TWM510421U - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
TWM510421U
TWM510421U TW104207123U TW104207123U TWM510421U TW M510421 U TWM510421 U TW M510421U TW 104207123 U TW104207123 U TW 104207123U TW 104207123 U TW104207123 U TW 104207123U TW M510421 U TWM510421 U TW M510421U
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Taiwan
Prior art keywords
heat
disposed
light source
source module
circuit board
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TW104207123U
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Chinese (zh)
Inventor
Chao-He Lin
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A Sun Photoelectric Inc
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Priority to TW104207123U priority Critical patent/TWM510421U/en
Publication of TWM510421U publication Critical patent/TWM510421U/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

照明裝置Lighting device

本創作尤指其提供一種於光源模組之LED元件發出光線照明時,即利用各散熱片以分流的方式將光源模組之LED元件所產生的熱量分散傳導至本體外部,以有效的進行散熱,並大幅提昇散熱效果及使用壽命之照明裝置。In particular, the present invention provides a method for dissipating the heat generated by the LED elements of the light source module to the outside of the body by means of the heat sinks when the LED elements of the light source module emit light, so as to effectively dissipate heat. And lighting devices that greatly improve the heat dissipation effect and service life.

按,對於戶外的廣告看板或場館、賣場、工廠等場所的照明,一般係會安裝投射燈或天井燈等具有較大瓦數之照明裝置,以提供足夠亮度的照明。According to the lighting of outdoor advertising billboards or venues, stores, factories, etc., lighting devices with a large wattage such as projection lamps or patio lights are generally installed to provide illumination with sufficient brightness.

請參閱第1圖所示,係為台灣公告第M487992號「天井燈結構」新型專利案,其主要包含有殼體10、金屬基座11、發光二極體單元12及散熱單元13;該殼體10內係設有一框架101,該框架101之一端連接固定於該殼體10,另端則連接設有該金屬基座11,該金屬基座11之側邊係環設有燈罩111,並於該金屬基座11之底面設有發光二極體單元12,以供發出光線,另於該金屬基座11之頂面設有可為散熱鰭片之散熱單元13,並使該散熱單元13之底面緊貼金屬基座11之頂面,而於該發光二極體單元12發出光線照明而產生高熱時,該發光二極體單元12所產生之熱量係傳導至該金屬基座11,再經由該金屬基座11傳導至散熱單元13,而由該散熱單元13進行散熱;惟,該天井燈於使用上仍有如下之缺弊:Please refer to FIG. 1 , which is a new patent case of "Patio Light Structure" of Taiwan Announcement No. M487992, which mainly comprises a casing 10, a metal base 11, a light emitting diode unit 12 and a heat dissipating unit 13; The frame 10 is provided with a frame 101, one end of the frame 101 is connected and fixed to the casing 10, and the metal base 11 is connected to the other end. The side ring of the metal base 11 is provided with a lamp cover 111, and A light emitting diode unit 12 is disposed on a bottom surface of the metal base 11 for emitting light, and a heat dissipating unit 13 that can be a heat dissipating fin is disposed on a top surface of the metal base 11 and the heat dissipating unit 13 is disposed. The bottom surface of the metal base 11 is closely attached to the top surface of the metal base 11 , and when the light emitting diode unit 12 emits light to generate high heat, the heat generated by the light emitting diode unit 12 is transmitted to the metal base 11 , and then It is conducted to the heat dissipating unit 13 via the metal base 11 to be dissipated by the heat dissipating unit 13; however, the patio lamp still has the following disadvantages in use:

1.該發光二極體單元12所產生之高熱係僅利用該金屬基座11傳導至單一散熱單元13進行散熱,然而,該散熱單元13係裝設於殼體10內部,該散熱單元13之體積及散熱面積將 受限於該殼體10內部空間,相對的影響該散熱單元13的散熱效率,而難以負荷散發該發光二極體單元12所產生之高熱量,進而於散熱效果上明顯不足。1. The high heat generated by the LED unit 12 is only conducted to the single heat dissipation unit 13 by the metal base 11 for heat dissipation. However, the heat dissipation unit 13 is installed inside the casing 10, and the volume of the heat dissipation unit 13 is Heat dissipation area will Restricted by the internal space of the casing 10, the heat dissipation efficiency of the heat dissipation unit 13 is relatively affected, and it is difficult to load and dissipate the high heat generated by the LED unit 12, and the heat dissipation effect is obviously insufficient.

