TWM332259U - Structure improvement of electro-thermal tube protecting switch - Google Patents

Structure improvement of electro-thermal tube protecting switch Download PDF

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Publication number
TWM332259U
TWM332259U TW096204673U TW96204673U TWM332259U TW M332259 U TWM332259 U TW M332259U TW 096204673 U TW096204673 U TW 096204673U TW 96204673 U TW96204673 U TW 96204673U TW M332259 U TWM332259 U TW M332259U
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processing
processing unit
unit
batch
substrate
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TW096204673U
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Chinese (zh)
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Masahiro Yamamoto
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Dainippon Screen Mfg
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Publication of TWM332259U publication Critical patent/TWM332259U/en

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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Description

M332259 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種基板處理裝置及其控制裝置,其對半 導體晶圓及液晶顯示裝置用之玻璃基板(以下僅稱之為基 板)實施特定處理。 【先前技術】 先刖’作為此種裝置,例如:在藉由用於對基板實施處 理之具備複數個處理部之基板處理裝置處理複數批次之 際,為在各處理部依次處理各批次,控制部基於包含複數 個處理步驟之流私而決定各批次之處理順序,依照該排程 一邊搬送各批次,一邊依次進行處理(例如參照專利文獻 1)。 如此之基板處理裝置,由於在實際開始對各批次處理之 前,須決定在何處理部於何時點處理何批次,故可高效率 地配置批次,提高基板處理裝置之利用率。 [專利文獻1]日本特開2002-341923號公報 【新型内容】 [創作欲解決之技術問題] 但疋,在具有如此構成之先前例之情形,存在如下之 題。 。 即,先前之裝置在某一處理步驟所使用之處理部發生異 韦之情形,將停止預定使用該處理部之批次之全部處理。 因而,在一個處理部發生異常之情形,存在基板處理裝置 之利用率降低之問題。 M332259 本創作係餐於如此情況而完成者 基板處理裝置及直栌制If丄 的在於棱供一種 批… 猎由容許對代替處理部之 批之轉換,即使在處理部發生 之降低。 m亦可防止利用率 [解決問題之技術手段] 本創作為達成如此之目的,採取如下之構成。 部即求項1之基板處理裝置,其具備複數個處理 仙於對基板進行處理者;及控㈣,其係在處理 後數批:人之際,基於包含複數個處理步驟之流程,決 2定爲了在各處理部依次處理各批次之各批次處理順序之 私,然後實行處理者,·前述處理部具有為處理—個處理 步驟而優先使用之優先處理部 J延仃興則述優先處理 ^相同之處理’而與前述㈣處理部不同之代替處理部; p使在處理步驟指定之優先處理部發生異常之情形下 =對應於發生異常之優先處理部而指定代替處理部之流程 处理之批次,前述控制部變更排程以使前述代替處理部進 仃,理’且前述控制部以該變更後之排程繼續實行該 之處理。 [作用.效果]基於如請求項1之創作,關於在發生里常之 =處理部以指定代替處理部之流程所處理之批次,控制 錢更排程以轉換為代替處理部並進行批次之處理,且押 制部以該變更後之排程繼續實行該批次之處理。從而^ 使處理部發生異常’亦不必對全部批次停止處理,故可防 止利用率降低。 M332259 又’在本創作’較好的是,在—個處理步驟中所指定之 優先處理部發生異常之情形下,對於僅指定發生異常之優 先處理部之流程所處理之批次,前述控制部進行待避開前 述批次之處理,且在可使用前述優先處理部之時點,對該 批-人再度排程之後’重新開始該批次之處理(請求項之)。關 於以僅發生異常之優先處理部所指定之流程處理之批次, 控制部《該減,且在優先處理部之異常解除之時點, 重新對該批開始排程後之處理。從而,可防止在指定優先 處理部為流程之内之批次處理所產生之不便。 又,在本創作’較好的是,前述優先處理部係第】藥液 處理部,前述代替處理部係第2藥液處理部(請求们)。為 提高處理效率’基板處理裝置有時成對具備進行藥液處理 之第1樂液處理部、及如同樣構成之第2藥液處理部般之同 樣處理部。為分別進行同樣處理,兩藥液處理部可設定液 種、溫度等條件’所以若預先設定為同樣條件,即可設定 -方為優先使用之優先處理部’另一方為代替處理部。 主二在本創作’較好的是,前述優先處理部係第m水 處理部’前述代替處理部係第2純水清洗處理部(請求 項4)。為提高處理效率,美柘声 手基板處理裝置有時成對具備進行 純水清洗處理之第1純水清洗處理部 '及如同樣構成之第2 純水清洗處理部般之同樣處理成第2 兩純水清洗處理部可設定純水之溫度:° 一理, 若預先設定為同樣條件,即可設料,所以 方為優先使用之優先 處理部,另一方為代替處理部。 M332259 如《月求項5所記載的創作在1 關則料基板處理裝置 一處理部;第二處理部,1係 、/、備:第 FT占 /糸可進打與前述第一處神土 冋之處理,而與前述第一處 处理。Μ目 存包含複數個處理步驟之产鞋 “係儲 邱又机耘者,控制部,直 流程作成排程,在前述 /…、χ據前述 中,指定可變更前述第一走 持第二處理部’在前述第—處理部發生異常—處理 藉由轉換前述第-處理部和第月形下, 且以轉換後之排程發出處理=理例更前述排程, ^作用·效果]如請求物記載之創作,在第 先處理部)發生異常之情形,為轉換為第二處理部: 繼續實行處理1而,即=二且以該變更後之排程 防止利用率降f 刀處理部發生異常’亦可 如請求項6所記載之創作, 係基板處理裝置之控制裝 置,其具備:第一處理部·笛 地°卩,弟一處理部,其係可進行與前 述第一處理部相同之虛w ^ , 丨則之處理’而與前述第-處理部不同者; 其特徵為具備··排程部,爱系 ”係對應於包含複數個處理步驟 之流程作成排程者;分抵位u此At ^ 杇止狀悲官理部,其係在前述排 程指定可變更前述第一處 处理邛和第二處理部,在前述第一 處理部發生異常之情形 猎由轉換前述第一處理部和第 二處理部而變更前述排程者 汉慝理實仃指不部,其係以 轉換後之排程發出處理指令者。 [作用·效果]如請求項6所 〇 項6所冗載之創作,在第-處理部(優 先處理部)發生異常之情形, 馬轉換為第^一處理部(代替處 M332259 理部)並進行基板處理而變更排程,且㈣變更後之 繼續實行處理。從而,即使—部分處理部發生異常,亦^ 防止利用率降低。 [創作之效果] 依據本創作之基板處理裝置及控制裝置,其中以對應於 發生異常之優先處理部而指定代替處理部之流程所處理之 才人彳工制邻為轉換為代替處理部並進行批次之處理而變 更排私,且控制部以該變更後之排程繼續實行處理。從 而即使一部分處理部發生異常,亦不必對全部批次停止 處理,故可防止利用率降低。 【實施方式】 以下參照圖式説明本創作之一實施例。 圖1係顯示實施例之基板處理裝置之概略構成之平面 圖,圖2係顯示實施例之基板處理裝置之概略構成之方塊 圖。 該基板處理裝置係用於對基板w進行藥液處理、純水清 洗處理及乾燥處理之裝置。基板w對於盒丨積層收納有複 數枚(例如25枚)。使積層收納有未處理之基板w之盒丨載置 於投入部3。投入部3具備兩個載置盒1之載置台5。在挾持 基板處理裝置之大略中央部之投入部3之相反侧,配設有 遞出部7。遞出部7將處理完畢之基板w收納於盒丨内,每 個盒1向裝置外遞出。遞出部7與投入部3同樣,具備兩個 用於載置盒1之載置台9。 在沿著投入部3和遞出部7之位置,配設有構成為可在該 M332259 等之間移動之第1搬送機構11。該第1搬送機構i丨將複數枚 基板W連同載置於投入部3之盒1對第2搬送機構13搬送。 第2搬送機構13自盒1取出所收納之全部基板w後,將全 部基板W對第3搬送機構15搬送。又,從第3搬送機構15接 受處理完畢之基板W後,將基板W收納於盒1,對第1搬送 機構搬送。 弟3搬送機構15構成為可向基板處理裝置之長度方向移 動,在該移動方向之最近側,配置有用於將複數個基板w 收容於腔室内並乾燥之乾燥處理部17。 在第3搬送機構15移動之方向中,在與乾燥處理部17相 鄰之位置,配置有第1處理部19,在與該第1處理部19相鄰‘ 之裏側位置,配置有第2處理部21。 第1處理部19具備用於對複數枚基板W進行純水清洗處 理之純水清洗處理部19a,且具備對複數枚基板w進行藥 液處理之藥液處理部19b。在挾持純水清洗處理部19a和藥 液處理部19b之第3搬送機構15之相反側,具備用於僅在挾 持純水清洗處理部19a和藥液處理部19b之間交接複數枚基 板W之副搬送機構i9c。 第2處理部2 1具備與上述第1處理部19相同之構成。即具 備純水清洗處理部21a、藥液處理部21b、及副搬送機構 21 c 〇 在與上述第2搬送機構13相鄰之位置,配置有盒清洗部 23。該盒清洗部23具備在上述第2搬送機構13取出全部基 板W後,清洗空置狀態之盒1之功能。 M332259 另,上述之第1搬送機構^、第2搬送機構13、第3搬送 機構15、乾燥處理部17、第1處理部ι9(純水清洗處理部 19a和藥液處理部19b)、第2處理部21(純水清洗處理部21a 和藥液處理部21 b)相當於本創作之處理部。 如圖2之方塊圖所示,上述構成之基板處理裝置藉由控 制部25(控制裝置)總體控制。 控制部25由CPU等構成,具備排程部27、分批停止狀態 官理部29、及處理實行指示部3丨。連接於控制部25之記憶 部33由本基板處理裝置之使用者預先作成,預先儲存有·· 流程,其包含規定如何處理基板w之複數個處理步驟;排 程作成程式;實行所作成之排程之處理程式;及判斷發生 異韦時應停止之批次,或判斷重新開始關於已停止之批次 之處理之程式等。又,亦儲存有所作成之排程。 排程部27作成排程,將收容於盒1、載置於投入部3之複 數故基板W作為一批次處理,根據裝置之操作員指示預先 記憶於記憶部33之流程,以便可在實際開始處理之前將每 批次之處理步驟時序地高效率地配置。又,將在後面詳 述關於待避開之批次,亦具備有在待避開理由解除時再 度進行排程之功能。 另,亦可不以盒1為單位,而將收容於複數個盒丨之複數 枚基板W作為一批次。 分批停止狀態管理部29在基於排程使用之任意處理部發 生異:之情形’判別必須停止處理之批次和不必停止處理 之批次,且就使該批次進行待避開或在代替處理部(後面 M332259 詳述)繼續處理之管理。 處理實行指示部31係基於排程部27作成、記憶於記憶部 33之排程,以適當之時序進行關於各處理部等之動作才t 示。 於此,一邊參照表1説明具體之流程。另,為易於理解 説明,以比實際流程更簡化者為例説明。 " [表 1]M332259 VIII. New description: [Technical field of new type] This is a substrate processing apparatus and a control device thereof, which perform specific processing on a semiconductor wafer and a glass substrate (hereinafter simply referred to as a substrate) for a liquid crystal display device. . [Prior Art] As such a device, for example, when a plurality of batches are processed by a substrate processing apparatus including a plurality of processing units for processing a substrate, each batch is sequentially processed in each processing unit. The control unit determines the processing order of each batch based on the flow of the plurality of processing steps, and sequentially processes the batches in accordance with the schedule (see, for example, Patent Document 1). In such a substrate processing apparatus, it is necessary to determine which processing unit is to process the batches before actually starting the processing of each batch, so that the batch can be efficiently arranged and the utilization rate of the substrate processing apparatus can be improved. [Patent Document 1] JP-A-2002-341923 [New content] [Technical problem to be solved by creation] However, in the case of the prior art having such a configuration, the following problems exist. . That is, in the case where the previous apparatus generates an exception in the processing unit used in a certain processing step, all processing of the batch in which the processing unit is scheduled to be used is stopped. Therefore, in the case where an abnormality occurs in one processing unit, there is a problem that the utilization rate of the substrate processing apparatus is lowered. M332259 This creation is completed in such a case. The substrate processing apparatus and the 丄 丄 丄 丄 丄 丄 丄 丄 供 供 供 供 供 供 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎m can also prevent utilization [Technical means to solve the problem] In order to achieve such a goal, this creation adopts the following constitution. The substrate processing apparatus of claim 1, which has a plurality of processing units for processing the substrate; and the control (4), which is based on a process including a plurality of processing steps after the processing of the plurality of batches: In order to sequentially process the private processing order of each batch in each processing unit, and then execute the processor, the processing unit has a priority processing unit that is preferentially used for processing one processing step. In the case where the processing of the same processing is performed, the processing unit is different from the processing unit (a), and the processing unit of the processing unit is designated as the priority processing unit in which the processing is specified. In the batch, the control unit changes the schedule so that the replacement processing unit advances, and the control unit continues the processing by the changed schedule. [Action. Effect] Based on the creation of the request item 1, the batch that is processed by the processing unit in the process of designating the replacement processing unit is controlled, and the money is further scheduled to be converted into a substitute processing unit and batch is executed. Processing, and the mortal department continues to process the batch with the changed schedule. Therefore, it is not necessary to stop the processing of all the batches, so that the utilization rate can be prevented from being lowered. M332259 Further, in the case of the present creation, in the case where an abnormality occurs in the priority processing unit specified in the processing step, the control unit processes the batch processed by the process of specifying only the priority processing unit in which the abnormality has occurred. The processing of the batch to be avoided is performed, and the processing of the batch (request of the request) is restarted after the batch-person is scheduled again at the time when the priority processing unit can be used. The control unit "subtracts" the batch processed by the flow specified by the priority processing unit in which only the abnormality has occurred, and restarts the processing after the schedule is started when the priority of the priority processing unit is canceled. Thereby, it is possible to prevent the inconvenience caused by the batch processing in which the priority processing unit is designated as the flow. Further, in the present invention, it is preferable that the priority processing unit is a chemical liquid processing unit, and the replacement processing unit is a second chemical liquid processing unit (request). In order to improve the processing efficiency, the substrate processing apparatus may be provided in the same manner as the first liquid processing unit that performs the chemical processing, and the same processing unit as the second chemical processing unit. In order to perform the same processing, the two chemical processing units can set the conditions such as the liquid type and the temperature. Therefore, if the same conditions are set in advance, the priority processing unit can be set as the priority processing unit, and the other is the replacement processing unit. In the present invention, it is preferable that the priority processing unit is the mth water treatment unit, and the replacement processing unit is the second pure water washing processing unit (request item 4). In order to improve the processing efficiency, the singer-handling substrate processing apparatus may be treated in the same manner as the first pure water cleaning processing unit that performs the pure water cleaning treatment and the second pure water cleaning processing unit that is configured in the same manner. The two pure water washing treatment units can set the temperature of the pure water: ° If the same conditions are set in advance, the material can be set, so that the priority processing unit is used preferentially, and the