M327054 八、新型說明： 【新型所屬之技術領域】M327054 Eight, new description: [New technology field]
本創作係有關於一種輻射散熱結構，尤其是指一種以 熱輻射方歧行憾，且其賴躲符合黑_射，並令 組，有該輻射散熱結構之機械或電子產品其體積可更^ 輕薄小巧，而在其整體施行使用上更增實用功效特輕 射散熱結構創新設計者。 【先前技術】 知^,各式機械或電子之產品於運作時，其均會產生 ，的熱能，使得若該產品上未組設有散熱元件，該產品内 =之機械或電子元件極容易因運作產生之大量的熱能而 ie成損壞，且該產品本身的運作功效也會受限於散熱元 ，效能優劣與否，若產品組設之散熱元件效能愈高，則產 品之運作功效也愈好，因散熱元件之效能與產品運作功致 息息相關，如何提高散熱元件之散熱效能，係為機 蕾 子產品產業之重要訴权-。 次電 其中，如第四圖現有之結構示意圖所示，其係為—般 機械或電子產品所組設之散熱器（61)，該散熱器（61)係應 用熱對流或熱傳導之原理，將大量的熱能予以排除，如^ 電腦内部之CPU中央處理器（62)，其則係在該中央處理器 (62)上組設散熱器（61)，同時亦可在該中央處理器（62)及 散熱器（61)之間塗佈有散熱膏（63)，以能增加該散熱器 (61)之散熱效能。 然而’上述之散熱#雖可達到將大量的熱能予以排除 的預期功效，但卻在其實際施行使用上發現，該結構由於 散熱器或散熱膏之散熱原理皆係為熱傳導或熱對流的方 M327054 式’在其散熱功效、速率上仍有所限制， 行使用上仍有其改進之空間。This creation is about a kind of radiation heat dissipation structure, especially refers to a kind of heat radiation, and it is suitable for black and white, and the mechanical or electronic products with the radiation heat dissipation structure can be made thinner and lighter. And in its overall implementation, it is more innovative and practical. [Prior Art] It is known that when various mechanical or electronic products are in operation, they generate heat energy, so that if there is no heat dissipating component on the product, the mechanical or electronic components in the product are extremely easy to be The large amount of heat generated by the operation is damaged, and the function of the product itself is limited by the heat sink element. The performance is good or bad. If the heat dissipation component of the product set is more efficient, the function of the product is better. Because the efficiency of the heat-dissipating components is closely related to the operation of the product, how to improve the heat-dissipating efficiency of the heat-dissipating components is an important right of action for the machine-leaf product industry. The secondary power, as shown in the prior art schematic diagram of the fourth figure, is a heat sink (61) assembled by a general mechanical or electronic product, and the heat sink (61) is applied by the principle of heat convection or heat conduction. A large amount of thermal energy is excluded, such as a CPU central processing unit (62) inside the computer, which is provided with a heat sink (61) on the central processing unit (62), and also in the central processing unit (62). A heat dissipating paste (63) is coated between the heat sink (61) to increase the heat dissipation performance of the heat sink (61). However, the above-mentioned heat dissipation # can achieve the expected effect of eliminating a large amount of heat energy, but it is found in the actual implementation of the structure that the heat dissipation principle of the heat sink or the thermal grease is the heat conduction or heat convection. The style 'is still limited in its heat dissipation efficiency and speed, and there is still room for improvement in its use.
