200809130 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種LED燈具與散熱器之結合方法及 其結構，尤指一種以可拆卸方式將散熱器組裝於LED燈具 上，以便於零組件的替換。 【先前技術】 按，由於發光二極體（LED)具有亮度高、省電、壽 命長等諸多優點，而被廣泛地應用在電子裝置或燈具的照 明上，且為增加其照射範圍與亮度，通常是由複數發光二 極體來組合成一 LED燈組。然而，隨著發光二極體數量的 增加及高功率發光二極體等陸續被開發出來，其運作所產 生的熱量正逐步向上攀升。因此，具有提供LED燈具用之 散熱結構，已成為現今從事該項行業之相關人士所研究的 重要課題之一。 而目前應用於LED燈具之散熱器，主要仍引用於電腦 之中央處理器（CPU)上的散熱裝置。惟，在傳統所運用 的製程上，係於設有複數發光二極體之LED燈具基板背面 貼附一散熱器，並直接以過錫爐的方式使該散熱器結合於 LED燈具基板背面，如此，LED燈具即無法再與該散熱器 分離，僅可以破壞性的手段進行拆解，故當LED燈具上的 發光二極體無法正常發亮、或其無法發亮之發光二極體的 數量達到不符規定之標準時，只能將整組LED燈具包含該 散熱器予以捨棄，無法藉由零組件替換之方式來節省成本 5 200809130 有鑑於此，本發明人係為改善並解決上述之缺失，乃 特潛心研究並配合學理之運用，終於提出一種設計合理且 有效改善上述缺失之本發明。 【發明内容】 本發明之主要目的，在於可提供一種LED燈具與散熱 器之結合方法及其結構，其係為解決上述之問題與缺失， 俾於LED燈具上裝設一導熱板，該導熱板乃用以供一散熱 器與之以可拆卸方式進行組裝，如此，當有拆卸之必要時 ，即可將該LED燈具與散熱器分離，且不會造成二者因拆 解而被破壞。 為了達成上述之目的，本發明係提供一種LED燈具與 散熱器之結合方法，其步驟包括： a) 準備一 LED燈具及一散熱器，該LED燈具包括複數 發光二極體、——供該等發光二極體設置於其上的基板、以 及一罩設於該基板外之燈罩； b) 於該LED燈具之基板背面貼附一導熱板，並令該導 熱板與基板作熱傳連結； c) 將該散熱器以可拆卸之方式組裝於該LED燈具之導 熱板上。 為了達成上述之目的，本發明係提供一種LED燈具與 散熱器之結合結構，用以與一散熱器以可拆卸方式進行組 裝；包括複數發光二極體、——供該等發光二極體設置於其 上之基板、以及一罩設於該基板外之燈罩；其中，於該基 板背面設有一位於燈罩頂部處之導熱板’該導熱板係與該 6 200809130 基板相貼附而作熱傳連結，以供所述散熱器由該燈罩頂部 安裝而與該導熱板相貼附。 【實施方式】 為了使貴審查委員能更進一步暸解本發明之特徵及 技術内容，請參閱以下有關本發明之詳細說明與附圖，然 而所附圖式僅提供參考與說明用，並非用來對本發明加以 限制者。 請參閱第一圖至第三圖，係分別為本發明LED燈具之 立體分解圖、剖面示意圖及本發明第一實施例LED燈具與 散熱器之立體分解圖。本發明係提供一種LED燈具與散熱 器之結合方法及其結構，該LED燈具1包括複數發光二極 體（LED ) 10、一供該等發光二極體10設置於其上的基板 11、以及一罩設於該基板11外之燈覃12，而該散熱器2則 設置於燈罩12頂部處，用以針對LED燈具1上之各發光二 極體10所產生的熱量進行散熱。 如第一圖及第二圖所示，該LED燈具1主要係於其基 板11背面設有一位於燈罩12頂部處之導熱板13，該導熱板 13與基板11相貼附而作熱傳連結，用以供上述散熱器2由 燈罩12頂部安裝而與該導熱板13相貼附。請一併參閱第三 圖所示，該散熱器2包括一熱傳導基座20、一豎立設置於 該熱傳導基座20上之熱管21、以及一套置於該熱管21外圍 之鰭片組22，其中之鰭片組22係可由擠製成型，如鋁擠者 ，並具有一中空柱220與環設於該中空柱220周圍且呈輻 射狀排列之散熱鰭片221 ，該中空柱220可供上述熱管21 7 200809130 套入，以使該熱管21管壁與該中空柱220内壁相貼而接觸 ，進而組成一所述之散熱器2者。此外，亦可於該散熱器 2上方設有一朝向各散熱鰭片221進行吹入或吸出氣流之 風扇23 〇 請一併參閱第三圖及第四圖所示，在本發明第一實施 例中，係以複數螺設元件24穿設於散熱器2之熱傳導基座 20近周緣處，並螺入LED燈具1頂部處之導熱板13上，以 令導熱板13與熱傳導基座20上、下相疊置而彼此呈面與面 之熱傳接觸，同時，該散熱器2與LED燈具1也可藉由該 等螺設元件24而作可拆卸方式進行組裝。該螺設元件24可 為螺絲或螺栓，可利用螺入或螺出來達到組裝或拆卸的目 的，如此即可便於更換該LED燈具1之基板11，而不需連 同散熱器2 —併丟棄。 另，請參閱第五圖所示，在本發明第二實施例中，係 以扣具25抵持於熱傳導基座20近周緣處上，而扣具25再進 一步扣合於燈罩12頂部外圍處，並於該燈罩12頂部外圍設 有可供扣具25扣入之扣合凸塊120，藉以將導熱板13與熱 傳導基座20疊置後扣合固定，且透過拆解扣具25即可令導 熱板13與熱傳導基座20分離，如此亦可達到散熱器與LED 燈具1以可拆卸方式進行組裝之目的。 再者，請參閱第六圖所示，在本發明第三實施例中， 主要係將上述第一實施例之螺設元件24替換為鉚接元件26 ，雖利用鉚接並非為一種完全可拆卸之連接手段，但由於 拆解後，被破壞者僅為鉚釘等鉚接元件26，且仍能保持導 8 200809130 熱板13與熱傳導基座20原有的型態而不受影響，故本發明 所謂之可拆卸方式亦可將鉚接包括在内。 是以，藉由上述之構造組成，即可得到本發明LED燈 具與散熱器之結合方法及其結構。 綜上所述，本發明確可達到預期之使用目的，而解決 習知之缺失，又因極具新穎性及進步性，完全符合發明專 利申請要件’爰依專利法提出申請’敬請詳查並賜准本案 專利，以保障發明人之權利。 惟以上所述僅為本發明之較佳可行實施例，非因此即 拘限本發明之專利範圍，故舉凡運用本發明說明書及圖式 内容所為之等效技術、手段等變化，均同理皆包含於本發 明之範圍内，合予陳明。200809130 IX. Description of the Invention: [Technical Field] The present invention relates to a method for combining an LED lamp and a heat sink and a structure thereof, and more particularly to a detachable assembly of a heat sink on an LED lamp to facilitate zero Replacement of components. [Prior Art] According to the high brightness, power saving, long life and the like, the light-emitting diode (LED) is widely used in the illumination of electronic devices or lamps, and in order to increase the illumination range and brightness thereof, Usually, a