other is the replacement processing unit. M332259, such as the one described in the monthly item 5, the processing unit 1 processing unit; the second processing unit, 1 series, /, preparation: the FT occupies / 糸 can enter the first Shendi Handling, and dealing with the first place mentioned above. Μ 存 包含 包含 包含 包含 包含 包含 包含 包含 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系The part 'in the first processing unit is abnormal—the processing is performed by converting the first processing unit and the moon shape, and the processing is performed by the converted schedule=there is a schedule, the action and the effect] as requested In the case where the object is created, the abnormality occurs in the first processing unit, and the process is switched to the second processing unit: the process 1 is continued, that is, the second process is performed, and the process is prevented from being reduced by the process. The abnormality can also be created as described in claim 6, and is a control device for the substrate processing apparatus, comprising: a first processing unit, a flute, and a processing unit, which can be the same as the first processing unit The virtual w ^ , the processing of the rule is different from the first processing unit; and the feature is that the scheduling unit and the love system are arranged in accordance with a process including a plurality of processing steps; Bit u this At ^ 杇 状 悲 官 官 , , In the schedule designation, the first processing unit and the second processing unit may be changed, and when the first processing unit is abnormal, the first processing unit and the second processing unit may be switched to change the scheduler. The truth is not the part, it is issued by the converted schedule. [Function and effect] In the case where the creation of the item 6 of the request item 6 is redundant, the horse is converted into the first processing unit (instead of the M332259 management unit) when an abnormality occurs in the first processing unit (priority processing unit). The substrate processing is performed to change the schedule, and (4) the processing is continued after the change. Therefore, even if an abnormality occurs in the partial processing section, the utilization rate is prevented from being lowered. [Effects of Creation] According to the substrate processing apparatus and the control device of the present invention, the process of designating the substitution processing unit corresponding to the priority processing unit in which the abnormality occurs is converted into the replacement processing unit and is performed. The privatization is changed by the processing of the lot, and the control unit continues the processing with the scheduled schedule. Therefore, even if an abnormality occurs in some of the processing units, it is not necessary to stop processing all the batches, so that the utilization rate can be prevented from being lowered. [Embodiment] An embodiment of the present creation will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment, and Fig. 2 is a block diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment. This substrate processing apparatus is a device for performing a chemical liquid treatment, a pure water cleaning treatment, and a drying treatment on the substrate w. The substrate w is housed in plural (e.g., 25) for the cassette entanglement layer. The cassette in which the unprocessed substrate w is stacked is placed on the input unit 3. The input unit 3 includes two mounting stages 5 on which the cassettes 1 are placed. A delivery unit 7 is disposed on the opposite side of the input unit 3 of the substantially central portion of the substrate processing apparatus. The delivery unit 7 stores the processed substrate w in a cassette, and each cassette 1 is delivered out of the apparatus. Similarly to the input unit 3, the delivery unit 7 includes two mounting bases 9 for mounting the cartridge 1. At the position along the input unit 3 and the delivery unit 7, a first transport mechanism 11 configured to be movable between the M332259 and the like is disposed. The first transport mechanism i transports a plurality of substrates W together with the cartridge 1 placed on the input unit 3 to the second transport mechanism 13. After the second transfer mechanism 13 takes out all the substrates w stored therein from the cassette 1, the entire substrate W is transported to the third transfer mechanism 15. When the processed substrate W is received from the third transport mechanism 15, the substrate W is stored in the cartridge 1 and transported to the first transport mechanism. The transport mechanism 15 is configured to be movable in the longitudinal direction of the substrate processing apparatus, and a drying processing unit 17 for accommodating a plurality of substrates w in the chamber and drying is disposed on the closest side of the moving direction. In the direction in which the third transport mechanism 15 moves, the first processing unit 19 is disposed at a position adjacent to the drying processing unit 17, and the second processing is disposed at a position on the back side of the first processing unit 19 Department 21. The first processing unit 19 includes a pure water washing treatment unit 19a for performing a pure water washing process on a plurality of substrates W, and a chemical liquid processing unit 19b that performs a chemical treatment on a plurality of substrates w. On the side opposite to the third transport mechanism 15 that holds the pure water washing treatment unit 19a and the