• M315352 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種背 之’特別係指一種多層次之 所製作的框體及背板，以及 熱粒子所形成多面積散熱效 背光模組之新構造。 光模組之新構造，更詳而言 月光拉組結構，藉由鋁材質 其外部所形成之散熱片與散 果’而具有極佳散熱效果的 【先前技術】 按附件-中華民國專利證書號數第M273277號專利 公報影本，由p圖所示可知其係為—種「背光模組盘 鏡面結合裝置」，其構造層次由下而上包含有反射片卜 導光板2、擴散板3及菱鏡片4’其中導光板之周邊並裝 設有CCFL、LED燈源5，底面設有反射網點，該構造層次 經喪入外框而裝置於底板7上，構成為背光模組，該背 光模組之導光板上裝設有一鏡面10，並於擴散板及菱鏡 片4上設相配應之鏡面孔31及41，用已呈現鏡面1〇。 然而’前述習知之背光模組與鏡面結合裝置，主要 係以導光板之周邊所裝設之CCFL、LED燈源為光源，既 由背光模組之導光板底面的反射網點將光源散射，在藉 由反射片將光源反射至導光板頂面之作用來加強鏡面周 邊之光源，以增加照鏡效果；一般為使背光模組形成輕 巧之型態，該外框係由塑膠材質而塑模成型，為使背光 板影像成形清晰而往往需提高光源之發光效果，進而使 燈源所產生之熱能相對提高，而使外框需承受一定裎度 5 材質所製成散熱效果極差， 時，該燈源容易造成散熱效 因CCFL、LED為燈源需透過 能增加照鏡效果，故習知背 增加其結構層次，而使結構 光模組之開發與研究，對於 相當程度的瞭解，由前述分 組具有結構複雜、散熱效果 曾見諸有任何改善之創作產 遂針對以上缺失進行研究改 實用之背光模組之新構造。 ，在於提供一種散熱效果高 之新構造。 作所述的背光模組之新構造 材質所製成散熱用之框體， 型之製作或單獨形成，框體 樣而可供放置反射片、導光 側周緣係為設置LED燈條之 LED燈條與框體之接合及定 置有多數散熱片，在散熱片 散熱粒子，同時於框體及背 有PCB (印刷電路板）置放 • M315352 之熱效應，且因外框為塑膠 而造成以CCFL、LED為燈源 果差而形成損害之情況，又 導光板、擴散片及菱鏡片才 光板模組為使影像清晰而需 層次形成複雜且製程繁雜。 本案創作人長久從事背 相關器具構造上的優缺點有 析得知習知之背光板構造模 差等缺失，而長期以來卻未 生，有鐘於此，本案創作人 良，希望能研發出一種較為 即’本創作之主要目的 且亮度效能極佳的背光模組 【新型内容】 依據上述之目的，本創 其特徵係包含有利用鋁金屬 該框體係可與背板為一體成 中央係形成為一中空凹槽態 板及光學膜等構件，框體内 燈源構件’並利用散熱膏作 位，框體外側端周緣則係設 及背板上則係形成有大量的 板之外端側面係可局部形成 6 • M315352 •槽’可用以放置p C B及其包含的IC晶片與其他被動元件。 、 緣是，本創作所述背光模組之新構造其散熱用之框 體係為紹金屬材質所製成，是以比習知背光模組的框體 擁有更佳的材質特性、導熱與散熱性，加上本創作所設 置大量之散熱片及散熱粒子，提高了總體散熱面積，俾 使led奋光時產生的高熱可以藉此獲得極佳的傳導與散 發，而能使用比習知創作較高之電流值通入LED以提升 其工作亮度’使其工作效率更高，且散熱效果提高亦延 鲁長了 led的使用壽命，可減少汰換成本，並改善習知框 體為塑膠製造而散熱效果差及產生環保節能問題。 為期使對於本創作之目的、功效及構造特徵能有更 詳細明確的瞭解，茲舉出如下述較佳之實施例並配合圖 示說明如后： 【實施方式】 請同時參閱第二圖，並配合第三圖與第四圖所示， 其分別為本創作之背光模組的立體分解圖及框體之後視 鲁圖與侧視圖。 由圖示可知，本創作所述的背光模組之新構造其主 要特徵係具有由鋁金屬材質所製成散熱用之框體1Q與背 板Π’該框體10係可單獨作成，或係與背板11採一體 成型製作；框體1 〇中央係形成一中空凹槽之態樣，可供 反射片3、導光板2及光學膜4(包含有擴散片40及上、 下菱鏡41、42)等構件貼附設置，並利用外部之上蓋6 之與框體作卡制結合，俾予以導光板等内部構件固定及 保瘦之作用；框體10之内側周緣係設置有LED燈條5， 7 .M315352 該LED燈條5係為本創作發光之燈源結構，其係將數個 高功率LED以錫接方式接在一铭製薄片ρ(：Β (印刷電路 板）上’再以散熱膏將PCB (印刷電路板）與框體1〇作 接合；框H U)外側端周緣則係形成有多個呈棘齒狀的散 熱片1 3，同時在背板i!以及散熱片i 3上則係設置大量 呈棘齒叙之散熱粒子14’俾用以增加本創作散熱用之面 積。於框體ίο與背板u之外端側面係可局部形成有pcB 置放槽12,可用以放置PCB (印刷電路板）及其所包含 的1C晶片與其他被動元件，俾提供PCB (印刷電路板） 一保護定位之空間。 由於鋁金屬材質具有導熱快與散熱性佳之優點，是 以框體1 0及为板11除了能夠保護及定位内部LED燈條5 以及導光板2、光學膜4等構件，同時LED燈條5經通電 時會產生的高度熱能，則可透過鋁製的pCB與接著的散 熱膏’迅速有效地傳導至鋁製的框體1 〇及背板1 1上， 俾排放熱能。 另外在框體10外侧端周緣係形成有多數個為棘齒狀 溝槽設計之散熱片15，背板11上則設置有大量呈棘齒狀 之散熱粒子’可以有效增加本創作散熱之面積，使得本 創作具有更佳的散熱效率，以使LED燈條5可以更有效 地降低其工作溫度，而能有效延長LEJ)的使用壽命。 另，該LED作用時的消粍功率係會因散熱面積增加 而遞增’其關係為〇〜η倍LED消粍功率正比於11倍散熱 面積。換言之，由於散熱面積的增加使得LED散熱效果 得以提高，故可藉由通入較高的電流（LED工作溫度不超 8 • M315352 •過6〇°c為原則），使得LED產生更高的亮度；亦即發出 …之光源在相同程度的亮度下，能減少led裝設之數量或 導光板2的厚度，俾節省成本。 3 本創作散熱粒子1 4及散熱片1 3之設置、以及背板 11所設計成形之規格皆係可依據客戶需求而作變更。其 中背板11係可由客戶要求，而形成為框體1 〇所圍面積 之相同大小、或係為框體1 〇所圍面積的1 / 2、1 / 3或i / 6 等規格’端看客戶對散熱之需求而能靈活變化。 # 請參閱第五圖所示，其為本創作之散熱片13棘齒狀 溝槽態樣示意圖，本創作之散熱片1 3溝槽的槽底與外緣 之形狀係可為圓形或尖形、矩形之設計，如圖al、a2為 散熱片1 3溝槽圓形之態樣、圖a3為散熱片丨3溝外緣尖 形之態樣、圖a4為散熱片1 5外緣溝槽矩形之態樣。另 再行參閱第三圖與第四圖所示，本創作作者經研究而得 到，設計棘齒狀散熱片13範圍A介於Omm〜10mm、散熱片 13棘齒狀溝槽間距長度B介於〇mm〜1〇mffl時，本創作可以 φ 有最佳的散熱功效；同樣地，設計散熱粒子的長寬範圍 C、D為0mm〜l〇mm、高度範圍E為0mm〜10mm時，本創作 的背板係可得到最佳之保護與散熱效果。 此外，本創作之背光模組之框體1 〇與背板11係為 金屬之鋁材質製造，故可在本創作之框體10背板11成 型後以陽極處理本創作之框體1 〇與背板11的表面，使 得本創作之框體1 〇與背板11之表面產生一層保護層， 藉以擁有良好的絕緣、防導電特性及美觀視覺效果。 由以上結構之組成，可知本創作所述之背光模組具 • M315352 '有下列優點： 、1 ·本創作之背光模組其框體、背板等構件係為鋁金屬 材質所製成，比習知塑膠材質具有導熱性更佳、散 熱更快之特性，亦較塑膠材質更為堅固，故對於設 置於框體内部之導光板等構件與設置在PCB放置槽 内的ic晶片及被動元件有較佳的定位保護，並具有 節能、散熱佳與不會污染環境之優點。 2·本創作以LED燈源替代傳統燈管，符合環保無鉛之 Φ 概念與要求。 3·框體外侧端周緣形成的散熱片、以及背板與散熱片 上設置的散熱粒子，可增加本創作之散熱的面積， 而具有良好迅速排散LED通入電流時產生的熱能之 效果’更為有效降低led之工作的溫度。 4.^創作能使LED有較佳之散熱後，可在不縮短lED 壽命下通入較高之電流，以提高LED發光亮度，而 能得到比習知更高輝度表現；同時能減少LED裝設 鲁 之數量或降低導光板的厚度，達到節省成本、節約 能源與縮減體積、重量、厚度之目標。 由上述所知，本創作在同類產品中具有極佳之進步 及實用性，同時查遍國内外關於此類結構之技術資料文 獻中’未發現有相同近似之構造存在在先，應已符合『創 作性』『合於產業利用性』以及『進步性』的專利要件， 爰依法之提出申請。 唯’以上所述者僅係本創作之一較佳實例而已，故 舉凡應用本創作說明書及申請專利範圍所為之其他等效 結構變化者，理應包含在本創作申請專利之範圍内。 