plurality of LEDs are combined to form an LED lamp group. However, with the increase in the number of light-emitting diodes and the development of high-power light-emitting diodes, the heat generated by their operation is gradually rising. Therefore, having a heat dissipation structure for providing LED lamps has become one of the important topics studied by people involved in the industry today. The heat sinks currently used in LED lamps are still mainly referred to as heat sinks on the central processing unit (CPU) of the computer. However, in the conventionally used process, a heat sink is attached to the back surface of the LED lamp substrate with a plurality of light-emitting diodes, and the heat sink is directly bonded to the back surface of the LED lamp substrate by means of a tin furnace. The LED lamp can no longer be separated from the heat sink, and can only be dismantled by destructive means, so the number of the light-emitting diodes on the LED lamp can not be normally brightened, or the number of the light-emitting diodes that cannot be illuminated can be reached. When the standard is not met, only the entire set of LED lamps can be discarded, and the cost can be saved by replacing the components. 5 200809130 In view of this, the inventors have improved and solved the above-mentioned defects. With painstaking research and the use of academics, the present invention has finally been proposed to rationally and effectively improve the above-mentioned defects. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for combining an LED lamp and a heat sink and a structure thereof, which are to solve the above problems and defects, and to install a heat conducting plate on the LED lamp, the heat conducting plate It is used for a heat sink to be assembled in a detachable manner, so that when necessary, the LED lamp can be separated from the heat sink without causing damage to the two due to disassembly. In order to achieve the above object, the present invention provides a method for combining an LED lamp and a heat sink, the steps of which include: a) preparing an LED lamp and a heat sink, the LED lamp comprising a plurality of light emitting diodes, for providing a substrate on which the light emitting diode is disposed, and a lamp cover disposed outside the substrate; b) attaching a heat conducting plate to the back surface of the substrate of the LED lamp, and thermally connecting the heat conducting plate to the substrate; The heat sink is detachably assembled to the heat conducting plate of the LED lamp. In order to achieve the above object, the present invention provides a combination structure of an LED lamp and a heat sink for detachably assembling with a heat sink, and includes a plurality of light emitting diodes for providing the light emitting diodes. a substrate on the substrate and a lamp cover disposed outside the substrate; wherein a heat conducting plate at the top of the lamp cover is disposed on the back surface of the substrate, and the heat conducting plate is attached to the substrate of the 20080909130 for heat transfer connection The heat sink is