective view and a cross-sectional view showing a second preferred embodiment of the present invention; the preferred embodiment is mainly for attaching the body 1 of the first preferred embodiment to the opposite one. At least one heating element 2 (such as a central processing unit, a graphics chip, a north-south bridge chip or other processing wafer), that is, the aforementioned body! The evaporation portion 1 having the protruding capillary portion 131 on the portion of the first bristles 13 is attached to the at least one heating element 2 and the condensing portion 11 and the corresponding heat dissipation unit 3 The heat dissipating unit 3 is a heat sink, a heat sink fin set and a water cooling device. Therefore, when the heat generating component 2 generates heat, the liquid working fluid 5 passing through the first capillary structure 13 and the protruding capillary portion 131 rapidly absorbs heat to generate evaporation to be converted into the vapor working fluid 4 to make the vapor working fluid 4 flowing in the chamber 12 toward the opposite condensation portion 11 until the vapor working fluid 4 flows onto the inner side of the condensation portion 11 (i.e., on the inner wall of the chamber 12 of the condensation portion 11) while being cooled. The unit 3 dissipates the heat adsorbed to the condensation portion 11 to accelerate the vapor working fluid 4 to cool the liquid 1012003756-0 10120126^^ M101 M429994 but after the condensation is converted into the liquid working fluid 5, the liquid working The fluid 5 is returned to the evaporation portion 1 by gravity and capillary force to continue the vapor-liquid circulation, thereby effectively achieving an excellent heat dissipation effect. Referring to FIG. 4, there is shown a perspective cross-sectional view of a third preferred embodiment of the present invention, supplemented by reference to the first embodiment; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as the first The preferred embodiment is the same, so it will not be repeated here. The difference between the two is that the convex portion 131 on the first capillary structure 13 of the inner portion of the evaporation portion is continuously extended in the axial direction of the opposite condensation portion 11. , generally refers to the protruding capillary. The P131 is integrally formed on a portion of the first capillary structure 13 between the evaporation portion 丨〇 and the condensation portion 》 1 and the free end of the protruding capillary portion 131 is from the evaporation portion 10 in the chamber 12 A portion of the first capillary structure 丨3 between the condensing portion 1 is radially expanded. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a cross-sectional view showing a fourth preferred embodiment of the present invention. The structure and connection relationship of the preferred embodiment and its function are substantially the same as those of the first preferred embodiment described above. Without further recitation, the preferred embodiment of the present invention is mainly to change the body i of the first preferred embodiment to 5X sf to be a plane on one side and a non-planar on the other side. There is a plane 161 and a non-planar 162, and the protruding capillary portion 131 is formed on the first capillary structure 13 inside the plane 161 (i.e., on the side of the plane 161 in the chamber 12 opposite to the non-planar surface 162). And the non-planar 162 is opposite to the plane ι61, and its shape is substantially D-shaped, but is not limited thereto, and may be, for example, a rectangular shape or a semi-circular shape. Please refer to FIG. 6 for a schematic view showing a fifth preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and its function l〇12〇126 (f·single number A0101 1012003756-0) The description of the first preferred embodiment is the same as that of the first preferred embodiment. Therefore, the preferred embodiment is mainly designed to change the body 1 of the first preferred embodiment into one side. The other side is planar, that is, the body 1 is substantially flat, and is provided with a first plane 163 and a second plane 164 opposite to the first plane 163. The protruding capillary portion 131 is formed. On the first capillary structure 13 inside the first plane 163 (i.e., on the side of the first plane 163 in the chamber 12 opposite the second plane 164).