10 • M315352 【圖式簡單說明】 第一圖係為習知LED背光模組之上視圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作之框體的後視圖。 第四圖係為本創作之框體的侧視圖。 第五圖/係為本創作之散熱片及其溝槽態樣示意圖。 附件一係為第M273277號專利公告影本。• M315352 VIII. New Description: [New Technology Area] This creation department is about a kind of back. It refers to a multi-layered frame and back plate, and a multi-area heat-dissipating backlight module formed by hot particles. The new structure of the group. The new structure of the optical module, more specifically, the moonlight pull structure, which has excellent heat dissipation effect by the heat sink and the scattered fruit formed by the aluminum material. [Previous technology] According to the attachment - the Republic of China patent certificate number The image of the patent publication No. M273277, which is shown in the figure of p, is a kind of "backlight module disk mirror surface bonding device", and its structural level includes a reflection sheet, a light guide plate 2, a diffusion plate 3, and a diamond from bottom to top. The lens 4' is provided with a CCFL and an LED light source 5 at the periphery of the light guide plate, and a reflective mesh point is arranged on the bottom surface. The structure layer is disposed on the bottom plate 7 by being immersed in the outer frame, and is configured as a backlight module. A mirror surface 10 is mounted on the light guide plate, and mirror faces 31 and 41 are provided on the diffuser plate and the diamond lens 4, and the mirror surface 1 已 has been used. However, the conventional backlight module and the mirror surface combination device mainly use a CCFL and an LED light source installed around the light guide plate as a light source, and the light source is scattered by the reflection mesh point on the bottom surface of the light guide plate of the backlight module. The light source is reflected by the reflection sheet to the top surface of the light guide plate to enhance the light source around the mirror surface to increase the mirror effect; generally, the backlight module is formed into a lightweight shape, and the outer frame is molded by a plastic material. In order to make the backlight image clear, it is often necessary to improve the light-emitting effect of the light source, so that the heat energy generated by the light source is relatively increased, and the outer frame needs to bear a certain degree of twist. 5 When the heat dissipation effect of the material is extremely poor, the light is The source is easy to cause heat dissipation. CCFL and LED are required to increase the illumination effect of the light source. Therefore, the structure of the structure is increased, and the development and research of the structural light module is understood by the aforementioned group. The complex structure and the heat dissipation effect have been seen in any improvement in the creation of a new structure of the backlight module that has been researched and modified for the above-mentioned defects. It is to provide a new structure with high heat dissipation effect. The frame body for heat dissipation is made of the new structure material of the backlight module, and the type is fabricated or separately formed, and the frame body is used for placing the reflection sheet, and the periphery of the light guide side is an LED lamp provided with an LED light bar. The strip and the frame are joined and fixed with a plurality of heat sinks, and the heat sink dissipates the particles, and the thermal effect of the M315352 is placed on the frame and the back of the PCB (printed circuit board), and the CCFL is caused by the outer frame being plastic. The LED is damaged by the light source, and the light guide plate, the diffusion sheet and