TWM428501U - Heat-dissipating and packaging device for solar cell - Google Patents

Heat-dissipating and packaging device for solar cell Download PDF

Info

Publication number
TWM428501U
TWM428501U TW100222908U TW100222908U TWM428501U TW M428501 U TWM428501 U TW M428501U TW 100222908 U TW100222908 U TW 100222908U TW 100222908 U TW100222908 U TW 100222908U TW M428501 U TWM428501 U TW M428501U
Authority
TW
Taiwan
Prior art keywords
layer
solar cell
heat
dissipating
laminated
Prior art date
Application number
TW100222908U
Other languages
Chinese (zh)
Inventor
hui-fen Hong
guo-xin Lin
Zun-Hao Shi
Hua-Yu Xin
Cheng-Cong Guo
Original Assignee
Atomic Energy Council
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atomic Energy Council filed Critical Atomic Energy Council
Priority to TW100222908U priority Critical patent/TWM428501U/en
Publication of TWM428501U publication Critical patent/TWM428501U/en

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)

Description

M428501 五、新型說明: 【新型所屬之技術領域】 本創作是有關於-種太陽能電池散熱封裝裝置,尤指一種 可使陶究層藉由緩衝層及黏著層與散熱單元穩固結合,而達到 提高散熱效率之功效者。 【先前技術】 # 按,一般習用太陽能電池之散熱裝置如第3圖所示,其係 其包含有-散熱藉片組8、-層疊於散熱鰭片組8 一面上之之 政熱局8 1 '—層疊於散熱貧81—面上之陶瓷材料層8 2、 -層疊於陶紐料層8 2-面上之電路佈局層8 3、以及一層 疊連接於電路佈局層8 3 -面上之太陽能電池8 4;藉此,可 利用太陽能電池8 4吸收太陽能光源進行光電轉換,並以電路 佈局層8 3將轉換後之電能傳輸至後段之儲存單元上,且同時 • 利用散熱鰭片組8進行太陽能電池8 4及電路佈局層8 3運 作時之熱源散逸。 雖然上述習用之太陽能電池8 4可於光電轉換後,以電路 佈局層8 3將電能傳輸至後段之儲存單元上,並利用散熱轉片 组8進行太陽能電池84及電路佈局層83運作時之熱源散 逸;但是由於該太陽能電池84友電路佈局層83於運作時^ 產生相當高之溫度,因此,易使散熱膏8 i受高熱而變質進 而導致散熱鰭片組8與陶瓷材料層8 2之間有脫落或無法穩 固連接之情形發生,造成太陽能電池8 4及電路佈局層8 ^於 3 2作時所產生之高溫度無法有效散逸,而影響太陽能電池8 4 電路佈局層8 3於使用時之速率及穩定性。 t新型内容】 爲,創作之主要目的係在於,可使陶兗層藉由緩衝層及黏著 曰與政熱單兀翻結合’而_提練熱效率之功效。 薏,為達上述之目的,本創作係-種太陽能電池散熱封裝裝 .其包含有一具有平面部及鰭片體或只為一平面之散熱單 爲層豐於平面部上之黏著層;一層疊於黏著層上之緩衝 ^ ’ ―層叠於緩衝層-面上之喊層;—層疊於喊層一面上 電路層;以及-層疊連接於電路層一面上之太陽能電池。 f實施方式】 。月參閲『第1A ®及第1B圖』所示,係分別為本創作之 〜實施制雜示意圖及本創作之第二實施剖面狀態示意 小。如圖所示:本創作係一種太陽能電池散熱封褒裝置,其至 二係由一散熱單元1、一黏著層2、-緩衝層3、-陶究層4、 :電路層5以及-太陽能電池6所構成,可使陶£層4藉曰由緩 率著層2與散熱單元1穩固結合’而達到提高散熱效 上述所提之散熱單W係具有—平面部i i,該平面部工 你延伸有H片體12,且該散熱單元!係為鋼之材質或為 =、錄之於材細製成J,該散熱單元1亦可為一平面之 灸屬板1 3。 該黏著層2係層疊於上述散熱單元i之平面部i丄上而 該黏著層2係為錫膏》 該緩衝層3係層疊於上述黏著層2上,而該緩衝3層係為 錫貧材質所製成。 該陶宪層4係層疊於上述緩衝層3之一面上。 該電路層5係層疊於上述陶:是層4之一面上,且該電路層 5上係具有配合太陽能電池6所需之電子電路佈局。 θ該太陽能電池6係層疊連接於上述電路層5之一面上。如 疋’藉由上述之結構構成—全新之太陽能電池散熱封裝裝置。 清參閱『第2圖』所示,係本創作之使用狀態示意圖。如 ^所不.當本創作於運用時,係可於該電路層5係連接有一能 量健存單元7 ;而使料储由太陽能電池6魏太陽之照射 光源’並同時進行所需之光電轉換,之後藉由電路層5之導通 作為太陽能電池6將光產生電之後傳輸至能量儲存單元7,達 到光電轉換後電能讀存,當太陽能電池6魏太陽之照射光 源、以及電路層5於運作時,係會同時產生高溫度之熱源,此 時該熱源即會由陶瓷層4吸收之後,透過緩衝層3及黏著層2 傳遞至散鮮元1上’使該散鮮元丨湘其鰭#體丨2進行 熱源之散逸,藉以使太陽能電池6及電路層5於運作時可獲較 佳之散熱效率,以提高太陽能電池6及電路層5於使用時之速 率及穩定性。 ,綜上所述,本創作太陽能電池散熱封裝裝置可有效改善習 用之種種缺點,可使陶瓷層藉由緩衝層及黏著層與散熱單元穩 固結合,而達到提高散熱效率之功效,進而使本創作之産生能 ,進V更實用、更符合使用者之所須’確已符合發明專利申 請之要件’纽法提出專利申請。 ,以上所述者’僅為本創作之較佳實施例而已當不能以 =疋本創作實施之細;故,凡依本創作申請專職圍及發 明書内容所作之簡單的等效變化與修飾 ,皆應仍屬本創作 專利涵蓋之範圍内。 【圖式簡單說明】 第1A圖,係本創作之第一實施剖面狀態示意圖。 第1B圖’係本創作之第二實施剖面狀態示意圖。 第2圖’係本創作之使用狀態示意圖。 第3圖,係習用之剖面狀態示意圖。 【主要元件符號說明】 (本創作部分) 散熱單元1 平面部1 1 鰭片體1 2 金屬板1 3 黏著層2 緩衝層3 陶瓷層4 電路層5 1 太陽能電池6 能量儲存單元7 M428501 (習用部分) 散熱鰭片組8 散熱膏81 . 