2.該發光二極體單元12所產生之熱量雖可利用散熱單元13進行散熱,然而,該散熱單元13係裝設於殼體10內部,將使得由該散熱單元13散發的熱量仍堆積於殼體10內,並無法將熱量有效的傳導至殼體10外部進行散熱,而使得散熱效果不佳,其不僅影響發光二極體單元12的發光效率,更大幅降低發光二極體單元12的使用壽命。2. The heat generated by the LED unit 12 can be dissipated by the heat dissipating unit 13. However, the heat dissipating unit 13 is disposed inside the casing 10, so that the heat dissipated by the heat dissipating unit 13 is still accumulated in the casing. In the case of 10, heat cannot be effectively conducted to the outside of the casing 10 for heat dissipation, so that the heat dissipation effect is not good, which not only affects the luminous efficiency of the LED unit 12, but also greatly reduces the service life of the LED unit 12. .

有鑑於此,本創作人遂以其多年從事相關行業的研發與製作經驗,針對目前所面臨之問題深入研究,經過長期努力之研究與試作,終究研創出一種照明裝置,並藉以改善習知之缺弊,此即為本創作之設計宗旨。In view of this, the creator has been engaged in research and development and production experience in related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and research, he has finally developed a lighting device to improve the lack of knowledge. Disadvantages, this is the design tenet of this creation.

本創作之目的一,係提供一種照明裝置,其包含有本體、複數個散熱片及光源模組;該本體之一端係設有承置部,並於外部設有複數個散熱片,該各相鄰之散熱片間具有間隔距離,並於該各散熱片之一端分別設有延伸至該本體之承置部的導熱部,另於本體之承置部裝設光源模組,該光源模組係設有一電路基板,該電路基板上設有至少一LED元件,並使該電路基板位於該各散熱片之導熱部上;藉此,於光源模組之LED元件發出光線照明時,即利用各散熱片以分流的方式將光源模組之LED元件所產生的熱量分散傳導至本體外部,以有效的進行散熱,進而達到大幅提昇散熱效果之實用目的。The purpose of the present invention is to provide a lighting device comprising a body, a plurality of heat sinks and a light source module; one end of the body is provided with a receiving portion, and a plurality of heat sinks are disposed outside, the phases are The adjacent heat sinks are spaced apart from each other, and a heat conducting portion extending to the receiving portion of the main body is respectively disposed at one end of each of the heat dissipating fins, and a light source module is disposed on the receiving portion of the main body. The circuit board is provided with at least one LED component, and the circuit board is located on the heat conducting portion of the heat sink; thereby, when the LED component of the light source module emits light, the heat dissipation is utilized. The film distributes the heat generated by the LED elements of the light source module to the outside of the body in a shunt manner, so as to effectively dissipate heat, thereby achieving the practical purpose of greatly improving the heat dissipation effect.

本創作之目的二,係提供一種照明裝置,其係於該本體之外部設複數個散熱片,該各相鄰之散熱片間具有間隔距離,並 於該各散熱片之一端分別設有延伸至該光源模組之電路基板底面的導熱部,於光源模組之LED元件發出光線照明時,即利用各散熱片以分流的方式將光源模組之LED元件所產生的熱量分散傳導至本體外部,以有效的進行散熱,使光源模組保持於正常工作溫度,而達到提昇使用壽命之實用目的。The second object of the present invention is to provide a lighting device, which is provided with a plurality of heat sinks on the outside of the body, wherein the adjacent heat sinks have a separation distance, and The heat conducting portion extending to the bottom surface of the circuit substrate of the light source module is respectively disposed at one end of each of the heat dissipating fins, and the light source module is shunted by using the heat dissipating fins when the LED components of the light source module emit light. The heat generated by the LED component is dispersed and transmitted to the outside of the body to effectively dissipate heat, so that the light source module is maintained at a normal working temperature, thereby achieving the practical purpose of improving the service life.

