獨37674 八、新型說明： * 【新型所屬之技術領域】 本新型是關於-種LE㈣燈結構，尤指—種散熱效果良好 的LE1D崁燈。 【先前技術】 近來由於LED具有低耗電量、亮度衰減緩慢、使用壽命長 、體積小_料優點’因此有_成為取代傳腿泡的趨勢 ，但LED也會產生熱能’尤其是高亮度的LED，若無法有效散 熱，同樣也會影響到LED的壽命’所以有業者研發出一種如專 利文獻1所示LED燈泡散熱結構。 專利文獻1:中華民國專利證書船145〇5號「高功率led 燈泡散熱結構」。 【新型内容】 一、 所欲解決的問題點： 别述專利文獻1的高轉LED以底面與—套設有複數散 熱片的熱導管頂端黏結而具有良好的散熱效果，但該熱導管 另-端藉由—底基板與—般具有接合部的燈頭結合，由於孰 導管是由複數散熱版成，而散刻又是_片，故不利於 、手抓持尤其疋將LED |燈安裝在燈座上或由燈座上卻下 時’都會因為沒有抓持部使安裝或拆卸產生困難，因此如何 能設計出-種能便祕狀具有良好散熱效果、又兼顧外觀 iei的LED坎燈才為本新型的主要目的。 二、 本新型的技術手段：· 為解決前述的問題點，本新型技術手段是達樣實現的， M337674 .. 一種LED崁燈，其特徵在於包括：Unique 37674 VIII, new description: * [New technology field] This new type is about LE (four) lamp structure, especially LE1D xenon lamp with good heat dissipation effect. [Prior Art] Recently, LEDs have low power consumption, slow brightness decay, long service life, and small size. Therefore, there is a tendency to replace the leg-bubbles, but LEDs also generate heat energy, especially high-brightness. If the LED cannot be effectively dissipated, it will also affect the life of the LED. Therefore, a manufacturer has developed an LED bulb heat dissipation structure as disclosed in Patent Document 1. Patent Document 1: The Republic of China Patent Certificate Ship 145〇5 "High-power LED bulb heat dissipation structure". [New content] First, the problem to be solved: The high-conversion LED of Patent Document 1 has a good heat dissipation effect by bonding the bottom surface with the heat pipe top with a plurality of heat sinks, but the heat pipe is another The end is combined with the base of the base with a joint, since the 孰 duct is made up of a plurality of heat-dissipating plates, and the stencil is _ piece, which is disadvantageous, hand grip, especially the LED | lamp is mounted on the lamp When the seat is on or under the lamp holder, it will be difficult to install or disassemble because there is no gripping part. Therefore, how to design a kind of LED light can be designed with constipation and good heat dissipation effect, and also take into account the appearance of iei The main purpose of the new type. Second, the technical means of the new:: In order to solve the above problems, the new technical means is achieved by the sample, M337674.. An LED xenon lamp, characterized in that:
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一由導接部（11)及具有散熱效果的殼罩（12)所組成的燈 頭（1); 一端固設於前述殼罩（12)内且另端裸露於殼罩（12)外的 散熱模組(2);以及 一設於散熱模組(2)另端面且與前述燈頭（1)電性連接的 高亮度LED(3)。 根據上述的LED崁燈結構，其中，所述殼罩（12)是喇队 形的金屬導熱材質製成，外圍環設有若干散熱鳍片（m)。 根據上述的LED崁燈結構，其中，所述散熱鳍片（22)的 形狀為圓形。 根據上述的LED崁燈結構，其中，所述散熱鳍片（22)的 形狀為半圓形。 根據上述的LED崁燈結構，其中，所述散熱模組(2)是由 至少一熱導柱(21)、及多片等間隔排列並重疊固定於熱導柱 (21)的散熱鳍片（22)所組成。 根據上述的LED崁燈結構，其中，所述高亮度LED(3)為 一種晶片式LED。 根據上述的LED崁燈結構，其中，所述散熱模組〇另端 面更設置一環罩於高亮度LED(3)周圍的錐形反射罩（4)。 根據上述的LE1D崁燈結構，其中，所述反射罩為一錐 形塑殼，在其内壁鍍設一層光線反射率極佳的鍍膜層。a lamp cap (1) consisting of a guiding portion (11) and a heat-dissipating cover (12); one end is fixed in the casing (12) and the other end is exposed to the heat dissipation outside the casing (12) The module (2); and a high-brightness LED (3) disposed on the other end surface of the heat dissipation module (2) and electrically connected to the lamp holder (1). According to the LED xenon lamp structure described above, the cover (12) is made of a bar-shaped metal heat conductive material, and the peripheral ring is provided with a plurality of heat radiating fins (m). According to the LED xenon lamp structure described above, the heat dissipating fins (22) have a circular shape. According to the LED xenon lamp structure described above, the heat dissipating fins (22) have a semicircular shape. According to the LED xenon lamp structure described above, the heat dissipation module (2) is a heat dissipation fin (21) and a plurality of heat dissipation fins (21) arranged at equal intervals and overlapped and fixed to the heat guide column (21) ( 22) Composition. According to the LED xenon lamp structure described above, the high-brightness LED (3) is a wafer type LED. According to the LED xenon lamp structure described above, the heat dissipating module is further provided with a conical reflector (4) surrounding the high-brightness LED (3). According to the LE1D xenon lamp structure described above, the reflector is a conical molded case, and a plating layer having excellent light reflectivity is plated on the inner wall thereof.