attached to the heat shield by the top of the lamp cover. [Embodiment] In order to make the present invention more fully understand the features and technical contents of the present invention, the following detailed description of the present invention and the accompanying drawings are provided. The invention is limited. Please refer to the first to third figures, which are respectively an exploded perspective view, a cross-sectional view of the LED lamp of the present invention, and an exploded perspective view of the LED lamp and the heat sink according to the first embodiment of the present invention. The present invention provides a method for combining an LED lamp and a heat sink, and a structure thereof, the LED lamp 1 includes a plurality of light emitting diodes (LEDs) 10, a substrate 11 on which the light emitting diodes 10 are disposed, and The lamp holder 12 is disposed outside the substrate 11 , and the heat sink 2 is disposed at the top of the lamp cover 12 for dissipating heat generated by the LEDs 10 on the LED lamp 1 . As shown in the first and second figures, the LED lamp 1 is mainly provided on the back surface of the substrate 11 with a heat conducting plate 13 at the top of the lamp cover 12, and the heat conducting plate 13 is attached to the substrate 11 for heat transfer connection. The heat sink 2 is attached to the top of the lamp cover 12 and attached to the heat conducting plate 13. As shown in the third figure, the heat sink 2 includes a heat conducting base 20, a heat pipe 21 erected on the heat conducting base 20, and a set of fins 22 disposed on the periphery of the heat pipe 21. The fin group 22 can be extruded, such as aluminum, and has a hollow column 220 and a heat radiating fin 221 disposed around the hollow column 220 and arranged in a radial shape. The hollow column 220 is available. The heat pipe 21 7 200809130 is nested so that the wall of the heat pipe 21 is in contact with the inner wall of the hollow column 220 to form a heat sink 2 . In addition, a fan 23 for blowing or sucking airflow toward each of the heat dissipating fins 221 may be disposed above the heat sink 2. Referring to the third and fourth figures, in the first embodiment of the present invention, The plurality of screwing elements 24 are disposed at the periphery of the heat conducting base 20 of the heat sink 2 and screwed into the heat conducting plate 13 at the top of the LED lamp 1 to make the heat conducting plate 13 and the heat conducting base 20 up and down. The heat sink 2 and the LED lamp 1 can also be assembled in a detachable manner by the screw elements 24 while being stacked. The screwing member 24 can be a screw or a bolt, and can be screwed or screwed out for assembly or disassembly purposes, so that the substrate 11 of the LED lamp 1 can be easily replaced without being attached to the heat sink 2 and discarded. In addition, referring to the fifth embodiment, in the second embodiment of the present invention, the buckle 25 is pressed against the near periphery of the heat conduction base 20, and the buckle 25 is further fastened to the top periphery of the lamp cover 