而令其 佟，And make it awkward,
緣是，創作人有鑑於此，秉持多年該相關行業之豐富 設計開發及實際製作經驗，針對現有之結構及缺失再 研究改良，提供一種輻射散熱結構，以期達到更佳實用價 值性之目的者。 【新型内容】 本創作之輻射散熱結構，其主要係包括作功產熱之發 • 熱體〔如：CpU中央處理器等各式機械或電子元件了及& 層，將奈米級金屬氧化微粒複合而成之散熱膠體噴塗於作 功產熱之發熱體上，並加以燒結烘乾，以形成一牢固之薄 ，，此散熱膠體形成之薄層能吸收作功產熱之發熱體之熱 能，並發出熱輻射，將熱能予以散除；藉此，使得由於^ 係以熱輻射方式進行散熱，並且散熱特性符合黑體輻射、， 因此其散熱效能較佳於以熱傳導或熱對流為原理之散熱 元件，當作功產熱之發熱體結合薄層後，能以較小之 Φ 達成較佳之散熱目標，而可縮小整體之體積，令機械或電 子產品將可因此使其體積更為輕薄小巧，而在其整體施 - 使用上更增實用功效特性者。 本創作之輻射散熱結構，其主要係包括可供黏附在作 功產熱之發熱體或吸熱體表面之導熱黏附基材及薄層，將 奈米級金屬氧化微粒複合而成之散熱膠體喷塗於導熱黏 附基材上，並加以燒結烘乾，以形成一牢固之薄層，^散 熱膠體形成之薄層能吸收作功產熱之發熱體之熱能，並I 出熱輻射，將熱能予以散除；藉此，即可將具有薄層之導 熱黏附基材貼設於作功產熱之發熱體上，則該導熱黏附基The reason is that the creators, in view of this, have long been rich in design development and practical production experience of the relevant industries, and provide a radiation heat dissipation structure for the purpose of achieving better practical value for the existing structure and lack of research and improvement. [New content] The radiant heat dissipation structure of this creation mainly includes the heat generation of the work and the heat body (such as: various mechanical or electronic components such as CpU central processing unit and & layer, oxidizing the nano-grade metal The heat-dissipating gel formed by the composite of particles is sprayed on the heating element for heat production, and is sintered and dried to form a firm thin, and the thin layer formed by the heat-dissipating gel can absorb the heat energy of the heating body for generating heat of work. And emitting heat radiation to dissipate the heat energy; thereby, the heat dissipation is performed by the heat radiation method, and the heat dissipation characteristic conforms to the black body radiation, so that the heat dissipation performance is better than the heat dissipation by the principle of heat conduction or heat convection. The component, which is used as a heating element of the work heat, can achieve a better heat dissipation target with a smaller Φ, and can reduce the overall volume, so that the mechanical or electronic product can make it lighter and smaller. And in its overall application - the use of more practical features. The radiation heat dissipating structure of the present invention mainly comprises a heat conductive adhesive substrate and a thin layer which can be adhered to the surface of the heating element or the heat absorbing body for heat production, and the heat dissipating gel coating by combining the nano metal oxidized particles. On the heat-conductive adhesive substrate, and sintering and drying to form a firm thin layer, the thin layer formed by the heat-dissipating gel can absorb the heat energy of the heat-generating body for power generation, and emit heat to dissipate heat. In addition, the thermally conductive adhesive substrate having a thin layer can be attached to the heating element for heat generation, and the thermally conductive adhesive base is
M327054 材吸收作功產熱之發熱體之熱能，並發出熱輻射r將熱能 予以散除，並且其散熱特性符合黑體輻射，而在其整體施 行使甩上更增實用功效特性者。 【實施方式】 為令本創作所運用之技術内容、創作目的及其達成之 功效有更完整且清楚的揭露，茲於下詳細說明之，旅請一 併參閱所揭之圖式及圖號·· 首先，請參閱第一圖本創作之結構示意圖所示，本創 作主要係包括作功產熱之發熱體〇)〔如：CPU中央處理器 等各式機械或電子元件〕及薄層（2)，其係將奈米級金屬 氧化微粒複合而成之散熱膠體喷塗於該作功產熱之發熱 體（1)上，並加以燒結烘乾，以在該作功產熱之發熱體（1) 表面形成一牢固之薄層（2)，該薄層（2)能耐高低溫衝擊， 且耐強酸及強鹼，並具有絕緣不導電之特性，同時能吸收 作功產熱之發熱體（1)之熱能，並發出熱輻射，將熱能予 以散除’並且此薄層（2)其散熱特性符合黑體輻射。 一另’請再一併參閱第二圖本創作之使用狀態示意圖所 不’其係將本創作輻射散熱結構應用於組設在CPU中央處 理器（3)上之散熱器（4)，該散熱器（4)於其上端面具設有 數多散熱鰭片（41)，並在該散熱器（4)的表面喷塗散熱膠 體，再加以燒結烘乾形成一薄層（42),此薄層（42)可吸收 散熱器（4)之熱能並發出熱輻射，將熱能予以散除；由於 該J熱器（4)表面結合有薄層（42)，使其具有較佳之散熱 效旎，於同樣散熱效能體積中，而能以較小之體積達成較 佳之散熱目標，因此可縮小散熱鰭片（41)體積，進而令結 合此薄層（42)之散熱器（4)的機械或電子產品整體體^ M327054 ---------------------一] L ：,.