陶瓷材料層8 2 電路佈局層8 3 太陽能電池8 4M428501 V. New Description: [New Technology Field] This creation is about a kind of solar cell heat-dissipating device, especially one that can make the ceramic layer be firmly combined with the heat-dissipating unit by the buffer layer and the adhesive layer. The efficacy of heat dissipation efficiency. [Prior Art] # Press, the heat sink of a conventional solar cell is as shown in Fig. 3, which includes a heat-dissipating chip group 8, a political heat bureau 8 1 stacked on one side of the heat sink fin group 8. '-a layer of ceramic material layered on the surface of the heat-dissipating 81-2, a circuit layout layer 8 3 laminated on the 2-sided surface of the ceramic layer 8 and a layer connected to the surface of the circuit layout layer 8 - 3 The solar cell 8 4; thereby, the solar cell 84 can be used to absorb the solar light source for photoelectric conversion, and the converted electric energy is transmitted to the storage unit of the rear stage by the circuit layout layer 83, and at the same time, the heat dissipation fin group 8 is utilized. The heat source is dissipated when the solar cell 84 and the circuit layout layer 8 3 are operated. Although the solar cell 8 of the above-mentioned conventional method can transmit the electric energy to the storage unit of the rear stage by the circuit layout layer 8 after the photoelectric conversion, and use the heat radiation rotor group 8 to perform the heat source when the solar cell 84 and the circuit layout layer 83 operate. Dissipating; however, since the solar cell 84 friend circuit layout layer 83 generates a relatively high temperature during operation, the thermal grease 8 i is easily deteriorated by high heat to cause a gap between the heat dissipation fin group 8 and the ceramic material layer 8 2 . The situation that the falling off or the inability to connect firmly occurs, causing the high temperature generated by the solar cell 8 4 and the circuit layout layer 8 ^3 to be effectively dissipated, and affecting the solar cell 8 4 circuit layout layer 8 3 when used Rate and stability. t new content] For the purpose of the creation, the ceramic layer can be combined with the political heat by the buffer layer and the adhesive layer to enhance the thermal efficiency. In order to achieve the above purpose, the present invention is a solar cell heat-dissipating package which comprises a flat layer and a fin body or a heat-dissipating layer which is only a flat surface and is a layer of an adhesive layer on the flat portion; Buffer on the adhesive layer ^ '-- shout layer layered on the buffer layer surface; - a circuit layer laminated on one side of the shout layer; and - a solar cell laminated on one side of the circuit layer. f implementation]. For the month, see "1A ® and 1B", which are the schematic diagrams of the implementation of the creation and the second implementation of the creation. As shown in the figure: This creation is a solar cell heat-dissipating device, which consists of a heat dissipating unit 1, an adhesive layer 2, a buffer layer 3, a ceramic layer 4, a circuit layer 5, and a solar cell. The structure of 6 can make the layer 4 of the pottery layer 4, and the heat-dissipating effect can be improved by the solid layer 2 and the heat-dissipating unit 1 to improve the heat-dissipating effect. The heat-dissipating single-W system has a plane part ii, and the plane part is extended by you. There are H-pieces 12, and the heat-dissipating unit! It is made of steel or is =, and the material is made into fine J. The heat dissipating unit 1 can also be a flat moxibustion board 13 . The adhesive layer 2 is laminated on the planar