M400605 五、新型說明： 【新型所屬之技術領域】 [0001] 本新型係關於一種散熱結構，特別是一種具有毛細結構 的散熱結構改良。 【先前技術】M400605 V. New description: [New technical field] [0001] The present invention relates to a heat dissipation structure, in particular to a heat dissipation structure with a capillary structure. [Prior Art]
[0002] 曰新月異的科技發展，便利了人類的生活，無窮盡的提 升電器產品的效能，例如強調運算速度與穩定性的高階 電子產品，如伺服器及工作站，甚至是個人用PC與筆記 型電腦，帶動了CPU越來越高的效能與速度需求。然而， 在這發展趨勢中，最大的障礙之一來自於發熱量，目前 最多的電子元件故障或是毁損的原因皆為熱量散發不出[0002] The rapid development of science and technology has facilitated human life and inexhaustibly improved the performance of electrical products, such as high-end electronic products that emphasize the speed and stability of computing, such as servers and workstations, and even personal PCs. The notebook computer has driven the increasing efficiency and speed of the CPU. However, one of the biggest obstacles in this trend is the amount of heat generated. The most common cause of electronic component failure or damage is that heat is not emitted.
，造成過熱所導致。熱主要是由1C中電晶體等主動元件 運算時所產生，隨著晶片中電晶體數目越來越多，發熱 量越來越大，但是電子產品的體積卻日趨縮小，在晶片 面積不隨之增加的同時，散熱面積日益縮小促使元件發 熱密度越來越高，使得傳統的散熱模組已不敷應用，而 過熱問題已造成目前電子元件技術發展的瓶頸。 [0003] 散熱問題，一直是電子系統設計時的重要考量因素，目 的是在降低電子元件因過熱而發生故障或毀損的機會， 不只提升電子產品系統的可靠度甚至可以延長電子產品 的使用壽命。文獻指出溫度每上升10〜15度C，晶片壽命 將會減少50%，因此如何有效且快速的帶走電子零件所產 生的熱量成為研究的重要課題。以電腦的中央處理器 (CPU)為例，目前較常使用的散熱方式為在中央處理器 (CPU)上加裝風扇或散熱片，直接對其進行散熱，但是風 表單編號A0101 第3頁/共17頁 M400605 扇強制對流方式散熱有需耗費電力、具噪音及壽命短等 問題，因此又有使用微熱管（HEATPIPE)將中央處理器 (CPU)產生的熱傳遞到熱沉（HEAT SINK)或電腦外殼， 此種被動散熱方式有不耗電、無嗓音、壽命長等優點， 微熱管在未來筆記型電腦及輕薄短小之資訊產品的散熱 問題上將扮演關鍵性的角色。 [0004] 請參見中華民國專利公告證書第14 21 6 4 4號，其揭示一種 熱管散熱裝置，其包括一熱管、一散熱器，該熱管具有 一蒸發段、一冷凝段、及連接該蒸發段與該冷凝段之絕 熱段，該蒸發段與發熱元件表面相貼合，其貼合面面積 與發熱元件表面面積基本相等，該冷'凝段與散熱器相連 接，該蒸發段與絕熱段之間以漸縮形狀過渡連接，該連 接處之曲率半徑與絕熱段斷面寬度之比值大於0. 2小於等 於1。 [0005] 前述技術之缺失在於，其散熱能力受到熱管内的容積所 限制，因其内部容積小故工作液體也較少，且其單一熱 管之設計在散熱速率上較慢，若使用於會產生高熱的超 高速電子運作速度電子元件，將無法達到其散熱要求。 【新型内容】 [0006] 本新型之主要目的，在於解決前述技術之散熱效率不佳 的缺失。 [0007] 為達上述目的，本新型提供一種散熱結構改良，使用於 一電子元件上以對其進行散熱，該散熱結構改良包括一 吸熱體及一散熱體。該吸熱體以一接觸面連接於該電子 表單編號A0101 第4頁/共17頁 M400605 元件上以吸收其產生的熱能，其内部為中空並形成一第 一空間，於該第一空間内設有傳送熱能之工作液體。該 散熱體具有一散熱面並於内部形成一第二空間，且該吸 熱體及該散熱體之間設有複數第一導管，該些第一導管 連接該第一空間及該第二空間，當該電子元件所產生的 熱能經由該接觸面被該吸熱體吸收後，位於該第一空間 内的該工作液體受熱而蒸發汽化變相成為蒸汽，而由該 第一空間經由該些第一導管流至該第二空間，該蒸汽於 該第二空間内與該散熱面進行熱交換而變相回復為工作 液體，並經由一内部具有毛細結構之第二導管回流至該 吸熱體之該第一空間内，形成一熱循環而不斷將該電子 元件之熱能帶走。Caused by overheating. Heat is mainly generated by active components such as 1C transistor. As the number of transistors in the wafer increases, the amount of heat is getting larger and larger, but the volume of electronic products is shrinking, and the area of the wafer is not At the same time of increasing, the heat dissipation area is shrinking, which makes the heat density of components higher and higher, which makes the traditional heat dissipation module insufficient. However, the overheating problem has caused the bottleneck of the current electronic component technology development. [0003] The problem of heat dissipation has always been an important consideration in the design of electronic systems. The purpose is to reduce the chances of electronic components failing or damaging due to overheating, not only improving the reliability of electronic product systems, but also extending the service life of electronic products. The literature indicates that for every 10 to 15 degrees C increase in temperature, wafer life will be reduced by 50%. Therefore, how to effectively and quickly remove the heat generated by electronic components has become an important topic of research. Taking the computer's central processing unit (CPU) as an example, the more commonly