M357566 五、新型說明： 【新型所屬之技術領域】 本創作係有關-種LED照·具及其散熱結構，_是指—種高功率 LED照明燈具及其散熱結構。 【先前技術】 : 隨著經濟驗速發展，能源_耗急速增加，不少地㈣現電力供應 -吃緊賴題，導致限賴電的措施產生，因此低功率消耗之商品成為」個 全人類極微迫切的重點需求。 在照明燈具商品上，LED因為自身的光學特性而具備很多優點，舉例來 說超長的使用壽命、極低的功率消耗，與關冷光源所具有的安全防火、 無鮮與餅絲料伽，佩，個LED照·具取代财的照明燈 具’將是-個不可逆轉的趨勢。而LED照明裝置輸出光通量的影響因素除 LED晶片的量子效率、晶片尺寸(發光面積）、輸入功率等外，另一個重要因 素就是散熱能力，若LED封裝結構的熱量無法消散(DissipatiQn)，_封 裝結構内各種域材料會目為彼關膨祕數的不同而有金線斷裂或樹脂 膠材黃化等可靠度·慮’晶粒的發光鱗更會隨著溫度社升而有明顯 地下降’並造祕壽命明舰縮贿波長、動電壓㈤縣等現象。 • 目此’目刚解決LED封裝結構熱量消散的方式是透過散熱器搭配風扇 的方式’來形成熱通道。但是综觀目前的設計’受到則的數量越多散 熱效果相對較_構想’因此散熱H平板制狀的散熱則呈現相當密集 的排列’但卻引起了邊際效應，造成散熱器表面3公_的空氣是黏著於 散熱器表面，進而造成空氣不流通，散熱效果不好。 M357566 有鑑於此，本創作遂針對上述習知技術之缺失，提出一種不需要設置 散熱風騎可具紐良散熱效果的高功率LED照·具及魏熱結構，以 有效克服上述之該等問題。 【新型内容】 本創作之主要目的在提供一種高功率led照明燈具及其散熱結構，其 利用散熱器本體在溫度上升時所形成的溫度差與熱鰭片與空氣接觸位置的 溫度差，促使熱空氣向上流動，搭配氣流導引罩的漸縮曲線，壓縮熱空氣， 加速熱空氟向外移動，形成壓力差，迫使冷空氣自然吸入，以達無須藉由 額外裝置即可推動空氣流動，以將LED晶片因發光產生的熱量快速消散， 達成高功率的輸出光通量。 本創作之另一目的在提供一種高功率LE)D照明燈具及其散熱結構，其 利用LED晶片成疏密狀排列’來形成溫度梯度差，使溫度自動形成溫差， 以助於空氣流動。 為達上述之目的’本創作提出一種高功率LED照明燈具，其包含有： 一設置有數個LEID晶片的LED基板；一散熱器，其包含有一設置於LED基 板上方的本體，本體之頂面設置有數個由中心向外輻射放射狀排列的第一 散熱鰭片與設置於兩相鄰第一散熱鰭片間的一第二散熱鰭片；以及一罩設 、- 於散熱器上的氣流導引罩，其形狀是採底端較頂端寬，且頂端設置數個對 流氣孔。 更者，本創作尚提供另一種高功率LED照明燈具，其相較於上述之燈 具之差異在於散熱器本體頂端之散熱鰭片的排列變更為數個由平板排列狀 的散熱鰭片。 4 M357566 本創作更提出一種使用於高功率LED照明燈具的散熱結構，其包含有 -散熱器’其包含有-具有—底面與—頂面的本體，底面係與—⑽基板 、·、。5頂面a又置有數個由中心向外輻射放射狀排列的第一散熱縛片兩相 鄰之該第-散熱片間設置有_第二散熱鰭片；以及—氣流導引罩，其係 罩设於散熱器上’氣流導引罩之形狀是採底端較頂端寬，且頂端設置數個 對流氣孔。 本創作尚提供另-種高神LED照醫具的散熱結構，其她於上述 • 之散熱結構之差異在於魅H本體頂獻散舰# _列败綠個由平 板排列狀的散熱鰭片。 茲為使貴審查委員對本創作之結構特徵及所達成之功效更有進一步 之瞭解與職，謹佐雖佳之實細目及配合詳蚊綱，說明如後： 【實施方式】 本創作之高辨LED照具及其散赌構之精神所祕糊散熱結 構所建構出的溫度差’形成推動空氣流動的動力，基於此—原理的散熱結 構，整體照明燈具將不需要散熱風扇的辅助即可有效地散熱，達到高 功率的輸出光通量。 4-併參閱第1圖〜第3圖’其係各為本創作之高功率通照明燈具 -的第-種具體實施例的立體示意圖、透視圖、元件分解示意圖。如圖所示， 此高功率LED Μ燈具1G包含有—LED基板12，其設置有數個⑽晶片 ⑷-銘製散熱n 16 ’其包含有一設置於⑽基板上的本體18，本體18 之頂面設置有數個由中心向外輻射放射狀排列的第一散熱縛片2〇，兩相鄰 之第-散熱縛片20間設置有-第二散熱韓片22，第二散熱錯片22與相鄰 5 M357566 的第一散熱鰭片20間設有一散熱間隙23 ;以及一可作為LED照明燈具1〇 之燈罩外殼以集中光線的氣流導引罩24,其係罩設於散熱器16與led基板 12上，氣流導引罩24之形狀是採底端較頂端寬’且頂端設置數個對流氣孔 26，以形成推動空氣流動的動力。 如同所示’本創作之尚功率LED照明燈具更包含有—穿設過散熱器μ 中心與氣流導引罩24的定位軸28，其底端連接至LED基板12，以供將燈 .* 具裝設於牆面（圖中未示）上並使供應LE1D晶片電力來源的相關線路設置 % 於内。此外，第一散熱鰭片20之一端面可如圖所示緊鄰於定位軸28周圍 設置。 本創作之散熱器16之輻射狀第一散熱鰭片20與第二散熱鰭片22的設 計主要目的為在驅散LH)晶片14所產生之熱能並同時加熱空氣，形成溫度 差，成為推動空氣流動的動力。 請一併參閱第4圖，隨著LED晶片14發光後產生熱傳遞至散熱器16， 散熱器16之本體18在溫度上升時會形成溫度差，第一散熱鑛片2〇與第二 散熱鰭片22與空氣接觸的位置同時也會產生溫度差，因此熱空氣開始向上 流動，搭配氟流導引罩24的漸縮曲線，熱空氣將被逐漸壓縮，因此移動的 速度逐漸增加’熱空氣透過氣孔26向外急速移動，形成壓力差，冷空氣由 氣流導引罩24與LED基板12、散熱器16間的細縫27(或者稱之為進氣孔) 自然被強迫吸入，以達到推動空氣流動。 更者，請參閱第5圖’為使溫度差更細著，⑽於推動空氣流動， 可將LED晶片14形成以疏密方式排列，例如圖中所示之採中心較密集而外 部較疏鬆的方式排列，來形成溫度梯度差，使溫度自動形成溫差，來自動 6 M357566 形成空氣流動。 請參閱第6圖，其係本創作之高功率LED照明燈具的第二種具體實施 例的元件分解示意圖。如圖所示，此實施例相較於上述之第—句體實施例 之差異在於改變散熱器30之散熱鰭片32結構為平板排列狀。 综上所述，本創作係揭示一種高功率LK)照明燈具及其散熱結構，其 ' 利用散熱器本體在溫度上升時所形成的溫度差，熱鰭片與空氣接觸位置的 :溫度差，促使熱空氣向上流動’搭配氣流導引罩的漸縮曲線，壓縮熱空氣， 、加速熱空氣向外移動，形成壓力差，迫使冷空氣自然吸入，以達無須藉由 額外裝置，如風扇，即可推動空氣流動，以將LED晶片因發光產生的熱量 快速消散’達成高功率的輸出光通量。 唯以上所述者’僅為本創作之較佳實施例配，並非用來蚊本創作 實施之範圍。故即凡依本創作申請範圍所述之特徵及精神所為之均等變化 或修飾，均應包括於本創作之申請專利範圍内。 【圖式簡單說明】 第1圖係本創作之❸轉LED照明燈具的第-種具體實施例的立體圖。 第2圖係本創作之尚功率LED照明燈具的第一種具體實施例的透視圖。 第3圖係本_之高辨LED照餐具㈣—種具體實酬的元件分解示 意圖。 第4圖係本創作之尚功率LED照明燈具的第一種具體實施例的實施示意圖。 第5圖係LED晶以疏密方式湖的示意圖。 第6圖係本創作之局功率LED照明燈具的第二種具體實施例的元件分解示 意圖。 