chemical liquid processing unit 19b, the substrate is provided to transfer a plurality of substrates W only between the pure water washing processing unit 19a and the chemical processing unit 19b. Sub-transport mechanism i9c. The second processing unit 2 1 has the same configuration as the first processing unit 19 described above. In other words, the pure water washing treatment unit 21a, the chemical liquid processing unit 21b, and the sub transport mechanism 21 c 配置 are disposed at positions adjacent to the second transport mechanism 13 to arrange the cartridge cleaning unit 23. The cartridge cleaning unit 23 has a function of cleaning the cartridge 1 in an empty state after the entire substrate W is taken out by the second transport mechanism 13. M332259 In addition, the first transport mechanism ^, the second transport mechanism 13, the third transport mechanism 15, the drying processing unit 17, the first processing unit ι9 (the pure water washing processing unit 19a and the chemical liquid processing unit 19b), and the second The processing unit 21 (the pure water washing processing unit 21a and the chemical liquid processing unit 21b) corresponds to the processing unit of the present creation. As shown in the block diagram of Fig. 2, the substrate processing apparatus of the above configuration is generally controlled by the control unit 25 (control means). The control unit 25 is constituted by a CPU or the like, and includes a scheduling unit 27, a batch stop state official unit 29, and a processing execution instruction unit 3A. The memory unit 33 connected to the control unit 25 is prepared in advance by the user of the substrate processing apparatus, and stores a flow in advance, including a plurality of processing steps for specifying how to process the substrate w, a schedule creation program, and execution scheduling. The processing program; and the batch that should be stopped when the occurrence of the different wei, or the program for restarting the processing of the stopped batch. Also, there are also scheduled schedules. The scheduling unit 27 is arranged to process the plurality of substrates W placed in the cassette 1 and placed in the input unit 3 as a batch, and the flow in advance in the memory unit 33 is instructed by the operator of the device so that the actual operation can be performed. The processing steps of each batch are time-efficiently configured before starting the process. Further, the batch to be avoided will be described in detail later, and the function of rescheduling when the reason to be avoided is released will be provided. Alternatively, the plurality of substrates W accommodated in the plurality of cassettes may be used as a single batch without using the cartridge 1. The batch stop state management unit 29 discriminates between the batch that must be stopped and the batch that does not have to be processed in the case where any processing unit based on the schedule is different: and the batch is to be avoided or replaced. The processing unit (described in detail later in M332259) continues the management of processing. The processing execution instruction unit 31 is based on the schedule created by the scheduling unit 27 and memorized in the memory unit 33, and performs an operation on each processing unit or the like at an appropriate timing. Here, the specific flow will be described with reference to Table 1. In addition, for the sake of easy understanding, the description is simplified by an example that is more simplified than the actual flow. " [Table 1]

處理步驟 處理内容 第1批次L1 第2批次L2 第3批次L3 第1處理步驟 A A A 第2處理步驟 B、C B、C B 第3處理步驟 D、E D、E D 第4處理步驟 F F F 第5處理步驟 A A A 在上表1,符號A〜F表示處理部,具體而言,處理部A表 示將第1搬送機構11、第2搬送機構13、第3搬送機構15作 為有關搬送之一個處理部者,處理部B表示第1處理部19之 藥液處理部19b,處理部C表示第2處理部21之藥液處理部 21b,處理部D表示第1處理部19之純水清洗處理部19a,處 理部E表示第2處理部21之純水清洗處理部21a,處理部F表 示乾燥處理部17。第1處理部19之藥液處理部19b和第2處 理部21之藥液處理部21b亦可設定為用於不同之流程之不 同之處理液及不同之液溫、供給流量等,但於此全部設定 為用於相同流程之相同設定。又,關於純水清洗處理部 19a和純水清洗處理部21 a,亦全部設定為純水之溫度及供 給流量等相同之設定。另,在上述流程,副搬送機構 -12- M332259 1 9c、2 1 c省略。 第1批次LI之流程由第1處理步驟〜第5處理步驟之5個處 理步驟構成,第1處理步驟係藉由處理部A之搬入處理,第 2處理步驟係藉由處理部b或處理部c之藥液處理,第3處 理步驟係藉由處理部D或處理部E之純水清洗處理,第4處 理步驟係藉由處理部F之乾燥處理,第5處理步驟係藉由處 理部A之搬出處理。又,第2批次以之流程與上述第1批次 L1之流程相同。 第3批次L3之流程由第1〜第5處理步驟之5個處理步驟構 成’第1處理步驟係藉由處理部A之搬入處理,第2處理步 驛係藉由處理部B之藥液處理,第3處理步驟係藉由處理部 D之純水清洗處理,第4處理步驟係藉由處理部ρ之乾燥處 理’弟5處理步驟係藉由處理部a之搬出處理。 另’在上述第1批次L1和第2批次L2之第2處理步驟,處 理部B係實施第2處理步驟所優先使用之處理部,稱之為優 先處理部。又,係可實施與優先處理部相同處理之處理 部,而又與優先處理部不同之處理部,稱為代替處理部。 在本例,第2處理步驟中之處理部c係處理部B之代替處理 部,第3處理步驟中之處理部E係處理部〇之代替處理部。 上述第3批次L3係在任一處理步驟均僅指定一個處理部, 未規定優先處理部和代替處理部之批次。但在此情形下, 將該處理部稱為優先處理部。 下面參照圖3〜圖5説明上述構成之基板處理裝置之動 作。另’圖3係顯示基板處理裝置之動作之絲圖,圖*係 -13 · M332259 示排程變更例 例之時序圖。 J之時序圖,圖5係顯Processing step processing content First batch L1 Second batch L2 Third batch L3 First processing step AAA Second processing step B, CB, CB Third processing step D, ED, ED Fourth processing step FFF Fifth processing Step AAA In the above table 1, the symbols A to F indicate the processing unit. Specifically, the processing unit A indicates that the first transport mechanism 11, the second transport mechanism 13, and the third transport mechanism 15 are one processing unit for transport. The processing unit B indicates the chemical processing unit 19b of the first processing unit 19, the processing unit C indicates the chemical processing unit 21b of the second processing unit 21, and the processing unit D indicates the pure water cleaning processing unit 19a of the first processing unit 19, and the processing unit B The part E indicates the pure water washing processing unit 21a of the second processing