TWM563516U - Heat-dissipation device of lamp - Google Patents

Abstract

The present invention relates to a heat sink for a lamp, the heat sink of the lamp comprises a heat conducting lamp shell, a heat dissipating structure, a light source module and a plurality of heat pipes, the heat conducting lamp shell is provided with one or a plurality of embedded grooves; and the heat dissipating structure is mounted on the heat conducting lamp shell. The heat dissipation structure comprises a heat conducting plate; the light source module is fixed on the heat conducting plate; the plurality of heat pipes are fixed to the heat conducting plate, and at least one of the plurality of heat pipes is fitted into the embedded groove and is thermally attached to the heat conducting lamp shell. Thereby, the heat can be transmitted to the heat conducting lamp shell through the heat pipe to dissipate, so as to improve the heat dissipation efficiency of the heat sink of the lamp.

Description

Lamp heat sink

This creation is related to a luminaire structure, and in particular to a luminaire heat sink.

Light-Emitting Diode (LED) has the advantages of high brightness, power saving and long service life, and is generally favored by the market, and with the module composed of the light-emitting diodes, it can generate high power, so the light-emitting diode Polar bodies have been gradually applied to various types of lighting equipment, and thus become the main light source in line with the theme of energy conservation and environmental protection.

However, when the LED is used in a high wattage lamp, the high-power LED source generates high temperature and high heat, causing the LED and the electronic component to be short-circuited or damaged. Therefore, the lamp is equipped with a heat pipe for heat dissipation. Therefore, how to improve the heat dissipation efficiency of the heat pipe is the focus of the lighting industry.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The present invention provides a heat sink for a lamp, wherein at least one of the plurality of heat pipes is thermally attached to the heat conducting lamp shell, so that heat can be transmitted to the heat conducting lamp shell through the heat pipe to dissipate heat, so as to improve the heat dissipation efficiency of the heat sink of the lamp.

In the present invention, the present invention provides a heat dissipation device for a lamp, comprising: a heat-conducting lamp housing having at least one embedded groove; a heat dissipation structure mounted on the heat-conducting lamp housing, the heat dissipation structure comprising a heat-conducting plate; A light source module is fixed to the heat conducting plate; and a plurality of heat pipes are fixed to the heat conducting plate, and at least one of the plurality of heat pipes is fitted into the embedded groove and thermally attached to the heat conducting lamp shell.

The plurality of heat pipes include a first heat pipe and a second heat pipe. The first heat pipe is fitted to the embedded groove and is thermally attached to the heat conducting lamp housing. The second heat pipe is connected to the plurality of fins and is heat-bonded to the plurality of fins. Then, a part of the plurality of heat pipes are thermally attached to the heat conducting lamp shell, and the other part of the plurality of heat pipes are heat-bonded to the fins, so that heat is transmitted through the heat pipes to the heat conducting lamp shell and the fins are dissipated to increase the heat dissipating area, so as to improve the heat dissipation of the lamp. The heat dissipation efficiency of the device.

Based on the above, the heat conducting lamp housing has an annular inner wall, and the embedded groove is an annular groove formed along the annular inner wall, and the first heat pipe is bent with an annular section that is fitted into the annular groove, thereby greatly enhancing the first heat pipe and the heat conduction. The thermal contact area of the lamp housing to enhance the heat dissipation efficiency of the lamp heat sink.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

Referring to FIG. 1 to FIG. 10 , the present invention provides a heat dissipation device for a lamp. The heat dissipation device 10 of the lamp mainly includes a heat conducting lamp shell 1 , a heat dissipating structure 2 , a light source module 3 , and a plurality of heat pipes 4 .

As shown in FIG. 4 to FIG. 10 , the heat conducting lamp housing 1 is provided with one or a plurality of embedded grooves 11 , and the heat conducting lamp housing 1 has a cavity 12 , an annular inner wall 13 and an opening 14 provided with the connecting cavity 12 . The embedded groove 11 is an annular groove 111 formed along the annular inner wall 13.

In addition, the heat conducting lamp housing 1 includes an upper casing 15, a lower casing 16 and a set of collars 17 which are assembled to each other. The upper casing 15 has a connecting bracket 151, and an embedded groove 11 and an opening 14 are formed in the lower casing 16 The upper chamber 15 and the lower housing 16 respectively define a flange, and the sleeve ring 17 is sleeved on the outside of the two flanges, thereby The housing 15 and the lower housing 16 are joined to each other up and down. Wherein, the connecting frame 151 is used for fixing on a light pole, a light stand, a wall or a ceiling.

As shown in FIG. 1 to FIG. 10, the heat dissipation structure 2 is mounted on the heat conduction lamp housing 1. The heat dissipation structure 2 includes a heat conduction plate 21 and a plurality of fins 22 connected to the heat conduction plate 21. The heat conduction plate 21 has an intermediate portion 211 and a setting. In the left side section 212 and the right side section 213 on both sides of the middle section 211, the middle section 211 is provided with a plurality of recessed grooves 214.