7 M357566 【主要元件符號說明】 10 LED照明燈具 12 LE：D基板 14 LED晶片 16散熱器 18本體M357566 V. New Description: [New Technology Field] This creation is related to a kind of LED photo/heating structure, _ refers to a kind of high-power LED lighting and its heat dissipation structure. [Prior Art]: With the development of economic speed, the energy consumption has increased rapidly, and many places (4) are now in a tight supply of electricity, which leads to the restriction of electricity. Therefore, the products with low power consumption become extremely small. Urgent focus needs. In lighting products, LEDs have many advantages due to their optical characteristics, such as long service life, extremely low power consumption, and the safety of fire protection, fresh and non-fresh yarns. Pei, an LED photo lamp with a replacement for the financial lighting 'will be an irreversible trend. In addition to the LED light source's quantum efficiency, wafer size (light-emitting area), input power, etc., another important factor is the heat dissipation capability. If the heat of the LED package structure cannot be dissipated (DissipatiQn), _ package The various domain materials in the structure will have the reliability of the gold wire breakage or the yellowing of the resin glue, and the luminescent scale of the grain will decrease significantly with the temperature rise. And to create a secret life, the ship shrinks bribe wavelength, dynamic voltage (five) county and other phenomena. • The way to solve the heat dissipation of the LED package structure is to form a hot aisle by means of a heat sink with a fan. However, looking at the current design, the more the number of heat dissipation, the more the heat dissipation effect is relatively _ conceived. Therefore, the heat dissipation of the H-plate shape is quite densely arranged, but it causes a marginal effect, causing the surface of the heat sink to be 3 _ The air adheres to the surface of the radiator, which causes the air to not circulate, and the heat dissipation effect is not good. M357566 In view of this, the author proposes a high-power LED photo-device and Wei-heat structure that does not need to be equipped with a heat-dissipating wind-riding effect to meet the above-mentioned problems. . [New content] The main purpose of this creation is to provide a high-power LED lighting fixture and its heat dissipation structure, which utilizes the temperature difference formed by the heat sink body when the temperature rises and the temperature difference between the hot fin and the air contact position, which promotes heat. The air flows upwards, with the tapered curve of the airflow guide cover, compresses the hot air, accelerates the outward movement of the hot air fluorine, creates a pressure difference, and forces the cold air to naturally inhale, so as to push the air flow without additional means, The heat generated by the LED chip is quickly dissipated to achieve high power output luminous flux. Another object of the present invention is to provide a high power LE) D luminaire and its heat dissipating structure which utilizes LED wafers in a dense arrangement to form a temperature gradient difference, which automatically forms a temperature difference to assist in air flow. In order to achieve the above purpose, a high-power LED lighting fixture is proposed, which comprises: an LED substrate provided with a plurality of LEID wafers; and a heat sink comprising a body disposed above the LED substrate, the top surface of the body is disposed a plurality of first heat dissipation fins radially radiated from the center and a second heat dissipation fin disposed between the two adjacent first heat dissipation fins; and a cover, a gas flow guide on the heat sink The cover is shaped such that the bottom end is wider than the top end and the apex is provided with a plurality of convection holes. Moreover, the present invention provides another high-power LED lighting fixture, which differs from the above-mentioned lamp in that the arrangement of the fins at the top end of the heat sink body is changed into a plurality of fins arranged in a flat plate shape. 