unit 21, and the processing unit F indicates the drying processing unit 17. The chemical processing unit 19b of the first processing unit 19 and the chemical processing unit 21b of the second processing unit 21 may be set to different processing liquids for different processes, different liquid temperatures, supply flow rates, and the like. All are set to the same settings for the same process. Further, all of the pure water washing treatment unit 19a and the pure water washing treatment unit 21a are set to the same settings as the temperature of the pure water and the supply flow rate. Further, in the above flow, the sub-transport mechanism -12- M332259 1 9c, 2 1 c is omitted. The flow of the first batch of LI is composed of five processing steps from the first processing step to the fifth processing step, the first processing step is performed by the processing unit A, and the second processing step is performed by the processing unit b or processing. In the liquid chemical treatment of the part c, the third processing step is a pure water cleaning process by the processing unit D or the processing unit E, the fourth processing step is a drying process by the processing unit F, and the fifth processing step is performed by the processing unit. A move out of processing. Further, the flow of the second batch is the same as the flow of the first batch L1 described above. The flow of the third batch L3 is constituted by five processing steps of the first to fifth processing steps. The first processing step is carried out by the processing unit A, and the second processing step is performed by the processing unit B. The third processing step is a pure water cleaning process by the processing unit D, and the fourth processing step is a drying process of the processing unit ρ. The processing process of the second processing step is performed by the processing unit a. In the second processing step of the first batch L1 and the second batch L2, the processing unit B is a processing unit that is preferentially used in the second processing step, and is referred to as a priority processing unit. Further, a processing unit that can perform the same processing as the priority processing unit and a processing unit that is different from the priority processing unit is referred to as a replacement processing unit. In this example, the processing unit c in the second processing step is a substitute processing unit of the processing unit B, and the processing unit E in the third processing step is a substitute processing unit in the processing unit. In the third batch L3, only one processing unit is specified in any of the processing steps, and the batch of the priority processing unit and the replacement processing unit is not defined. However, in this case, the processing unit is referred to as a priority processing unit. Next, the operation of the substrate processing apparatus having the above configuration will be described with reference to Figs. 3 to 5 . Fig. 3 is a view showing the operation of the substrate processing apparatus, and Fig. 3 is a timing chart showing an example of the schedule change. J's timing chart, Figure 5 shows

.^ 未處基板之盒1載置於投入 之載置台(步驟S1),同睥您去同—1 仅八4 3 J f從未圖不之指示部指 S2)。於是,控制邱9ς # ?曰不机私(步驟 ί工制邛25讀取記憶部33中 顯示排程後狀態之一例 之時序圖。又, 步驟S1〜S 3 裝置操作員將收納有夫 料,進而進行處理步驟之時 °隐之〜程資 /评炙時間汁异(步驟S3)。然 部27基於處理步驟所需 矛王 坏而時間作成排程。於此,自第 L1至第3批次L3依次載詈尺 指定流程。人栽置於載置台5,由操作員按上述表叉 步驟S4 排程部27參照記憶部33,基於上述表丨所示之各流程作 成排程(步驟S4)。該排程方法有各式轉,例如圖4所 示;;夺序地配置有第1批次U、第2批次L2、第3批次“之 /瓜私所i g之各處理步驟(圖中顯示為第1處理步驟p 1、第 2處理ν驟卩2、第3處理步驟ρ3、第4處理步驟ρ4、第5處理 乂驟卩5)另’圖4中之第1處理步驟?1等,其中央部表示 實質之處理,其前部係前作業(使用處理部之前所進行之 準備),其後部作為後作業(使用處理部之後所進行之清理) 附加。因為本創作係實際開始處理之前預先作成排程之方 式所以在κ際移動批次之前開始其後之處理部之前作 業,批次移動至其後之處理部之後,使用該批次進行處理 部之後作業。 步驟S5、S6 -14 - M332259 行指程之同時開始處理(步卿處理實 _令_. 步驟S7、S8 处里枇久L1〜L3。 刀批铋止狀態管理部29 驟峨分歧處理。在未…各,&否發生異常(步 > -#。 未表生異甲之情形,藉由處理實;f亍 “部_斷有否其 <里實订 返回步驟S… ?曰士_,在有如此指令時, 达口 4S6 ’指示其後之 形,結束處理。 在無如此指令之情 步驟S9、S10 ^ = ’在分批停止狀§管理部骑 =之:形’進行步驟S9之處理,為向操作員報知異 ^而進打報知。然後判斷是否應停止處理(步驟 S10),在不必停止之愔 八甘,, 之^形下,返回步驟S6,指示處理指 y其例如相當於在與現在正在處理之^批次L1〜第3批 -人L3無關之處理部發生異常之情形。 步驟 S11、s 12 在分批停止狀態管理部29檢測出任一處理部發生 且判斷應停止處理之情形’首先判斷成為對象之料,在 待避開該批次(步驟S11)之同時,在該批次之處理可以重新 開始之情形下,進;^干番雜P弓 次在排程部27再度排程Μ令(步驟S12)’僅就該批 於此,如圖5所示’現在時點係時刻ti,例如係處理部 B(第1處理部19之藥液處理部⑽)發生異常,未進行使用 -15- M332259 該處理部B之處理(第2處理步驟P2)之狀態。在該時刻tl, 因為藉由處理部B對第丨批次以之處理已經結束,所以成為 對象之批次判斷為第2批次L2和第3批次L3。因此,分批停 止狀態管理部29參照第2批次L2之流程,判斷是否指定代 替處理部,若有代替處理部,則變更第2批次L2之排程, 將優先處理部之處理部B之處理轉換為代替處理部之處理 部C(第2處理部21之藥液處理部21b)之處理。然後,處理 貝行指示部3 1接收其,並用轉換為處理部c之情形之排程 發出處理指令,關於第2批次L2,可不必停止處理而繼續 進行處理。 另,關於停止處理之第3批次L3,在處理實行指示部3 i 使其暫且待避開於未圖示之待避部之同時,分批停止狀態 管理部29管理使第3批次L3於待避部待避開。在處理部b之 異常解除,可以使用之情形,將其傳輸至分批停止狀態管 理部29,分批停止狀態管理部29接收其且使再度進行使用 處理部B之排程之方式傳輸至排程部27。接收其之排程部 27進行再度排程。 例如,在圖6中之時刻t2(正在進行第2批次藉處理部!^之 乾燥處理)’若處理部B之異常解除,則為從當初圖中虛線 所示位置開始處理,所排程之第3批次L3係從第2批次L2之 搬送處理結束之後開始處理而進行再度排程。 如上所述,關於在發生異常之優先處理部B指定代替處 理部C之流程所處理之第2批次L2,為轉換為代替處理部c 並進行第2批次L2之處理,在控制部25變更排程之同時, -16 - M332259 控制部25用該變更之排程繼續實行第2批次£2之處理。從 而,即使優先處理部B發生異常,自第1批次L1至第3批次 L3之全部批次亦不必停止處理,故可防止基板處理裝置之 利用率降低。 又,關於僅發生異常之優先處理部B以所指定之流程處 理之第3批次L3,控制部25使第3批次L3待避開,且在優先 處理部B之異常解除之時點,對第3批次以排程之後,再度 開始處理。從而,可防止於優先處理部B中指定為流程之 内之第3批次L3之處理產生不便。 本創作並不限於上述實施形態,可如下變形實施。 (1) 在上述實施例,以同時處理3批次之情形為例説明, 但即使在同時處理1〜2批次或4批次以上之情形亦可適用本 創作。 (2) 在上述實施例,在流程内於一個優先處理部規定一 個代替處理部。但是,在基板處理裝置,在除上述之第工 處理部19和第2處理部21外,進而具備第3處理部和第4處 理部等3台以上可進行同一處理之處理部之情形,於一個 優先處理部規定複數個代替處理部亦可。此情形下,為按 照代替處理部之指定順序優先地使用而進行排程,進而在 該代替處理部發生異常之情形,使用其後之代替處理部即 可。 分(3)在實施例所例舉之基板處理裝置係對基板依次進行 藥液處理、純水清洗處理、及乾燥處理之裝置,但即使^ 進行其以外處理之基板處理裝置,亦可適用本創作。例 -17- M332259 如,亦可為在基板上塗佈光阻劑,藉由旋轉處理薄膜化, 藉由焙燒處理形成被膜之裝置。 (4)在上述實施例,關於以規定代替處理部之流程處理 之批次,使其進行轉換,關於非如此之批次使其待避開, 規定代替處理部之内之流程處理之批次,亦 在解除處理部之故障之時點使其爯声妯兹 ,一 一……..