12. And a fastening protrusion 120 for fastening the buckle 25 is disposed on the outer periphery of the top of the lamp cover 12, so as to overlap the heat conduction plate 13 and the heat conduction base 20, and then fasten and fix the buckle 25 The heat conducting plate 13 is separated from the heat conducting base 20, so that the heat sink and the LED lamp 1 can be assembled in a detachable manner. Furthermore, referring to the sixth embodiment, in the third embodiment of the present invention, the screwing member 24 of the first embodiment is mainly replaced with the riveting member 26, although the riveting is not a completely detachable connection. Means, but since the dismantled, only the riveting element 26 such as a rivet, and the original type of the heat-conducting plate 13 and the heat-conducting base 20 are not affected, the so-called The riveting can also be included in the disassembly method. Therefore, the combination of the LED lamp and the heat sink of the present invention and the structure thereof can be obtained by the above-described structural composition. In summary, the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and progress, fully meet the requirements of the invention patent application 'application according to the patent law', please check and The patent in this case is granted to protect the rights of the inventor. However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent techniques and means, etc., which are used in the description of the present invention and the contents of the drawings, are the same. It is included in the scope of the present invention and is combined with Chen Ming.
9 200809130 【圖式簡單說明】 第一圖係本發明LED燈具之立體分解圖。 第二圖係本發明LED燈具之剖面示意圖。 第三圖係本發明第一實施例LED燈具與散熱器之立 體分解圖。 第四圖係本發明第一實施例LED燈具與散熱器之局 部剖視圖。 第五圖係本發明第二實施例LED燈具與散熱器之局 部剖視圖。 第六圖係本發明第三實施例LED燈具與散熱器之局 部剖視圖。 【主要元件符號說明】 <本發明> LED燈具 1 發光二極體 10 基板 11 燈罩 12 凸塊 120 導熱板 13 散熱器 2 熱傳導基座 20 熱管 21 鰭片組 22 中空柱 220 散熱鰭片 221 風扇 23 螺設元件 24 200809130 扣具 25 鉚接元件 269 200809130 [Simple description of the drawings] The first figure is an exploded perspective view of the LED lamp of the present invention. The second figure is a schematic cross-sectional view of the LED lamp of the present invention. The third figure is a perspective view of the LED lamp and the heat sink of the first embodiment of the present invention. Figure 4 is a cross-sectional view showing a portion of an LED lamp and a heat sink according to a first embodiment of the present invention. Figure 5 is a cross-sectional view showing a portion of an LED lamp and a heat sink according to a second embodiment of the present invention. Figure 6 is a cross-sectional view showing a portion of an LED lamp and a heat sink according to a third embodiment of the present invention. [Main component symbol description] <Invention> LED lamp 1 Light-emitting diode 10 Substrate 11 Lampshade 12 Bump 120 Heat-conducting plate 13 Heat sink 2 Heat-conducting base 20 Heat pipe 21 Fin group 22 Hollow column 220 Heat-dissipating fin 221 Fan 23 screwing element 24 200809130 buckle 25 riveting element 26
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