portion i of the heat dissipating unit i, and the adhesive layer 2 is solder paste. The buffer layer 3 is laminated on the adhesive layer 2, and the buffer layer 3 is made of a tin-poor material. Made. The pottery layer 4 is laminated on one surface of the buffer layer 3. The circuit layer 5 is laminated on the ceramic surface: one side of the layer 4, and the circuit layer 5 has an electronic circuit layout required for mating the solar cell 6. θ The solar cell 6 is laminated and connected to one surface of the circuit layer 5. Such as 疋' by the above structure - a new solar cell thermal packaging device. See "Figure 2" for a clear description of the state of use of this creation. If the present application is used, an energy storage unit 7 can be connected to the circuit layer 5; and the solar cell 6 can be used to illuminate the light source of the sun and simultaneously perform the required photoelectric conversion. Then, the light is generated by the solar cell 6 as the solar cell 6 and then transmitted to the energy storage unit 7 to achieve the photoelectric storage after the photoelectric conversion, when the solar cell 6 is irradiated with the sun and the circuit layer 5 is in operation. At the same time, the heat source of high temperature is generated at the same time. At this time, the heat source is absorbed by the ceramic layer 4, and then transmitted to the fresh element 1 through the buffer layer 3 and the adhesive layer 2 to make the scattered element Xiaoxiang its fins丨2 performs the dissipation of the heat source, so that the solar cell 6 and the circuit layer 5 can obtain better heat dissipation efficiency during operation, so as to improve the rate and stability of the solar cell 6 and the circuit layer 5 during use. In summary, the solar cell heat-dissipating device of the present invention can effectively improve various disadvantages of the conventional use, and the ceramic layer can be stably combined with the heat-dissipating unit through the buffer layer and the adhesive layer, thereby achieving the effect of improving heat dissipation efficiency, thereby further creating the present invention. The production of energy, V is more practical, more in line with the user's need to 'have met the requirements of the invention patent application' New Zealand patent application. The above-mentioned ones are only for the preferred embodiment of the present invention and cannot be implemented by the 疋 疋 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; All should remain within the scope of this creation patent. [Simple description of the drawing] Fig. 1A is a schematic diagram showing the state of the first embodiment of the present invention. Fig. 1B is a schematic view showing the state of the second embodiment of the present invention. Figure 2 is a schematic diagram of the state of use of this creation. Figure 3 is a schematic view of the profile state of the conventional use. [Main component symbol description] (This creation part) Heat dissipating unit 1 Planar part 1 1 Fin body 1 2 Metal plate 1 3 Adhesive layer 2 Buffer layer 3 Ceramic layer 4 Circuit layer 5 1 Solar cell 6 Energy storage unit 7 M428501 (Applied Part) Heat sink fin set 8 Thermal paste 81. Ceramic material layer 8 2 Circuit layout layer 8 3 Solar cell 8 4