'M337674 二、對照先前技術的功效： 藉由本新型的實施可獲至下列優點： 1·散熱模組(2) —端固設於外圍環設散熱鳍片的殼罩 (12)内’除了增加散熱面積而具有更佳的散熱效果外，同時 也能使LED崁燈的整體造型較具特色。 • 2·散熱模組（2)固設於殼罩（12)内，因此在安裝或拆卸 . LED炭燈時，能便於操作者手持殼罩（12)而利於組卸。 3·增設反射罩（4)後，能使高亮度LED光線集中，而產生 • 更佳的照射效果。 【實施方式】 以下依據圖面所示的實施例詳細說明如後： 如圖1所示，為本新型LED崁燈結構的立體分解圖；圖2 為本新型LED崁燈結構另一視角的立體分解圖；圖3為圖^ 的立體組合圖；圖4為圖1增設反射照的示意圖；圖〜圖 5D為圖1燈頭的另一實施狀態示意圖；圖6為本新型散熱模 組的另一實施狀態示意圖；圖7為圖6的立體組合圖。 由上述圖中可知LED坎燈的組成包括：一由導接部（η) 及具有散熱效果的殼罩（12)所組成的燈頭（1); 一固設於前述 殼罩（12)内且部分裸露於殼罩（12)外的散熱模組(2) ;以及一 u又於政熱模組（2)頂面且與燈頭（1)電性連接的高亮度 LED(3) 〇 上述中，燈頭（1)的導接部（11)是用來與燈座（未揭）電性 連接以提供南亮度LED⑶發搞需的電源，可為—般公規的 螺接式導接部（如圖G，或為插接式（圖5A〜圖5幻。其次，殼 ‘M337674 p: i U7 佟工 I . I ' 1 …:Ί • 罩（12)是喇叭形的金屬導熱材質製成，且外圍環設有^干散〜」$ 熱鳍片（121)使用於散熱。 月 上述中，散熱模組(2)是由一熱導柱(21)、及若干間隔、 套疊固定於熱導柱(21)的散熱鳍片（22)所組成，藉由與具散 熱效果的殼罩（12)導觸更為擴大散熱面積以增強散熱效果； • 又熱導柱（21)以銅材質製成為最佳，而散熱鳍片（22)的形狀 ^ 除了圓形外也可為其它形狀，如圖6所示的半圓造型。 上述中，高亮度LED(3)為一種晶片式[ED，藉由螺接或 _ 鉚接等方式固定在散熱模組(2)頂面，使發光時產生的高熱能 迅速透過散熱模組（2)吸收；另外，在散熱模組（2)頂面還能 設置一環罩於高亮度LED(3)周圍的反射罩（4)，該反射罩（4) 具有金屬鏡面電鍍的反射面，能輔助高亮度LED(3)發揮更佳 的照射效果。 以上依據圖面所示的實施例詳細說明了本新型的構造、 特徵及作用效果，由於符合新穎及進步性要件，遂爰依法提 出新型專利申請。 -M337674 ^ ，· I； ' 【圖式簡單說明】 圖1 :本新型LED崁燈結構的立體分解圖。 - 圖2 ··本新型LED崁燈結構另一視角的立體分解圖。 _ 圖3:為圖1的立體組合圖。 圖4:為圖1增設反射照的示意圖。 . 圖5A〜圖5D :為圖1燈頭的另一實施狀態示意圖。 ^ 圖6:本新型散熱模組的另一實施狀態示意圖。 圖7 :為圖6的立體組合圖。 Φ 【主要元件符號說明】 1 燈頭 11 導接部 12 殼罩 121 散熱鳍片 2 散熱模組 21 熱導柱 Φ 22 散熱鳍片 3 高亮度LED 反射罩 4'M337674 II. Controlling the efficacy of the prior art: With the implementation of the present invention, the following advantages can be obtained: 1. The heat dissipation module (2) is fixed in the outer casing (12) of the heat-dissipating fins. The heat dissipation area has a better heat dissipation effect, and at the same time, the overall shape of the LED xenon lamp is more distinctive. • 2) The heat dissipation module (2) is fixed in the cover (12), so when installing or disassembling the LED carbon lamp, the operator can easily hold the cover (12) to facilitate assembly. 3. When the reflector (4) is added, the high-brightness LED light can be concentrated to produce a better illumination effect. [Embodiment] The following is a detailed description of the following embodiments according to the drawings: as shown in FIG. 1 , an exploded perspective view of the structure of the novel LED xenon lamp; FIG. 2 is a perspective view of the new LED xenon lamp structure. 3 is a perspective view of FIG. 1; FIG. 4 is a schematic view showing another embodiment of the lamp head of FIG. 1; FIG. 5D is a schematic view of another embodiment of the lamp cap of FIG. FIG. 7 is a perspective assembled view of FIG. 6. FIG. It can be seen from the above figure that the composition of the LED illuminator comprises: a lamp cap (1) composed of a guiding portion (η) and a cover (12) having a heat dissipating effect; one is fixed in the casing (12) and a heat-dissipating module (2) partially exposed outside the cover (12); and a high-brightness LED (3) which is electrically connected to the top of the thermal module (2) and electrically connected to the lamp cap (1). The guiding portion (11) of the lamp cap (1) is used for electrically connecting with the lamp holder (not uncovered) to provide the power supply for the south brightness LED (3), and can be a general-purpose screw-type guiding portion ( As shown in Figure G, or plug-in (Figure 5A ~ Figure 5 magic. Secondly, the shell 'M337674 p: i U7 Completion I. I ' 1 ...: Ί • The cover (12) is made of a horn-shaped metal heat conductive material And the outer ring is provided with a dry heat sink and a heat fin (121) for heat dissipation. In the above, the heat dissipation module (2) is fixed by a heat guide column (21) and a plurality of intervals and nestings. The heat-dissipating fins (22) of the heat-guiding column (21) are formed by the heat-conducting surface of the heat-conducting cover (12) to enhance the heat dissipation effect; • The heat-conductive column (21) is made of copper. Made of the best material, while cooling The shape of the fin (22) can be other shapes besides the circle, such as the semicircular shape shown in Fig. 6. In the above, the high-brightness LED (3) is a wafer type [ED, by screwing or _ riveting The method is fixed on the top surface of the heat dissipation module (2), so that the high heat generated during the illumination is quickly absorbed by the heat dissipation module (2); in addition, a ring cover can be disposed on the top surface of the heat dissipation module (2) for the high brightness LED. (3) The surrounding reflector (4), which has a reflective surface coated with a metal mirror surface, can assist the high-brightness LED (3) to exert a better illumination effect. The above embodiment is detailed in accordance with the embodiment shown in the figure. Explain the structure, characteristics and effects of the new model. Because it meets the requirements of novelty and progressiveness, it proposes a new patent application according to law. -M337674 ^ ,· I; ' [Simple description of the diagram] Figure 1: The new LED xenon lamp An exploded view of the structure. - Figure 2 · An exploded perspective view of another perspective of the new LED xenon lamp structure. _ Figure 3: is a three-dimensional combination of Figure 1. Figure 4: Schematic diagram of adding a reflection to Figure 1. 5A to 5D are schematic views showing another embodiment of the lamp cap of Fig. 1. ^ Figure 6: This new Schematic diagram of another embodiment of the heat dissipation module Fig. 7 is a perspective combination diagram of Fig. 6. Φ [Description of main component symbols] 1 lamp head 11 lead portion 12 cover 121 heat sink fin 2 heat dissipation module 21 heat guide column Φ 22 heat sink fins 3 high brightness LED reflector 4