TWM631444U - Uniform temperature device - Google Patents

Abstract

This creation discloses a temperature equalizing device, which is a stacked temperature equalizing device arranged on a heat source to improve heat dissipation efficiency and achieve uniform heat dissipation. The temperature equalizing device of this creation includes a substrate, a heat conducting member and a radiation layer; Therefore, the temperature uniformity device of this creation is mainly based on the hardware design of stacking the radiation layer, the substrate, and the heat-conducting member in sequence, so as to effectively physically contact the heat-conducting member and the heat source to be dissipated, so as to dissipate the heat generated by the heat source. By transferring the substrate to a large-area radiation layer made of graphene with high thermal conductivity, and then transferring it to the air, it can effectively improve the heat dissipation efficiency of the heat source to achieve uniform heat dissipation, and the overall temperature uniformity device is thin. major advantages.

Description

temperature equalization device

This creation relates to a temperature equalizing device, especially a stacked temperature equalizing device that is arranged on a heat source to improve heat dissipation efficiency and achieve uniform heat dissipation.

Press, heat pipe (heat pipe) and vapor chamber (vapor chamber) are both fast heat conduction elements designed using the same two-phase flow (for example: liquid or gas) principle, the main function is to generate heat generated by the heat source. The heat is transferred to the outside world, in which the heat pipe is mostly used for point-to-point heat transfer, while the vapor chamber is mostly used for point-to-point heat transfer. Because the vapor chamber has a low thermal resistance property, that is, under the same power wattage, Using a vapor chamber as a heat transfer element is more efficient than using a heat pipe, and the temperature is lower, but it is not absolute. The medium of heat transfer; however, due to the large diameter of the traditional heat pipe, it is not easy to extend, so that the overall volume of the temperature equalization device cannot be reduced, nor can it meet the requirements of thinning, and because the heat pipe is point-to-point heat dissipation, so in The purpose of uniform heat dissipation cannot be effectively achieved in terms of heat dissipation efficiency; therefore, how to effectively improve the heat dissipation efficiency of the heat source through innovative hardware design to achieve uniform heat dissipation and the purpose of thinning the overall temperature uniformity device is absolutely related to the heat dissipation structure and so on. Industry developers and related researchers need to continue to work hard to overcome and solve problems.

The reason is that the creator, in view of this, and with the assistance of his rich professional knowledge and years of practical experience, has improved and created a temperature equalizing device, the purpose of which is to provide a heat dissipation device arranged on the heat source to improve the heat dissipation efficiency. The stacked temperature equalization device that achieves uniform heat dissipation is mainly based on the hardware design of stacking the radiation layer, the substrate, and the heat-conducting member in sequence, so as to effectively physically contact the heat-conducting member and the heat source to be dissipated to dissipate the heat generated by the heat source. The heat is transmitted through the substrate to a large-area radiant layer made of graphene with high thermal conductivity and then transmitted to the air, which effectively improves the heat dissipation efficiency of the heat source and achieves uniform heat dissipation and overall temperature uniformity. Device thinning and other major advantages.

According to the purpose of this creation, a temperature equalization device is proposed, which enables a heat source to achieve uniform heat dissipation. The temperature equalization device at least includes a substrate, a heat-conducting member, and a radiation layer; the substrate includes a first surface, and a second surface opposite to the first surface; the heat conducting member is arranged on the first surface of the substrate; the radiation layer is arranged on the second surface of the substrate.

In an embodiment of the present invention, the thickness of the temperature equalizing device is between 0.3 millimeter (millimeter, mm for short) to 1 millimeter (mm).

In one embodiment of the present invention, the substrate is made of one of materials such as copper metal or copper composite material.

In an embodiment of the present invention, the thermally conductive member is one of a heat pipe or a vapor chamber.

In an embodiment of the present invention, the thermally conductive member includes a hollow structure and a secondary thermally conductive member disposed in the hollow structure.

In an embodiment of the present invention, the secondary thermally conductive member is one of vacuum or thermal fluid.

In an embodiment of the present invention, an end surface of the thermally conductive member away from the substrate can further contact the heat source.

In an embodiment of the present invention, an end surface of the thermally conductive member away from the substrate may be further provided with a bottom plate.

In an embodiment of the present invention, one end of the bottom plate away from the heat conducting member can further contact the heat source.

