201204991 六、發明說明： 【發明所屬之技術領域】 本發明係提供一種LED燈具散熱器成型方法與結構， 尤指其技術上提供一種藉由LED燈板上之凸柱插入一尚未 硬化的散熱鰭片座之接合面，而使接合面形成數凹槽，藉 此增加接觸面積與緊密結合為一體，而達到快速散熱之具 微奈米金屬和石墨之LED燈具散熱器成型方法與結構。 【先前技術】 按，發光二極體（LED)元件由於耗電量少 '體積小及使 用壽命長’目前廣泛地使用於家電用品之指示燈、液晶顯 示器之背光源、圖文顯示幕及汽車第三煞車燈等應用，而 近年來由於如磷化鋁鎵銦（AlGalnP)及氮化銘嫁姻 (AlGalnN)等發光二極體材料已被成功開發，因此能夠在許 多應用上以發光二極體元件取代傳統的白織燈泡。 然而’目前高功率發光二極體的輸入功率僅有15~2〇% 會轉換成光，其餘80〜85%則轉變成為熱，若這些熱未能及 時排出至外界’會使發光二極體晶粒界面溫度過高，而降 低發光效率及壽命。 因此，為了有效散逸發光二極體使用時產生的熱能， 進而提昇發光二極體的使用壽命與發光效率，如何設計可 有效散熱的發光二極體散熱模組係為一重要關鍵。 請參閱第六圖’其為一般的LED散熱模組分解示意圖 201204991 ’通常是附有LEds(5g)的電路板（51)結合於一 散熱鰭片座（5 2 )上來達到快速將LED燈（5 〇 )產生 之熱能透過散熱韓片座（52)而散熱，但是由於電路板 (5 1 )與散熱縛片座（5 2 )的接觸面積有限，且接觸 時並不會完全密合’電路板（5丄）肖散熱縛片座（5 2 )接觸面之間會有空隙，造成導熱不佳，丨以將熱能由電 路板（5 1 )導向散熱鰭片座（5 2 )就會遇到瓶頸。 疋以’ '針對上述習知結構所存在之問題點，如何開發 -種更具理想實用性之創新結構，實消費者所殷切企盼， 亦係相關業者須努力研發突破之目標及方向。 有鑑於此’發明人本於多年從事相關產品之製造開發 …又桃驗，針對上述之目帛，詳加設計與審慎評估後， 終得一確具實用性之本發明。 【發明内容】 欲解決之技術問題點：—㈣LED散熱模组通常是附 有led燈的電路板結合於一散熱鰭片座上來達到快速將⑽ 燈產生之熱能透過散熱鰭片座而散熱，但是由於電路板與 散熱鰭片座的接觸面積有限，且接觸時並不會完全密合， 電路板與散熱鰭片座接觸面之間會有空隙，造成導熱不佳 所以將熱能由電路板導向散熱縛片座就會遇到瓶頸。 解決問題之技術特，點：提供一種具微奈米金屬和石墨 之LED燈具散熱器成型方法，其包括以下步驟：提供一 201204991 LED燈板，該LED燈板依序由導熱層、絕緣層與電路板結合 ♦ 而成，至少一 LED燈附著於該電路板上，該導熱層上形成 數凸柱犬出於該LED燈板外；B.提供一尚未硬化之散熱鰭 片座，該尚未硬化之散熱鰭片座形成有數散熱鰭片與中央 形成一接合面；C.將該導熱層之數凸柱插入該尚未硬化之 散熱鰭片座之接合面，使該接合面形成與數該凸柱對應之 數凹槽；D.將c步驟之該尚未硬化之散熱鰭片座靜置直到 • &成硬化之散熱韓片座，並使該硬化之散熱縛片座與該 LED燈板之該導熱層緊密結合為一體。並藉由以上步驟製成 一具微奈米金屬和石墨之UD燈具散熱器結構。 對照先前技術之功效：本發明透過將LED燈板的凸柱 直接插入尚未硬化之散熱鰭片座之該接合面使接合面形 成數凹槽’待散熱鰭片座硬化後，不但凹槽與凸柱形成廣 大的接觸面積’並且能夠緊密的結合在一起，達到最佳的 φ 散熱效果。 有關本發明所採用之技術、手段及其功效，茲舉一較 佳實施例並配合圖式詳細說明於后，相信本發明上述之目 的、構造及特徵，當可由之得一深入而具體的瞭解。 【實施方式】 請參閱第-圖，本發明提供一種具微奈米金屬和石墨 之LED燈具散熱器成型方法，纟包括以下步驟： A·提供-LED燈板，該㈣燈板依序由導熱層、絕緣 201204991 層與電路板結合而成，至少一 LED燈附著於該電路板上， 該導熱層上形成數凸柱突出於該LED燈板外； B. 提供一尚未硬化之散熱鰭片座，該尚未硬化之散熱 鰭片座形成有數散熱鰭片與中央形成一接合面； C. 將該導熱層之數凸柱插入該尚未硬化之散熱鰭片座 之接合面’使該接合面形成與數該凸柱對應之數凹槽； D. 將C步驟之該尚未硬化之散熱鰭片座靜置直到形成 一硬化之散熱鰭片座，並使該硬化之散熱鰭片座與該led 燈板之該導熱層緊密結合為一體。 睛參閱第二圖’其為上述步驟C的示意圖，該附有至 少一 LED燈（2 )之LED燈板（1)形成有數凸柱（3)， 將凸柱（3)插入還在一模具（4)内等待硬化成型的散 熱鰭片座（5)之接合面（6)，使接合面（6)相對形成 數凹槽’並使凸柱（3)與凹槽能緊密結合，於散熱錯片 座（5 )硬化後，該LED燈板（1 )與該散熱鰭片座（5 )能結合為一體，之間完全密合而不會有空隙。 晴參閱第三至第五圖’透過以上成型方法所形成之結 構包括： 一 LED燈板（1 0 )，該LED燈板（1 〇 )係依序由導 熱層（11)、絕緣層（12)與電路板（13)結合而成 ，至少一個LED燈（131)附著於該電路板（13)上 ’該導熱層（1 1)上則形成數凸柱（1 1 1)突出於該 201204991 LED燈板（1 〇 )外； 一散熱錯片座勒埶錄w )該散熱轉片座（20)具有數 散熱鰭片（21、 ^Q、 —接合面（22)，該接合面201204991 VI. Description of the Invention: [Technical Field] The present invention provides a method and structure for forming a heat sink of an LED lamp, in particular, a technically provided method for inserting an unhardened heat sink fin by a stud on an LED lamp panel The joint surface of the wafer seat, and the joint surface forms a plurality of grooves, thereby increasing the contact area and tightly integrating, and achieving the rapid heat dissipation of the micro-nano metal and graphite LED lamp heat sink molding method and structure. [Prior Art] According to the light-emitting diode (LED) component, due to low power consumption, 'small size and long service life', it is widely used in the indicator light of household appliances, the backlight of liquid crystal display, graphic display screen and automobile. Applications such as the third brake lamp have been successfully developed in recent years due to the development of light-emitting diode materials such as aluminum gallium indium phosphide (AlGalnP) and nitriding marsh (AlGalnN). The body element replaces the traditional white woven bulb. However, the current input power of high-power LEDs is only 15~2〇%, which will be