WO2021168874A1

WO2021168874A1 - Heat dissipation structure

Info

Publication number: WO2021168874A1
Application number: PCT/CN2020/077585
Authority: WO
Inventors: 方文兵; 徐莎莎; 陈晓杰; 李富根
Original assignee: 瑞声声学科技(深圳)有限公司; 瑞声科技(新加坡)有限公司
Priority date: 2020-02-25
Filing date: 2020-03-03
Publication date: 2021-09-02
Also published as: CN211745081U

Abstract

A heat dissipation structure, which is used for dissipating the heat of a heating electronic component, comprising a heat pipe one end of which is connected to the electronic component, wherein the heat pipe comprises an evaporation section close to the electronic component and a condensation section far away from the electronic component; and further comprising a thermoelectric refrigeration device one end of which is connected to the electronic component and/or the heat pipe, wherein the thermoelectric refrigeration device has a heat absorption end connected to the electronic component and/or the heat pipe and a heat dissipation end far away from the electronic component and/or the heat pipe. On one hand, the working fluid in the heat pipe may dissipate the heat of heating electronic components by means of an evaporation-condensation cycle. On the other hand, the thermoelectric refrigeration device may actively cool down the electronic component or the heat pipe connected to the heat absorption end, thereby improving the heat dissipation efficiency.

Description

A heat dissipation structure

Technical field

The utility model belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation structure.

Background technique

In the environment of rapid development of communication technology, the integration and miniaturization of components such as CPUs that generate heat during operation are becoming increasingly prominent, and the heating power is getting higher and higher. In related technologies, phase change refrigeration technology is used to dissipate heat, which is generally a heat pipe structure. The heat pipe includes an evaporation section and a condensation section. The heating power of heating components is increasing day by day, and it is difficult to ensure sufficient working fluid reflux with the use of heat pipe structure, and the heat dissipation efficiency is difficult to keep up with the development of the times.

technical problem

The purpose of the utility model is to provide a heat dissipation structure, which can assist the heat pipe structure to dissipate heat through an active heat dissipation method, thereby improving the heat dissipation efficiency, so as to meet the development of the times.

Technical solutions

The technical solution of the present invention is as follows: a heat dissipation structure for dissipating heat of electronic components, the heat dissipation structure includes a heat pipe connected to the electronic component at one end, and the heat pipe includes a heat pipe close to the electronic component The evaporating section and the condensing section away from the electronic component, the heat dissipation structure further includes a thermoelectric refrigeration device connected to the electronic component and/or the heat pipe at one end, the thermoelectric refrigeration device having a connection to the electronic component The heat-absorbing end of the device and/or the heat pipe and the heat-dissipating end away from the electronic component and/or the heat pipe.

Further, the heat absorption end of the thermoelectric refrigeration device is connected to the condensation section of the heat pipe.

Further, the heat-absorbing end of the thermoelectric refrigeration device is connected to the electronic component.

Further, the thermoelectric refrigeration device and the heat pipe are arranged at intervals.

Further, the evaporation section to the condensation section of the heat pipe are all connected with the heat absorption end of the thermoelectric refrigeration device.

Further, the number of the thermoelectric refrigeration device is two, and the two thermoelectric refrigeration devices are axially symmetrically distributed on both sides of the heat pipe with the central axis of the heat pipe extending from the evaporation section to the condensation section as an axis.

Further, the connection gap between the thermoelectric refrigeration device and the electronic component and/or the heat pipe is filled with a heat-conducting medium.

Further, the heat-conducting medium adopts heat-conducting gel.

Further, the thermoelectric refrigeration device is a P-type thermoelectric refrigeration device, the heat absorption end is supplied with current, and the heat dissipation end is grounded.

Beneficial effect

The beneficial effects of the utility model are:

On the one hand, the working fluid in the heat pipe can dissipate the heat of the electronic components through the evaporation-condensation cycle. On the other hand, by passing current into the heat-absorbing end of the thermoelectric refrigeration device and grounding the heat-dissipating end, it can actively realize the pairing with The electronic components or heat pipes connected to the heat-absorbing end are cooled, which improves the heat dissipation efficiency of the heat dissipation structure and can better meet the development of the times.