習知部份:Conventional part:

10‧‧‧殼體10‧‧‧shell

101‧‧‧框架101‧‧‧Frame

11‧‧‧金屬基座11‧‧‧Metal base

111‧‧‧燈罩111‧‧‧shade

12‧‧‧發光二極體單元12‧‧‧Lighting diode unit

13‧‧‧散熱單元13‧‧‧Heat unit

本創作部份:This creative part:

20‧‧‧本體20‧‧‧ body

201‧‧‧鎖接部201‧‧‧Locking Department

202‧‧‧架置部202‧‧‧ Mounting Department

203‧‧‧承置部203‧‧‧Holding Department

204‧‧‧肋條204‧‧‧ Ribs

205‧‧‧凸塊205‧‧‧Bumps

206‧‧‧槽孔206‧‧‧ slots

207‧‧‧卡掣緣207‧‧‧ card edge

208‧‧‧間隔條208‧‧‧ spacer

30‧‧‧散熱片30‧‧‧ Heat sink

301‧‧‧導熱部301‧‧‧Transfer Department

3011‧‧‧凸桿3011‧‧‧Bumps

302‧‧‧穿槽302‧‧‧through slot

303‧‧‧扣合部303‧‧‧Deduction Department

40‧‧‧光源模組40‧‧‧Light source module

41‧‧‧電路基板41‧‧‧ circuit board

411‧‧‧穿孔411‧‧‧Perforation

412‧‧‧插頭412‧‧‧ plug

42‧‧‧LED元件42‧‧‧LED components

43‧‧‧螺栓43‧‧‧Bolts

44‧‧‧聚光罩44‧‧‧ concentrator

45‧‧‧燈罩45‧‧‧shade

46‧‧‧固定環46‧‧‧Fixed ring

50‧‧‧驅動模組50‧‧‧Drive Module

51‧‧‧驅動電路單元51‧‧‧Drive circuit unit

511‧‧‧導線511‧‧‧ wire

512‧‧‧導線512‧‧‧ wire

513‧‧‧插座513‧‧‧ socket

52‧‧‧電源接頭52‧‧‧Power connector

60‧‧‧導熱介質60‧‧‧ Thermal medium

第1圖:係台灣公告第M487992號新型專利案之結構示意圖。Figure 1 is a schematic diagram of the structure of the new patent case No. M487992 published by Taiwan.

第2圖:本創作之分解示意圖。Figure 2: An exploded view of the creation.

第3圖:本創作之組合外觀示意圖。Figure 3: Schematic diagram of the combination of the creation.

第4圖:本創作之組合剖面示意圖(一)。Figure 4: Schematic diagram of the combined profile of this creation (1).

第5圖:本創作之組合剖面示意圖(二)。Figure 5: Schematic diagram of the combined profile of this creation (2).

第6圖:係第5圖之部分剖面示意圖。Figure 6 is a partial cross-sectional view of Figure 5.

第7圖:本創作於使用時進行散熱之示意圖(一)。Figure 7: Schematic diagram of the heat dissipation of this creation during use (1).

第8圖:本創作於使用時進行散熱之示意圖(二)。Figure 8: Schematic diagram of the heat dissipation of this creation during use (2).

第9圖:本創作於使用時進行散熱之示意圖(三)。Figure 9: Schematic diagram of the heat dissipation of the creation during use (3).