條正丨 释年4 #4曰姻 為輕薄小巧。 圖所再—併參閱第三圖本創作之另-使用狀態示意 株祕时㈣可供軸在作減熱之發熱 Γ乞2表面之導熱黏附基材⑸上，並加以燒結烘 ⑼，二該導熱黏附基材(5)表面形成-牢固之薄層 吸》^ /1、體⑴或體職導熱黏附基材⑸即能 能予以散除，同時此具㈣層;）^出_射’將熱 散熱特性符合黑體輻射。 之導熱黏附基材⑸其 尺寸實Γ删❹雜以創叙結構樣態或 ::，tl所屬技術領域中具有通常知識者之適當變化i 多飾 &應視為不脫離本創作之專利範痛 知L由以上所述，本創作之結構組成W用實施說明可 本創作與現有結構相較之下，確具有下列優點· l本創作之輻射韻結義叫輻射方式料，並且 熱特性符合黑體輻射，因而散埶& = 政 熱對流為原理之散減件 熱傳料 2·本創作储散熱膠體餘於作功錢 黏附基材上，並加以燒結棋乾，以形成一牢固體之t熱 此薄層耐高低溫衝擊，並耐強酸及強驗，且具絕緣θ 電之特性，組設於機械或電子產品内較為安全。 3·本創作之作功產熱之發熱體結合薄層後，能^較小之 積達成較佳之散熱目標’因此可縮小該輻射散熱 體積，組设有此輻射散熱結構之機械或電子產品因而口 更為輕薄小巧。 Τ M327054 4. 本創作之薄層不會揮發具毒性之化學氣體，因而較為環 保。 5. 本創作亦可將散熱膠體喷塗於導熱黏附基材上，並加以 燒結烘乾，則於該導熱黏附基材形成一牢固之薄層，只 需將此具有薄層之導熱黏附基材貼設於作功產熱之發 熱體，即可將熱能予以散除，使用上簡單方便且用途廣 泛。 綜上所述，本創作實施例確能達到所預期之使用功 效，又其所揭露之具體構造，不僅未曾見於同類產品中， 亦未曾公開於申請前，誠已完全符合專利法之規定與要 求，爰依法提出新型專利之申請，懇請惠予審查，並賜准 專利，則實感德便。M327054 absorbs the heat energy of the heating element, and emits heat radiation to dissipate the heat energy, and its heat dissipation characteristics conform to the black body radiation, and the utility model is more effective in its overall application. [Embodiment] In order to make the technical content, creative purpose and the effect achieved by this creation more complete and clear, please elaborate on it below. Please refer to the drawings and drawings mentioned above. · First of all, please refer to the first diagram of the structure diagram of this creation. This creation mainly includes the heating element for the production of heat (such as: CPU or other mechanical or electronic components) and thin layer (2) a heat-dissipating gel obtained by combining nano-sized metal oxide particles on the heating element (1) for heat production, and sintering and drying to heat the heating body ( 1) The surface forms a firm thin layer (2) which is resistant to high and low temperature impact, resistant to strong acids and alkalis, and has the property of being insulative and non-conductive, and capable of absorbing the heating element for heat production ( 1) The thermal energy, and emit heat radiation to dissipate the heat energy' and the thin layer (2) has a heat dissipation characteristic that conforms to black body radiation. Another 'Please refer to the second picture. The schematic diagram of the use state of this creation is not used. The system applies the radiation radiating structure to the heat sink (4) assembled on the CPU central processor (3). The device (4) is provided with a plurality of heat dissipating fins (41) on the upper end of the mask, and sprays a heat dissipating gel on the surface of the heat sink (4), and then sintering and drying to form a thin layer (42), the thin layer ( 42) absorbing the thermal energy of the heat sink (4) and emitting heat radiation to dissipate the heat energy; since the surface of the J heat exchanger (4) is combined with a thin layer (42), it has better heat dissipation effect, In the heat dissipation performance volume, a better heat dissipation target can be achieved in a small volume, so that the volume of the heat dissipation fin (41) can be reduced, and the mechanical or electronic product of the heat sink (4) combined with the thin layer (42) can be integrated. Body ^ M327054 --------------------- A] L :,. 