In an embodiment of the present invention, the bottom plate is made of copper metal.

In an embodiment of the present invention, the radiation layer is made of a material with high thermal conductivity.

In an embodiment of the present invention, the radiation layer is made of graphene.

In an embodiment of the present invention, the substrate has a first width, and the thermally conductive member has a second width, and the first width is equal to or not equal to the second width.

In one embodiment of the present invention, the substrate has a first length, and the thermally conductive member has a second length, and the first length is equal to or not equal to the second length.

Therefore, the temperature equalization device of this creation is mainly based on the hardware design of stacking the radiation layer, the substrate, and the heat-conducting member in sequence, so as to effectively physically contact the heat-conducting member and the heat source to be dissipated, so as to dissipate the heat generated by the heat source. The heat is transmitted through the substrate to a large area of the radiation layer made of graphene with high thermal conductivity and then transmitted to the air, which can effectively improve the heat dissipation efficiency of the heat source and achieve uniform heat dissipation, and the overall temperature equalization device Main advantages such as thinning.

In order to help the examiners to understand the technical features, content and advantages of this creation and the effects that can be achieved, this creation is hereby combined with the accompanying drawings, and is described in detail as follows in the form of embodiment. The subject matter is only for illustration and auxiliary instructions, and may not necessarily be the real proportion and precise configuration after the implementation of this creation. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of this creation in actual implementation. Together first to describe.

First of all, please refer to Figures 1 to 3, which are a schematic diagram of the overall device structure, a cross-sectional view of the overall device structure, and a schematic diagram of the overall device size of a preferred embodiment of the temperature uniformity device of the present creation. The temperature uniformity device of this creation is (1) A heat source (2) achieves uniform heat dissipation, and the temperature equalization device (1) is composed of at least a substrate (11), a heat-conducting member (12) and a radiation layer (13). , and the heat source (2) can be, for example, but not limited to, a circuit board or a motherboard (21) set in a personal computer or a server (such as the fourth preferred implementation of the temperature-equilibrium device of this creation in Figure 8). The schematic diagram (1) of the device used in this example is shown, or it can be, for example, but not limited to, the battery (22) of a mobile communication device (such as the schematic diagram of the device in the four preferred embodiments of the temperature equalizing device in Figure 9 (Figure 9). 2)), wherein the thickness of the temperature equalization device (1) in this creation is between 0.3mm and 1mm, and the best is 0.4mm, which can achieve the purpose of optimal thinning; The temperature equalizing device (1) is mainly designed by a hardware in which the radiation layer (13), the substrate (11), and the thermally conductive member (12) are sequentially stacked, so that the thermally conductive member (12) is effectively connected to the thermally conductive member (12) to be dissipated. The heat source (2) is in physical contact, so that the heat generated by the heat source (2) is transferred through the substrate (11) to a large-area radiation layer (13) which is prepared from a material with high thermal conductivity of graphene ) and then transferred to the air, thereby effectively improving the heat dissipation efficiency of the heat source (2) to achieve uniform heat dissipation, and the main advantages of thinning the overall temperature equalizing device (1).

The substrate (11) includes a first surface (111) and a second surface (112), wherein the second surface (112) is arranged corresponding to the first surface (111), and the substrate (11) It is made of one of copper metal or copper composite material. In a preferred embodiment of the present invention, the substrate (11) is made of copper metal, which can easily transmit the heat source. (2) The purpose of the heat generated.

The heat-conducting member (12) is disposed on the first surface (111) of the substrate (11) and is in physical contact with the heat source (2), wherein the heat-conducting member (12) is a heat pipe or a temperature equalizing plate ( vapor chamber), the thermally conductive member (12) includes a hollow structure (not shown in the figure), and a secondary heat-conducting member (not shown in the figure) disposed in the hollow structure, and the The heat-conducting element is one of vacuum or heat-conducting liquid; in a preferred embodiment of the present invention, the heat-conducting element (12) disposed on the first surface (111) of the substrate (11) is made of a uniform temperature consisting of a vapor chamber, wherein the temperature equalizing plate comprises a hollow structure and a thermal fluid disposed in the hollow structure, wherein the temperature equalizing device (1) is in physical contact with the thermally conductive member (12) The heat source (2) and the heat transfer fluid in the hollow structure receive the heat generated by the heat source (2), so as to achieve the purpose of uniform heat dissipation of the heat source (2).