converted into light, and the remaining 80~85% will be converted into heat. If these heats are not discharged to the outside world in time, the LEDs will be emitted. The grain boundary temperature is too high, which reduces luminous efficiency and lifetime. Therefore, in order to effectively dissipate the heat energy generated when the light-emitting diode is used, thereby improving the service life and luminous efficiency of the light-emitting diode, how to design a light-emitting diode heat-dissipating module capable of effectively dissipating heat is an important key. Please refer to the sixth figure, which is a schematic diagram of the general LED cooling module. 201204991 'The board (51) with LEds (5g) is usually combined with a heat sink fin (52) to achieve fast LED light ( 5 〇) The generated heat is dissipated through the heat sink (52), but the contact area between the board (5 1 ) and the heat sink holder (5 2 ) is limited and does not completely close the 'circuit There is a gap between the contact faces of the board (5 丄) Xiao heat-bonding block (5 2 ), which causes poor heat conduction. In order to guide the heat from the circuit board (5 1 ) to the heat-dissipating fin seat (5 2 ) To the bottleneck. In view of the problems existing in the above-mentioned conventional structure, how to develop an innovative structure with more ideal and practicality, the consumers are eagerly awaiting, and the relevant industry must strive to develop the goal and direction of breakthrough. In view of this, the inventor has been engaged in the manufacture and development of related products for many years... and the inspection of the above-mentioned products, after detailed design and careful evaluation, the invention has finally become practical. SUMMARY OF THE INVENTION The technical problem to be solved is: - (4) The LED heat dissipation module is usually a circuit board with a led lamp combined with a heat sink fin to quickly dissipate heat generated by the (10) lamp through the heat sink fin seat, but Since the contact area between the circuit board and the heat sink fin seat is limited, and the contact is not completely tight, there is a gap between the contact surface of the circuit board and the heat sink fin seat, resulting in poor heat conduction, so that heat is guided by the circuit board to dissipate heat. The cassette holder will encounter a bottleneck. The technical problem of solving the problem is that a method for forming a heat sink of an LED lamp with micro-nano metal and graphite is provided, which comprises the following steps: providing a 201204991 LED light board, which is sequentially composed of a heat conducting layer, an insulating layer and The circuit board is combined with ♦, at least one LED lamp is attached to the circuit board, and a plurality of protruding dogs are formed on the heat conducting layer outside the LED light board; B. providing an unhardened heat sink fin seat, which is not yet hardened The heat dissipation fins are formed with a plurality of heat dissipation fins forming a joint surface with the center; C. inserting the plurality of protrusions of the heat conduction layer into the joint surface of the heat-hardened fin seat, so that the joint surface forms a plurality of the protrusions Corresponding number of grooves; D. The heat-dissipating fin seat of the step c is left to stand until the hardened heat sink is mounted, and the hardened