M311941 八、新型說明： 【新型所屬之技術領域】 本創作係一種主機板之中央處理器的辅助散熱器，係 提供一種設置於主機板的另一側面，並可將中央處理器所 產生的高溫散發至空氣中的散熱結構。 【先前技術】 電腦的應用已經日漸普及，電腦係由相當的電子構件 所組成的，於這些電子構件中最重要的為中央處理器，中 央處理器係可運算所輸入的資料，並且輸出二可供^們所 使用的數據，隨著電子科技的日新月異，中央處理器的運 算速度亦隨之增快，然而伴隨著運算速度的增快，中央處 理器的工作溫度亦隨之提升，為避免中央處理号因工作、、w 度過高，而使其運算速度減緩或因過熱㈣，因此會於； 央處理器處設置一散熱裝置。 現有的散熱裝置，其具有導熱塊與散熱鰭片，導熱塊 係緊密貼附於中央處理器的一側處， . 执麥仏一而此中央處理器係 δ又置於一主機板的一側面，散執 ^ u . 、、、θ片係固定於導熱塊處， 另於散…、〃、曰片處連接有散熱風扇。 當中央處理器的工作溫度過高時 會經由導熱依序傳導至導熱塊與散t 的…皿就 熱風扇吹送，而使傳導至散熱鰭片處的de並t藉由散 氣中，藉此達到降溫的效果。 ^…發散至空 然而仍有少部分的高溫會傳導至 而此側面並無設有任何散 ：：的另-側面， 文阿溫會聚集於此側面 M311941 處，所以經過一段時間的使用後，此聚集的高溫會對t央 處理器與其周圍為的電子構件產生相當程度的影響。 【新型内容】 θ 有鑑於前述之現有技術上的不便之處，本創作係設計 一種主機板之中央處理器的輔助散熱器，係提供一種設置 於主機板的另一側面且相對於中央處理器位置處，並可將 傳導至主機板另一側面的高溫散發至空氣中的散熱構。 為達到上述創作目的，本創作所採用的技術手段為設 計一種主機板之中央處理器的辅助散熱器，其係設置於一 主機板處，主機板的一側面設有中央處理器，該辅助散熱 器具有-座體、-導熱塊、一熱管與一散熱鰭[座體係 貼附於主機板的另一侧面且相對於中央處理器位置處，導 熱塊係設置於座體的一側面，熱管的一 連接，另端朝向遠離導熱塊的方向延伸，該延伸端= 主機板的一側邊，散熱鰭片係與熱管的延伸端相互連接。 當部分中央處理器所產生的高溫傳導至主機板的另一 側面且相對於中央處理的位置時，該高溫會傳導至座體與 導熱塊，並經由熱管而傳導至散熱簿片處，再由散熱讀片、 發散至空氣中，如此使得主機板的另一側面且相對於中央 處理益位置處的溫度可保㈣中央處理器與其周圍為的電 子構件所能接受的範圍内’藉此使前述之構件可維持於正 常的工作狀態下。 【實施方式】 本創作係-種主機板之中央處理器的輔助散熱器，請 M311941 配合參考第一、二及三圖所示，其係設置於一主機板（2 〇)處，主機板（20)的一側面設有中央處理器（21)， 於主機板（2 0)且相對於中央處理器（2丄）的邊角處 設有固定孔，輔助散熱器具有一座體（1〇)、一導熱塊 (11)、一熱管（12)與一散熱鰭片（13); 座體（1 0 )，係貼附於主機板（2 〇 )的另一側面 且相對於中央處理器（2 i )位置處，座體（i 〇 )的邊 角且相對於固定孔位置處形成有穿孔，於穿孔處穿設有可 與固定孔相互固定的連接柱（1〇1)，座體（1〇)的 -側面形成有容槽（1〇2)，座體（1〇)係為可導敎 的絕緣體； ^ 導熱塊（11)，其係固定於座體（1〇)的容槽（工 0 2 )處； θ 熱管（1 2 )，其一端係與導熱塊（丄i )相互連接， 另端朝向遠離議（1 1 )的方向延伸，並且該端彎則 形成有彎折端（12"，熱管（12)係為呈爲平狀的 管體； 散熱鰭片（1 3 )，其係被熱管（丄2 )的彎折端（丄 2 1 )所貫穿固定。 請配合參考第三及四圖所示，主機板（2〇)係設置 於機双（23)的内部，並於中央處理器的上 方設有散熱裝4 (圖中未示），另於機殼（23)且㈣ 於中央處理器（21)處設有風扇（22)，並將座體（1 ◦)設置於主機板（20)的另—側面且相對於中央處理 M311941 )係朝向主機板 1 3 )位於風扇 (20) (22) 器（21)位置處，熱管（1 的一側邊延伸’而使散熱鰭片 的相對位置處。 當中央處理器（2!)開始_^M311941 VIII. New Description: [New Technology Field] This is an auxiliary heat sink for the central processing unit of the motherboard. It provides a high temperature generated by the central processor on the other side of the motherboard. A heat dissipation structure that is emitted into the air. [Prior Art] The application of computers has become increasingly popular. Computers are composed of equivalent electronic components. The most important of these electronic components is the central processing unit. The central processing unit can calculate the input data and output two. For the data used by the experts, with the rapid development of electronic technology, the computing speed of the central processing unit will also increase. However, with the increase of the computing speed, the operating temperature of the central processing unit will also increase, in order to avoid the central The processing number is slow due to work, and the speed is too high, or the operation speed is slowed down or overheated (4). Therefore, a heat sink is disposed at the central processor. The existing heat dissipating device has a heat conducting block and a heat dissipating fin, and the heat conducting block is closely attached to one side of the central processing unit, and the central processing unit δ is placed on one side of a main board , Dissipative ^ u . , , , θ film is fixed at the heat-conducting block, and a heat-dissipating fan is connected to the bulk, 〃, and 曰. When the operating temperature of the central