The radiation layer (13) is disposed on the second surface (112) of the substrate (11), wherein the radiation layer (13) is made of a material with high thermal conductivity, in a preferred embodiment of the present invention , the radiation layer (13) is made of graphene, and the area of the radiation layer (13) is equal to the area of the substrate (11). When the thermally conductive member (12) physically contacts the heat source (2) Then, the heat generated by the heating source (2) can be absorbed, and transmitted through the substrate (11) to the radiation layer (13) with high thermal conductivity, and finally the radiation layer (13) transmits the heat to the In the air, in order to achieve the purpose of rapid and uniform heat dissipation.

In addition, the substrate (11) has a first width (W1), and the thermally conductive member (12) has a second width (W2), wherein the first width (W1) is equal to or not equal to the second width (W2) width (W2); furthermore, the substrate (11) has a first length (L1), and the thermally conductive member (12) has a second length (L2), wherein the first length (L1) is equal to or not equal to the second length (L2); when the first width (W1) is equal to the second width (W2), or the first length (L1) is equal to the second length (L2), the average temperature The device (1) can achieve the purpose of evenly dissipating heat from the heat source (2); please refer to Figure 4 (A) and (B) together for the second and third preferred embodiments of the temperature equalizing device for this creation The schematic diagram of the overall device structure, wherein the first width (W1) of the second preferred embodiment and the third preferred embodiment of the present invention is not equal to the second width (W2), and the first length (L1) is not equal to Equal to the second length ( L2 ), this design can effectively meet the actual heat dissipation requirements and achieve better heat dissipation efficiency.

Please refer to FIG. 5 and FIG. 6 together, which are schematic diagrams of the overall device of the four preferred embodiments of the temperature uniformity device, and a cross-sectional view of the overall device, wherein the thermally conductive member (12) is away from the base plate (11). One end face is provided with a bottom plate (14) for physically contacting the heat source (2) (please refer to Figures 8 and 9 again), and the bottom plate (14) is made of copper metal , wherein the base plate (14) made of copper metal can evenly absorb the heat generated by the heating source (2), and then transmit it to the heat conducting member (12) and the substrate (11), and finally pass through the graphene The radiation layer (13) presented in this manner transfers heat to the air, so as to achieve the purpose of rapid and uniform heat dissipation.

In addition, the base plate (11) has the first width (W1), the thermally conductive member (12) has the second width (W2), and the bottom plate (14) has a third width (W3), wherein The third width (W3) is equal to or not equal to the second width (W2), and the first width (W1) is equal to or not equal to the second width (W2); furthermore, the substrate (11) has A first length (L1), the thermally conductive member (12) has a second length (L2), and the bottom plate (14) has a third length (L3), wherein the third length (L3) is equal to or not equal to the second length (L2), and the first length (L1) is equal to or not equal to the second length (L2); when the third width (W3) is equal to the second width (W2) and equal to When the first width (W1), or the third length (L3) is equal to the second length (L2) and equal to the first length (L1), the temperature equalization device (1) can be used for the heat source (2) To achieve the purpose of uniform heat dissipation; please refer to Figure 7 (A) and (B) together, which are schematic diagrams of the overall device structure of the fifth and sixth preferred embodiments of the temperature uniformity device of the present invention, of which the fifth embodiment of the present invention is more The third width (W3) of the preferred embodiment and its six preferred embodiments is equal to the second width (W2), but the first width (W1) is not equal to the second width (W2), and the third length ( L3) is equal to the second length (L2), but the first length (L1) is not equal to the second length (L2). This design, like the second and third preferred embodiments, can effectively meet the actual heat dissipation requirements to achieve better heat dissipation efficiency.

Furthermore, in another embodiment of the present invention, wherein the third width (W3) is not equal to the second width (W2), and the first width (W1) is not equal to the second width (W2), the The third length (L3) is not equal to the second length (L2), and the first length (L1) is not equal to the second length (L2). In order to achieve heat dissipation efficiency according to actual needs through different area ratios.