heat-dissipating block seat and the LED light board are The heat conductive layer is tightly integrated. And through the above steps, a UD lamp radiator structure with micro-nano metal and graphite is fabricated. Compared with the effect of the prior art: the invention directly inserts the protrusion of the LED lamp plate into the joint surface of the heat-dissipating fin seat which has not been hardened, so that the joint surface forms a plurality of grooves. After the fin seat is hardened, not only the groove and the convex portion The columns form a large contact area' and can be tightly bonded together for optimum φ heat dissipation. The above-mentioned objects, structures and features of the present invention will be described in detail with reference to the preferred embodiments of the present invention. . [Embodiment] Please refer to the first figure, the present invention provides a method for forming a heat sink of an LED lamp with micro-nano metal and graphite, comprising the following steps: A·providing - LED light board, the (four) light board is sequentially thermally conductive Layer and insulation 201204991 layer is combined with the circuit board, at least one LED lamp is attached to the circuit board, and a plurality of protrusions are formed on the heat conduction layer to protrude outside the LED lamp board; B. providing a heat-dissipating fin seat which is not yet hardened The heat-hardened fin seat is formed with a plurality of heat-dissipating fins forming a joint surface with the center; C. inserting the plurality of protrusions of the heat-conducting layer into the joint surface of the heat-hardened fin seat to make the joint surface Counting the number of grooves corresponding to the protrusions; D. Resting the heat-hardened fin seat of the C step until a hardened fin seat is formed, and the hardened fin seat and the led light board are formed The heat conducting layer is tightly integrated into one body. Referring to the second figure, which is a schematic diagram of the above step C, the LED lamp board (1) with at least one LED lamp (2) is formed with a plurality of protrusions (3), and the protrusions (3) are inserted into a mold. (4) waiting for the joint surface (6) of the heat-dissipating fin seat (5) to be hardened, so that the joint surface (6) is relatively formed with a plurality of grooves' and the protrusions (3) and the grooves can be tightly coupled to dissipate heat. After the chip holder (5) is hardened, the LED lamp panel (1) and the heat dissipation fin holder (5) can be integrated into one body, and are completely tightly sealed without a gap. Refer to the third to fifth figures. The structure formed by the above molding method includes: an LED lamp panel (10), which is sequentially composed of a heat conducting layer (11) and an insulating layer (12). And a circuit board (13) is combined, at least one LED lamp (131) is attached to the circuit board (13). The heat conducting layer (1 1) forms a plurality of protrusions (1 1 1) protruding from the 201204991 LED light board (1 〇) outside; a heat-dissipating chip holder w w) The heat-dissipating rotor holder (20) has a plurality of heat-dissipating fins (21, ^Q, - joint surface (22), the joint surface