冉度排私。但是,對於以 待避開,由操作員再度投入該批二欠 【圖式簡單說明】 可為使其全部 圖1係顯示貫施例之基板處理梦 面 塊 圖 圖 。 戒置之概略構成之平 圖2係顯示實施例之基板處 。 U裝置之概略構成之方 圖3係顯示基板處理裝置之動作之流程圖。 圖4係顯示排程後狀態之—例之日夺# _ 圖5係顯示排程變更例之時序圖。 圖6係顯示再度排程之一例 〜听序圖。 【主要元件符號說明】 1 盒 3 投入部 5 載置台 7 遞出部 9 載置台 11 第1搬送機構 13 第2搬送機構 M332259 15 第3搬送機構 17 乾燥處理部 19 第1處理部 19a 純水清洗處理部 19b 藥液處理部 19c 副搬送機構 21 第2處理部 21a 純水清洗處理部 21b 藥液處理部 21c 副搬送機構 23 盒清洗部 25 控制部 27 排程部 29 分批停止狀態管理部 31 處理實行指示部 33 記憶部 W 基板 -19-.^ The box 1 that is not on the substrate is placed on the loading table (step S1), and you are going to the same -1 only 8 4 3 J f has never been indicated by the instruction part S2). Then, the control Qiu 9 ς 曰 曰 ( ( 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取 读取And when the processing step is performed, the time is hidden (the process time/the evaluation time is different (step S3). The second part 27 is scheduled based on the time required for the processing step. Here, from the first L1 to the third The batch L3 is sequentially loaded with the ruler designation flow. The person is placed on the mounting table 5, and the operator presses the memory unit 33 in accordance with the above-described table step S4, and the schedule is made based on the processes shown in the above table (steps). S4). The scheduling method has various types of conversion, for example, as shown in FIG. 4;; the processing of the first batch U, the second batch L2, and the third batch of "the melon private office ig" are arranged in order. Step (the figure shows the first processing step p1, the second processing ν 卩2, the third processing step ρ3, the fourth processing step ρ4, and the fifth processing step 卩5) and the first processing in FIG. In the first step, etc., the central part indicates the actual processing, the front part is the front work (preparation before the use of the processing part), and the rear part is the post work. (cleaning after the use of the processing unit) is added. Since the creation system is pre-programmed before the processing is actually started, the work before the processing unit is started before the batch is moved, and the batch is moved to the subsequent one. After the processing unit, the batch is used to perform the processing after the processing unit. Steps S5, S6 - 14 - M332259 The processing starts at the same time as the step (step qing processing _ _. Steps S7 and S8 are long L1 to L3. The knife-and-battery state management unit 29 slams the divergence process. In the case of [...], no abnormality occurs (step >-#. The case where the face is not formed, by the fact that it is processed; Otherwise, it is returned to step S...? gentleman _, when there is such an instruction, the port 4S6' indicates the subsequent shape and ends the processing. In the absence of such a command, the steps S9, S10 ^ = 'in the minute The batch stop § management unit rides the = shape "going to the processing of step S9, in order to notify the operator of the difference, and then to report the knowledge. Then determine whether the processing should be stopped (step S10), without having to stop it, Return to step S6, indicating that the processing finger y is, for example, equivalent An abnormality occurs in the processing unit that is not related to the batch L1 to the third batch-person L3 that are currently being processed. Steps S11 and s12 The batch stop state management unit 29 detects that any processing unit has occurred and determines that the processing should be stopped. The situation 'first judges the material to be the object, while the batch is to be avoided (step S11), in the case where the processing of the batch can be restarted, the ^Panfan P bow is in the scheduling section. 27 rescheduling command (step S12) 'only this is the case, as shown in Fig. 5, the current time point ti, for example, the processing unit B (the liquid chemical processing unit (10) of the first processing unit 19) is abnormal. The state of the processing of the processing unit B (second processing step P2) is not performed using -15- M332259. At this time t1, since the processing by the processing unit B for the second batch has been completed, the target batch is determined to be the second batch L2 and the third batch L3. Therefore, the batch stop state management unit 29 refers to the flow of the second lot L2, and determines whether or not the replacement processing unit is designated. If there is a substitute processing unit, the schedule of the second batch L2 is changed, and the processing unit B of the priority processing unit is changed. The processing is switched to the processing of the processing unit C (the chemical processing unit 21b of the second processing unit 21) in place of the processing unit. Then, the processing line instruction unit 31 receives the processing, and issues a processing instruction with the schedule converted to the processing unit c. With respect to the second batch L2, the processing can be continued without stopping the processing. In the third batch L3 in which the processing is stopped, the processing execution instruction unit 3 i is temporarily prevented from being bypassed by the to-be-avoided portion (not shown), and the batch stop state management unit 29 manages the third batch L3. The shelter to be avoided is to be avoided. When the abnormality of the processing unit b is released, it can be transmitted to the batch stop state management unit 29, and the batch stop state management unit 29 can receive the schedule of the use processing unit B and transfer it to the