請參閱第2~6圖所示,本創作之照明裝置係包含有本體20、複數個散熱片30、光源模組40及驅動模組50;該本體20係呈中空狀,而於該本體20內設有容置空間,於該本體20之容置空間內設有複數個鎖接部201及二相對之架置部202,並於該各鎖接部201之一端處設有承置部203;於本實施例中,該本體20係以塑膠、陶瓷等具低導熱係數之絕熱材質製作,另該本體20之外部係凸設有複數個肋條204,以增加該本體20之整體強度;另於該本體20之外部裝設複數個以鋁、銅或鋁鎂合金等具高導熱係數的導熱材料製作成型之散熱片30,該各散熱 片30之一端分別設有延伸至該本體20之承置部203內的導熱部301,並使該各相鄰之散熱片30間具有間隔距離,以避免該各散熱片30相互接觸導熱,該各散熱片30之內側面與該本體20之外環面間則具有間隔空間;於本實施例中,該各散熱片30係該各散熱片30與該本體20間係設有組裝結構,使該各散熱片30固定裝設於該本體20之外部,該組裝結構係於該各散熱片30之一端處分別設有穿槽302,該本體20之一端則設有對應該各散熱片30之穿槽302的複數個凸塊205,並使該本體20之各凸塊205分別穿置於該各散熱片30之穿槽302內,另於該各散熱片30之另端分別設有扣合部303,該本體20則設有對應該各散熱片30之扣合部303的槽孔206,並於該各槽孔206之內側分別凸設有卡掣緣207,以供卡扣固定該各散熱片30之扣合部303,而使該各散熱片30固定裝設於該本體20之外部,另為了確實阻隔該各散熱片30間的熱傳導,該本體20係於該各相鄰之散熱片30的間隔內分別凸設有間隔條208,由於該本體20係以塑膠、陶瓷等具低導熱係數之絕熱材質製作,而可以該本體20之各間隔條208阻隔該各散熱片30間的熱傳導;該光源模組40係裝設於該本體20之承置部203內,該光源模組40設有一電路基板41,並於該電路基板41上設有複數個LED元件42,以供發出光線照明;於本實施例中,該光源模組40之電路基板係以複數個螺栓43穿伸鎖固於該本體20之鎖接部201上,並使該電路基板41位於該各散熱片30之導熱部301上,該電路基板41上並分隔有複數個分別對應各散熱片30之導熱部301的區域,再分別於各區域內集中設置有複數個LED元件42,其中,該電路基板41上係開設有複數個分別對應該各LED元件42之穿孔411,該各散熱片30之導熱部301上 則凸設有複數個凸桿3011,並使該各凸桿3011分別穿伸於該電路基板41之各穿孔411內,再於該各凸桿3011之端部與該各LED元件42間塗佈可為導熱膏之導熱介質60,而使該各LED元件42之所產生的熱量經由該導熱介質60傳導至各散熱片30之導熱部301上的凸桿3011,再由各散熱片30分散傳導至本體20外部,以進行散熱;另為了使該各LED元件42所發出的光線可集中投射,於該電路基板41之周側處套設有一聚光罩44,並於該聚光罩44上設有一可為凸透鏡之燈罩45,而以該聚光罩44及該燈罩45提供聚光的效果,使該各LED元件42所發出的光線可集中投射,其中,該本體20之一端係以黏合的方式設有一固定環46,以供固定該聚光罩44及該燈罩45;該驅動模組50係設有一為電路板之驅動電路單元51,該驅動電路單元51架置於該本體20之架置部202內,並於該驅動電路單元51之輸入端電性連接一設於該本體20另端之電源接頭52,輸出端則電性連接該光源模組40之電路基板41,而可由該驅動電路單元51進行電力之變壓、穩壓及交、直流電轉換,進而驅動該光源模組40之各LED元件42發出光線,由於該驅動模組50進行電力變壓、穩壓及交、直流電轉換之方式已為業界熟悉之技術,且非本創作之設計重點,因此不於贅述;於本實施例中,該驅動模組50之驅動電路單元51之輸入端係以二導線511、512電性連接該電源接頭52,該驅動電路單元51之輸出端設有插座513,該光源模組40之電路基板41則設有一插頭412,以與該插座513相互插接,而使該光源模組40之電路基板41與該驅動模組50之驅動電路單元51電性連接。Referring to FIGS. 2-6, the lighting device of the present invention includes a body 20, a plurality of heat sinks 30, a light source module 40, and a driving module 50. The body 20 is hollow, and the body 20 is A plurality of locking portions 201 and two opposite mounting portions 202 are disposed in the receiving space of the body 20, and the receiving portion 203 is disposed at one end of each of the locking portions 201. In the embodiment, the body 20 is made of a heat insulating material having a low thermal conductivity such as plastic or ceramic, and the outer portion of the body 20 is convexly provided with a plurality of ribs 204 to increase the overall strength of the body 20; A heat sink 30 formed by forming a heat conductive material having a high thermal conductivity such as aluminum, copper or aluminum-magnesium alloy is disposed outside the body 20, and the heat dissipation is performed. One end of the sheet 30 is respectively provided with a heat conducting portion 301 extending into the receiving portion 203 of the body 20, and the adjacent fins 30 are spaced apart to prevent the heat sinks 30 from contacting each other for heat conduction. Each of the fins 30 has a space between the inner surface of each of the heat sinks 30 and the outer surface of the body 20; in the embodiment, the heat sinks 30 are provided with an assembly structure between the heat sinks 30 and the body 20, so that The heat dissipation fins 30 are fixedly disposed on the outside of the main body 20. The assembly structure is respectively provided with a through slot 302 at one end of the heat sink 30, and one end of the main body 20 is provided with a corresponding heat sink 30. The plurality of bumps 205 of the recesses 205 are inserted into the slots 302 of the heat sinks 30, and the other ends of the heat sinks 30 are respectively fastened. a portion 303, the body 20 is provided with a slot 206 corresponding to the fastening portion 303 of each of the heat sinks 30, and a snap edge 207 is respectively protruded from the inner side of each of the slots 206 for fastening the respective The fastening portion 303 of the heat sink 30 allows the heat