The heat dissipation structure 2 is disposed in the cavity 12, and the plurality of fins 22 are divided into a plurality of first fins 221 and a plurality of second fins 222. The plurality of first fins 221 are fixed to the left side segment 212, and the second plurality is fixed. The fin 222 is fixed to the right side section 213.

In addition, the heat dissipation structure 2 further includes an external cover plate 23 fixed to the intermediate portion 211, and the external cover plate 23 includes an upper cover plate 231 and a lower cover plate 232 which are butted against each other.

As shown in FIG. 3 and FIG. 8 to FIG. 9 , the light source module 3 is fixed to the heat conducting plate 21 . The light source module 3 includes a circuit board 31 and one or a plurality of LEDs 32 mounted on the circuit board 31 .

As shown in FIGS. 1 to 10, the plurality of heat pipes 4 are fixed to the heat conducting plate 21, and at least one of the plurality of heat pipes 4 is fitted to the embedded groove 11 and thermally bonded to the heat conducting lamp envelope 1.

Further, as described below, the plurality of heat pipes 4 include one or a plurality of first heat pipes 41 and one or a plurality of second heat pipes 42. The first heat pipe 41 is fitted into the embedded groove 11 and is heat-bonded to the heat conducting lamp envelope 1, and the second heat pipe 42 is worn. It is connected to the plurality of fins 22 and is thermally attached to the plurality of fins 22 . The first heat pipe 41 is bent and has an annular section 411 fitted to the annular groove 111.

In addition, the number of the first heat pipes 41 in the embodiment is plural, and the plurality of first heat pipes 41 are respectively fitted into the plurality of recessed grooves 214 and sandwiched between the intermediate section 211 and the cap plate 23, and each of the first heat pipes 41 A portion of the ring portion 211 is bent and has a curved portion 412. The annular portion 411 is surrounded by a plurality of curved segments 412.

Furthermore, the number of the second heat pipes 42 in the embodiment is plural, and the plurality of second heat pipes 42 are sandwiched between the upper cover plate 231 and the lower cover plate 232, and one of the second heat pipes 42 is partially connected to the middle portion. 211 and another portion are connected to the plurality of first fins 221 or the plurality of second fins 222.

As shown in FIG. 3, FIG. 5, and FIG. 7 to FIG. 9, the heat dissipation device 10 of the present invention further includes a transparent cover 5, the transparent cover 5 is fixed to the heat conduction plate 21 and exposed to the opening 14, and the circuit board 31 is clamped. The light-emitting diodes 32 are disposed between the heat-conducting plate 21 and the light-transmitting cover 5, and the light-transmitting cover 5 is used to protect the light source module 3.

As shown in FIG. 3, FIG. 5, and FIG. 8 to FIG. 9, the heat dissipation device 10 of the present invention further includes a temperature equalizing plate 6, a light collecting sleeve 7, and a transformer 8. The temperature equalizing plate 6 is sandwiched between heat conduction. Between the board 21 and the circuit board 31, the light collecting sleeve 7 is fixed to the transparent cover 5 and penetrates the opening 14. The transformer 8 is received in the cavity 12 and electrically connected to the circuit board 31. The temperature equalizing plate 6 is used to help the light source module 3 to cool down, the light collecting sleeve 7 is used to concentrate the light of the light emitting diode 32, and the power transformer 8 is used to supply power to the light source module 3.

As shown in FIG. 8 to FIG. 10, the use state of the heat dissipation device 10 of the present invention includes a first heat pipe 41 and a second heat pipe 42 by using a plurality of heat pipes 4, and the first heat pipe 41 is fitted into the embedded groove 11 and is hot-applied. Connected to the heat-conducting lamp housing 1, the second heat pipe 42 is connected to the plurality of fins 22 and is heat-bonded to the plurality of fins 22, so that a part of the plurality of heat pipes 4 are thermally attached to the heat-conducting lamp housing 1, and the other part of the plurality of heat pipes 4 is heat-bonded to the fins 22, so that heat is transmitted through the heat pipe 4 to the heat-dissipating lamp housing 1 and the fins 22 to dissipate and increase the heat-dissipating area, so as to improve the heat-dissipating efficiency of the heat-dissipating device 10 of the lamp.

In addition, the heat conducting lamp housing 1 has an annular inner wall 13 , and the embedded groove 11 is an annular groove 111 formed along the annular inner wall 13 . The first heat pipe 41 is bent with an annular segment 411 fitted to the annular groove 111 , and further The thermal contact area of the first heat pipe 41 and the heat conducting lamp housing 1 is greatly increased to enhance the heat dissipation efficiency of the lamp heat sink 10.

In summary, the heat sink of the lamp can achieve the intended purpose of use, and solve the lack of knowledge, and has industrial utilization, novelty and progress, fully comply with the patent application requirements, and apply according to the patent law. Please carefully check and grant the patent in this case to protect the rights of the creator.