row. Cheng Department 27. The scheduling unit 27 is received to perform the rescheduling. For example, at time t2 in FIG. 6 (drying process of the second lot borrowing processing unit is performed), if the abnormality of the processing unit B is canceled, the processing is started from the position indicated by the broken line in the original drawing, and the scheduling is performed. The third batch L3 is processed after the end of the transfer process of the second lot L2, and is rescheduled. As described above, the second batch L2 processed by the priority processing unit B that specifies the abnormality processing unit B is converted into the replacement processing unit c and the second batch L2 is processed, and the control unit 25 At the same time as the schedule is changed, the -16 - M332259 control unit 25 continues the processing of the second batch of £2 with the schedule of the change. Therefore, even if an abnormality occurs in the priority processing unit B, it is not necessary to stop the processing from all the batches of the first batch L1 to the third batch L3, so that the utilization rate of the substrate processing apparatus can be prevented from being lowered. Further, in the third batch L3 in which the priority processing unit B that has generated only the abnormality is processed in the designated flow, the control unit 25 causes the third batch L3 to be avoided, and when the priority processing unit B is abnormally released, After the third batch is scheduled, the processing starts again. Therefore, it is possible to prevent inconvenience in the processing of the third lot L3 designated as the flow in the priority processing unit B. The present invention is not limited to the above embodiment, and can be modified as follows. (1) In the above embodiment, the case where three batches are simultaneously processed is taken as an example, but the present invention can be applied even in the case of simultaneously processing 1 to 2 batches or 4 batches or more. (2) In the above embodiment, an alternative processing unit is defined in a priority processing unit in the flow. In addition to the above-described processing unit 19 and the second processing unit 21, the substrate processing apparatus further includes three or more processing units that can perform the same processing, such as the third processing unit and the fourth processing unit. One priority processing unit may specify a plurality of alternative processing units. In this case, the scheduling is performed preferentially in accordance with the order of designation in place of the processing unit, and in the case where an abnormality occurs in the replacement processing unit, the subsequent processing unit may be used. (3) In the substrate processing apparatus exemplified in the embodiment, the substrate is sequentially subjected to a chemical liquid treatment, a pure water cleaning treatment, and a drying treatment. However, the substrate processing apparatus that performs the other processing may be applied to the substrate processing apparatus. creation. Example -17- M332259 For example, a device in which a photoresist is coated on a substrate and thinned by a spin process to form a film by firing is also possible. (4) In the above embodiment, the batch processed by the process of replacing the processing unit with a predetermined portion is converted, and the batch to be avoided is excluded from the batch, and the batch processing in place of the processing portion is specified. Also, when the fault of the processing department is released, it will be humming, and one by one........ However, for the operator to be avoided, the operator re-introduces the batch of two owes. [Simplified description of the drawing] It is possible to display all of the substrate processing dream block diagrams of the embodiment. The schematic configuration of the ring is shown in Fig. 2 which shows the substrate of the embodiment. Outline of U Device FIG. 3 is a flow chart showing the operation of the substrate processing apparatus. Fig. 4 shows the state after the schedule - the example of the day # _ Fig. 5 is a timing chart showing the example of the schedule change. Figure 6 shows an example of rescheduling ~ listening sequence. [Description of main component symbols] 1 cartridge 3 input unit 5 mounting table 7 delivery unit 9 mounting table 11 first conveying mechanism 13 second conveying mechanism M332259 15 third conveying mechanism 17 drying processing unit 19 first processing unit 19a pure water cleaning Processing unit 19b Chemical liquid processing unit 19c Sub-transporting mechanism 21 Second processing unit 21a Pure water washing processing unit 21b Chemical liquid processing unit 21c Sub-transporting mechanism 23 Cartridge cleaning unit 25 Control unit 27 Scheduling unit 29 Batch stop state management unit 31 Processing execution instruction unit 33 memory unit W substrate-19-

Claims (1)