sinks 30 to be fixedly mounted on the outside of the body 20, and in order to reliably block the heat sink 30 The heat dissipation between the heat sinks 30, the body 20 is respectively provided with a spacer strip 208 in the interval between the adjacent heat sinks 30, and the body 20 is made of a heat insulating material with a low thermal conductivity such as plastic or ceramic. The spacers 208 of the body 20 can block the heat conduction between the heat sinks 30. The light source module 40 is disposed in the receiving portion 203 of the body 20, and the light source module 40 is provided with a circuit substrate 41. The circuit board 41 is provided with a plurality of LED elements 42 for emitting light illumination. In this embodiment, the circuit board of the light source module 40 is locked to the body 20 by a plurality of bolts 43. The circuit board 41 is disposed on the heat conducting portion 301 of each of the heat sinks 30. The circuit board 41 is separated by a plurality of regions respectively corresponding to the heat conducting portions 301 of the heat sinks 30, and then respectively A plurality of LED elements 42 are disposed in each of the regions. The circuit board 41 is provided with a plurality of through holes 411 respectively corresponding to the LED elements 42. The heat conducting portions 301 of the heat sinks 30 are disposed on the circuit board 41. Then, a plurality of protruding rods 3011 are protruded, and the protruding rods 3011 are respectively protruded into the respective through holes 411 of the circuit board 41, and then coated between the end portions of the protruding rods 3011 and the LED elements 42. The heat transfer medium 60 of the thermal conductive paste may be used to conduct heat generated by the LED elements 42 to the bumps 3011 on the heat conducting portion 301 of each of the heat sinks 30 via the heat conducting medium 60, and then dispersed and conducted by the heat sinks 30. The heat is applied to the outside of the body 20, and the light emitted by the LED elements 42 is concentrated. The concentrating cover 44 is disposed on the peripheral side of the circuit board 41 and is disposed on the concentrating cover 44. A light cover 45, which can be a convex lens, is provided, and the light collecting effect is provided by the light collecting cover 44 and the light cover 45, so that the light emitted by the LED elements 42 can be concentratedly projected, wherein one end of the body 20 is bonded. The fixing module 46 is provided with a fixing ring 46 for fixing the concentrating cover 44 and the lamp cover 45. The driving module 50 is provided with a driving circuit unit 51 for the circuit board, and the driving circuit unit 51 is disposed on the body 20 The mounting portion 202 is electrically connected to the input end of the driving circuit unit 51. The power connector 52 at the other end of the body 20 is electrically connected to the circuit substrate 41 of the light source module 40, and the driving circuit unit 51 can perform voltage transformation, voltage regulation, AC and DC conversion, and then drive. The LED elements 42 of the light source module 40 emit light. Since the driving module 50 performs power transformation, voltage regulation, and AC/DC conversion, the technology is familiar in the industry, and is not the design focus of the creation, so In the present embodiment, the input end of the driving circuit unit 51 of the driving module 50 is electrically connected to the power connector 52 by two wires 511 and 512, and the output end of the driving circuit unit 51 is provided with a socket 513. The circuit board 41 of the light source module 40 is provided with a plug 412 for interposing with the socket 513 to electrically connect the circuit board 41 of the light source module 40 to the driving circuit unit 51 of the driving module 50.