the diamond lens module are complicated to form and the process is complicated. The pros and cons of the creator of this case have long been engaged in the construction of the back-related instruments. The analysis of the shortcomings of the backlight structure is not known, but it has not been born for a long time. There is a bell in this case. The author of this case is eager to develop a comparative That is, the main purpose of this creation and the brightness module with excellent brightness performance [new content] According to the above purpose, the characteristics of the invention include the use of aluminum metal. The frame system can be integrated with the back plate to form a central system. Hollow groove state plate and optical film and other components, the light source member in the frame body is made of heat-dissipating paste, the outer edge of the frame body is arranged on the periphery and the back plate is formed with a large number of outer side faces of the plate. Local formation 6 • M315352 • Slots can be used to place the p CB and its included IC chips with other passive components. The edge is that the frame structure of the backlight module of the present invention is made of Shao metal material, which has better material properties, heat conduction and heat dissipation than the frame of the conventional backlight module. In addition, a large number of heat sinks and heat dissipating particles are provided in the creation, which improves the overall heat dissipation area, so that the high heat generated by the LED light can be used to obtain excellent conduction and emission, and can be used higher than the conventional creation. The current value is passed into the LED to improve its working brightness', so that the working efficiency is higher, and the heat dissipation effect is also extended, which shortens the service life of the LED, reduces the replacement cost, and improves the conventional frame for the plastic manufacturing. Poor heat dissipation and environmental protection and energy saving problems. In order to provide a more detailed and clear understanding of the purpose, function and structural features of the present invention, the following preferred embodiments are illustrated with the following description: [Embodiment] Please refer to the second figure at the same time, and cooperate with The third and fourth figures are respectively an exploded view of the backlight module and a rear view and a side view of the frame. As can be seen from the figure, the main structure of the backlight module described in the present invention has a main body 1Q and a back plate 散热 which are made of aluminum metal, and the frame 10 can be separately formed or The back plate 11 is integrally formed; the frame body 1 has a hollow groove formed in the center, and is provided for the reflection sheet 3, the light guide plate 2, and the optical film 4 (including the diffusion sheet 40 and the upper and lower mirrors 41). , 42) and other components are attached, and the external upper cover 6 is used for carding and bonding, and the inner member such as the light guide plate is fixed and thinned; the inner periphery of the frame 10 is provided with an LED light bar. 5, 7 .M315352 The LED light bar 5 is the light source structure of the creative light. It is connected with several high-power LEDs in a tin-plated manner on a piece of ρ (: Β (printed circuit board)' The PCB (printed circuit board) is bonded to the frame 1 by a heat-dissipating paste; the peripheral edge of the outer end of the frame HU) is formed with a plurality of fin-shaped fins 13 at the same time, and at the back plate i! and the heat sink i On the 