4 M357566 The present invention further proposes a heat dissipation structure for a high-power LED lighting fixture, which comprises a heat sink, which comprises a body having a bottom surface and a top surface, and a bottom surface and a substrate (10). 5 top surface a is further provided with a plurality of first heat dissipating fins radially radiated from the center, and two adjacent fins are disposed between the first fins; and a gas guiding cover is provided The cover is disposed on the heat sink. The shape of the airflow guide cover is that the bottom end is wider than the top end, and the top end is provided with a plurality of convection air holes. This creation still provides a heat dissipation structure for another kind of high-definition LED phototherapy equipment. The difference in the heat dissipation structure of the above is that the charm H body top distribution ship # _ column is green and the heat dissipation fins arranged by the flat plate. In order to enable your review board to have a better understanding of the structural characteristics and the functions achieved by this reviewer, I would like to read the details of the work and the detailed mosquitoes, as explained below: [Embodiment] The high-definition LED of this creation The temperature difference constructed by the secret heat dissipation structure of the illuminating and gambling structure forms the driving force for propelling the air flow. Based on the heat dissipation structure of the principle, the overall lighting fixture will not need the assistance of the cooling fan to effectively Heat dissipation to achieve high power output luminous flux. 4- and FIG. 1 to FIG. 3 are schematic perspective views, perspective views, and component exploded views of the first embodiment of the high-power lighting fixture of the present invention. As shown, the high power LED lamp 1G includes an LED substrate 12 provided with a plurality of (10) wafers (4) - a heat sink n 16 ' comprising a body 18 disposed on the substrate (10), a top surface of the body 18 A plurality of first heat dissipating tabs 2 are arranged radially outwardly from the center, and two adjacent heat dissipating fins 20 are disposed between the second heat dissipating fins 22, and the second heat dissipating strips 22 are adjacent to each other. 5 M357566 is provided with a heat dissipation gap 23 between the first heat dissipation fins 20; and an air flow guiding cover 24 which can be used as a light shielding cover of the LED lighting device to concentrate light, which is disposed on the heat sink 16 and the LED substrate 12 Above, the airflow guiding cover 24 is shaped such that the bottom end is wider than the top end and the top end is provided with a plurality of convection holes 26 to form a power for pushing the air flow. As shown, the power LED lighting fixture of the present invention further includes a positioning shaft 28 that passes through the heat sink μ center and the airflow guiding cover 24, and the bottom end thereof is connected to the LED substrate 12 for the lamp. Installed on the wall (not shown) and the relevant line setting for supplying power to the LE1D chip is %. Further, one end face of the first heat radiation fin 20 may be disposed adjacent to the positioning shaft 28 as shown. The radiation-shaped first heat-dissipating fins 20 and the second heat-dissipating fins 22 of the heat sink 16 of the present invention are mainly designed to dissipate the heat energy generated by the LH wafer 14 and simultaneously heat the air to form a temperature difference, thereby promoting the air