As can be seen from the above implementation description, compared with the prior art and products, this creation has the following advantages:

The temperature uniformity device of this creation is mainly based on the hardware design of stacking the radiation layer, the substrate, and the heat-conducting member in sequence, so as to effectively physically contact the heat-conducting member and the heat source to be dissipated, so as to dissipate the heat generated by the heat source through the The substrate is transferred to a large-area radiation layer made of graphene with high thermal conductivity and then transferred to the air, which can effectively improve the heat dissipation efficiency of the heat source to achieve uniform heat dissipation, and the overall temperature equalization device is thinned, etc. main advantage.

To sum up, the temperature equalization device of this creation can indeed achieve the expected use effect through the above disclosed embodiments, and this creation has not been disclosed before the application, since it fully complies with the provisions and requirements of the Patent Law . It is indeed a virtue to file an application for a new type of patent in accordance with the law.

However, the illustrations and descriptions disclosed above are only the preferred embodiments of this creation, and are not intended to limit the scope of protection of this creation; those who are familiar with the art may, based on the characteristics of this creation, make other Equivalent changes or modifications should be considered as not departing from the design scope of this creation.

(1): uniform temperature device (11): Substrate (111): first surface (112): Second Surface (12): Thermally conductive parts (13): Radiation layer (14): Bottom plate (2): heat source (21): circuit board or motherboard (22): Battery (L1): first length (L2): Second length (L3): third length (W1): first width (W2): Second width (W3): Third width

Figure 1: Schematic diagram of the overall device of a preferred embodiment of the temperature equalization device of this creation Figure 2: Cross-sectional view of the overall device of a preferred embodiment of the temperature equalization device of the present invention Figure 3: Schematic diagram of the overall device size of a preferred embodiment of the temperature equalization device of this creation Figure 4 (A), (B): schematic diagram of the overall device structure of the second and third preferred embodiments of the temperature equalization device of this creation Figure 5: Schematic diagram of the overall device of the four preferred embodiments of the temperature equalization device of this creation Figure 6: Cross-sectional view of the overall device of the four preferred embodiments of the temperature equalization device of the present invention Figure 7 (A), (B): schematic diagram of the overall device structure of the fifth and sixth preferred embodiments of the temperature equalization device of this creation Figure 8: Schematic diagram of the device operation of the four preferred embodiments of the temperature equalization device of this creation (1) Figure 9: Schematic diagram of the device operation of the four preferred embodiments of the temperature equalization device of this creation (2)

(1): uniform temperature device

(11): Substrate

(12): Thermally conductive parts

(13): Radiation layer

Claims (13)

A temperature equalizing device, which enables a heat source (2) to achieve uniform heat dissipation, the temperature equalizing device (1) at least comprising: a substrate (11) comprising a first surface (111) and a second surface (112) opposite to the first surface (111); a thermally conductive member (12) disposed on the first surface (111) of the substrate (11); and A radiation layer (13) is arranged on the second surface (112) of the substrate (11). The temperature equalizing device according to claim 1, wherein the thickness of the temperature equalizing device (1) is between 0.3 mm and 1 mm. The temperature equalizing device according to claim 1, wherein the substrate (11) is made of one of copper metal or copper composite materials. The temperature equalizing device according to claim 1, wherein the heat conducting member (12) is one of a heat pipe or a vapor chamber. The temperature equalizing device according to claim 4, wherein the heat-conducting member (12) comprises a hollow structure and a secondary heat-conducting member disposed in the hollow structure. The temperature equalizing device as claimed in claim 5, wherein the secondary heat-conducting member is one of vacuum or heat-conducting fluid. The temperature equalizing device according to claim 1, wherein an end surface of the heat conducting member (12) away from the substrate (11) further contacts the heat source (2). The temperature equalizing device according to claim 1, wherein an end surface of the heat conducting member (12) away from the base plate (11) is further provided with a bottom plate (14). The temperature equalizing device according to claim 8, wherein an end of the bottom plate (14) away from the heat conducting member (12) is further in contact with the heat source (2). The temperature equalizing device according to claim 8, wherein the bottom plate (14) is made of copper metal. The temperature equalizing device according to claim 1, wherein the radiation layer (13) is made of a material with high thermal conductivity. The temperature equalizing device according to claim 1, wherein the substrate (11) has a first width (W1), and the heat conducting member (12) has a second width (W2), the first width (W1) ) is equal to or not equal to the second width (W2). The temperature equalizing device according to claim 1, wherein the substrate (11) has a first length (L1), and the heat conducting member (12) has a second length (L2), the first length (L1) ) is equal to or not equal to the second length (L2).

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