Description of the drawings

Figure 1 is a schematic structural diagram of the heat dissipation structure in embodiment 1 of the utility model;

2 is a schematic diagram of the structure of the heat dissipation structure in Embodiment 2 of the utility model;

FIG. 3 is a schematic diagram of the structure of the heat dissipation structure in Embodiment 3 of the present invention.

Embodiments of the present invention

In the following, the utility model will be further described in conjunction with the drawings and embodiments.

Example 1

A heat dissipation structure is provided for dissipating heat of electronic components 1 that generate heat. The heat dissipation structure includes a heat pipe 2 connected to the electronic component 1 at one end. The heat pipe 2 includes an evaporation section 21 close to the electronic component 1 and away from the electronic component 1 The heat dissipation structure of the condensing section 22 also includes a thermoelectric refrigeration device 3 connected to the electronic component 1 and/or heat pipe 2 at one end. The heat dissipation end 32 of the component 1 and/or the heat pipe 2, the thermoelectric refrigeration device 3 is a P-type thermoelectric refrigeration device, the heat absorption end 31 is supplied with current, and the heat dissipation end 32 is grounded. In other embodiments, it can also be designed as an N-type thermoelectric refrigeration device or a P-N junction thermoelectric refrigeration device.

On the one hand, the working fluid in the heat pipe 2 can dissipate the heat-generating electronic components 1 through an evaporation-condensation cycle. On the other hand, by passing a current through the heat-absorbing end 31 of the thermoelectric refrigeration device 3 and the heat-dissipating end 32 is grounded, The electronic component 1 or the heat pipe 2 connected to the heat absorption end 31 is actively cooled, which improves the heat dissipation efficiency of the heat dissipation structure and better meets the development of the times.

In this embodiment, the electronic component 1 may be a CPU, a GPU, an integrated chip, etc., as long as it is a component that generates heat that affects the working state during the working process.

In this embodiment, the heat-absorbing end 31 of the thermoelectric refrigeration device 3 is connected to the condensing section 22 of the heat pipe 2. Specifically, the contact surface of the heat-absorbing end 31 of the thermoelectric refrigeration device 3 is in contact with the outer wall surface of the condensing section 22 of the heat pipe 2. The contact surface of the heat absorbing end 31 and the condensing section 22 is supplied with current, and the contact gap between the heat absorbing end 31 and the condensing section 22 can be filled with a thermally conductive medium, such as a thermally conductive gel, thereby improving the gap between the heat absorbing end 31 and the condensing section 22. The heat transfer efficiency between. In the technical solution of this embodiment, the thermoelectric refrigeration device 3 can transport the heat of the condensing section 22 of the heat pipe 2 to the environment by actively dissipating heat, thereby increasing the condensation efficiency of the working fluid in the condensing section 22, so as to improve the cycle efficiency of the working fluid. The heat dissipation efficiency of the heat pipe 2 is further improved, so that the heat dissipation capacity of the heat dissipation structure is higher, and it is more adaptable to the development of technology.

Example 2

In this embodiment, the heat absorption end 31 of the thermoelectric refrigeration device 3 is connected to the electronic component 1, and the thermoelectric refrigeration device 3 and the heat pipe 2 are spaced apart. Specifically, the surface of the heat absorption end 31 of the thermoelectric refrigeration device 3 is connected to the electronic component 1. The surface of the component 1 is in contact and connected, the contact surface of the thermoelectric refrigeration device 3 and the electronic component 1 passes current, and the contact gap between the thermoelectric refrigeration device 3 and the electronic component 1 can be filled with a heat-conducting medium, such as a heat-conducting gel, thereby improving The heat exchange efficiency between the heat-absorbing end 31 and the condensing section 22. In the technical solution of this embodiment, the thermoelectric refrigeration device 3 can actively dissipate the heat generated by the electronic component 1 to the environment. Under the cooperative heat dissipation of the heat pipe 2, the combination of active heat dissipation and passive heat dissipation can be extremely effective. Increasing the heat dissipation limit can better meet the heat dissipation requirements of the technological development of corresponding components.