正正丨年年4 #4曰 marriage is light and small. Figure again - and refer to the third picture of the creation of the other - use state to indicate the time of the plant (four) for the shaft on the heat-dissipating substrate (5) on the surface of the heat-reducing heat Γ乞 2, and sintering and baking (9), two The surface of the thermally conductive adhesive substrate (5) is formed - a firm thin layer of suction "^ / 1, body (1) or body thermal conductive adhesion substrate (5) can be dispersed, and this (four) layer;) ^ _ _ ' The heat dissipation characteristics are in accordance with black body radiation. The thermal conductive adhesive substrate (5) is singularly sized to create a structural pattern or::, tl has appropriate changes in the technical field of the technical field i should be considered as a patent that does not deviate from the creation of the patent The pain knows L is described above. The structure of the creation is W. The implementation description can be compared with the existing structure. It has the following advantages. l The radiation rhyme of this creation is called radiation material, and the thermal characteristics are in black body. Radiation, and thus the divergence & = political heat convection as the principle of the reduction of the heat transfer material. 2. The creation of the heat storage gel is left on the work substrate, and is sintered to form a solid body. This thin layer is resistant to high and low temperature impact, and is resistant to strong acid and strong test, and has the characteristics of insulating θ electricity. It is safer to set up in mechanical or electronic products. 3. The heat-generating body of the work is combined with a thin layer to achieve a better heat-dissipating target. Therefore, the radiation heat-dissipating volume can be reduced, and the mechanical or electronic product of the radiation-dissipating structure is assembled. The mouth is lighter and smaller. Τ M327054 4. The thin layer of this creation does not volatilize toxic chemical gases and is therefore more environmentally friendly. 5. This creation can also spray the heat-dissipating gel on the heat-conductive adhesive substrate and sinter and dry it to form a firm thin layer on the heat-conductive adhesive substrate, which only needs to be a thin layer of thermally conductive adhesive substrate. It is attached to the heating element of the work heat production, and the heat energy can be dissipated, which is simple and convenient to use and widely used. In summary, the present embodiment can achieve the expected use efficiency, and the specific structure disclosed is not only found in similar products, nor has it been disclosed before the application, and has fully complied with the requirements and requirements of the Patent Law.爰Proposing an application for a new type of patent in accordance with the law, and requesting a review and granting a patent, it is really sensible.
M327054 【圖式簡單說明 第一圖：本創作之結構示意圖 第二圖：本創作之使用狀態示意圖所示 第三圖：本創作之另一使用狀態示意圖 — 第四圖··現有之結構示意圖 【主要元件符號說明】 (1) 發熱體 (2) 薄層 (3) 中央處理器 (4) 散熱器 (41) 散熱鰭片 (42) 薄層 (5) 導熱黏附基材 (51) 薄層 (61) 散熱器 (62) 中央處理器 (63) 散熱膏M327054 [Simple diagram of the diagram: The first diagram of the structure of the creation: The second diagram of the creation state of the creation: The third diagram of the use state of the creation: Schematic diagram of another use state of the creation - The fourth diagram · The existing structure diagram [ Main component symbol description] (1) Heating element (2) Thin layer (3) Central processing unit (4) Heat sink (41) Heat sink fin (42) Thin layer (5) Thermally conductive adhesive substrate (51) Thin layer ( 61) Heat sink (62) Central processing unit (63) Thermal grease
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