請參閱第7圖示，係顯示本創作之第六較佳實施例之 剖面示意圖，並輔以參閱第1A圖示；該較佳實施例的結 構及連結關係及其功效大致與前述第一較佳實施例相同 ，其兩者差異處在於：前述腔室12内更設有一第二毛細 結構17，該第二毛細結構17係形成在該本體1之腔室12内 壁上，且該第一毛細結構13係設在該第二毛細結構17上 相接。 並於該較佳實施之第二毛細結構17係以微溝槽做說明 ，但並不侷限於此，於本創作實際實施時，亦可選擇為 網目、纖維體、燒結粉末體及網目與燒結粉末組合其中 任一，合先陳明。 以上所述，本創作相較於習知具有下列之優點： 1. 具有較佳熱傳效率； 2. 由於第一毛細結構13與其上凸出毛細部131共同界定的 單位面積較大，使得可承受較大的熱功率衝擊，相對的 熱傳量亦比較大。 3. 散熱效果佳。 惟以上所述者，僅係本創作之較佳可行之實施例而已 ，舉凡利用本創作上述之方法、形狀、構造、裝置所為 1()12{)126(^單编號A0101 第8頁/共19頁 1012003756-0 M429994 之變化’皆應包含於本案之權利範圍内 【圖式簡單說明】 [0005] 第1A圖係本創作之本體立體示意圖； 第1B圖係本創作之第一較佳實施例之剖面示意圖； 第2圖係本創作之第一較佳實施例之另一剖面示意圖； 第3A圖係本創作之第二較佳實施例之實施示意圖； 第3B圖係本創作之第二較佳實施例之剖面示意圖； 第4圖係本創作之第三較佳實施例之立體剖面示意圖； 第5圖係本創作之第四較佳實施例之剖面示意圖； 第6圖係本創作之第五較佳實施例之剖面示意圖； 第7圖係本創作之第六較佳實施例之剖面示意圖。 【主要元件符號說明】 [0006] 本體 ... 1 非平面 … 162 蒸發部 ... 10 第一平面 … 163 冷凝部 ... 11 第二平© … 164 腔室 ... 12 第二毛細結構 … 17 第一毛細結構... 13 發熱元件 … 2 凸出毛細部 … 131 散熱單元 … 3 自由端 ... 1311 汽態工作流體 … 4 間隔空間 ... 15 液態工作流體 … 5 平面 … 161Please refer to FIG. 7 for a cross-sectional view showing a sixth preferred embodiment of the present invention, supplemented by reference to FIG. 1A; the structure and connection relationship of the preferred embodiment and its efficacy are substantially compared with the first The difference between the two embodiments is that the second capillary structure 17 is further formed in the chamber 12, and the second capillary structure 17 is formed on the inner wall of the chamber 12 of the body 1, and the first capillary The structure 13 is attached to the second capillary structure 17. The preferred second embodiment of the second capillary structure 17 is described by micro-grooves, but is not limited thereto. In the actual implementation of the present invention, the mesh, the fibrous body, the sintered powder body, and the mesh and the sintering may be selected. Any combination of powders, combined with Chen Ming. As described above, the present invention has the following advantages over the prior art: 1. It has better heat transfer efficiency; 2. Since the first capillary structure 13 and the upper convex capillary portion 131 define a larger unit area, With a large thermal power impact, the relative heat transfer is also relatively large. 3. Good heat dissipation. However, the above description is only a preferred embodiment of the present invention, and the method, shape, structure, and apparatus described above are 1()12{)126 (^单号 A0101第8页/ A total of 19 pages 1012003756-0 M429994 changes 'all should be included in the scope of the right of the case [simplified description of the schema] [0005] Figure 1A is a three-dimensional schematic diagram of the body of the creation; Figure 1B is the first preferred of the creation 2 is a schematic cross-sectional view of a first preferred embodiment of the present invention; FIG. 3A is a schematic view of the second preferred embodiment of the present invention; 2 is a schematic cross-sectional view of a third preferred embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of a fourth preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a cross-sectional view showing a sixth preferred embodiment of the present invention. [Main component symbol description] [0006] Body... 1 non-planar... 162 Evaporation section.. . 10 First plane... 163 Condensation... 11 Second flat © ... 164 Chamber... 12 Second capillary structure... 17 First capillary structure... 13 Heating element... 2 Projection capillary... 131 Heat sink... 3 Free end... 1311 Vapor working fluid ... 4 Space... 15 Liquid working fluid... 5 Plane... 161
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