Example 3

In this embodiment, the evaporation section 21 to the condensation section 22 of the heat pipe 2 are all connected to the heat absorption end 31 of the thermoelectric refrigeration device 3, and the heat absorption end 31 of the thermoelectric refrigeration device 3 is connected to the electronic component 1. Specifically, the end surface of the heat-absorbing end 31 of the thermoelectric cooling device 3 is in contact with the entire tube body of the heat pipe 2, and one side of the heat-absorbing end 31 is in contact with the surface of the electronic component 1. In some embodiments, the thermoelectric cooling The end surface of the heat-absorbing end 31 of the device 3 can be in contact with a part of the body of the heat pipe 2; in this embodiment, the number of thermoelectric refrigeration devices 3 is two, and the two thermoelectric refrigeration devices 3 extend by the self-evaporating section 21 of the heat pipe 2 The central axis to the condensing section 22 is axisymmetrically distributed on both sides of the heat pipe 2. In some embodiments, only one thermoelectric cooling device 3 may be provided, or three thermoelectric cooling devices 3 may be provided at equal angular intervals around the circumference of the heat pipe 2. Four, five, etc. thermoelectric refrigeration devices 3 to ensure heat dissipation efficiency and heat dissipation uniformity. The connection gaps between the thermoelectric refrigeration device 3 and the electronic components 1 and the heat pipe 2 are filled with a heat-conducting medium, such as a heat-conducting gel, so as to improve the heat conduction efficiency between the thermoelectric refrigeration device 3 and the electronic components 1 and the heat pipe 2. In this embodiment, the heat pipe 2 and the thermoelectric refrigeration device 3 work together. On the one hand, they both absorb heat from the electronic component 1 and radiate it to the environment. On the other hand, the thermoelectric refrigeration device 3 can actively dissipate heat from the heat pipe. 2 The heat is transported to the environment, and the heat dissipation power allocated by the electronic components to the heat pipe 2 is assumed, thereby overall improving the heat dissipation capacity of the heat dissipation structure to meet the development requirements of the electronic components 1.

The technical solutions of the above embodiments can be combined with each other, and the size of the thermoelectric refrigeration device 3 can be specifically set according to the actual situation. Under allowable conditions, try to ensure the thickness of the thermoelectric refrigeration device 3. The greater the thickness of the thermoelectric refrigeration device 3, The better the cooling effect, the better the heat dissipation effect of the heat dissipation structure.

The above are only the embodiments of the present utility model. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present utility model, but these all belong to The scope of protection of the utility model.

Claims

A heat dissipation structure for dissipating heat of electronic components that generate heat. The heat dissipation structure includes a heat pipe connected to the electronic component at one end, and the heat pipe includes an evaporation section close to the electronic component and an evaporation section away from the The condensing section of the component is characterized in that the heat dissipation structure further includes a thermoelectric refrigeration device connected to the electronic component and/or the heat pipe at one end, and the thermoelectric refrigeration device has a thermoelectric refrigeration device connected to the electronic component and/or The heat absorption end of the heat pipe and the heat dissipation end away from the electronic component and/or the heat pipe.
The heat dissipation structure according to claim 1, wherein the heat absorption end of the thermoelectric refrigeration device is connected to the condensation section of the heat pipe.
The heat dissipation structure according to claim 1, wherein the heat absorption end of the thermoelectric refrigeration device is connected to the electronic component.
The heat dissipation structure according to claim 3, wherein the thermoelectric refrigeration device and the heat pipe are arranged at intervals.
The heat dissipation structure according to claim 4, wherein the evaporation section to the condensation section of the heat pipe are all connected to the heat absorption end of the thermoelectric refrigeration device.
The heat dissipation structure according to claim 5, wherein the number of the thermoelectric refrigeration device is two, and the two thermoelectric refrigeration devices are axisymmetric with the central axis of the heat pipe extending from the evaporation section to the condensation section Are distributed on both sides of the heat pipe.
The heat dissipation structure according to any one of claims 1-6, wherein the connection gap between the thermoelectric refrigeration device and the electronic component and/or the heat pipe is filled with a heat-conducting medium.
The heat dissipation structure according to claim 7, wherein the heat conduction medium is a heat conduction gel.
The heat dissipation structure according to claim 1, wherein the thermoelectric refrigeration device is a P-type thermoelectric refrigeration device, the heat absorption end is supplied with current, and the heat dissipation end is grounded.