used heat dissipation method is to add a fan or a heat sink to the central processing unit (CPU) to directly dissipate heat, but the wind form number A0101 is page 3 / A total of 17 pages of M400605 fan forced convection heat dissipation requires power, noise and short life. Therefore, the heat generated by the central processing unit (CPU) is transferred to the heat sink (HEAT SINK) using HEATPIPE. The computer casing, this passive cooling method has the advantages of no power consumption, no noise, long life, etc. The micro heat pipe will play a key role in the heat dissipation problem of future notebook computers and light and short information products. [0004] Please refer to the Republic of China Patent Publication No. 14 21 6 4 4, which discloses a heat pipe heat dissipating device including a heat pipe and a radiator having an evaporation section, a condensation section, and a connection to the evaporation section And the adiabatic section of the condensation section, the evaporation section is in contact with the surface of the heating element, the bonding surface area is substantially equal to the surface area of the heating element, and the cold 'condensing section is connected with the heat sink, and the evaporation section and the adiabatic section are The ratio of the radius of curvature of the joint to the width of the section of the adiabatic section is greater than 0.2. [0005] The shortcoming of the foregoing technology is that the heat dissipation capability is limited by the volume in the heat pipe, because the internal volume is small, the working liquid is also small, and the design of the single heat pipe is slow in the heat dissipation rate, and if it is used, it may be generated. High-heat ultra-high-speed electronic operating speed electronic components will not be able to meet their cooling requirements. [New Content] [0006] The main purpose of the present invention is to solve the lack of heat dissipation efficiency of the aforementioned technology. In order to achieve the above object, the present invention provides an improved heat dissipation structure for use in dissipating heat from an electronic component, the heat dissipation structure including a heat absorbing body and a heat sink. The heat absorbing body is connected to the M400605 component of the electronic form number A0101 on page 4 of the electronic form number A0101 to absorb the heat energy generated by the heat absorbing body, and the interior thereof is hollow and forms a first space, and the first space is provided in the first space. A working fluid that transfers heat. The heat dissipating body has a heat dissipating surface and a second space is formed therein, and a plurality of first conduits are disposed between the heat absorbing body and the heat dissipating body, and the first ducts are connected to the first space and the second space. After the thermal energy generated by the electronic component is absorbed by the heat absorbing body through the contact surface, the working liquid located in the first space is heated to evaporate and vaporize and transform into steam, and the first space flows through the first conduits to the first space. In the second space, the steam exchanges heat with the heat dissipating surface in the second space to return to the working liquid, and is returned to the first space of the heat absorbing body via a second conduit having a capillary structure therein. A thermal cycle is formed to continuously carry away the thermal energy of the electronic component.