請參閱第7、8、9圖所示,本創作於使用時,其係可將該照明裝置裝設於天花板上,並以該驅動模組50之電源接頭 52連接電源,而由該驅動電路單元51進行電力之變壓、穩壓及交、直流電轉換,以驅動該光源模組40之各LED元件42發出光線,由於該光源模組40之電路基板41上係分隔有複數個分別對應該各散熱片30之導熱部301的區域,再分別於各區域內集中設置有該複數個LED元件42,因此,當該光源模組40之各LED元件42發出光線時,該各區域內的各LED元件42所產生的熱量即經由該導熱介質60傳導至各散熱片30之導熱部301上的各凸桿3011,再由該各散熱片30之導熱部301將該各LED元件42之熱量所產生的熱量分散傳導至本體20外部,由於該各相鄰的散熱片30間具有間隔,並以該本體20之各間隔條208阻隔該各散熱片30間的熱傳導,並避免熱量堆積於該本體20內,進而可以分流的方式將該光源模組40之各LED元件42所產生的熱量分散傳導至本體20外部,以有效進行散熱,另外,當各LED元件42所產生的熱量分散傳導至本體20外部後,該各散熱片30的溫度即高於該本體20的溫度,而利用該各散熱片30與本體20間的溫度高低差異,使該各散熱片30之內側面與該本體20之外環面間的間隔空間內形成渦旋氣流,以增加散熱效果;藉此,本創作於該光源模組40之各LED元件42發出光線時,係利用各散熱片30以分流的方式將光源模組40之各LED元件42所產生的熱量分散傳導至本體20外部,即可有效的進行散熱,進而達到大幅提昇散熱效果及使用壽命之實用效益。Please refer to Figures 7, 8, and 9. When the present invention is used, the lighting device can be installed on the ceiling, and the power connector of the driving module 50 is used. 52 is connected to the power source, and the driving circuit unit 51 performs voltage transformation, voltage regulation, and AC/DC conversion to drive the LED elements 42 of the light source module 40 to emit light, because the circuit substrate 41 of the light source module 40 The upper portion is divided into a plurality of regions respectively corresponding to the heat conducting portions 301 of the heat sinks 30, and the plurality of LED elements 42 are collectively disposed in the respective regions. Therefore, when the LED elements 42 of the light source module 40 are emitted In the case of light, the heat generated by each of the LED elements 42 in each of the regions is transmitted to the respective bumps 3011 on the heat conducting portion 301 of each of the heat sinks 30 via the heat conducting medium 60, and the heat conducting portions 301 of the heat sinks 30 are further Dissipating the heat generated by the heat of each of the LED elements 42 to the outside of the body 20, because the adjacent fins 30 are spaced apart, and the spacers 208 of the body 20 block the gaps between the heat sinks 30. The heat is transferred, and the heat is prevented from being accumulated in the body 20, so that the heat generated by the LED elements 42 of the light source module 40 can be distributed and distributed to the outside of the body 20 to effectively dissipate heat, and in addition, when each LED element 42 produced After the heat is dispersed and transmitted to the outside of the body 20, the temperature of each of the heat sinks 30 is higher than the temperature of the body 20, and the temperature difference between the heat sinks 30 and the body 20 is used to make the heat sinks 30 A vortex flow is formed in the space between the inner side surface and the outer annular surface of the body 20 to increase the heat dissipation effect. Therefore, when the LED elements 42 of the light source module 40 emit light, the heat sinks are utilized. The heat generated by the LED elements 42 of the light source module 40 is distributed and distributed to the outside of the body 20 in a shunt manner, thereby effectively dissipating heat, thereby achieving the practical benefit of greatly improving the heat dissipation effect and the service life.