flow. Power. Referring to FIG. 4 together, as the LED chip 14 emits heat and generates heat transfer to the heat sink 16, the body 18 of the heat sink 16 forms a temperature difference when the temperature rises, and the first heat sink 2 〇 and the second heat sink fin The position where the sheet 22 is in contact with the air also causes a temperature difference, so that the hot air starts to flow upward, and with the tapered curve of the fluorine flow guide cover 24, the hot air is gradually compressed, so the moving speed is gradually increased. The air hole 26 is rapidly moved outward to form a pressure difference, and the cold air is naturally forced to be sucked by the slit 27 (or the air inlet hole) between the air flow guiding cover 24 and the LED substrate 12 and the radiator 16 to push the air. flow. Furthermore, please refer to Fig. 5 'In order to make the temperature difference finer, (10) to push the air flow, the LED chips 14 can be arranged in a dense manner, for example, the mining center is dense and the outside is loose. The way to form a temperature gradient difference, so that the temperature automatically forms a temperature difference, automatically 6 M357566 to form air flow. Please refer to Fig. 6, which is an exploded view of the second embodiment of the high power LED lighting fixture of the present invention. As shown in the figure, this embodiment differs from the above-described first sentence embodiment in that the heat dissipation fins 32 of the heat sink 30 are changed in a flat plate arrangement. In summary, this creation reveals a high-power LK) lighting fixture and its heat dissipation structure, which utilizes the temperature difference formed by the heat sink body when the temperature rises, and the temperature difference between the hot fin and the air: The hot air flows upwards' with the tapered curve of the airflow guide cover, compresses the hot air, accelerates the hot air to move outward, and creates a pressure difference, forcing the cold air to naturally inhale, so that no additional device, such as a fan, can be used. The air flow is pushed to quickly dissipate the heat generated by the LED chip due to illuminance to achieve a high power output luminous flux. The above descriptions are only for the preferred embodiment of the present invention and are not intended to be used in the practice of mosquito creation. Therefore, any changes or modifications to the characteristics and spirits described in the scope of this application shall be included in the scope of the patent application for this creation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a first embodiment of the LED lighting fixture of the present invention. Figure 2 is a perspective view of a first embodiment of a power LED lighting fixture of the present invention. Figure 3 is a high-resolution LED photo tableware (4) - a specific decommissioning component. Fig. 4 is a schematic view showing the implementation of the first embodiment of the power LED lighting fixture of the present invention. Figure 5 is a schematic diagram of a lake crystal in a densely packed manner. Figure 6 is an exploded view of the second embodiment of the power LED lighting fixture of the present invention. 7 M357566 [Key component symbol description] 10 LED lighting fixtures 12 LE: D base plate 14 LED chip 16 heat sink 18 body
20第一散熱鰭片 22第二散熱鰭片 23散熱間隙 24氣流導引罩 26氣孔 27細缝 28定位軸 30散熱器 φφ 32散熱鰭片 820 first heat sink fin 22 second heat sink fin 23 heat dissipation gap 24 air flow guide cover 26 air hole 27 slit 28 positioning shaft 30 heat sink φφ 32 heat sink fin 8