processing unit is too high, the heat conduction block and the heat transfer block are sequentially transmitted to the heat transfer block and the heat transfer fan is blown, so that the de and t conducted to the heat dissipation fin are dispersed. The effect of cooling is achieved. ^...The air is divergent to the air, but there is still a small part of the high temperature that will be transmitted to the side. There is no other side on the side:: the other side, Wen Awen will gather on the side of M311941, so after a period of use, This concentrated high temperature can have a considerable effect on the electronic components of the t-processor and its surroundings. [New content] θ In view of the above-mentioned prior art inconvenience, the present invention designs an auxiliary heat sink of a central processing unit of a motherboard, which is provided on the other side of the motherboard and opposite to the central processing unit. At the location, the high temperature conducted to the other side of the motherboard can be radiated to the heat dissipation structure in the air. In order to achieve the above-mentioned creative purposes, the technical means adopted by the present invention is to design an auxiliary heat sink of a central processing unit of the motherboard, which is disposed at a motherboard, and a central processor is disposed on one side of the motherboard, the auxiliary heat dissipation The device has a body, a heat conducting block, a heat pipe and a heat sink fin [the seat system is attached to the other side of the motherboard and is located at a position relative to the central processor, and the heat conducting block is disposed on one side of the base body, the heat pipe A connection, the other end extending away from the heat conducting block, the extending end = one side of the motherboard, the heat sink fins and the extended end of the heat pipe are connected to each other. When the high temperature generated by part of the central processing unit is conducted to the other side of the motherboard and relative to the central processing position, the high temperature is transmitted to the base body and the heat conducting block, and is conducted to the heat sink through the heat pipe, and then The heat-dissipating film is diverged into the air, so that the temperature of the other side of the motherboard and relative to the central processing position can be guaranteed (4) within the acceptable range of the central processing unit and the electronic components around it. The components can be maintained under normal working conditions. [Embodiment] This is the auxiliary heat sink of the central processor of the motherboard. Please refer to the first, second and third figures of the M311941. It is installed on a motherboard (2 〇), the motherboard ( A side surface of 20) is provided with a central processing unit (21), and a fixing hole is provided at a corner of the main board (20) with respect to the central processing unit (2丄), and the auxiliary radiator has a body (1〇) a heat conducting block (11), a heat pipe (12) and a heat sink fin (13); the base body (10) is attached to the other side of the motherboard (2 〇) and opposite to the central processing unit ( 2 i) at the position, the corner