(2 2 )形成與該LED 板C1U)之數該凸柱（111 )對應之數凹槽（99ί、 2 1 )’其中數該凹槽（2 2 1 )係於 該散熱鰭片座 (2 0 )射出成型而尚未硬化時數該凸柱 (1 1 1)插入該接合面（22)而报士、 Z )而形成，使該LED燈板 (10)之該導熱層（1 1)與 丄）興涿散熱鰭片座（20)緊 密結合為一體。 、其中，該絕緣層（12)是為了防止電路板（13) 通電後之電流流至導埶層 ▲ u(ll)形成短路（導熱層（11 )可能為金屬或石墨等導電材料）。 β其中，該散熱韓片座（2 0)與該導熱層（丄丄）係 可由重量百分比86-94%石墨粉末、3_7%樹脂乳膠與㈣微 •奈米金屬粉末混合後射出成型之結構者，可達到降低成本 減輕重量與合宜之散熱效果’藉此取代傳統用銅與銘等 金屬散熱材料。 其中，上述之樹脂乳膠為聚醋酸乙烯脂乳膠或丙烯樹 脂0 其中，上述之微奈米金屬粉末為三氧化二鋁。 其中，言亥具微奈米金屬和石墨之LED燈具散熱器結構 可結合一燈罩（3 〇 )而具美觀者。 201204991 前文係針對本發明之較佳實施例為本發明之技術特徵 進行具體之說明；惟，熟悉此項技術之人士當可在不脫離 本發明之精神與原則下對本發明進行變更與修改，而該等 變更與修改’皆應涵蓋於如下申請專利範圍所界定之範脅 中。 【圖式簡單說明】 第一圖：本發明成型方法之步驟流程圖。 第二圖：本發明成型方法之步驟c示意圖。 第三圖：本發明之結構分解示意圖。 第四圖：本發明之led燈板剖視圖。 第五圖··本發明之LED燈板與散熱鰭片座結合剖面圖。 第六圖：習知之LED散熱模組分解示意圖。 【主要元件符號說明】 •習用部分： (5 0 ) LED 燈 (51)電路板 (5 2 )散熱鰭片座 *本創作部分： (1 ) LED燈板 (1 0 ) LED 燈板 (11)導熱層 201204991 (12) 絕緣層 (13) 電路板 (1 3 1 ) LED 燈 (2 ) LED 燈 (2 0 )散熱鰭片座 (2 1 )散熱鰭片 (2 2 )接合面(2 2 ) forming a number of grooves (99 ί, 2 1 ) corresponding to the number of the pillars (111) of the LED board C1U), wherein the number of the grooves (2 2 1 ) is attached to the heat sink fin seat (2) 0) when the injection molding is not yet hardened, the protrusion (11 1) is inserted into the joint surface (22) and is formed by the newspaper, Z), so that the heat conduction layer (11) of the LED lamp panel (10)丄) Xingyu heat sink fin seat (20) is closely integrated into one. The insulating layer (12) is for preventing a current flowing from the circuit board (13) from flowing to the conductive layer ▲ u (11) to form a short circuit (the heat conductive layer (11) may be a conductive material such as metal or graphite). β, wherein the heat-dissipating film holder (20) and the heat-conducting layer (丄丄) are formed by mixing 86-94% graphite powder, 3_7% resin latex and (4) micro-nano metal powder. It can reduce the cost and reduce the weight and the proper heat dissipation effect. This replaces the traditional metal and heat dissipation materials such as copper and Ming. Wherein the above resin latex is a polyvinyl acetate latex or a propylene resin. The above-mentioned micro-nano metal powder is aluminum oxide. Among them, Yanhai's micro-nano metal and graphite LED lamp radiator structure can be combined with a lampshade (3 〇) and is beautiful. The present invention is described in detail with reference to the preferred embodiments of the present invention. However, those skilled in the art can change and modify the present invention without departing from the spirit and scope of the invention. These changes and modifications shall be covered by the scope of the patent as defined in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the steps of the molding method of the present invention. Second Figure: Schematic diagram of step c of the molding method of the present invention. Third figure: Schematic diagram of the structure of the present invention. Fourth Figure: A cross-sectional view of a led light panel of the present invention. Fig. 5 is a sectional view showing the combination of the LED lamp panel and the heat dissipating fin holder of the present invention. Figure 6: Schematic diagram of the decomposition of the LED cooling module. [Main component symbol description] • Conventional part: (5 0 ) LED lamp (51) Circuit board (5 2 ) Heat sink fin holder * This creation part: (1) LED light board (1 0 ) LED light board (11) Thermal Conductive Layer 201204991 (12) Insulation Layer (13) Circuit Board (1 3 1 ) LED Light (2) LED Light (2 0 ) Heat Sink Seat (2 1 ) Heat Sink (2 2 ) Joint Surface
(2 2 1 )凹槽 (3 )凸柱 (3 0 )燈罩 (4 )模具 (5 )散熱鰭片座 (6 )接合面(2 2 1) groove (3) stud (3 0) lamp cover (4) mold (5) heat sink fin seat (6) joint surface