據此,本創作實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符新型專利申請要件,爰依法提出申請。Accordingly, this creation is a practical and progressive design. However, the same products and publications have not been disclosed, so that the requirements for new patent applications are allowed, and applications are filed according to law.

20‧‧‧本體20‧‧‧ body

202‧‧‧架置部202‧‧‧ Mounting Department

206‧‧‧槽孔206‧‧‧ slots

207‧‧‧卡掣緣207‧‧‧ card edge

30‧‧‧散熱片30‧‧‧ Heat sink

301‧‧‧導熱部301‧‧‧Transfer Department

302‧‧‧穿槽302‧‧‧through slot

303‧‧‧扣合部303‧‧‧Deduction Department

40‧‧‧光源模組40‧‧‧Light source module

41‧‧‧電路基板41‧‧‧ circuit board

412‧‧‧插頭412‧‧‧ plug

42‧‧‧LED元件42‧‧‧LED components

44‧‧‧聚光罩44‧‧‧ concentrator

45‧‧‧燈罩45‧‧‧shade

46‧‧‧固定環46‧‧‧Fixed ring

50‧‧‧驅動模組50‧‧‧Drive Module

51‧‧‧驅動電路單元51‧‧‧Drive circuit unit

511‧‧‧導線511‧‧‧ wire

512‧‧‧導線512‧‧‧ wire

513‧‧‧插座513‧‧‧ socket

52‧‧‧電源接頭52‧‧‧Power connector

Claims (10)