10‧‧‧Lighting fixture

1‧‧‧thermal lamp housing

11‧‧‧ embedded trench

111‧‧‧ annular groove

12‧‧‧ cavity

13‧‧‧Circular inner wall

14‧‧‧ openings

15‧‧‧Upper casing

151‧‧‧Connecting frame

16‧‧‧ Lower case

17‧‧‧ Sockets

2‧‧‧heating structure

21‧‧‧heat conducting plate

211‧‧‧ middle section

212‧‧‧left segment

213‧‧‧ right segment

214‧‧‧recessed trough

22‧‧‧Fins

221‧‧‧First fin

222‧‧‧second fin

23‧‧‧plus cover

231‧‧‧Upper cover

232‧‧‧Under cover

3‧‧‧Light source module

31‧‧‧ boards

32‧‧‧Lighting diode

4‧‧‧heat pipe

41‧‧‧First heat pipe

411‧‧‧ ring segment

412‧‧‧ curved section

42‧‧‧second heat pipe

5‧‧‧Transparent cover

6‧‧‧Wall plate

7‧‧‧Light collecting sleeve

8‧‧‧Transformer

Figure 1 is a first perspective exploded view of the heat sink of the present lamp.

Figure 2 is the first three-dimensional combination of the heat sink of the created lamp.

Figure 3 is a second exploded view of the heat sink of the present lamp.

Figure 4 is a third exploded view of the heat sink of the lamp.

Fig. 5 is a fourth exploded view of the heat sink of the lamp.

Figure 6 is a second perspective view of the heat sink of the present lamp.

Figure 7 is a third perspective view of the heat sink of the present lamp.

Figure 8 is a first cross-sectional view of the heat sink of the present luminaire.

Figure 9 is a second cross-sectional view of the heat sink of the present luminaire.

Figure 10 is a third cross-sectional view of the heat sink of the present lamp.

Claims (10)

A heat dissipation device for a lamp, comprising: a heat conducting lamp housing having at least one embedded groove; a heat dissipating structure mounted on the heat conducting lamp housing, the heat dissipating structure comprising a heat conducting plate; a light source module fixed to the heat conducting plate; And the plurality of heat pipes are fixed to the heat conducting plate, and at least one of the plurality of heat pipes is fitted into the embedded groove and thermally attached to the heat conducting lamp shell. The heat dissipation device of claim 1, wherein the heat dissipation structure further comprises a plurality of fins connected to the heat conduction plate, the plurality of heat pipes comprising at least one first heat pipe and at least one second heat pipe, the first heat pipe fitting The second heat pipe is connected to the plurality of fins and is thermally attached to the plurality of fins. The heat sink of the lamp of claim 2, wherein the heat conducting lamp housing has a cavity and an annular inner wall, the heat dissipating structure is received in the cavity, and the embedding groove is opened along the annular inner wall. An annular groove, the first heat pipe is bent with an annular section fitted to the annular groove. The heat sink of the lamp of claim 3, wherein the number of the first heat pipes is plural, the heat conducting plate has an intermediate portion, and one of the first heat pipes is partially connected to the middle portion and the other portion is bent In the curved arc segment, the annular segment is formed by a plurality of curved segments. The heat dissipation device of the luminaire of claim 4, wherein the number of the second heat pipes is plural, the heat conduction plate further has a left side segment and a right side segment disposed on opposite sides of the middle portion, and the plurality of fins are divided into plural first And a plurality of second fins, the plurality of first fins are fixed to the left side segment, the plurality of second fins are fixed to the right side segment, and one of the second heat pipes is partially connected to the middle portion and Another portion is coupled to the plurality of first fins or the plurality of second fins. The illuminating device of the luminaire of claim 5, wherein the heat dissipating structure further comprises an outer cover plate fixed to the middle portion, the outer cover plate comprises an upper cover plate and a lower cover plate which are butted against each other, and the middle portion is provided a plurality of recessed grooves, the plurality of first heat pipes are respectively fitted in the plurality of recessed grooves and sandwiched between the intermediate portion and the cap plate, and the plurality of second heat pipes are sandwiched between the upper cover and the lower cover Between the covers. The heat sink of the lamp of claim 6, further comprising a light transmissive cover, wherein the heat conducting lamp housing is provided with an opening that communicates with the cavity, the light transmissive cover is fixed to the heat conducting plate and exposed to the opening, The light source module includes a circuit board and at least one light emitting diode mounted on the circuit board, the circuit board is sandwiched between the heat conducting board and the light transmissive cover, and the light emitting diode is disposed corresponding to the light transmissive cover . The heat sink of the lamp of claim 7, further comprising a temperature equalizing plate and a light collecting sleeve, the temperature equalizing plate being sandwiched between the heat conducting plate and the circuit board, the light collecting sleeve being fixed And passing through the transparent cover. The heat sink of the lamp of claim 8, wherein the heat conducting lamp housing comprises an upper casing, a lower casing and a set of rings connected to each other, the upper casing having a connecting frame, the embedded groove, the An opening is formed on the lower casing, the cavity is formed in the inner portion of the upper casing and the lower casing, and the upper casing and the lower casing respectively extend with a flange, and the sleeve is sleeved on the convex portion The outer portion of the rim is such that the upper and lower housings are joined to each other up and down. The luminaire heat sink of claim 9, further comprising a transformer, the transformer being received in the cavity and electrically connected to the circuit board.