[0008] 藉由本新型所設置之該具有毛細結構的第二導管，使該 散熱結構可以迅速的將該工作液體回流至該第一空間而 形成一熱循環，並因該吸熱體及該散熱體分別具有該第 一空間及該第二空間，使内部容積較大而能容納較多的 工作液體，達到結構簡單、散熱迅速之功效。 【實施方式】 [0009] 有關本新型之詳細說明及技術内容，現就配合圖式說明 如下： [0010] 請參見『圖1』及『圖2』，為本新型散熱結構改良之外 觀示意圖及分解示意圖。本新型是一種散熱結構改良1， 主要使用於一電子元件60上以對其進行散熱。該散熱結 構改良1包括一吸熱體10、一散熱體20、及複數連接該吸 熱體10及該散熱體20之第一導管30，該吸熱體10係裝設 表單編號A0101 第5頁/共17頁 M400605 於該電子元件60之表面上以吸收其所散發之熱量，其為 一中空殼體，並於内部形成一第一空間12。該散熱體2〇 亦為一中空殼體，具有一散熱面21並於内部形成一第二 空間22以進行熱能交換，該吸熱體1〇及該散熱體2〇分別 設有複數第一接設孔13及第二接設孔23，用以接設該些 第一導管30，如是以上構成本新型之主要架構。 [〇〇11]請參閱『圖3-1』及『圖3-2』，為本新型之結構剖面作 動示意圖。如『圖3-1』所示’該吸熱體1〇安裝於該電子 元件60上’以一接觸面η將該電子元件60於運作時所產 生的熱能傳導吸收，並於該第一空間12内設有工作液體 50，於本實施例中該工作液體50為冷媒，或是如純水、 曱醇 '乙醇、丙醐、或庚燒等液體，但並不以此些液體 為限制。當該電子元件60運作並產生熱能時，該接觸面 11將吸收自該電子元件60的熱能傳導至該位於第一空間 12内之工作液體50，同時該工作液體50的溫度開始上升 ，當溫度大於該工作液體5〇之蒸發點時，該工作液體5〇 開始變相轉換為蒸汽，並由該第一空間丨2經由該第一導 管30而進入該散熱體2〇之該第二空間22内。由於該散熱 體20本身是採用高導熱性的材質所製成，因此當該蒸汽 進入該第二空間22並碰觸到該散熱面21時，該蒸汽所夾 帶之熱能將迅速被該散熱面21所吸收並與外部空氣進行 熱交換，使該蒸A之溫度開始下降，當蒸汽溫度下降至 冷凝點時，該蒸汽開始變相並回復為該工作液體5〇，而 附著於該散熱體20之内壁面。 [0012]如『圖3-2』所示，該散熱結構改良1設有一第二導管4〇 表單編號A0101 第6頁/共π頁 M400605 ，該第二導管40具有複數毛細結構41，該毛細結構41係 可為微細溝槽、金屬纖維、燒結粉末、金屬網目、或棉 絮布料等，但並不以該些結構為限，凡具有毛細吸附能 力之結構皆為本新型之保護範圍。於該第二導管40兩端 並設有導流部42，該導流部42呈倒角狀以讓該工作液體 50得以更順利地流動至該第二導管40内，該些凝結後的 工作液體50沿著設於該散熱體20之一傾斜壁面24流動， 該傾斜壁面2 4係由邊緣往該第二導管4 0方向往下傾斜， 使該工作液體50能迅速地往該第二導管40方向流動而加 速循環速率，且該工作液體50受到該第二·導管40之該毛 細結構41的吸附作用而被牽引回至該吸熱體10之該第一 空間12内，並繼續吸收該電子元件60所散發之熱能，而 形成一熱循環，使該電子元件60得以常態保持一適當的 工作溫度。[0008] The heat dissipation structure can quickly return the working liquid to the first space to form a thermal cycle by the second conduit having the capillary structure provided by the present invention, and the heat absorbing body and the heat sink The first space and the second space respectively have a larger internal volume and can accommodate a larger amount of working liquid, thereby achieving the advantages of simple structure and rapid heat dissipation. [Embodiment] [0009] The detailed description and technical contents of the present invention will now be described as follows: [0010] Please refer to FIG. 1 and FIG. 2, which are schematic views of the improved heat dissipation structure and the appearance thereof. Decomposition diagram. The present invention is a heat dissipation structure improvement 1 which is mainly used on an electronic component 60 to dissipate heat. The heat dissipation structure improvement 1 includes a heat absorbing body 10, a heat dissipating body 20, and a first conduit 30 connecting the heat absorbing body 10 and the heat dissipating body 20, and the heat absorbing body 10 is provided with a form number A0101, page 5 of 17 The page M400605 is on the surface of the electronic component 60 to absorb the heat radiated therefrom, which is a hollow casing and forms a first space 12 therein. The heat dissipating body 2 is also a hollow casing, and has a heat dissipating surface 21 and a second space 22 is formed therein for heat energy exchange. The heat dissipating body 1 and the heat dissipating body 2 are respectively provided with a plurality of first connections. A hole 13 and a second connection hole 23 are provided for connecting the first conduits 30, and the above is the main structure of the present invention. [〇〇11] Please refer to Figure 3-1 and Figure 3-2 for a schematic diagram of the structure of the new structure. As shown in FIG. 3-1, the heat absorbing body 1 is mounted on the electronic component 60 to conduct heat absorption of the thermal energy generated by the electronic component 60 during operation, and in the first space 12 The working liquid 50 is provided in the embodiment. In the embodiment, the working liquid 50 is a refrigerant, or a liquid such as pure water, sterol alcohol, propionol, or heptane, but is not limited by such liquid. When the electronic component 60 operates and