3rd, a large number of heat-dissipating particles 14' are arranged to increase the area for heat dissipation. A pcB placement slot 12 may be partially formed on the outer side of the frame ίο and the back plate u, and may be used to place a PCB (printed circuit board) and the 1C chip and other passive components contained therein, and provide a PCB (printed circuit) Board) A space to protect the positioning. Since the aluminum metal material has the advantages of fast heat conduction and good heat dissipation, the frame 10 and the plate 11 can protect and position the inner LED strip 5 and the light guide plate 2, the optical film 4 and the like, and the LED strip 5 The high thermal energy generated during the energization can be quickly and efficiently transmitted to the aluminum frame 1 and the back plate 1 through the aluminum pCB and the subsequent heat-dissipating paste, and the heat energy is discharged. In addition, a plurality of fins 15 designed as ratchet-shaped grooves are formed on the outer periphery of the frame body 10, and a plurality of fin-shaped heat dissipating particles are disposed on the back plate 11 to effectively increase the area of the heat dissipation of the present invention. This makes the creation of better heat dissipation efficiency, so that the LED light bar 5 can more effectively reduce its working temperature, and can effectively extend the service life of the LEJ). In addition, the power consumption of the LED is increased by the increase of the heat dissipation area, and the relationship is 〇~η times. The LED power consumption is proportional to the 11 times heat dissipation area. In other words, the LED heat dissipation effect is improved due to the increase of the heat dissipation area, so that the LED can generate higher brightness by introducing a higher current (the LED operating temperature is not more than 8 • M315352 • over 6 〇 °c). That is, the light source that emits ... can reduce the number of LED installations or the thickness of the light guide plate 2 under the same degree of brightness, thereby saving cost. 3 The creation of the heat dissipating particles 14 and the fins 13 and the specifications of the back sheet 11 can be changed according to customer requirements. The back plate 11 can be requested by the customer, and is formed into the same size of the area enclosed by the frame 1 or the size of the frame of the frame 1 的 1 / 2, 1 / 3 or i / 6 Customers can flexibly change their needs for heat dissipation. # Please refer to the fifth figure, which is a schematic diagram of the ratcheted groove pattern of the heat sink 13 of the present invention. The shape of the groove bottom and the outer edge of the groove of the created heat sink 13 can be round or pointed. The design of the shape and the rectangle, as shown in the figure, a and a2 are the circular shape of the fins of the heat sink, the a3 is the shape of the outer edge of the fin 丨3, and the a4 is the outer edge of the fin. The shape of the groove rectangle. Referring to the third and fourth figures, the author of the author has obtained the design that the design of the ratchet fins 13 ranges from 0 mm to 10 mm, and the fins 13 has a ratchet-like groove pitch length B. When 〇mm~1〇mffl, this creation can have the best heat dissipation effect; similarly, when the length and width range of the heat-dissipating particles are designed to be 0mm~l〇mm, and the height range E is 0mm~10mm, this creation The back panel provides the best protection and heat dissipation. In addition, the frame 1 〇 and the back plate 11 of the backlight module of the present invention are made of metal aluminum, so the frame 1 of the present invention