一種照明裝置,其係包含有:本體:係於一端設有承置部;複數個散熱片:係設於該本體之外部,該各相鄰之散熱片間具有間隔距離,並於該各散熱片之一端分別設有延伸至該本體之承置部的導熱部;光源模組:係設於該本體之承置部,該光源模組設有一電路基板,該電路基板上設有至少一LED元件,並使該電路基板位於該各散熱片之導熱部上。A lighting device includes: a main body: a receiving portion is disposed at one end; a plurality of heat dissipating fins are disposed outside the main body, and the adjacent heat dissipating fins have a separation distance, and the heat dissipating One end of the sheet is respectively provided with a heat conducting portion extending to the receiving portion of the body; the light source module is disposed on the receiving portion of the body, the light source module is provided with a circuit substrate, and the circuit substrate is provided with at least one LED The component is disposed on the heat conducting portion of each of the heat sinks. 依申請專利範圍第1項所述之照明裝置,其中,該本體內係設有容置空間,於該本體之容置空間內設有複數個鎖接部及二相對之架置部,並於該各鎖接部之一端處設有該承置部,該本體之外部則凸設有複數個肋條。The illuminating device according to the first aspect of the invention, wherein the body is provided with a accommodating space, and a plurality of locking portions and two opposite mounting portions are disposed in the accommodating space of the body, and The receiving portion is disposed at one end of each of the locking portions, and a plurality of ribs are protruded from the outside of the body. 依申請專利範圍第1項所述之照明裝置,其中,該本體係以具低導熱係數之絕熱材質製作,該散熱片則以具高導熱係數的導熱材料製作成型。The lighting device according to claim 1, wherein the system is made of a heat insulating material having a low thermal conductivity, and the heat sink is formed by a heat conductive material having a high thermal conductivity. 依申請專利範圍第1項所述之照明裝置,其中,該本體係於該各相鄰之散熱片的間隔內分別凸設有間隔條。The illuminating device of claim 1, wherein the system has a spacer strip protruding from each of the adjacent fins. 依申請專利範圍第1項所述之照明裝置,其中,該各散熱片與該本體間係設有組裝結構,該組裝結構係於該各散熱片之一端處分別設有穿槽,該本體之一端則設有對應該各散熱片之穿槽的複數個凸塊,並使該本體之各凸塊分別穿置於該各散熱片之穿槽內,另於該各散熱片之另端分別設有扣合部,該本體則設有對應該各散熱片之扣合部的槽孔,並於該各槽孔之內側分別凸設有卡掣緣,以供卡扣固定該各散熱片之扣合部。The illuminating device of claim 1, wherein the heat dissipating fins and the main body are provided with an assembling structure, and the assembling structure is respectively provided with a through groove at one end of each of the heat dissipating fins, and the main body is provided One end is provided with a plurality of bumps corresponding to the slots of the heat sinks, and the bumps of the body are respectively disposed in the through slots of the heat sinks, and are respectively disposed at the other ends of the heat sinks. There is a fastening portion, the body is provided with a slot corresponding to the fastening portion of each of the heat sinks, and a snap edge is respectively protruded on the inner side of the slot for fastening and fastening the heat sink Joint department. 依申請專利範圍第1項所述之照明裝置,其中,該光源模組之電路基板上係分隔有複數個分別對應該各散熱片之導熱部的區域,並分別於該各區域內集中設置有複數個LED元件。The illuminating device of the first aspect of the invention, wherein the circuit board of the light source module is separated by a plurality of regions respectively corresponding to the heat conducting portions of the heat sinks, and are respectively disposed in the respective regions. A plurality of LED elements. 依申請專利範圍第1項所述之照明裝置,其中,該光源模組之電路基板上係開設有複數個分別對應該各LED元件之穿孔,該各散熱片之導熱部上則凸設有複數個凸桿,並使該各凸桿分別穿伸於該電路基板之各穿孔內,再於該各凸桿之端部與該各LED元件間塗佈為導熱膏之導熱介質。The lighting device of claim 1, wherein the circuit board of the light source module is provided with a plurality of perforations respectively corresponding to the LED elements, and the heat conducting portions of the heat dissipating fins are convexly provided with a plurality of And the protruding rods are respectively inserted into the perforations of the circuit board, and then coated with the heat conducting medium of the thermal conductive paste between the end portions of the protruding rods and the LED elements. 依申請專利範圍第1項所述之照明裝置,其中,該光源模組之電路基板周側處係套設有一聚光罩,並於該聚光罩上設有一為凸透鏡之燈罩,該本體之一端則以黏合的方式設有一固定環,以供固定該聚光罩及該燈罩。The illumination device of claim 1, wherein a light collecting cover is disposed on a peripheral side of the circuit board of the light source module, and a light cover for the convex lens is disposed on the light collecting cover, the body is One end is provided with a fixing ring for fixing the concentrating cover and the lamp cover. 依申請專利範圍第1項所述之照明裝置,更包含有驅動模組,該驅動模組係設有一為電路板之驅動電路單元,該驅動電路單元架置於該本體內,並於該驅動電路單元之輸入端電性連接一設於該本體另端之電源接頭,輸出端則電性連接該光源模組之電路基板。The lighting device according to the first aspect of the patent application, further comprising a driving module, wherein the driving module is provided with a driving circuit unit for the circuit board, the driving circuit unit is disposed in the body, and the driving The input end of the circuit unit is electrically connected to a power connector disposed at the other end of the body, and the output end is electrically connected to the circuit substrate of the light source module. 依申請專利範圍第9項所述之照明裝置,其中,該驅動模組之驅動電路單元的輸入端係以二導線電性連接該電源接頭,該驅動電路單元之輸出端設有插座,該光源模組之電路基板則設有一插頭,以與該插座相互插接,使該光源模組之電路基板與該驅動模組之驅動電路單元電性連接。The illuminating device of claim 9, wherein the input end of the driving circuit unit of the driving module is electrically connected to the power connector by two wires, and the output end of the driving circuit unit is provided with a socket, the light source The circuit board of the module is provided with a plug for interposing with the socket, so that the circuit substrate of the light source module is electrically connected to the driving circuit unit of the driving module.
TW104207123U 2015-05-08 2015-05-08 Lighting device TWM510421U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561767B (en) * 2016-01-29 2016-12-11 Fu Erl Ta Entpr Co Ltd Composition structure of the led lighting cooling fins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561767B (en) * 2016-01-29 2016-12-11 Fu Erl Ta Entpr Co Ltd Composition structure of the led lighting cooling fins

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