M332259 九、申請專利範圍: 1. 一種基板處理裝置,其具備:複數個處理部,其係用於 對基板進行處理者;及控制部,其係在處理複數批次之 際,基於包含複數個處理步驟之流程,決定供規定在各 處理部依次處理各批次之各批:欠處理順序之排程,然後 實行處理者; 前述處理部具有為處理一個處理步驟而優先使用之優 先處理部;及彳進行與前述優先處理部㈣之處理,而 與前述優先處理部不同之代替處理部; 即使在處理步驟中指定之優先處理部發生異常之情形 下,對於對應於發生異常之優先處理部而指定代替處理 部之流程所處理之批次,前述控制部變更排程以使前述 代替處理部進行處理,且前述控制部以該變更後之排程 繼續實行該批次之處理。 2·如請求項1之基板處理裝置,其中 在一個處理步驟中所指定之優先處理部發生異常之情 1下’對於僅&定發生異常之優先處理部之流程所處理 之批次,前述控制部進行避開前述批次之處理,且在可 使用前述優先處理部之時點,對該批次再度排程之後, 重新開始該批次之處理。 3·如請求項1或2之基板處理裝置,其中 前述優先處理部係第丨藥液處理部,前述代替處理部 係第2藥液處理部。 4·如請求項1或2之基板處理裝置,其中 -20· M332259 前述優先處理部係第1純水清洗處理部,前述代替声 理部係第2純水清洗處理部。 種基板處理裝置,其係處理基板之基板處理裝置, 特徵為具備: >、 第一處理部; 第二處理部’其係可進行與前述第—處理部相同 理,而與前述第一處理部不同者; 2憶部’其係儲存包含複數個處理步驟之流程者; 控=,其係根據前述流程作成排程,在前 中二曰疋可變更前述第一處理部和第二處理 第一處理部發生異常之情形下^ 部釦筮-占 稽田轉換則述第一處理 苐一處理部而變更前述排程, 出處理指令者。 以轉換後之排程發 6. 一„裝置之控制裝置,其特徵為具備: 处理部’第二處理部,呈 / 理部相同之卢拽, 八係可進行與前述第一處 其心處理,而與前述第一處理部不同者; 排程排程部,其係根據包含複數個處理步驟之流程作成 分批停止狀態管理部,| 乂 更前述第-處理部和第二處理::在中指定可變 ^異常之情形下,藉由轉換前述第一處理部發 邛而變更前述排程者;及 处理邛和第二處理 處理實行指示部,其传 令者。 …、轉換後之排程發出處理指 •21·M332259 IX. Patent Application Range: 1. A substrate processing apparatus comprising: a plurality of processing units for processing a substrate; and a control unit for processing a plurality of batches based on a plurality of In the flow of the processing step, it is determined that the batches of each batch are sequentially processed in each processing unit: the schedule of the under-processing sequence is executed, and then the processor is executed; the processing unit has a priority processing unit that is preferentially used for processing one processing step; And the processing of the priority processing unit (4), and the replacement processing unit different from the priority processing unit; and when the priority processing unit specified in the processing step is abnormal, the priority processing unit corresponding to the occurrence of the abnormality The batch that is processed by the flow of the processing unit is designated, and the control unit changes the schedule to cause the substitute processing unit to perform processing, and the control unit continues the processing of the batch with the changed schedule. 2. The substrate processing apparatus according to claim 1, wherein in the case where the priority processing unit specified in one processing step is abnormal, the batch processed by the flow of the priority processing unit that only generates an abnormality is the aforementioned The control unit performs the processing of avoiding the batch, and restarts the processing of the batch after the batch is rescheduled at the time when the priority processing unit can be used. The substrate processing apparatus according to claim 1 or 2, wherein the priority processing unit is a second drug solution processing unit, and the replacement processing unit is a second drug solution processing unit. 4. The substrate processing apparatus according to claim 1 or 2, wherein the priority processing unit is a first pure water cleaning unit, and the substitute sound unit is a second pure water washing unit. A substrate processing apparatus which is characterized in that: a substrate processing apparatus for processing a substrate is characterized in that: • a first processing unit; and a second processing unit that performs the same processing as the first processing unit, and the first processing 2 different parts; 2 memorandum's department stores a process that includes a plurality of processing steps; control =, which is based on the foregoing process, and the first processing unit and the second processing unit can be changed in the first two When an abnormality occurs in one processing unit, the first processing unit is used to change the schedule, and the processing command is executed. According to the schedule after the conversion, the control device of the device is characterized in that: the processing unit is provided with a second processing unit, and the same processing unit is used, and the eight systems can be processed with the first part. And the first processing unit is different from the first processing unit; the scheduling unit is configured as a component batch state management unit according to a process including a plurality of processing steps, and the first processing unit and the second processing are: In the case where the variable is specified, the scheduler is changed by switching the first processing unit; and the processing unit and the second processing processing execution instruction unit are transmitted by the ...., the converted schedule Issue processing instructions
TW096204673U 2006-03-27 2007-03-23 Structure improvement of electro-thermal tube protecting switch TWM332259U (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724388B (en) * 2018-11-05 2021-04-11 日商國際電氣股份有限公司 Substrate processing device, semiconductor device manufacturing method, and recording medium

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5270285B2 (en) * 2008-09-29 2013-08-21 大日本スクリーン製造株式会社 Substrate processing equipment
JP4770938B2 (en) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 Substrate processing equipment
JP5374203B2 (en) * 2009-03-25 2013-12-25 大日本スクリーン製造株式会社 Substrate processing apparatus schedule creation method and program thereof
JP6224359B2 (en) 2013-06-20 2017-11-01 株式会社Screenホールディングス Schedule creation method and schedule creation program for substrate processing apparatus
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US10698392B2 (en) * 2018-06-22 2020-06-30 Applied Materials, Inc. Using graphics processing unit for substrate routing and throughput modeling

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206092A (en) * 1992-01-24 1993-08-13 Kyushu Electron Metal Co Ltd Method of automatically washing semiconductor wafer
JP3254520B2 (en) * 1997-11-27 2002-02-12 東京エレクトロン株式会社 Cleaning treatment method and cleaning treatment system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724388B (en) * 2018-11-05 2021-04-11 日商國際電氣股份有限公司 Substrate processing device, semiconductor device manufacturing method, and recording medium
US10984991B2 (en) 2018-11-05 2021-04-20 Kokusai Electric Corporation Substrate processing apparatus

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