can be anodized after the frame 10 of the frame 10 of the present invention is molded. The surface of the back plate 11 creates a protective layer on the surface of the frame 1 and the back plate 11 of the present invention, thereby having good insulation, anti-conductivity and aesthetic appearance. According to the composition of the above structure, it can be seen that the backlight module of the present invention, M315352, has the following advantages: 1. The backlight module of the present invention is made of aluminum metal material, such as a frame body and a back plate. The plastic material has better thermal conductivity and faster heat dissipation. It is also stronger than the plastic material. Therefore, the components such as the light guide plate disposed inside the frame and the ic chip and the passive component disposed in the PCB placement groove are provided. It has better positioning protection and has the advantages of energy saving, good heat dissipation and no pollution to the environment. 2. This creation replaces the traditional lamp with LED light source, which conforms to the concept and requirements of environmental protection and lead-free Φ. 3. The heat sink formed on the outer edge of the outer side of the frame and the heat dissipating particles disposed on the back plate and the heat sink can increase the heat dissipation area of the present invention, and have the effect of rapidly dissipating the heat energy generated when the LED is supplied with current. In order to effectively reduce the temperature of the work of the led. 4.^ Creation can make LEDs have better heat dissipation, and can input higher current without shortening lED life, so as to improve LED brightness, and get higher brightness performance than conventional ones; The number of Lu or the thickness of the light guide plate can achieve the goal of saving cost, saving energy and reducing volume, weight and thickness. As far as the above is concerned, this creation has excellent progress and practicability in similar products. At the same time, it has been found in the technical literature on such structures at home and abroad that 'the structure that does not find the same approximation exists first and should have been met. The patent element of the creative "combined with industrial use" and "progressive" is applied in accordance with the law. It is to be understood that the above description is only one of the preferred examples of the present invention, and that other equivalent structural changes that apply to the present specification and the scope of the patent application are intended to be included in the scope of the present patent application. 10 • M315352 [Simple description of the diagram] The first diagram is a top view of a conventional LED backlight module. The second picture is a three-dimensional exploded view of the creation. The third picture is a rear view of the frame of the creation. The fourth picture is a side view of the frame of the creation. The fifth picture/ is a schematic diagram of the heat sink and its groove pattern. Annex I is a copy of the patent announcement No. M273277.
【主要元件符號說明】 背光模組1 上蓋6 框體10 散熱片範圍長度A 背板11 散熱片溝槽間距長度B PCB置放槽12 散熱粒子長度C 散熱片13 散熱粒子寬度D 散熱粒子14 導光板2 反射片3 光學膜4 擴散片40 上菱鏡片41 下菱鏡片42 LED燈條5 散熱粒子高度E[Main component symbol description] Backlight module 1 Upper cover 6 Frame 10 Heat sink range length A Back plate 11 Heat sink groove pitch length B PCB placement groove 12 Heat sink particle length C Heat sink 13 Heat sink particle width D Heat sink particle 14 Guide Light plate 2 Reflector 3 Optical film 4 Diffuser 40 Upper diamond lens 41 Lower diamond lens 42 LED light bar 5 Heat sink particle height E