of the seat body (i 〇) is formed with a perforation at a position relative to the fixing hole, and a connecting post (1〇1) which can be fixed to the fixing hole is formed at the through hole, and the seat body ( 1〇)-side formed with a pocket (1〇2), the seat (1〇) is a conductive insulator; ^ Thermal block (11), which is fixed to the cavity of the seat (1〇) (工0 2); θ heat pipe (1 2 ), one end of which is connected to the heat conducting block (丄i), the other end extends away from the discussion (1 1 ), and the end bend is formed There is a bent end (12", the heat pipe (12) is a flat tube; the heat sink fin (13) is fixed by the bent end (丄2 1 ) of the heat pipe (丄2) Please refer to the third and fourth figures. The motherboard (2〇) is installed inside the double (23) and has a heat sink 4 (not shown) above the central processor. The casing (23) and (4) are provided with a fan (22) at the central processing unit (21), and the seat body (1 ◦) is disposed on the other side of the main board (20) and is oriented with respect to the central processing M311941) The motherboard 1 3 ) is located at the position of the fan (20) (22) (21), and the heat pipe (one side of the extension 1) makes the relative position of the heat dissipation fins. When the central processing unit (2!) starts _^
_ 溫會被散熱裝置散發至空氣中，而部分的高溫會聚华= 機板（2…另一側面且相對於中央處理器（21、)、位 置處，此高溫會傳導至座體（i Q )與導熱塊（丄丄）處， 並經由熱管（12)，而傳遞至散熱縛片（13)處，再 經由前述之風4 ( 2 2 )的吹動，使該高溫得以散發至空 氣中，藉由此散熱模式，使得主機板（2 〇 )的另一側面 且相對於中央處理器（2 位置處的溫度可保持於中央 處理器（2 1 )與其周圍為的電子構件所能接受的範圍内， 故可使前述之構件得以正常運作。 【圖式簡單說明】 第一圖係本創作之立體分解圖。 第二圖係本創作之立體外觀圖。 第二圖係本創作與一主機板相互結合，並且設置於一 機殼内之立體外觀圖。 第四圖係本創作與主機板相互結合，並且設置於機殼 内之侧視圖。 【主要元件符號說明】 (1〇)座體 （ιοί)連接柱 (102)容槽 （11)導熱塊 (1 2 )熱管 （1 2 1 )彎折端 M311941 (13)散熱鰭片 （20)主機板 - (21)中央處理器 （22)風扇 一 (2 3 )機殼_ The temperature will be dissipated into the air by the heat sink, and some of the high temperature will converge on the machine board (2...the other side and relative to the central processor (21,), the position, this high temperature will be transmitted to the seat (i Q And the heat conducting block (丄丄), and transmitted to the heat dissipating tab (13) via the heat pipe (12), and then the high temperature is released into the air through the blowing of the wind 4 (2 2 ) With this heat dissipation mode, the other side of the motherboard (2 〇) and relative to the central processing unit (the temperature at the 2 position can be maintained by the central processing unit (2 1 ) and the electronic components around it are acceptable Within the scope, the above-mentioned components can be operated normally. [Simple diagram of the drawing] The first figure is an exploded view of the creation. The second picture is a three-dimensional appearance of the creation. The second picture is the creation and a host The three-dimensional appearance of the boards is combined with each other and arranged in a casing. The fourth picture is a side view of the creation and the main board, and is arranged in the casing. [Main component symbol description] (1〇) seat body (ιοί) connecting column (102) receiving groove (11) Heat block (1 2 ) heat pipe (1 2 1 ) bent end M311941 (13) heat sink fin (20) motherboard - (21) central processor (22) fan one (2 3 ) case
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