generates thermal energy, the contact surface 11 conducts heat energy absorbed from the electronic component 60 to the working fluid 50 located in the first space 12, while the temperature of the working fluid 50 begins to rise, when the temperature When the evaporation point of the working liquid is greater than 5 ,, the working liquid 5 〇 starts to be phase-converted into steam, and the first space 丨 2 enters the second space 22 of the heat sink 2 through the first conduit 30 . . Since the heat sink 20 itself is made of a material having high thermal conductivity, when the steam enters the second space 22 and touches the heat dissipating surface 21, the heat energy entrained by the steam will be quickly absorbed by the heat dissipating surface 21 The heat is absorbed and exchanged with the outside air, so that the temperature of the steam A begins to decrease. When the steam temperature drops to the condensation point, the steam begins to disguise and returns to the working liquid 5 〇, and adheres to the heat sink 20 Wall. [0012] As shown in FIG. 3-2, the heat dissipation structure improvement 1 is provided with a second conduit 4, a form number A0101, page 6 / total π page M400605, and the second conduit 40 has a plurality of capillary structures 41, the capillary The structure 41 can be a fine groove, a metal fiber, a sintered powder, a metal mesh, or a cotton fabric, but is not limited to the structures. Any structure having a capillary adsorption capacity is a novel protection range. A flow guiding portion 42 is disposed at both ends of the second conduit 40, and the guiding portion 42 is chamfered to allow the working fluid 50 to flow more smoothly into the second conduit 40. The liquid 50 flows along an inclined wall surface 24 disposed on the heat dissipating body 20, and the inclined wall surface 24 is inclined downward from the edge toward the second duct 40, so that the working liquid 50 can quickly go to the second duct. The 40 direction flows to accelerate the circulation rate, and the working liquid 50 is drawn back into the first space 12 of the heat absorbing body 10 by the adsorption of the capillary structure 41 of the second conduit 40, and continues to absorb the electrons. The thermal energy dissipated by the component 60 forms a thermal cycle that maintains the electronic component 60 in a normal state for an appropriate operating temperature.
[0013] 本新型更具有將棉條作為該毛細結構41之實施例。請參 見『圖4』，為本新型之以棉條作為毛細結構的結構剖面 作動示意圖。如圖所示，在該第二導管40内部設置有該 條狀棉絮之毛細結構41，當蒸汽在該第二空間22内凝結 成工作液體50時，該工作液體50將沿著該散熱體20之該 傾斜壁面24往該第二導管40流動，該毛細結構41得以吸 取該工作液體50並將其經由該第二導管40而傳送至該第 一空間12，而形成一熱循環。 [0014] 為了提升本新型之散熱效率，更有一具有散熱鰭片70之 實施例，請參閱『圖5』，為本新型之裝設散熱鰭片的實 施例之外觀示意圖。於該散熱體20之該散熱面21上另外 表單編號A0101 M400605 裝設了一散熱鰭片70，該散熱鰭片70是由高散熱性質的 材質，如鋁、銅所製成，其表面具有許多溝槽，除了可 增加散熱面積之外，更具有引導空氣於其間流通的效果 ，藉由裝設該散熱鰭片70使該散熱體20的散熱效果更加 優越，並強化了本新型之散熱功能。 [0015] 综上所述，本新型藉由該第二導管40所設置之毛細結構 41，可將該工作液體5 0快速地傳送回該第一空間1 2内， 並繼續進行熱循環，而達到結構簡單、散熱迅速等功效 〇 [0016] 以上已將本新型做一詳細說明，惟以上所述者，僅爲本 新型之一較佳實施例而已，當不能以此限定本新型實施 之範圍，即凡依本新型申請專利範圍所作之均等變化與 修飾，皆應仍屬本新型之專利涵蓋範圍内。 【圖式簡單說明】 [0017] 圖1，係本新型散熱結構改良之外觀示意圖。 [0018] 圖2，係本新型散熱結構改良之分解示意圖。 [0019] 圖3-1，係本新型散熱結構改良一較佳實施例之結構剖面 作動示意圖（一）。 [0020] 圖3-2，係本新型散熱結構改良一較佳實施例之結構剖面 作動示意圖（二）。 [0021] 圖4，係本新型散熱結構改良以棉條作為毛細結構之實施 例的結構剖面作動示意圖。 [0022] 圖5，係本新型散熱結構改良裝設散熱鰭片之實施例的外 表單編號A0101 第8頁/共17頁 M400605 觀示意圖。 【主要元件符號說明】 [0023] 1....... ...... 散熱結構改良 [0024] 10....... ......吸熱體 [0025] 11....... ......接觸面 [0026] 12....... ......第一空間 [0027] 13....... ...... 第一接設孔 [0028] 20....... ......散熱體 [0029] 21....... ......散熱面 [0030] 22....... ......第二空間 [0031] 23....... ...... 第二接設孔 [0032] 24....... [0033] 30....... ......第一導管 [0034] 40....... ......第二導管 [0035] 41....... ......毛細結構 [0036] 42....... ......導流部 [0037] 50....... ......工作液體 [0038] 60....... ......電子元件 [0039] 70....... ......散熱鰭片[0013] The present invention further has an embodiment in which a sliver is used as the capillary structure 41. Please refer to Fig. 4 for a schematic diagram of the structural section of the tampon as a capillary structure. As shown in the figure, the strip-shaped batt capillary structure 41 is disposed inside the second duct 40. When the steam condenses into the working liquid 50 in the second space 22, the working liquid 50 will follow the heat sink 20 The inclined wall surface 24 flows toward the second conduit 40, and the capillary structure 41 can suck the working liquid 50 and transfer it to the first space 12 via the second conduit 40 to form a thermal cycle. [0014] In order to improve the heat dissipation efficiency of the present invention, there is an embodiment having a heat dissipating fin 70. Please refer to FIG. 5, which is a schematic view of an embodiment of a heat dissipating fin according to an embodiment of the present invention. On the heat dissipating surface 21 of the heat dissipating body 20, another form number A0101 M400605 is provided with a heat dissipating fin 70 which is made of a material having high heat dissipation properties, such as aluminum or copper, and has many surfaces thereon. In addition to increasing the heat dissipation area, the groove has the effect of guiding air to flow therebetween. The heat dissipation fins 70 are provided to further improve the heat dissipation effect of the heat sink 20, and the heat dissipation function of the present invention is enhanced. [0015] In summary, the present invention can quickly transfer the working fluid 50 back into the first space 12 by the capillary structure 41 disposed by the second conduit 40, and continue the thermal cycle. The utility model has the advantages of simple structure and rapid heat dissipation. [0016] The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. The equivalent changes and modifications made by the scope of this new patent application shall remain within the scope of the patent of this new type. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is a schematic view showing the appearance of the improved heat dissipation structure of the present invention. [0018] FIG. 2 is an exploded perspective view of the improved heat dissipation structure of the present invention. 3-1 is a schematic cross-sectional view showing the structure of a preferred embodiment of the heat dissipation structure of the present invention (1). 3-2 is a schematic cross-sectional view showing the structure of the improved heat dissipation structure of the present invention (2). [0021] FIG. 4 is a schematic cross-sectional view showing the structure of the present invention in which the heat dissipating structure is modified to have a sliver as a capillary structure. [0022] FIG. 5 is an external view of the embodiment of the present invention for improving the heat dissipating structure of the heat dissipating fin. Form No. A0101 Page 8 of 17 M400605 Schematic diagram. [Explanation of main component symbols] [0023] 1....... ...... Heat dissipation structure improvement [0024] 10....... ...... Heat absorber [0025] 11. ...... ...... contact surface [0026] 12....... ...... first space [0027] 13....... ..... First connection hole [0028] 20.............heat radiator [0029] 21.............heat dissipation surface [0030] 22. ..... ......Second space [0031] 23............. Second connection hole [0032] 24....... [0033] 30.............the first catheter [0034] 40.............the second catheter [0035] 41....... ....Capillary structure [0036] 42.............Conduit [0037] 50.............Working liquid [0038] 60. ...... ......electronic components [0039] 70....... ...... heat sink fins
表單編號Α0101 第9頁/共17頁Form number Α0101 Page 9 of 17