Claims (1)

、申請專利範圍: 1.一種太陽能電池散熱封裝裝置,其至少包括: -散熱單元,該散鮮元係具有—平崎,該平面部 係延伸有鰭片體; 點著層,泫黏著層係為錫膏,係層疊於上述散熱單 元之平面部上; 緩衝層,该緩衝層係為錫膏材質所製成,係層疊於 上述黏著層上; 一陶瓷層,該陶瓷層係層疊於上述緩衝層之一面上; 一電路層,該電路層係層疊於上述陶瓷層之一面上; 以及 一太%能電池,該太陽能電池係層疊連接於上述電路 層之一面上。 2·依申请專利範圍第1項所述之太陽能電池散熱封裝裝置, 其中’該散熱單元係為銅之材質所製成。 3·依申請專利範圍第1項所述之太陽能電池散熱封裝裝置, 其中’該散熱單元係為鋁、鎳之混合材質所製成。 4·依申請專利範圍第1項所述之太陽能電池散熱封裳裳置, 其中’該電路層係連接有一能量儲存單元。 5·依申請專利範圍第1項所述之太陽能電池散熱封裝裳置, 其中,該散熱單元亦可為一平面之金屬板。Patent application scope: 1. A solar cell heat dissipating packaging device, comprising at least: - a heat dissipating unit, wherein the dispersing element has - a flat surface, the flat portion has a fin body extending; the layer is layered, and the adhesive layer is a solder paste laminated on a planar portion of the heat dissipation unit; a buffer layer formed by a solder paste material laminated on the adhesive layer; and a ceramic layer laminated on the buffer layer On one side of the circuit layer, the circuit layer is laminated on one side of the ceramic layer; and a solar cell is laminated on one surface of the circuit layer. 2. The solar cell heat dissipating packaging device according to claim 1, wherein the heat dissipating unit is made of a copper material. 3. The solar cell heat dissipating packaging device according to claim 1, wherein the heat dissipating unit is made of a mixed material of aluminum and nickel. 4. The solar cell heat-dissipating package according to claim 1, wherein the circuit layer is connected to an energy storage unit. 5. The solar cell heat-dissipating package according to item 1 of the patent application scope, wherein the heat-dissipating unit can also be a flat metal plate.
TW100222908U 2007-07-27 2007-07-27 Heat-dissipating and packaging device for solar cell TWM428501U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100222908U TWM428501U (en) 2007-07-27 2007-07-27 Heat-dissipating and packaging device for solar cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100222908U TWM428501U (en) 2007-07-27 2007-07-27 Heat-dissipating and packaging device for solar cell

Publications (1)

Publication Number Publication Date
TWM428501U true TWM428501U (en) 2012-05-01

Family

ID=46549687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100222908U TWM428501U (en) 2007-07-27 2007-07-27 Heat-dissipating and packaging device for solar cell

Country Status (1)

Country Link
TW (1) TWM428501U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482305B (en) * 2012-09-27 2015-04-21 Win Win Prec Technology Co Ltd Solar cell module, manufacturing method thereof, method for enhancing thermal dissipation of solar cell device and thermal enhanced solar cell device
TWI506804B (en) * 2013-06-28 2015-11-01 Mh Gopower Company Ltd Solar cell module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482305B (en) * 2012-09-27 2015-04-21 Win Win Prec Technology Co Ltd Solar cell module, manufacturing method thereof, method for enhancing thermal dissipation of solar cell device and thermal enhanced solar cell device
TWI506804B (en) * 2013-06-28 2015-11-01 Mh Gopower Company Ltd Solar cell module

Similar Documents

Publication Publication Date Title
TWM345341U (en) Light-emitting structure
JP2006196593A (en) Semiconductor device and heat sink
TWM428501U (en) Heat-dissipating and packaging device for solar cell
US20090303685A1 (en) Interface module with high heat-dissipation
JP3164067U (en) Circuit board
JP2009021445A (en) Inverter apparatus
JP2002164585A (en) Thermoelectric conversion module
TWI258871B (en) Improved structure for LED package
CN208028050U (en) A kind of spliced uniform-temperature plate heat dissipating device
TW200905903A (en) Improved heat dissipation structure of solar cell
JP2009123920A (en) Heat dissipating configuration for solar energy battery
JP2019075564A (en) Heat sink plate
TW200905904A (en) Heat-dissipating and packaging device for solar cell
CN108389841A (en) A kind of spliced uniform-temperature plate heat dissipating device
TW202023008A (en) Igbt module with improved heat dissipation structure
JP5057379B2 (en) Solar cell heat dissipation package device
CN212587482U (en) Semiconductor product with top heat dissipation function and electronic product
CN208014679U (en) A kind of high thermal conductive substrate for power module
TWM342725U (en) High heat dissipation printed circuit board
TWI378580B (en) Socket led device
EP2056360A1 (en) Solar Cell Dissipation Package
US20150047821A1 (en) Heating device structure
TW200816422A (en) Heating dissipating chip on film package
RU160165U1 (en) POWER MODULE
TWI523069B (en) The structure of the heating device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees